EP2994809A4 - Système et procédé de conditionnement de ressources informatiques garantissant de l'espace et une résistance au feu - Google Patents
Système et procédé de conditionnement de ressources informatiques garantissant de l'espace et une résistance au feu Download PDFInfo
- Publication number
- EP2994809A4 EP2994809A4 EP14795158.6A EP14795158A EP2994809A4 EP 2994809 A4 EP2994809 A4 EP 2994809A4 EP 14795158 A EP14795158 A EP 14795158A EP 2994809 A4 EP2994809 A4 EP 2994809A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- fire
- resistance
- space
- computing resources
- packaging computing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20781—Liquid cooling without phase change within cabinets for removing heat from server blades
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Human Computer Interaction (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361854949P | 2013-05-06 | 2013-05-06 | |
| PCT/US2014/037005 WO2014182724A1 (fr) | 2013-05-06 | 2014-05-06 | Système et procédé de conditionnement de ressources informatiques garantissant de l'espace et une résistance au feu |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP2994809A1 EP2994809A1 (fr) | 2016-03-16 |
| EP2994809A4 true EP2994809A4 (fr) | 2017-01-11 |
| EP2994809B1 EP2994809B1 (fr) | 2019-08-28 |
Family
ID=51867694
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP14795158.6A Active EP2994809B1 (fr) | 2013-05-06 | 2014-05-06 | Système et procédé de conditionnement de ressources informatiques garantissant de l'espace et une résistance au feu |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US9504190B2 (fr) |
| EP (1) | EP2994809B1 (fr) |
| AU (1) | AU2014262796A1 (fr) |
| CA (1) | CA2914797A1 (fr) |
| WO (1) | WO2014182724A1 (fr) |
Families Citing this family (59)
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| US9504190B2 (en) * | 2013-05-06 | 2016-11-22 | Green Revolution Cooling, Inc. | System and method of packaging computing resources for space and fire-resistance |
| US9756766B2 (en) | 2014-05-13 | 2017-09-05 | Green Revolution Cooling, Inc. | System and method for air-cooling hard drives in liquid-cooled server rack |
| WO2017002270A1 (fr) | 2015-07-02 | 2017-01-05 | 株式会社ＥｘａＳｃａｌｅｒ | Dispositif de refroidissement par immersion dans un liquide |
| JP6565611B2 (ja) * | 2015-11-04 | 2019-08-28 | 富士通株式会社 | 情報処理装置 |
| JP6127217B1 (ja) * | 2015-11-11 | 2017-05-10 | 株式会社ＥｘａＳｃａｌｅｒ | 電子機器の冷却システム |
| WO2017081780A1 (fr) * | 2015-11-11 | 2017-05-18 | 株式会社ＥｘａＳｃａｌｅｒ | Système de refroidissement de dispositif électronique |
| NL2015841B1 (en) * | 2015-11-23 | 2017-06-07 | Aecorsis B V | A device comprising heat producing components with liquid submersion cooling. |
| JP6652018B2 (ja) * | 2016-09-01 | 2020-02-19 | 富士通株式会社 | 液浸槽及び液浸冷却装置 |
| JP6790690B2 (ja) * | 2016-10-04 | 2020-11-25 | 富士通株式会社 | 情報処理システム、及び情報処理システムの制御方法 |
| RU2663213C2 (ru) * | 2017-01-27 | 2018-08-02 | Сергей Михайлович Абрамов | Устройство для охлаждения изделий электронной техники |
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| JP2019091348A (ja) * | 2017-11-16 | 2019-06-13 | 富士通株式会社 | 情報処理装置 |
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| CN113647204B (zh) * | 2018-11-16 | 2024-11-22 | 摩丁有限责任公司 | 液体浸没冷却平台 |
| US11856727B2 (en) * | 2019-03-13 | 2023-12-26 | Submer Technologies, S.L. | Cooling system for computer components |
| CA3139776A1 (fr) | 2019-05-15 | 2020-11-19 | Upstream Data Inc. | Systeme de minage de chaine de blocs portable et procedes d'utilisation |
| US10750637B1 (en) * | 2019-10-24 | 2020-08-18 | Microsoft Technology Licensing, Llc | Immersion cooling infrastructure module having compute device form factor |
| US11074943B2 (en) | 2019-11-11 | 2021-07-27 | Seagate Technology Llc | Methods and devices for alleviating thermal boil off in immersion-cooled electronic devices |
| US11160194B2 (en) * | 2019-11-14 | 2021-10-26 | Liquidstack Holding B.V. | Hot swap condensor for immersion cooling |
| CN111194155B (zh) * | 2019-12-18 | 2021-10-12 | 深圳市迅凌科技有限公司 | 水冷头、水冷散热器以及电子设备 |
| US20230037391A1 (en) * | 2020-01-23 | 2023-02-09 | Ivan KIRILLOV | Cooling bath for multiprocessor circuit boards |
| CA3076653A1 (fr) | 2020-03-21 | 2021-09-21 | Upstream Data Inc. | Systemes d`exploration de la chaine de blocs et methodes d`utilisation |
| US11069383B1 (en) | 2020-04-06 | 2021-07-20 | Seagate Technology Llc | Thermal interface materials for immersion cooled data storage devices |
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| AU2020459333A1 (en) * | 2020-07-20 | 2022-05-26 | Ivan Kirillov | Fast flow cooling bath for multiprocessor circuit boards |
| USD982145S1 (en) * | 2020-10-19 | 2023-03-28 | Green Revolution Cooling, Inc. | Cooling system enclosure |
| USD998770S1 (en) * | 2020-10-19 | 2023-09-12 | Green Revolution Cooling, Inc. | Cooling system enclosure |
| US12389566B2 (en) * | 2020-11-12 | 2025-08-12 | Green Revolution Cooling, Inc. | Multi-rack immersion cooling distribution system |
| US12035508B2 (en) * | 2020-12-29 | 2024-07-09 | Modine LLC | Liquid immersion cooling platform and components thereof |
| US20210185850A1 (en) * | 2021-02-25 | 2021-06-17 | Intel Corporation | Hybrid liquid cooling |
| CA3113022A1 (fr) | 2021-03-23 | 2022-09-23 | Stephane Gauthier | Systeme de chauffage utilisant la chaleur extraite d'une unite de traitement par ordinateur |
| US11729950B2 (en) | 2021-04-01 | 2023-08-15 | Ovh | Immersion cooling system with dual dielectric cooling liquid circulation |
| WO2022208404A1 (fr) | 2021-04-01 | 2022-10-06 | Ovh | Structure de ciseaux pour la gestion de câbles/tubes d'ensembles électroniques refroidis par liquide montés sur bâti |
| EP4068930B1 (fr) | 2021-04-01 | 2024-03-13 | Ovh | Système de rayonnage pour loger un dispositif électronique |
| US11924998B2 (en) | 2021-04-01 | 2024-03-05 | Ovh | Hybrid immersion cooling system for rack-mounted electronic assemblies |
| US12137536B2 (en) | 2021-04-01 | 2024-11-05 | Ovh | Systems and methods for autonomously activable redundant cooling of a heat generating component |
| EP4068928B1 (fr) | 2021-04-01 | 2024-01-31 | Ovh | Dispositif de refroidissement |
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| US11696423B2 (en) * | 2021-05-06 | 2023-07-04 | Tyco Fire & Security Gmbh | Liquid immersion cooling tank with variable flow for high density computer server equipment |
| US12010820B2 (en) * | 2021-09-15 | 2024-06-11 | Modine LLC | Liquid immersion cooling platform and components thereof |
| US11805624B2 (en) | 2021-09-17 | 2023-10-31 | Green Revolution Cooling, Inc. | Coolant shroud |
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| US12049239B2 (en) | 2021-11-12 | 2024-07-30 | Modine LLC | Distributed computing network comprised of autonomous vehicles carrying liquid immersion cooling platforms |
| US12477684B1 (en) | 2022-03-07 | 2025-11-18 | Rhodium Technologies LLC | Fluid circulation systems and cooling facilities with elevated heat exchanger |
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| US12513852B2 (en) * | 2022-05-31 | 2025-12-30 | Rykor Energy Solutions, LLC | Mobile data center platform with immersion cooling |
| CN219108016U (zh) * | 2022-08-18 | 2023-05-30 | 喜动技术有限公司 | 计算设备用冷却槽、冷却设备以及集装箱式计算装置 |
| WO2024059016A1 (fr) | 2022-09-14 | 2024-03-21 | Green Revolution Cooling, Inc. | Système et procédé pour fournir un flux uniforme de fluide de refroidissement diélectrique pour serveurs de données |
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| USD1124280S1 (en) | 2023-09-19 | 2026-04-28 | Green Revolution Cooling, Inc | Cooling system enclosure |
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|---|---|
| US20140362527A1 (en) | 2014-12-11 |
| CA2914797A1 (fr) | 2014-11-13 |
| AU2014262796A1 (en) | 2015-12-24 |
| US9504190B2 (en) | 2016-11-22 |
| EP2994809A1 (fr) | 2016-03-16 |
| WO2014182724A1 (fr) | 2014-11-13 |
| EP2994809B1 (fr) | 2019-08-28 |
| US10624242B2 (en) | 2020-04-14 |
| US20170127558A1 (en) | 2017-05-04 |
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