EP3013130A4 - Dispositif de commande monté sur véhicule semblable à une boîte - Google Patents

Dispositif de commande monté sur véhicule semblable à une boîte Download PDF

Info

Publication number: EP3013130A4
Authority: EP; European Patent Office
Prior art keywords: box; control device; type vehicle; mounted control; vehicle
Prior art date: 2013-06-17
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP14814427.2A

Other languages

German (de)

English (en)

Other versions

EP3013130B1 (fr

EP3013130A1 (fr

Inventor

Maki Ito

Toshiaki Ishii

Masaru Kamoshida

Hideto Yoshinari

Masato Saito

Akitoyo Konno

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Astemo Ltd

Original Assignee

Hitachi Automotive Systems Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2013-06-17

Filing date

2014-05-12

Publication date

2017-08-02

2014-05-12 Application filed by Hitachi Automotive Systems Ltd filed Critical Hitachi Automotive Systems Ltd

2016-04-27 Publication of EP3013130A1 publication Critical patent/EP3013130A1/fr

2017-08-02 Publication of EP3013130A4 publication Critical patent/EP3013130A4/fr

2019-01-02 Application granted granted Critical

2019-01-02 Publication of EP3013130B1 publication Critical patent/EP3013130B1/fr

Status Not-in-force legal-status Critical Current

2034-05-12 Anticipated expiration legal-status Critical

Links

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the printed circuit board [PCB]
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Physics & Mathematics (AREA)
Thermal Sciences (AREA)
Cooling Or The Like Of Electrical Apparatus (AREA)
Non-Metallic Protective Coatings For Printed Circuits (AREA)
Structure Of Printed Boards (AREA)
Coupling Device And Connection With Printed Circuit (AREA)
Casings For Electric Apparatus (AREA)

EP14814427.2A 2013-06-17 2014-05-12 Dispositif de commande monté sur véhicule semblable à une boîte Not-in-force EP3013130B1 (fr)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2013126387A JP6271164B2 (ja)	2013-06-17	2013-06-17	箱型車載制御装置
PCT/JP2014/062548 WO2014203648A1 (fr)	2013-06-17	2014-05-12	Dispositif de commande monté sur véhicule semblable à une boîte

Publications (3)

Publication Number	Publication Date
EP3013130A1 EP3013130A1 (fr)	2016-04-27
EP3013130A4 true EP3013130A4 (fr)	2017-08-02
EP3013130B1 EP3013130B1 (fr)	2019-01-02

Family

ID=52104390

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP14814427.2A Not-in-force EP3013130B1 (fr)	2013-06-17	2014-05-12	Dispositif de commande monté sur véhicule semblable à une boîte

Country Status (5)

Country	Link
US (1)	US11166396B2 (fr)
EP (1)	EP3013130B1 (fr)
JP (1)	JP6271164B2 (fr)
CN (1)	CN105284197B (fr)
WO (1)	WO2014203648A1 (fr)

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US20150373867A1 (en) *	2014-06-18	2015-12-24	Continental Automotive Systems, Inc.	Electronics housing
JP6431779B2 (ja) *	2015-01-30	2018-11-28	日立オートモティブシステムズ株式会社	車載制御装置および車載制御装置の製造方法
JP6693706B2 (ja) *	2015-04-06	2020-05-13	株式会社デンソー	電子制御装置
CN205105500U (zh) *	2015-08-06	2016-03-23	台达电子企业管理（上海）有限公司	散热器与电源模块
JP6528741B2 (ja) *	2016-08-24	2019-06-12	トヨタ自動車株式会社	ヒートシンクの製造方法
CN108306144B (zh) *	2017-02-16	2019-10-01	番禺得意精密电子工业有限公司	电连接器组合
JP6735248B2 (ja) *	2017-03-30	2020-08-05	日立オートモティブシステムズ株式会社	車載制御装置
JP2018186143A (ja) *	2017-04-25	2018-11-22	オムロンオートモーティブエレクトロニクス株式会社	回路基板モジュール、電子装置
KR102281998B1 (ko) *	2017-08-30	2021-07-27	삼성전자 주식회사	이종재질 통신장치 함체
JP6852649B2 (ja) *	2017-10-24	2021-03-31	株式会社オートネットワーク技術研究所	回路構成体及び回路構成体の製造方法
CN110753473B (zh) *	2018-07-23	2021-03-30	华为技术有限公司	电路板组合以及电子设备
US20210351102A1 (en) *	2018-10-04	2021-11-11	Showa Denko Materials Co., Ltd.	Heat radiation material, method for producing a heat radiation material, composition, and heat-generating element
US11125199B2 (en) *	2019-01-25	2021-09-21	Clarence Wheeler	Power functioning system for intelligent automotive component and control method using the same
US20210367485A1 (en) *	2019-01-25	2021-11-25	Nurosphere Inc.	Intelligent Automotive Component For Hybrid Vehicle
JP7257893B2 (ja) *	2019-06-25	2023-04-14	日立Astemo株式会社	電子制御装置
JP7372810B2 (ja) *	2019-10-17	2023-11-01	日立Astemo株式会社	電子制御装置
JP2021089994A (ja) *	2019-12-05	2021-06-10	日立Astemo株式会社	車載電子制御装置
CN111148339B (zh) *	2020-01-09	2023-06-23	广州美立达电子技术有限公司	一种主动散热系统
JP7641267B2 (ja) *	2020-03-10	2025-03-06	ローム株式会社	電子装置
JP7365295B2 (ja) *	2020-06-05	2023-10-19	日立Astemo株式会社	車載電子制御装置
KR20220049453A (ko) *	2020-10-14	2022-04-21	호시덴 가부시기가이샤	충전기
DE102020216390A1 (de) *	2020-12-21	2022-06-23	Vitesco Technologies Germany Gmbh	Steuermodul für ein Fahrzeug mit mindestens einem Elektromotor
JP7494138B2 (ja) *	2021-03-24	2024-06-03	日立Astemo株式会社	電子制御装置
CN114356058B (zh) *	2021-12-31	2024-11-08	北京有竹居网络技术有限公司	电子设备内部腔体结构
DE102024201399A1 (de) *	2024-02-15	2025-08-21	Robert Bosch Gesellschaft mit beschränkter Haftung	Elektronische Baugruppe

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US6219258B1 (en) *	1999-01-29	2001-04-17	Ericsson Inc.	Electronic enclosure with improved environmental protection
JP3770157B2 (ja)	2001-12-26	2006-04-26	株式会社デンソー	電子制御機器
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JP2006032490A (ja) *	2004-07-13	2006-02-02	Hitachi Ltd	エンジン制御回路装置
EP1897921B1 (fr) *	2005-06-24	2014-07-16	Nippon Kasei Chemical Company Limited	Composition de revêtement, son procédé de production, moulages en résine et procédé de production des moulages
US7964236B2 (en) *	2005-10-18	2011-06-21	Elantas Pdg, Inc.	Use of nanomaterials in secondary electrical insulation coatings
EP2071911B1 (fr) *	2007-12-11	2011-12-21	Denso Corporation	Dispositif de contrôle électrique et son procédé de fabrication
JP2011003563A (ja) *	2009-06-16	2011-01-06	Hitachi Automotive Systems Ltd	箱型電子モジュール
JP5587116B2 (ja) *	2009-09-30	2014-09-10	京セラ株式会社	配線基板及び実装構造体
JP5460397B2 (ja)	2010-03-17	2014-04-02	日立オートモティブシステムズ株式会社	自動車用電子制御装置
JP2012195525A (ja) *	2011-03-18	2012-10-11	Hitachi Automotive Systems Ltd	電子制御装置
JP2012204729A (ja)	2011-03-28	2012-10-22	Denso Corp	車両用電子制御装置およびその製造方法
JP5281121B2 (ja)	2011-06-14	2013-09-04	三菱電機株式会社	車載電子装置の基板収納筐体
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2013
- 2013-06-17 JP JP2013126387A patent/JP6271164B2/ja not_active Expired - Fee Related
2014
- 2014-05-12 EP EP14814427.2A patent/EP3013130B1/fr not_active Not-in-force
- 2014-05-12 CN CN201480033275.3A patent/CN105284197B/zh not_active Expired - Fee Related
- 2014-05-12 WO PCT/JP2014/062548 patent/WO2014203648A1/fr not_active Ceased
- 2014-05-12 US US14/893,774 patent/US11166396B2/en not_active Expired - Fee Related

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
No further relevant documents disclosed *

Also Published As

Publication number	Publication date
WO2014203648A1 (fr)	2014-12-24
EP3013130B1 (fr)	2019-01-02
EP3013130A1 (fr)	2016-04-27
US11166396B2 (en)	2021-11-02
JP2015002280A (ja)	2015-01-05
CN105284197A (zh)	2016-01-27
US20160106010A1 (en)	2016-04-14
CN105284197B (zh)	2019-02-26
JP6271164B2 (ja)	2018-01-31

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2017-08-02	RIC1	Information provided on ipc code assigned before grant	Ipc: H05K 1/02 20060101ALI20170623BHEP Ipc: H05K 7/20 20060101AFI20170623BHEP Ipc: H01R 12/72 20110101ALI20170623BHEP Ipc: H05K 1/18 20060101ALI20170623BHEP Ipc: H01R 12/71 20110101ALI20170623BHEP
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