EP3041966A2 - Alliage de cuivre, que contient de fer et phosphore - Google Patents

Alliage de cuivre, que contient de fer et phosphore

Info

Publication number
EP3041966A2
EP3041966A2 EP14809274.5A EP14809274A EP3041966A2 EP 3041966 A2 EP3041966 A2 EP 3041966A2 EP 14809274 A EP14809274 A EP 14809274A EP 3041966 A2 EP3041966 A2 EP 3041966A2
Authority
EP
European Patent Office
Prior art keywords
copper alloy
max
copper
manganese
iron
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP14809274.5A
Other languages
German (de)
English (en)
Other versions
EP3041966B1 (fr
Inventor
Hark Schulze
Dirk Rode
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cunova GmbH
Original Assignee
KME Germany GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by KME Germany GmbH and Co KG filed Critical KME Germany GmbH and Co KG
Priority to PL14809274T priority Critical patent/PL3041966T3/pl
Publication of EP3041966A2 publication Critical patent/EP3041966A2/fr
Application granted granted Critical
Publication of EP3041966B1 publication Critical patent/EP3041966B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C22C9/04—Alloys based on copper with zinc as the next major constituent

Definitions

  • the invention relates to a copper alloy having the features in the preamble of claim 1 and the use of such a copper alloy according to the features of claim 7 or 8.
  • copper with the exception of silver, has the lowest electrical resistance of all known metals, copper alloys are preferred and used for electrical contact components merely because of the frequency of copper and the associated price advantage over silver.
  • Such contact components include, for example, mechanically connectable and separable fasteners and crimp connections.
  • Copper alloys such as CuFe0.1 P (C19210) and CuFe2P (C19400) are mainly used for plug-in contacts, as they have a high solid solution and medium relaxation resistance. In contrast, the aforementioned copper alloys have a poor machinability, so that they are not or only poorly suited for the production of contact components by machining.
  • CONFIRMATION COPY In contrast, good machinability is achieved when using known copper alloys such as CuSP, CuTeP or CuSMn. Since these are non-hardenable alloys with very slight solid solution hardening, however, they have only a low relaxation resistance.
  • the alloys used in the prior art also sometimes contain components of lead (Pb) or beryllium (Be), so that these copper alloys can not be safely used for all applications due to the known toxicity of these alloying elements.
  • Pb lead
  • Be beryllium
  • the invention has for its object to provide a both relaxation-resistant and machinable copper alloy available, which is free of the alloying elements beryllium and lead. Furthermore, the use of such a relaxation-resistant and machinable as well as lead and beryllium-free copper alloy for products to be produced from it is to be shown.
  • a copper alloy is proposed, with proportions in weight%
  • Phosphorus (P) 0.01-0.50 In order to achieve the required machinability, at least one element from the following group is furthermore contained for the formation of chip-breaking phases:
  • the alloy is free of beryllium (Be) and lead (Pb) to avoid toxic properties.
  • sulfur (S) or manganese (Mn) or tellurium (Te) may be contained alone or in combination within the specified limits.
  • the copper alloy contains to improve the respective required properties:
  • the aforementioned group are optional alloying elements. If necessary, they can be included individually or in combination within the specified limits.
  • the alloy contains copper (Cu) as the remainder and may contain common impurities caused by melting.
  • the copper alloy according to the invention combines good machinability and high relaxation resistance. Especially with respect to lead (Pb), it has been found that its addition of not more than 0.1% does not improve the machinability. In the case of lead addition, the hot cracking risk is predominated by lead smelting on the grain boundaries of the crystallites. This is remarkable because in the case of the copper materials known in the prior art, the improvement in machinability is generally attributable to the addition of lead (Pb) in metallic form.
  • Phosphorus (P) forms iron phosphide precipitates with iron (Fe).
  • Iron (Fe) generally serves to increase the corrosion resistance of the copper alloy.
  • the machinability of the alloy according to the invention is also improved without the addition of lead (Pb) by forming chip-breaking phases.
  • Manganese (Mn) acts as a hardening agent and serves as a deoxidizer within the copper alloy. Furthermore, by manganese (Mn), the grain of the copper alloy can be refined.
  • S Sulfur
  • Mn Manganese
  • the copper alloy according to the invention has a good electrical conductivity, which, depending on the composition investigated, ranges from 21 MS / m for CuFe4P to 52 MS / m for CuFeO, 02PS.
  • the alloy components of the above group may be contained in a range of 0.01 - 2.50 wt% each with respect to zinc (Zn) and tin (Sn).
  • amounts of aluminum (Al), boron (B), chromium (Cr), magnesium (Mg), silver (Ag), and zircon (Zr) may each be 0.01% - 0.5% by weight.
  • Phosphorus (P) and boron (B) have the property of counteracting hydrogen disease.
  • the oxygen dissolved in the copper mixed crystal is bound to these alloying elements by the addition of phosphorus (P) and optionally boron (B).
  • Phosphorus (P) and boron (B) act as deoxidizers.
  • phosphorus (P) prevents the oxidation of individual alloying elements. Moreover, the tile properties of the copper alloy during casting can be improved by adding phosphorus (P).
  • Aluminum (AI) is an alloying element by which the strength, machinability and wear resistance of the copper alloy at high temperatures can be improved. Incidentally, this also applies to the improvement of the oxidation resistance of the copper alloy.
  • chromium (Cr) and magnesium (Mg) also serves to improve the oxidation resistance of the copper alloy at high temperatures. Particularly good results are observed in this context when chromium (Cr) and magnesium (Mg) are added in combination with aluminum (Al). In this way, an advantageous synergy effect of these components can be achieved.
  • Zircon (Zr) can improve the hot workability of the copper material according to the invention.
  • Zinc (Zn) improves the adhesion of the tin-plating or improves the resistance to the peel-off behavior of peelings.
  • Tin (Sn) can further increase the solid solution hardening of the copper alloy according to the invention.
  • S and / or tellurium (Te) as chip breakers may preferably be combined with manganese (Mn).
  • Sulfur and manganese form manganese sulfides, which increase the machinability towards copper sulfides.
  • compositions in terms of the alloying elements phosphorus (P), sulfur (S), manganese (Mn) and tellurium (Te) are given, wherein in addition the other alloying elements specified in claim 1 may be contained in the copper alloy.
  • the remainder is formed by copper and impurities caused by melting:
  • FIG. 2 Examination results on the copper alloys CuSP, CuTeP and CuSMn with a view to the chip forming classes by mechanical processing in the form of external longitudinal rotation with variation of the cutting speed;
  • FIG. 3 shows the examination results on the materials from FIG. 2 with respect to the chipform classes in the case of variants of the depth of cut;
  • FIG. 4 shows the results of the chipforming classes of FIGS. 2 and 3 in FIG.
  • Figure 5 is a tabular overview of the material properties of individual im
  • FIG. 6 shows a microsection through the microstructure of the copper alloy CuSP known in the prior art
  • FIG. 7 shows a microsection through the microstructure of the copper alloy CuTeP known in the prior art
  • FIG. 8 shows a further microsection through the microstructure of the prior art
  • FIG. 10 shows an illustration of the mechanical processing of the
  • Figure 1 1 is a microsection through the microstructure of an inventive
  • FIG. 12 shows an illustration of the chip formation resulting during the mechanical processing of the copper alloy according to the invention from FIG.
  • FIG. 13 Diagram for varying the Fe and P contents at a constant content of the chipbreaker S or S + Mn and / or Te and
  • FIG. 14 Diagram for varying the contents of the chipbreaker S or S + Mn and / or Te at a constant content of the basic elements Fe and P.
  • FIG. 1 shows a steel-iron test sheet 1 178-90 in order to refer to the embodiments of the chips resulting from the machining in an analogous manner to the group investigated in the present case.
  • the resulting chip image was classified into one of eight chipforming classes (1 - 8), as can be seen in the first column, to the left of the chips shown schematically.
  • the individual chip images are associated with appropriate terminology according to their design, ranging from “band chips” to "shavings”.
  • the chip space number R is listed, which indicates the relationship between the space requirement of a disordered chip quantity (V span ) and the material volume of the same chip quantity (V).
  • V span disordered chip quantity
  • V material volume of the same chip quantity
  • chipforming classes and the respective chip space numbers R are given a judgment in the rightmost column in FIG. 1, the chipforming classes 7 and 8 having their respective chip space number R being classified as “usable” while the chipforming classes 5 and 6 are combined with their respective chip space numbers R are judged to be "good”. On the other hand, the remaining chip forming classes 1 to 4 in connection with their respective chip space number R are classified as "unfavorable", with a smooth transition to "good” occurring in chipform classes 3 and 4.
  • Figure 2 shows the results of mechanical working of the examined group of known copper alloys with respect to the resulting chip forming classes in external longitudinal turning of a workpiece thereof.
  • the results presented in FIG. 2 are based on a constant cutting depth a p of 1.5 mm and a feed f of 0.2 mm.
  • the respective cutting speed v c was varied from 450 m / min (v c i) to 150 m / min (v C 2).
  • the respective chip form classes of the materials from the group (CuSP, CuTeP and CuSMn) are all between 3 and 5.
  • the resulting chip images are also shown schematically in the present table. For better clarity, they are each assigned a single line for 20mm as a reference in order to be able to better estimate the results in the form of the chip sizes set during the examination.
  • Figure 3 shows the results of further processing steps of the group of Figure 2.
  • v c 450 m / min
  • a p of 1, 5 mm (a p i) to 0.75 mm (a p2) varies.
  • f 0.2 mm
  • the chip form class in particular of the copper alloy CuSMn, thus remains constant both in the case of variation of the cutting speed and in the case of variation of the cutting depth in the respectively present areas.
  • the group of investigated copper alloys also moves with variation of the cutting depth a p in a range of chipforming classes 3 to 5.
  • the results obtained in this way and compiled in FIGS. 2 to 4 were then compared with the test results for the present copper alloy according to the invention.
  • the reference value used was the well-known copper alloy CuZn39Pb3, which is considered to be the main alloy for machining, especially in Germany. Said copper alloy is used everywhere, where it increasingly depends on a cutting and cutting shaping. In connection with the CuZn39Pb3 copper alloy used herein as reference, its machinability is assumed to be 100%.
  • pure copper material achieves a stress index of 20% to a maximum of 30%.
  • chip-breaking elements such as sulfur (S), tellurium (Te), sulfur (S) and manganese (Mn), and lead (Pb).
  • the group investigated here is such that CuSP has a stress index of 70%, while CuTeP has a stress index of 80%. Finally, CuSMn achieves the highest stress index in the group of 90%.
  • FIG. 5 shows a tabular comparison of the materials contained therein with respect to their respective material properties.
  • the present table in FIG. 5 is constructed in such a way that it reflects the approximate production costs of the individually listed materials, starting with the cheapest material at the top.
  • the table shows the copper alloy according to the invention with the orders of magnitude of its individual alloy components listed there, more particularly CuFe0.1 PS0.35 and CuFe2PS0.35.
  • the copper alloy CuFe0.1 PS0.35 in direct comparison with only chip-breaking alloyed materials has a slightly lower 0.2% yield strength and tensile strength R m .
  • the elongation at break is 17% and the relaxation with "o" better than CuSP, CuTeP and CuSMn.
  • the alloy CuFe2PS0.35 has higher mechanical properties and a higher relaxation resistance, which is indicated in the table by "+".
  • FIGS. 6 to 9 each show a micrograph of the microstructures from the group of individual copper materials underlying the investigations.
  • FIG. 6 shows the material CuSP with its arrangement of the chip-breaking elements. Its microstructure shows in part closely spaced and each dark copper sulfides, which serve here as a chip breaker.
  • FIG. 7 shows the material CuTeP, which in its microstructure contains darkened copper cell fluorates as chip breakers. These are in their arrangement largely isolated and further apart.
  • FIG. 8 shows the microstructure of the material CuSMn, which contains manganese sulphides as a chip breaker.
  • CuSMn has a high cutting index with a mostly good chipforming class, which is due to the uniform distribution of its chipbreakers shown in FIG.
  • FIG. 9 shows the etched microstructure of the standardized material CuFe0.1 P (C19210) without chip-breaking phases.
  • iron phosphors that are not visible under light microscopy are present.
  • the iron phosphides have no chipbreaking effect.
  • FIG. 12 shows the chip formation after the mechanical processing of the copper material CuFe0.1 PS0.35 according to the invention.
  • the copper alloy according to the invention has both a sufficient cold workability and a very good hot workability.
  • the invention is also directed to the use of such a copper alloy for the production of a product to be machined according to claim 7.
  • the invention is directed to the use of such a copper alloy for the production of a semi-finished to be produced according to claim 8.
  • This may in particular be a rolled, pressed, drawn, forged or cast product.
  • rods and wires can be delivered from press and pull sequences as semi-finished products.
  • the following products can be produced by machining: plug contacts, crimping sleeves, crimp connectors, drilled shaft nails, motor parts, screws, locating pins, clamps, welding nozzles, cutting torch nozzles, valves, fittings, nuts, fittings, contraelectrons, contact pins.
  • FIG. 13 shows a diagram for varying the Fe and P content at a constant content of the chipbreaker S or S + Mn and / or Te
  • FIG. 14 shows a diagram for varying the contents of the chipbreaker S or S + Mn and / or Te constant content of the basic elements Fe and P.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Conductive Materials (AREA)
  • Contacts (AREA)
  • Soft Magnetic Materials (AREA)

Abstract

L'invention concerne un alliage de cuivre comportant les fractions suivantes, en % en poids, fer (Fe) 0,02 - 4,00, phosphore (P) 0,01 - 0,50 et au moins un élément du groupe suivant : soufre (S) 0,10 - 0,80, manganèse (Mn) 0,01 - 0,80, tellure (Te) 0,10 - 1,00, l'alliage étant respectivement exempt de béryllium (Be) et plomb (Pb) et contenant sélectivement aluminium (Al) max. 0,50, chrome (Cr) max. 0,50,, magnésium (Mg) max. 0,50, zirconium (Zr) max. 0,50, zinc (Zn) max. 2,50, étain (Sn) max. 2,50, bore (B) max. 0,50, argent (Ag) max. 0,50, ainsi qu'un reste de cuivre (Cu) et des impuretés issues de la fusion.
EP14809274.5A 2013-09-02 2014-08-29 Alliage de cuivre, que contient de fer et phosphore Not-in-force EP3041966B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PL14809274T PL3041966T3 (pl) 2013-09-02 2014-08-29 Stop miedzi, który zawiera żelazo i fosfor

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE201310014501 DE102013014501A1 (de) 2013-09-02 2013-09-02 Kupferlegierung
PCT/DE2014/000435 WO2015027975A2 (fr) 2013-09-02 2014-08-29 Alliage de cuivre

Publications (2)

Publication Number Publication Date
EP3041966A2 true EP3041966A2 (fr) 2016-07-13
EP3041966B1 EP3041966B1 (fr) 2018-05-30

Family

ID=52015777

Family Applications (1)

Application Number Title Priority Date Filing Date
EP14809274.5A Not-in-force EP3041966B1 (fr) 2013-09-02 2014-08-29 Alliage de cuivre, que contient de fer et phosphore

Country Status (6)

Country Link
EP (1) EP3041966B1 (fr)
DE (1) DE102013014501A1 (fr)
ES (1) ES2675143T3 (fr)
HU (1) HUE038253T4 (fr)
PL (1) PL3041966T3 (fr)
WO (1) WO2015027975A2 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202018104958U1 (de) 2018-08-30 2018-09-12 Harting Electric Gmbh & Co. Kg Steckverbinder mit Komponenten aus verbessertem Material

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH108167A (ja) * 1996-06-18 1998-01-13 Mitsubishi Shindoh Co Ltd 熱間加工性に優れた銅合金
KR20060120276A (ko) * 2004-03-12 2006-11-24 수미도모 메탈 인더스트리즈, 리미티드 동 합금 및 그 제조방법
JP4542008B2 (ja) * 2005-06-07 2010-09-08 株式会社神戸製鋼所 表示デバイス
CN102690972A (zh) * 2011-03-22 2012-09-26 日立电线株式会社 热交换器用铜合金管

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See references of WO2015027975A2 *

Also Published As

Publication number Publication date
HUE038253T2 (hu) 2018-10-29
PL3041966T3 (pl) 2018-09-28
WO2015027975A2 (fr) 2015-03-05
DE102013014501A1 (de) 2015-03-05
EP3041966B1 (fr) 2018-05-30
HUE038253T4 (hu) 2018-11-28
WO2015027975A3 (fr) 2015-11-12
ES2675143T3 (es) 2018-07-09

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