EP2955733A4 - Structure multicouche, élément condensateur et procédé permettant de fabriquer ce dernier - Google Patents

Structure multicouche, élément condensateur et procédé permettant de fabriquer ce dernier Download PDF

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Publication number
EP2955733A4
EP2955733A4 EP14748896.9A EP14748896A EP2955733A4 EP 2955733 A4 EP2955733 A4 EP 2955733A4 EP 14748896 A EP14748896 A EP 14748896A EP 2955733 A4 EP2955733 A4 EP 2955733A4
Authority
EP
European Patent Office
Prior art keywords
layer structure
capacitor element
manufacturing same
manufacturing
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14748896.9A
Other languages
German (de)
English (en)
Other versions
EP2955733A1 (fr
Inventor
Naoaki Tsurumi
Yasuo Kanetake
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of EP2955733A1 publication Critical patent/EP2955733A1/fr
Publication of EP2955733A4 publication Critical patent/EP2955733A4/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/32—Wound capacitors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
    • F16B25/00—Screws that cut thread in the body into which they are screwed, e.g. wood screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
    • H01G13/02—Machines for winding capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/10—Metal-oxide dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/14—Organic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00—Resistors, capacitors or inductors
    • H10D1/60—Capacitors
    • H10D1/68—Capacitors having no potential barriers
    • H10D1/692—Electrodes
    • H10D1/696—Electrodes comprising multiple layers, e.g. comprising a barrier layer and a metal layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/70—Energy storage systems for electromobility, e.g. batteries

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
EP14748896.9A 2013-02-06 2014-02-06 Structure multicouche, élément condensateur et procédé permettant de fabriquer ce dernier Withdrawn EP2955733A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013021414A JP2014154632A (ja) 2013-02-06 2013-02-06 多層構造体、コンデンサ素子およびその製造方法
PCT/JP2014/052748 WO2014123182A1 (fr) 2013-02-06 2014-02-06 Structure multicouche, élément condensateur et procédé permettant de fabriquer ce dernier

Publications (2)

Publication Number Publication Date
EP2955733A1 EP2955733A1 (fr) 2015-12-16
EP2955733A4 true EP2955733A4 (fr) 2017-07-12

Family

ID=51299773

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14748896.9A Withdrawn EP2955733A4 (fr) 2013-02-06 2014-02-06 Structure multicouche, élément condensateur et procédé permettant de fabriquer ce dernier

Country Status (5)

Country Link
US (1) US20160035493A1 (fr)
EP (1) EP2955733A4 (fr)
JP (1) JP2014154632A (fr)
CN (1) CN105122401A (fr)
WO (1) WO2014123182A1 (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106756781B (zh) * 2015-11-24 2019-03-01 中国科学院深圳先进技术研究院 一种仿生结构立方氮化硼涂层及其制备方法
KR20170083888A (ko) * 2016-01-11 2017-07-19 앰코 테크놀로지 코리아 주식회사 반도체 집적회로의 커패시터 및 그 제조 방법
CN105679785B (zh) * 2016-01-18 2018-11-27 苏州大学 一种基于多层氮化硼的rram器件及其制备方法
JP6889399B2 (ja) * 2017-08-08 2021-06-18 大日本印刷株式会社 貫通電極基板
CN110660582A (zh) * 2018-06-29 2020-01-07 浙江清华柔性电子技术研究院 柔性储能薄膜及其制备方法、薄膜电容器
CN110767473B (zh) * 2018-07-25 2022-06-03 浙江清华柔性电子技术研究院 柔性储能薄膜
CN109166730B (zh) * 2018-08-28 2020-05-22 西安交通大学 一种宽温高储能的无铅柔性的介电薄膜电容器及其制备方法
JP7396041B2 (ja) * 2019-12-27 2023-12-12 ニデックパワートレインシステムズ株式会社 モータ駆動用制御基板、及び電動オイルポンプ
EP4190505A1 (fr) * 2021-12-01 2023-06-07 Hilti Aktiengesellschaft Système comprenant une machine-outil et un dispositif d'alimentation en énergie, ainsi que dispositif d'alimentation en énergie
CN119164315B (zh) * 2024-11-25 2025-02-25 成都思越智能装备股份有限公司 一种板状产品载具变形检测装置及检测方法

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH207267A (de) * 1937-11-24 1939-10-15 Fides Gmbh Elektrischer Kondensator.
JPH06267783A (ja) * 1993-03-16 1994-09-22 Tokuyama Soda Co Ltd コンデンサー
JPH0884482A (ja) * 1994-09-09 1996-03-26 Nissin Electric Co Ltd インバータ装置
GB2373923A (en) * 2000-12-11 2002-10-02 Murata Manufacturing Co MIM capacitor for microwave ICs
US20030008455A1 (en) * 2001-06-12 2003-01-09 Kyong- Min Kim Method for fabricating capacitor of semiconductor memory device
JP2006210681A (ja) * 2005-01-28 2006-08-10 Nissin Electric Co Ltd 金属蒸着フィルムコンデンサ
US20070080388A1 (en) * 2005-10-11 2007-04-12 Daisuke Inomata Capacitor assembly
US20070159767A1 (en) * 2006-01-09 2007-07-12 Jamison Keith D Flexible dielectric film and method for making
US20080265371A1 (en) * 2007-04-26 2008-10-30 Park Jung-Min Capacitor Unit and Method of Forming the Same
US20100128410A1 (en) * 2008-11-24 2010-05-27 Kia Motors Corporaion Film capacitor
US20110233722A1 (en) * 2010-02-10 2011-09-29 Institute of Microelectronic, Chinese Academy of Sciences Capacitor structure and method of manufacture

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JP3684059B2 (ja) * 1998-01-07 2005-08-17 株式会社東芝 半導体装置
JP2001024167A (ja) * 1999-07-08 2001-01-26 Hitachi Ltd 半導体装置及びその製造方法
DE10002861A1 (de) * 2000-01-24 2001-08-09 Walter Ag Zerspannungswerkzeug mit Carbonitrid-Beschichtung
CN2433262Y (zh) * 2000-07-18 2001-06-06 湖南三才科技有限公司 多靶磁控溅射卷绕镀膜机
JP4211210B2 (ja) * 2000-09-08 2009-01-21 日本電気株式会社 コンデンサとその実装構造ならびにその製造方法、半導体装置およびその製造方法
US6570753B2 (en) 2001-05-25 2003-05-27 University Of Houston Capacitor and method of storing energy
JP4401070B2 (ja) * 2002-02-05 2010-01-20 ソニー株式会社 半導体装置内蔵多層配線基板及びその製造方法
JP4859333B2 (ja) * 2002-03-25 2012-01-25 セイコーエプソン株式会社 電子デバイス用基板の製造方法
KR100818058B1 (ko) * 2002-06-28 2008-03-31 매그나칩 반도체 유한회사 엠아이엠 캐패시터 형성방법
FR2855650B1 (fr) * 2003-05-30 2006-03-03 Soitec Silicon On Insulator Substrats pour systemes contraints et procede de croissance cristalline sur un tel substrat
JP4287826B2 (ja) * 2005-02-14 2009-07-01 Ｔｄｋ株式会社 キャパシタ及びその製造方法、それを用いたフィルタ、それに用いる誘電体薄膜
EP1691383A1 (fr) * 2005-02-14 2006-08-16 TDK Corporation Condensateur, méthode de fabrication, filtre l'utilisant et film diélectrique pour ce condensateur
US7473986B2 (en) * 2006-09-22 2009-01-06 Taiwan Semiconductor Manufacturing Co., Ltd. Positive-intrinsic-negative (PIN) diode semiconductor devices and fabrication methods thereof
JP5064094B2 (ja) * 2007-04-16 2012-10-31 パナソニック株式会社 半導体記憶装置およびその製造方法
JP2010103459A (ja) * 2008-09-24 2010-05-06 Alps Electric Co Ltd 圧電素子及び、前記圧電素子を備えた物理量センサ
JP5055246B2 (ja) * 2008-10-31 2012-10-24 日立オートモティブシステムズ株式会社 回転電機の制御装置
JP5334561B2 (ja) * 2008-12-22 2013-11-06 住友電気工業株式会社 表面被覆切削工具
JP4964268B2 (ja) * 2009-04-10 2012-06-27 住友電気工業株式会社 表面被覆切削工具
JP2012166207A (ja) * 2011-02-10 2012-09-06 Olympus Corp 金属の成形方法および成形用金型

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH207267A (de) * 1937-11-24 1939-10-15 Fides Gmbh Elektrischer Kondensator.
JPH06267783A (ja) * 1993-03-16 1994-09-22 Tokuyama Soda Co Ltd コンデンサー
JPH0884482A (ja) * 1994-09-09 1996-03-26 Nissin Electric Co Ltd インバータ装置
GB2373923A (en) * 2000-12-11 2002-10-02 Murata Manufacturing Co MIM capacitor for microwave ICs
US20030008455A1 (en) * 2001-06-12 2003-01-09 Kyong- Min Kim Method for fabricating capacitor of semiconductor memory device
JP2006210681A (ja) * 2005-01-28 2006-08-10 Nissin Electric Co Ltd 金属蒸着フィルムコンデンサ
US20070080388A1 (en) * 2005-10-11 2007-04-12 Daisuke Inomata Capacitor assembly
US20070159767A1 (en) * 2006-01-09 2007-07-12 Jamison Keith D Flexible dielectric film and method for making
US20080265371A1 (en) * 2007-04-26 2008-10-30 Park Jung-Min Capacitor Unit and Method of Forming the Same
US20100128410A1 (en) * 2008-11-24 2010-05-27 Kia Motors Corporaion Film capacitor
US20110233722A1 (en) * 2010-02-10 2011-09-29 Institute of Microelectronic, Chinese Academy of Sciences Capacitor structure and method of manufacture

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2014123182A1 *

Also Published As

Publication number Publication date
CN105122401A (zh) 2015-12-02
JP2014154632A (ja) 2014-08-25
WO2014123182A1 (fr) 2014-08-14
US20160035493A1 (en) 2016-02-04
EP2955733A1 (fr) 2015-12-16

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