EP2943979A4 - Halbleiterbauelement mit merkmalen zur verhinderung von reverse-engineering - Google Patents

Halbleiterbauelement mit merkmalen zur verhinderung von reverse-engineering Download PDF

Info

Publication number: EP2943979A4
Authority: EP; European Patent Office
Prior art keywords: features; semiconductor device; reverse engineering; prevent reverse; engineering
Prior art date: 2013-01-11
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

EP14737723.8A

Other languages

English (en)

French (fr)

Other versions

EP2943979A1 (de

Inventor

William Eli Thacker

Robert Francis TENCZAR

Michael Clinton HOKE

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Verisiti Inc

Original Assignee

Verisiti Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2013-01-11

Filing date

2014-01-03

Publication date

2017-05-17

2013-01-11 Priority claimed from US13/739,401 external-priority patent/US20130320491A1/en

2014-01-03 Application filed by Verisiti Inc filed Critical Verisiti Inc

2015-11-18 Publication of EP2943979A1 publication Critical patent/EP2943979A1/de

2017-05-17 Publication of EP2943979A4 publication Critical patent/EP2943979A4/de

Status Withdrawn legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H10W42/40—Arrangements for protection of devices protecting against tampering, e.g. unauthorised inspection or reverse engineering
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00

EP14737723.8A 2013-01-11 2014-01-03 Halbleiterbauelement mit merkmalen zur verhinderung von reverse-engineering Withdrawn EP2943979A4 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US13/739,401 US20130320491A1 (en)	2011-06-07	2013-01-11	Semiconductor Device Having Features to Prevent Reverse Engineering
PCT/US2014/010185 WO2014109961A1 (en)	2013-01-11	2014-01-03	Semiconductor device having features to prevent reverse engineering

Publications (2)

Publication Number	Publication Date
EP2943979A1 EP2943979A1 (de)	2015-11-18
EP2943979A4 true EP2943979A4 (de)	2017-05-17

Family

ID=51167305

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP14737723.8A Withdrawn EP2943979A4 (de)	2013-01-11	2014-01-03	Halbleiterbauelement mit merkmalen zur verhinderung von reverse-engineering

Country Status (7)

Country	Link
EP (1)	EP2943979A4 (de)
CN (1)	CN104969345B (de)
AP (1)	AP2015008585A0 (de)
CA (1)	CA2897082A1 (de)
EA (1)	EA201591224A1 (de)
MX (2)	MX374662B (de)
WO (1)	WO2014109961A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP7109755B2 (ja) *	2018-02-15	2022-08-01	株式会社吉川システック	半導体装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20100001403A1 (en) *	2008-07-03	2010-01-07	Nec Electronics Corporation	Method for designing semiconductor integrated circuit which includes metallic wiring connected to gate electrode and satisfies antenna criterion

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4766516A (en) *	1987-09-24	1988-08-23	Hughes Aircraft Company	Method and apparatus for securing integrated circuits from unauthorized copying and use
US4933898A (en) *	1989-01-12	1990-06-12	General Instrument Corporation	Secure integrated circuit chip with conductive shield
US5783846A (en) *	1995-09-22	1998-07-21	Hughes Electronics Corporation	Digital circuit with transistor geometry and channel stops providing camouflage against reverse engineering
US20020096744A1 (en) *	2001-01-24	2002-07-25	Hrl Laboratories, Llc	Integrated circuits protected against reverse engineering and method for fabricating the same using etched passivation openings in integrated circuits
US7135734B2 (en) *	2001-08-30	2006-11-14	Micron Technology, Inc.	Graded composition metal oxide tunnel barrier interpoly insulators
US20120313664A1 (en) *	2011-06-07	2012-12-13	Static Control Components, Inc.	Semiconductor Device Having Features to Prevent Reverse Engineering

2014
- 2014-01-03 CN CN201480004534.XA patent/CN104969345B/zh not_active Expired - Fee Related
- 2014-01-03 EP EP14737723.8A patent/EP2943979A4/de not_active Withdrawn
- 2014-01-03 AP AP2015008585A patent/AP2015008585A0/xx unknown
- 2014-01-03 MX MX2016017344A patent/MX374662B/es unknown
- 2014-01-03 EA EA201591224A patent/EA201591224A1/ru unknown
- 2014-01-03 MX MX2015008948A patent/MX348002B/es active IP Right Grant
- 2014-01-03 CA CA2897082A patent/CA2897082A1/en not_active Abandoned
- 2014-01-03 WO PCT/US2014/010185 patent/WO2014109961A1/en not_active Ceased

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20100001403A1 (en) *	2008-07-03	2010-01-07	Nec Electronics Corporation	Method for designing semiconductor integrated circuit which includes metallic wiring connected to gate electrode and satisfies antenna criterion

Also Published As

Publication number	Publication date
AP2015008585A0 (en)	2015-07-31
WO2014109961A1 (en)	2014-07-17
MX348002B (es)	2017-01-05
EA201591224A1 (ru)	2016-02-29
EP2943979A1 (de)	2015-11-18
MX374662B (es)	2025-03-06
CA2897082A1 (en)	2014-07-17
MX2015008948A (es)	2015-09-28
CN104969345B (zh)	2018-12-07
CN104969345A (zh)	2015-10-07

Legal Events

Date	Code	Title	Description
2015-10-16	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2015-11-18	17P	Request for examination filed	Effective date: 20150722
2015-11-18	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2015-11-18	AX	Request for extension of the european patent	Extension state: BA ME
2016-04-20	DAX	Request for extension of the european patent (deleted)
2017-02-08	RIC1	Information provided on ipc code assigned before grant	Ipc: H01L 23/00 20060101ALI20170105BHEP Ipc: H01L 27/02 20060101ALI20170105BHEP Ipc: G06F 21/75 20130101ALI20170105BHEP Ipc: H01L 23/52 20060101AFI20170105BHEP
2017-05-17	A4	Supplementary search report drawn up and despatched	Effective date: 20170421
2017-05-17	RIC1	Information provided on ipc code assigned before grant	Ipc: H01L 23/52 20060101AFI20170413BHEP Ipc: H01L 27/02 20060101ALI20170413BHEP Ipc: H01L 23/00 20060101ALI20170413BHEP Ipc: G06F 21/75 20130101ALI20170413BHEP
2021-03-19	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: EXAMINATION IS IN PROGRESS
2021-04-21	17Q	First examination report despatched	Effective date: 20210319
2023-03-31	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN
2023-05-03	18D	Application deemed to be withdrawn	Effective date: 20221130

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EP3076431A4 (de)	2017-08-09	Halbleiterbauelement
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AU2014348034A1 (en)	2016-05-12	Shift device
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