EP2966136A4 - Haftfilm und verfahren zur herstellung einer organischen elektronischen vorrichtung damit - Google Patents

Haftfilm und verfahren zur herstellung einer organischen elektronischen vorrichtung damit

Info

Publication number
EP2966136A4
EP2966136A4 EP14833859.3A EP14833859A EP2966136A4 EP 2966136 A4 EP2966136 A4 EP 2966136A4 EP 14833859 A EP14833859 A EP 14833859A EP 2966136 A4 EP2966136 A4 EP 2966136A4
Authority
EP
European Patent Office
Prior art keywords
electronic device
same
adhesive film
organic electronic
manufacturing organic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP14833859.3A
Other languages
English (en)
French (fr)
Other versions
EP2966136B1 (de
EP2966136A1 (de
Inventor
Yoon Gyung Cho
Kyung Yul Bae
Hyun Jee Yoo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LG Chem Ltd
Original Assignee
LG Chem Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
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Application filed by LG Chem Ltd filed Critical LG Chem Ltd
Publication of EP2966136A1 publication Critical patent/EP2966136A1/de
Publication of EP2966136A4 publication Critical patent/EP2966136A4/de
Application granted granted Critical
Publication of EP2966136B1 publication Critical patent/EP2966136B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C09J123/02—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers not modified by chemical after-treatment
    • C09J123/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
    • C09J123/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
    • C09J123/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F255/00—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00
    • C08F255/08—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having four or more carbon atoms
    • C08F255/10—Macromolecular compounds obtained by polymerising monomers on to polymers of hydrocarbons as defined in group C08F10/00 on to polymers of olefins having four or more carbon atoms on to butene polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D151/00—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers
    • C09D151/04—Coating compositions based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Coating compositions based on derivatives of such polymers grafted on to rubbers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J123/00—Adhesives based on homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J145/00—Adhesives based on homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in a side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic system; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • C09J151/04—Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers grafted on to rubbers
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    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
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    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J7/00—Adhesives in the form of films or foils
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/841—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/151—Copolymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/40—Organosilicon compounds, e.g. TIPS pentacene
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10K99/00—Subject matter not provided for in other groups of this subclass
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    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
    • C09J2301/208—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive layer being constituted by at least two or more adjacent or superposed adhesive layers, e.g. multilayer adhesive
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/302—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier the adhesive being pressure-sensitive, i.e. tacky at temperatures inferior to 30°C
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/414—Additional features of adhesives in the form of films or foils characterized by the presence of essential components presence of a copolymer
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    • C09J2409/00—Presence of diene rubber
    • C—CHEMISTRY; METALLURGY
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    • C09J2415/00—Presence of rubber derivatives
    • C09J2415/003—Presence of rubber derivatives in the primer coating
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    • C09J2423/00—Presence of polyolefin
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    • C09J2423/00—Presence of polyolefin
    • C09J2423/003—Presence of polyolefin in the primer coating
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    • C09J2433/00—Presence of (meth)acrylic polymer
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    • C09J2433/00—Presence of (meth)acrylic polymer
    • C09J2433/003—Presence of (meth)acrylic polymer in the primer coating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2883—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer of diene monomer [e.g., SBR, SIS, etc.]

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Optics & Photonics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Wood Science & Technology (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Electroluminescent Light Sources (AREA)
  • Adhesive Tapes (AREA)
  • Polymerisation Methods In General (AREA)
  • Graft Or Block Polymers (AREA)
  • Sealing Material Composition (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
EP14833859.3A 2013-08-05 2014-08-05 Haftfilm und verfahren zur herstellung einer organischen elektronischen vorrichtung damit Active EP2966136B1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR20130092782 2013-08-05
KR1020140040826A KR20150016879A (ko) 2013-08-05 2014-04-04 점착제 조성물, 점착 필름 및 이를 이용한 유기전자장치의 봉지방법
PCT/KR2014/007238 WO2015020410A1 (ko) 2013-08-05 2014-08-05 점착 필름 및 이를 이용한 유기전자장치의 제조방법

Publications (3)

Publication Number Publication Date
EP2966136A1 EP2966136A1 (de) 2016-01-13
EP2966136A4 true EP2966136A4 (de) 2016-11-30
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Families Citing this family (59)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2876451B2 (ja) 1993-12-30 1999-03-31 興建産業株式会社 Ｌ形擁壁の構築工法
EP2803711B1 (de) * 2013-05-17 2018-06-27 3M Innovative Properties Company Druckempfindliche Haftklebstoffanordnung mit einem Füllmaterial
KR20150016877A (ko) * 2013-08-05 2015-02-13 주식회사 엘지화학 점착제 조성물, 점착 필름 및 이를 이용한 유기전자장치의 봉지방법
JP6152319B2 (ja) * 2013-08-09 2017-06-21 日東電工株式会社 粘着剤組成物、粘着テープ又はシート
TWI575052B (zh) * 2015-02-04 2017-03-21 Ｌｇ化學股份有限公司 封裝膜
KR101740183B1 (ko) * 2015-03-24 2017-05-25 주식회사 엘지화학 접착제 조성물
KR102056598B1 (ko) * 2015-09-25 2019-12-17 주식회사 엘지화학 점착제 조성물
KR102034441B1 (ko) * 2015-09-25 2019-10-21 주식회사 엘지화학 점착제 조성물
JP6867126B2 (ja) * 2015-11-04 2021-04-28 日東電工株式会社 粘着剤層付き偏光板、画像表示装置、偏光板の貼り合わせ方法、および粘着剤層付き偏光板の製造方法
KR20170061227A (ko) 2015-11-25 2017-06-05 삼성디스플레이 주식회사 유기막 형성용 조성물 및 이의 경화물을 포함한 전자 장치
KR101693797B1 (ko) * 2015-12-29 2017-01-09 주식회사 이녹스 유기전자장치 봉지재용 점착필름 및 이를 포함하는 봉지재
KR102494986B1 (ko) 2016-01-11 2023-02-03 삼성디스플레이 주식회사 폴더블 표시장치
KR102069936B1 (ko) * 2016-04-29 2020-01-23 주식회사 엘지화학 발열체
KR101720932B1 (ko) 2016-05-04 2017-03-29 (주)리버앤씨 데이터 로거를 구비하는 해저계류장치
KR101887993B1 (ko) * 2016-07-27 2018-08-13 주식회사 엘지화학 광경화 수지 조성물 및 이의 용도
CN109661431B (zh) * 2016-12-09 2021-09-21 株式会社Lg化学 封装组合物
JP6625079B2 (ja) * 2017-02-14 2019-12-25 アイカ工業株式会社 封止樹脂組成物
CN110431174A (zh) 2017-03-22 2019-11-08 三菱化学株式会社 固化性组合物、片、使用其的层叠体、图像显示装置
JP7010597B2 (ja) * 2017-03-30 2022-01-26 リンテック株式会社 粘着剤組成物、封止シート、及び封止体
US9960389B1 (en) 2017-05-05 2018-05-01 3M Innovative Properties Company Polymeric films and display devices containing such films
KR101936600B1 (ko) * 2017-07-06 2019-01-09 (주)이녹스첨단소재 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재
KR101961700B1 (ko) * 2017-08-08 2019-03-25 (주)이녹스첨단소재 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재
KR101961699B1 (ko) * 2017-08-08 2019-03-25 (주)이녹스첨단소재 유기전자장치용 접착필름 및 이를 포함하는 유기전자장치용 봉지재
JP7170387B2 (ja) * 2017-08-21 2022-11-14 リンテック株式会社 粘着シートおよび表示体
KR101962193B1 (ko) * 2017-08-22 2019-03-26 (주)이녹스첨단소재 유기전자장치 봉지재용 접착필름 및 이를 포함하는 유기전자장치용 봉지재
US11795314B2 (en) 2017-09-12 2023-10-24 Lg Chem, Ltd. Encapsulating composition
KR102283118B1 (ko) * 2017-11-01 2021-07-28 주식회사 엘지화학 유-무기 복합 태양전지 및 유-무기 복합 태양전지 제조방법
KR102190867B1 (ko) 2017-11-17 2020-12-14 주식회사 엘지화학 폼 조성물 및 이의 경화물을 포함하는 폼층을 포함하는 폼 테이프
KR20190065662A (ko) * 2017-12-04 2019-06-12 주식회사 케이씨씨 접착제 키트, 이를 포함하는 접착필름 및 봉지재, 및 유기전자장치의 봉지방법
EP3725860B1 (de) * 2017-12-18 2024-07-03 Lg Chem, Ltd. Verkapselungszusammensetzung
KR102212139B1 (ko) * 2018-01-11 2021-02-03 주식회사 엘지화학 온도가변형 점착 시트 및 이를 이용한 온도가변형 점착 시트 제조방법
TWI708819B (zh) * 2018-06-14 2020-11-01 香港商創王(香港)股份有限公司 顯示裝置及其製造方法
US11643494B2 (en) 2018-07-12 2023-05-09 3M Innovative Properties Company Composition comprising styrene isobutylene block copolymer and ethylenically unsaturated monomer
CN109439262B (zh) * 2018-10-29 2021-04-23 常州浩阳水性新材料有限公司 一种pvc带胶膜用胶水及其制备方法
EP3884007A4 (de) 2018-11-20 2022-07-27 Oregon State University Uv-strahlungsgehärtete druckempfindliche klebstoffe aus pflanzlichen ölen oder tierischen fetten
US12534593B2 (en) 2018-12-07 2026-01-27 Lg Chem, Ltd. Encapsulation composition
KR102208996B1 (ko) * 2019-02-13 2021-01-28 서울대학교산학협력단 내열성이 향상된 유사-상호침투 중합체 네트워크 구조의 고무 점착 필름, 이의 제조방법 및 이를 포함하는 점착 필름
JP7317133B2 (ja) * 2019-02-28 2023-07-28 エルジー・ケム・リミテッド 封止フィルム
CA3140966A1 (en) 2019-05-31 2020-12-03 Oregon State University Pressure sensitive adhesives made from uv curing of plant oil-based polyesters
KR102059172B1 (ko) * 2019-07-04 2019-12-24 (주)이녹스첨단소재 유기전자장치 봉지재용 접착필름 및 이를 포함하는 유기전자장치용 봉지재
US12577724B2 (en) 2019-10-22 2026-03-17 DetraPel, Inc. Nonfluorinated hydrophobic waterborne treatments and coatings
CN110752312A (zh) * 2019-10-30 2020-02-04 京东方科技集团股份有限公司 一种显示面板、其制作方法及显示装置
CN110776832A (zh) * 2019-11-07 2020-02-11 广州市永隆新材料研究院有限公司 一种遮盖压敏胶及其制备方法与应用
CN110828707A (zh) * 2019-11-19 2020-02-21 京东方科技集团股份有限公司 显示基板的制备方法和离型层材料
KR102764483B1 (ko) * 2019-12-09 2025-02-05 주식회사 엘지화학 아크릴 계 에멀젼 점착제 조성물
KR102349088B1 (ko) * 2020-01-29 2022-01-12 주식회사 오플렉스 백플레이트 필름 및 이를 이용한 플렉서블 표시장치
KR102240907B1 (ko) * 2020-02-28 2021-04-15 (주)이녹스첨단소재 디스플레이용 점착 시트
TWI774184B (zh) 2020-03-18 2022-08-11 日商日本航空電子工業股份有限公司 可薄型化半導體裝置及其製造方法
KR102954798B1 (ko) * 2020-07-14 2026-04-22 삼성전자주식회사 가공 테이프 및 이를 사용한 반도체 장치 제조 방법
JP7591885B2 (ja) 2020-08-03 2024-11-29 日本航空電子工業株式会社 デバイス
KR20230153366A (ko) * 2021-03-03 2023-11-06 도요보 가부시키가이샤 적층 필름, 적층 필름의 제조 방법, 적층체, 및 적층체의 제조 방법
US20240002567A1 (en) * 2021-08-30 2024-01-04 Lg Chem, Ltd. Antibacterial Polymer, and Antibacterial Polymer Film Comprising the Same
KR102804724B1 (ko) * 2021-12-01 2025-05-12 주식회사 엘지화학 봉지 필름
JP2024535907A (ja) * 2021-12-01 2024-10-02 エルジー・ケム・リミテッド 封止フィルム
WO2023132664A1 (ko) * 2022-01-06 2023-07-13 주식회사 엘지화학 점착제
KR102891645B1 (ko) * 2022-01-28 2025-11-27 주식회사 엘지화학 봉지 필름
KR102804723B1 (ko) * 2022-01-28 2025-05-12 주식회사 엘지화학 봉지 필름
WO2024187026A2 (en) * 2023-03-07 2024-09-12 DetraPel, Inc. Polymer composition and method of making
KR20260055765A (ko) * 2024-10-17 2026-04-24 도레이첨단소재 주식회사 봉지용 점착 필름 및 그 제조방법

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6092343A (ja) * 1983-10-27 1985-05-23 Sumitomo Chem Co Ltd 低温加硫方法
WO2006107748A1 (en) * 2005-04-04 2006-10-12 National Starch And Chemical Investment Holding Corporation Radiation-curable desiccant-filled adhesive/sealant
WO2007111607A1 (en) * 2006-03-29 2007-10-04 National Starch And Chemical Investment Radiation-curable rubber adhesive/sealant
WO2008144080A1 (en) * 2007-05-18 2008-11-27 Henkel Ag & Co. Kgaa Organic electronic devices protected by elastomeric laminating adhesive
WO2013057264A1 (de) * 2011-10-21 2013-04-25 Tesa Se Klebemasse insbesondere zur kapselung einer elektronischen anordnung
EP2610319A1 (de) * 2010-08-27 2013-07-03 Nitto Denko Corporation Acrylklebstoffzusammensetzung, acrylklebeschicht und acrylklebeband
WO2015129625A1 (ja) * 2014-02-25 2015-09-03 リンテック株式会社 接着剤組成物、接着シート及び電子デバイス

Family Cites Families (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4133731A (en) * 1978-03-03 1979-01-09 Shell Oil Company Radiation cured, high temperature adhesive composition
JPS60104142A (ja) * 1983-11-10 1985-06-08 Nippon Zeon Co Ltd 粘着剤組成物
KR910004643B1 (ko) * 1987-10-31 1991-07-09 고려화학 주식회사 고분자 수지재의 반도체봉지용 충격완화제 제조방법
JP2706285B2 (ja) 1988-12-23 1998-01-28 関西ペイント株式会社 活性エネルギー線硬化型組成物
US5393841A (en) * 1993-11-09 1995-02-28 Shell Oil Company Dissimilar arm asymmetric radial or star block copolymers for adhesives and sealants
US6093757A (en) * 1995-12-19 2000-07-25 Midwest Research Institute Composition and method for encapsulating photovoltaic devices
JPH1046125A (ja) * 1996-08-01 1998-02-17 Nippon Synthetic Chem Ind Co Ltd:The 粘着剤組成物
JP3918887B2 (ja) * 1997-07-07 2007-05-23 株式会社ブリヂストン 電子デバイス用封止フィルム
JPH11199837A (ja) * 1998-01-06 1999-07-27 Sekisui Chem Co Ltd 粘着テープおよびそれを用いた壁施工方法
JP3260349B2 (ja) * 2000-06-05 2002-02-25 松下電器産業株式会社 電気化学素子用封止剤およびそれを用いた電気化学素子
CA2447302C (en) * 2001-05-01 2008-07-29 A.V. Topchiev Institute Of Petrochemical Synthesis Two-phase, water-absorbent bioadhesive composition
CN1678639A (zh) * 2002-07-24 2005-10-05 粘合剂研究公司 可转换的压敏粘合剂胶带及其在显示屏上的用途
JP4243939B2 (ja) * 2002-09-17 2009-03-25 日東ライフテック株式会社 カイロ用粘着部材およびそれを用いたカイロ
JP2004307579A (ja) 2003-04-03 2004-11-04 Mitsubishi Chemicals Corp 活性エネルギー線硬化性コーティング剤組成物及び該組成物から得られる硬化皮膜を有する成形品
US7479653B2 (en) * 2003-12-04 2009-01-20 Henkel Ag & Co Kgaa UV curable protective encapsulant
JP2005261453A (ja) * 2004-03-16 2005-09-29 Nitto Lifetech Kk 紙おむつ内面用粘着シートおよび紙おむつ
JP4459138B2 (ja) 2004-09-13 2010-04-28 富士フイルム株式会社 熱現像感光材料を用いた画像形成方法
DE102004058282A1 (de) * 2004-12-02 2006-06-08 Tesa Ag Doppelseitige Haftklebebänder zur Herstellung von LC-Displays mit lichtreflektierenden und absorbierenden Eigenschaften
JP3916638B2 (ja) * 2004-12-02 2007-05-16 日東電工株式会社 粘着型光学フィルムおよび画像表示装置
JP2006309114A (ja) * 2005-03-30 2006-11-09 Lintec Corp 偏光板用粘着剤、粘着剤付き偏光板及びその製造方法
JP2006276671A (ja) * 2005-03-30 2006-10-12 Canon Inc 光学機器
CN1872933A (zh) * 2005-03-30 2006-12-06 琳得科株式会社 起偏振片用压敏粘合剂和起偏振片及起偏振片的制备方法
US7687119B2 (en) 2005-04-04 2010-03-30 Henkel Ag & Co. Kgaa Radiation-curable desiccant-filled adhesive/sealant
KR101263393B1 (ko) * 2005-07-15 2013-05-21 삼성전자주식회사 유피앤피 에이브이 스트림 전송 방법 및 장치
JP4122033B2 (ja) * 2005-10-21 2008-07-23 横浜ゴム株式会社 変性ブチルゴム組成物
JP2007197517A (ja) * 2006-01-24 2007-08-09 Three M Innovative Properties Co 接着性封止組成物、封止フィルム及び有機ｅｌ素子
KR100813217B1 (ko) * 2006-03-16 2008-03-13 재단법인서울대학교산학협력재단 Ｓｅｍｉ-ＩＰＮ 구조 형성에 의한 ＵＶ 경화형 아크릴점착제 점착물성 개선방법
JP2007262309A (ja) 2006-03-29 2007-10-11 Sekisui Plastics Co Ltd 高分子ゲル、該ゲル製造用組成物及び粘着テープ
JP5043025B2 (ja) * 2006-09-26 2012-10-10 リンテック株式会社 剥離シートおよび粘着体
KR101000565B1 (ko) * 2007-02-02 2010-12-14 주식회사 엘지화학 점착제 조성물, 이를 이용한 광학 필터 및 플라즈마디스플레이 패널 표시 장치
JP2009096856A (ja) * 2007-10-16 2009-05-07 Bridgestone Corp ゴム組成物及びそれを用いた重荷重用空気入りラジアルタイヤ
KR101023842B1 (ko) * 2008-01-11 2011-03-22 주식회사 엘지화학 점착제 조성물, 상기를 포함하는 편광판 및 액정표시장치
JP5704541B2 (ja) * 2008-04-21 2015-04-22 エルジー・ケム・リミテッド 粘着剤組成物と、これを含む偏光板及び液晶表示装置
JP2009267020A (ja) * 2008-04-24 2009-11-12 Nitto Denko Corp 太陽電池パネル用粘着シート、該粘着シートを用いてなる太陽電池パネルおよび該粘着シートを用いた太陽電池パネルの製造方法
EP2291477B1 (de) 2008-06-02 2016-03-23 3M Innovative Properties Company Adhäsives verkapselungsmittel und damit hergestellte elektronische bauteile
JP5270755B2 (ja) * 2008-06-02 2013-08-21 スリーエム イノベイティブ プロパティズ カンパニー 接着剤封入組成物及びそれで作られた電子デバイス
JP2010132761A (ja) * 2008-12-04 2010-06-17 Tosoh Corp 粘着剤組成物
JP5455362B2 (ja) * 2008-12-25 2014-03-26 チェイル インダストリーズ インコーポレイテッド 粘着剤組成物およびこれを用いた光学部材
US8368218B2 (en) * 2009-01-14 2013-02-05 Dow Corning Corporation Adhesive flexible barrier film, method of forming same, and organic electronic device including same
KR101075192B1 (ko) 2009-03-03 2011-10-21 도레이첨단소재 주식회사 전자부품 제조용 점착테이프
JP2010209168A (ja) * 2009-03-09 2010-09-24 Lintec Corp 粘着シート
DE102009012272B4 (de) * 2009-03-11 2011-06-09 Wellmann, Stefanie, Dr. Dual härtende UV-Klebstoffe und deren Verwendungen
US20120258305A1 (en) * 2010-01-21 2012-10-11 Nitto Denko Corporation Transparent film and use thereof
JP5495906B2 (ja) * 2010-04-06 2014-05-21 東亞合成株式会社 光硬化性接着剤組成物、偏光板とその製造法、光学部材及び液晶表示装置
US20130040137A1 (en) * 2010-04-20 2013-02-14 Nitto Denko Corporation Water-dispersible acrylic pressure-sensitive adhesive composition and pressure-sensitive adhesive sheet
JP2011236298A (ja) * 2010-05-07 2011-11-24 Bridgestone Corp 接着性組成物、フレキシブル情報表示パネル及びフレキシブル情報表示パネルの製造方法
JP5593175B2 (ja) * 2010-09-09 2014-09-17 リンテック株式会社 封止用粘着シート、電子デバイス、及び有機デバイス
CN104882564B (zh) 2010-11-02 2019-07-12 Lg化学株式会社 粘合膜和使用其包封有机电子装置的方法
KR101576689B1 (ko) * 2010-11-24 2015-12-10 (주)엘지하우시스 터치패널용 점착제 조성물, 점착필름 및 터치패널
JP6097474B2 (ja) 2010-12-13 2017-03-15 日東電工株式会社 光学フィルム用粘着剤組成物、光学フィルム用粘着剤層、粘着型光学フィルム、および画像表示装置
JP6097473B2 (ja) 2010-12-13 2017-03-15 日東電工株式会社 光学フィルム用粘着剤組成物、光学フィルム用粘着剤層、粘着型光学フィルム、および画像表示装置
KR101362879B1 (ko) 2010-12-31 2014-02-14 제일모직주식회사 편광판용 점착제 조성물
WO2013028047A2 (ko) * 2011-08-25 2013-02-28 주식회사 엘지화학 점착제
TWI437343B (zh) * 2011-09-14 2014-05-11 Hon Hai Prec Ind Co Ltd 取像鏡頭遮光罩結構
JP5945393B2 (ja) * 2011-09-30 2016-07-05 日東電工株式会社 粘着シート
KR102073114B1 (ko) * 2011-10-24 2020-02-04 쓰리엠 이노베이티브 프로퍼티즈 컴파니 미세구조화된 광학 투명 접착제
KR101459125B1 (ko) 2011-12-07 2014-11-07 제일모직주식회사 광경화형 점착제 조성물 및 이를 포함하는 디스플레이 장치
EP2781568B1 (de) 2011-11-14 2018-02-21 LG Chem, Ltd. Haftfilm und verfahren zum einkapseln einer organischen elektronischen vorrichtung damit
WO2013073902A1 (ko) * 2011-11-18 2013-05-23 주식회사 엘지화학 유기전자장치 봉지용 광경화형 점접착 필름, 유기전자장치 및 그의 봉지 방법
TWI582202B (zh) 2011-11-18 2017-05-11 Ｌｇ化學股份有限公司 用於封裝有機電子裝置之光可硬化壓感性黏著膜、有機電子裝置及用於封裝有機電子裝置之方法
JP2013120804A (ja) * 2011-12-06 2013-06-17 Daicel Corp シート状カバリング剤、カバリング方法又は電子デバイスの製造方法
TWI521030B (zh) 2011-12-21 2016-02-11 Ｌｇ化學股份有限公司 壓感性黏著劑組成物
TWI549820B (zh) * 2012-01-06 2016-09-21 Ｌｇ化學股份有限公司 包封用膜
JP2015529344A (ja) 2012-08-27 2015-10-05 エルジー・ケム・リミテッド 偏光板
US20150240133A1 (en) * 2012-10-29 2015-08-27 Lintec Corporation Adhesive agent composition and adhesive sheet
KR20150016877A (ko) * 2013-08-05 2015-02-13 주식회사 엘지화학 점착제 조성물, 점착 필름 및 이를 이용한 유기전자장치의 봉지방법
KR101758418B1 (ko) * 2013-08-27 2017-07-14 주식회사 엘지화학 내구성이 우수한 고무계 점착제 조성물
EP2921528B1 (de) * 2013-09-24 2025-08-06 LG Chem, Ltd. Selbsthaftendes klebstoffmischung
JP6410066B2 (ja) * 2014-03-27 2018-10-24 エルジー・ケム・リミテッド 封止フィルム及びこれを含む有機電子装置
US20160100299A1 (en) * 2014-10-04 2016-04-07 Piotr Nawrocki Communication Method And System To Process And Control The Legality Of Products
US9698374B2 (en) * 2014-11-12 2017-07-04 Lg Chem, Ltd. Pressure sensitive adhesive film
TWI575052B (zh) * 2015-02-04 2017-03-21 Ｌｇ化學股份有限公司 封裝膜
KR101746333B1 (ko) * 2015-03-24 2017-06-12 주식회사 엘지화학 접착제 조성물
TWI603318B (zh) * 2016-02-01 2017-10-21 于詠為 Piano

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6092343A (ja) * 1983-10-27 1985-05-23 Sumitomo Chem Co Ltd 低温加硫方法
WO2006107748A1 (en) * 2005-04-04 2006-10-12 National Starch And Chemical Investment Holding Corporation Radiation-curable desiccant-filled adhesive/sealant
WO2007111607A1 (en) * 2006-03-29 2007-10-04 National Starch And Chemical Investment Radiation-curable rubber adhesive/sealant
WO2008144080A1 (en) * 2007-05-18 2008-11-27 Henkel Ag & Co. Kgaa Organic electronic devices protected by elastomeric laminating adhesive
EP2610319A1 (de) * 2010-08-27 2013-07-03 Nitto Denko Corporation Acrylklebstoffzusammensetzung, acrylklebeschicht und acrylklebeband
WO2013057264A1 (de) * 2011-10-21 2013-04-25 Tesa Se Klebemasse insbesondere zur kapselung einer elektronischen anordnung
WO2015129625A1 (ja) * 2014-02-25 2015-09-03 リンテック株式会社 接着剤組成物、接着シート及び電子デバイス

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2015020410A1 *

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US10336917B2 (en) 2019-07-02
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US20150299523A1 (en) 2015-10-22
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US9803112B2 (en) 2017-10-31
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US20160046841A1 (en) 2016-02-18
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