EP2980832A4 - Markierungsformungsverfahren, markierungserkennungsverfahren und vorrichtungsherstellungsverfahren - Google Patents

Markierungsformungsverfahren, markierungserkennungsverfahren und vorrichtungsherstellungsverfahren Download PDF

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Publication number
EP2980832A4
EP2980832A4 EP14774072.4A EP14774072A EP2980832A4 EP 2980832 A4 EP2980832 A4 EP 2980832A4 EP 14774072 A EP14774072 A EP 14774072A EP 2980832 A4 EP2980832 A4 EP 2980832A4
Authority
EP
European Patent Office
Prior art keywords
mark
device manufacturing
mark detecting
mark forming
forming method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP14774072.4A
Other languages
English (en)
French (fr)
Other versions
EP2980832A1 (de
Inventor
Yuji Shiba
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikon Corp
Original Assignee
Nikon Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corp filed Critical Nikon Corp
Publication of EP2980832A1 publication Critical patent/EP2980832A1/de
Publication of EP2980832A4 publication Critical patent/EP2980832A4/de
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
    • G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7073—Alignment marks and their environment
    • G03F9/708—Mark formation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/69—Etching of wafers, substrates or parts of devices using masks for semiconductor materials
    • H10P50/691—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group IV materials or Group III-V materials
    • H10P50/693—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group IV materials or Group III-V materials characterised by their size, orientation, disposition, behaviour or shape, in horizontal or vertical plane
    • H10P50/695—Etching of wafers, substrates or parts of devices using masks for semiconductor materials for Group IV materials or Group III-V materials characterised by their size, orientation, disposition, behaviour or shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks or sidewalls or to modify the mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H10P76/2041—Photolithographic processes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/101—Marks applied to devices, e.g. for alignment or identification characterised by the type of information, e.g. logos or symbols
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/301—Marks applied to devices, e.g. for alignment or identification for alignment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W46/00—Marks applied to devices, e.g. for alignment or identification
    • H10W46/501—Marks applied to devices, e.g. for alignment or identification for use before dicing
    • H10W46/503—Located in scribe lines

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Length Measuring Devices By Optical Means (AREA)
EP14774072.4A 2013-03-27 2014-03-25 Markierungsformungsverfahren, markierungserkennungsverfahren und vorrichtungsherstellungsverfahren Withdrawn EP2980832A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013067696 2013-03-27
PCT/JP2014/058393 WO2014157262A1 (ja) 2013-03-27 2014-03-25 マーク形成方法、マーク検出方法、及びデバイス製造方法

Publications (2)

Publication Number Publication Date
EP2980832A1 EP2980832A1 (de) 2016-02-03
EP2980832A4 true EP2980832A4 (de) 2017-03-01

Family

ID=51624228

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14774072.4A Withdrawn EP2980832A4 (de) 2013-03-27 2014-03-25 Markierungsformungsverfahren, markierungserkennungsverfahren und vorrichtungsherstellungsverfahren

Country Status (8)

Country Link
US (2) US9972574B2 (de)
EP (1) EP2980832A4 (de)
JP (2) JP6269982B2 (de)
KR (2) KR101951989B1 (de)
CN (1) CN105378892B (de)
HK (2) HK1219174A1 (de)
TW (1) TWI672788B (de)
WO (1) WO2014157262A1 (de)

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JP2015015424A (ja) * 2013-07-08 2015-01-22 株式会社東芝 位置合わせマーク、フォトマスク、および位置合わせマークの形成方法
CN107924844B (zh) * 2016-03-24 2021-07-20 东京毅力科创株式会社 半导体装置的制造方法
US11056410B2 (en) * 2017-03-31 2021-07-06 National Institute Of Advanced Industrial Science And Technology Method of manufacturing semiconductor package using alignment mark on wafer
US10103166B1 (en) 2017-04-10 2018-10-16 Macronix International Co., Ltd. Semiconductor device and critical dimension defining method thereof
US10705435B2 (en) * 2018-01-12 2020-07-07 Globalfoundries Inc. Self-referencing and self-calibrating interference pattern overlay measurement
CN108899288B (zh) * 2018-07-20 2020-11-13 上海华虹宏力半导体制造有限公司 晶圆标记的监控方法和激光刻号机台对准位置的判定方法
KR102498631B1 (ko) * 2018-08-16 2023-02-10 주식회사 엘지화학 패턴화 기판의 제조 방법
JP2020041859A (ja) * 2018-09-07 2020-03-19 キオクシア株式会社 位置計測方法、位置計測装置および半導体装置の製造方法
KR102629290B1 (ko) 2018-12-13 2024-01-29 삼성디스플레이 주식회사 표시 장치 제조 방법
TW202027189A (zh) * 2019-01-07 2020-07-16 力晶積成電子製造股份有限公司 晶粒的標記方法、晶圓及晶粒
TWI699580B (zh) * 2019-03-07 2020-07-21 友達光電股份有限公司 陣列基板
TWI786554B (zh) * 2020-02-27 2022-12-11 台灣積體電路製造股份有限公司 疊對誤差量測方法及疊對誤差量測結構
CN111314391B (zh) * 2020-03-31 2022-03-08 四川九强通信科技有限公司 基于区块链的卫星网络安全路由方法
TWI736317B (zh) * 2020-06-12 2021-08-11 華邦電子股份有限公司 用於黃光製程的辨識方法與半導體元件
CN113871290B (zh) * 2020-06-30 2025-05-13 华邦电子股份有限公司 用于光刻工艺的识别方法与半导体元件
JP7607423B2 (ja) * 2020-09-23 2024-12-27 キヤノン株式会社 リソグラフィ装置の制御方法、リソグラフィ装置、および物品製造方法
KR102860314B1 (ko) 2021-10-08 2025-09-16 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
US12265335B2 (en) * 2022-09-21 2025-04-01 Micron Technology, Inc. Alignment-overlay mark and method using the same

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WO2011151109A1 (en) * 2010-06-04 2011-12-08 Asml Netherlands B.V. Self-assemblable polymer and method for use in lithography

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Also Published As

Publication number Publication date
US20160079179A1 (en) 2016-03-17
JP6269982B2 (ja) 2018-01-31
EP2980832A1 (de) 2016-02-03
HK1219174A1 (en) 2017-03-24
CN105378892B (zh) 2018-05-08
US9972574B2 (en) 2018-05-15
US20180182713A1 (en) 2018-06-28
HK1220544A1 (zh) 2017-05-05
TWI672788B (zh) 2019-09-21
TW201508893A (zh) 2015-03-01
KR20190018560A (ko) 2019-02-22
JPWO2014157262A1 (ja) 2017-02-16
JP2018078321A (ja) 2018-05-17
KR20150136503A (ko) 2015-12-07
JP6687910B2 (ja) 2020-04-28
CN105378892A (zh) 2016-03-02
WO2014157262A1 (ja) 2014-10-02
US10354959B2 (en) 2019-07-16
KR101951989B1 (ko) 2019-02-25

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