EP3043207B1 - Récipient pour stocker une pellicule pour lithographie - Google Patents

Récipient pour stocker une pellicule pour lithographie Download PDF

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Publication number
EP3043207B1
EP3043207B1 EP15197003.5A EP15197003A EP3043207B1 EP 3043207 B1 EP3043207 B1 EP 3043207B1 EP 15197003 A EP15197003 A EP 15197003A EP 3043207 B1 EP3043207 B1 EP 3043207B1
Authority
EP
European Patent Office
Prior art keywords
pellicle
container
flatness
mount
mask
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Not-in-force
Application number
EP15197003.5A
Other languages
German (de)
English (en)
Other versions
EP3043207A1 (fr
Inventor
Shirasaki Toru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Chemical Co Ltd
Publication of EP3043207A1 publication Critical patent/EP3043207A1/fr
Application granted granted Critical
Publication of EP3043207B1 publication Critical patent/EP3043207B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70908—Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution or removing pollutants from apparatus
    • G03F7/70916—Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70983—Optical system protection, e.g. pellicles or removable covers for protection of mask
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1906—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers specially adapted for containing masks, reticles or pellicles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/10—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP]
    • H10P72/19—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers
    • H10P72/1911—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof using carriers specially adapted therefor, e.g. front opening unified pods [FOUP] closed carriers characterised by materials, roughness, coatings or the like

Definitions

  • the present invention relates to a container to store a pellicle for lithography, which pellicle is used as a dust fender for a mask for lithography employed in the scenes of manufacturing semiconductor devices such as LSI and Super-LSI, and liquid crystal display panels, etc.
  • a pattern is made by irradiating a light to a semiconductor wafer or an original plate for liquid crystal; however, if a dust adheres to a mask for lithography (also simply referred to as “mask”) or a reticle (these are collectively referred to as “exposure original plate” herein below), the dust absorbs light or bends it, causing deformation of a transferred pattern, roughened edges or black stains on a base, and leads to problems of damaged dimensions, poor quality, deformed appearance and the like.
  • lithography also simply referred to as "mask”
  • exposure original plate a reticle
  • the above-mentioned manufacturing of semiconductor devices and liquid crystal display board are usually performed in a clean room, but even so, it is still difficult to keep the exposure original plate clean all the time; therefore, in general the light irradiation is carried out only after a surface of the exposure original plate is sheltered by a pellicle. In this way, the dust particle is prevented from directly adhering to the surface of the exposure original plate but is caught on the pellicle, and if, at the time of the lithography, the exposure light is focused on the pattern described on the exposure original plate the dust particle on the pellicle fails to affect the image transferring.
  • a pellicle is basically built up of a pellicle frame 3, a transparent pellicle membrane 2, which is attached tensely to an upper annular face of the pellicle frame 3, and an agglutinant layer 4 formed on a lower annular face of the pellicle frame 3 for enabling the pellicle to be adhered to a mask or an exposure original plate.
  • the pellicle membrane 2 is made of cellulose nitrate, cellulose acetate and a fluorine-containing polymer or the like which transmit well such lights of mercury lamp that are used in light exposure (e.g., g-line [436 nm], i-line [365 nm], KrF excimer laser [248 nm], and ArF excimer laser [193 nm]).
  • a solvent that dissolves the pellicle membrane well is applied to the upper annular face of the frame 3 and, after pasting the pellicle membrane 2 on it, the solvent and the membrane are dried by air flow, or alternatively an adhesive agent such as acrylic resin, epoxy resin and fluorine-containing resin is used to fix the pellicle membrane 2 on the upper annular face.
  • the lower annular face of the pellicle frame 3 is laid with an agglutinant layer 4 made of a polybutene resin, a polyvinyl acetate resin, an acrylic resin and a silicone resin or the like for enabling the pellicle frame 3 to be adhered to the exposure original plate, and on this agglutinant layer 4 is laid a releasable liner for protecting the agglutinant layer 4, if it is required.
  • Fig. 3 shows how a pellicle sits on a mount 6 in a pellicle container made of a resin.
  • the design rule for LSI has progressed to require as high a resolution as sub-quarter micron order, and correspondingly as this, shortening of the wavelength of exposure light source is in progress.
  • the choice of the exposure light source is shifting from the heretofore commonly used mercury lamp, which emits g-line [436 nm] and i-line [365 nm], to KrF excimer laser [248 nm] and ArF excimer laser [193 nm]) or the like.
  • the wavelength of the exposure light is shortened, the influence of the deformation of the mask upon the quality of the transferred lithographic image is becoming a greater problem, and therefore the flatness demanded of the mask has been heightening.
  • IP Publication 1 teaches to make the flatness of the agglutinant layer of the pellicle frame to be 15 micrometers or smaller so as to reduce the deformation of the mask induced by the pellicle as it is adhered to the mask.
  • the present invention was made in view of this fact and it is therefore an object of the present invention to provide a container for storing a pellicle for lithography which can suppress the deformation of the mask and exposure original plate.
  • the present inventor made a strenuous effort and came to a thought that a cause for the problem might lie in the flatness of the pellicle mount of the injection-molded pellicle container made of a resin, and he explored the flatness of the pellicle mount of the conventional pellicle containers made of resin, and as a result it was found that there were deformations of which a maximum case measured about 80 micrometers, as shown in Fig. 6 .
  • the present invention relates to a container for storing a pellicle used in lithography, comprising a tray and a cover (not shown) between which a pellicle is stored; the tray of the container has a pellicle mount for supporting the pellicle; this container is characteristic in that a plane plate, or preferably a quartz plane plate, having a flatness of 10 micrometers or smaller is provided on top of the pellicle mount.
  • the container of the invention is applicable to various types of pellicle which comprises a pellicle frame, a pellicle membrane attached tensely to an upper annular face of the pellicle frame, and an agglutinant layer laid on a lower annular face of the pellicle frame.
  • the plane plate having a high flatness such as a quartz plane plate is provided on top of the pellicle mount, usually made of a resin, so that it is possible to suppress the degradation of the flatness of the agglutinant layer of the pellicle caused by the unreliable flatness of the pellicle mount, with a result that it becomes possible to prevent the mask or the like from undergoing a deformation induced by the pellicle whereby micromachining of a pattern with high precision is enabled.
  • the present invention is characteristic in that a plane plate, preferably a quartz plane plate 7, having a flatness of 10 micrometers or smaller is introduced, and except for this the construction of the pellicle container of the present invention is similar to that of conventional pellicle containers.
  • the quartz plane plate 7 is used, and since a plane plate made of quartz is hard and durable and its surface can be easily polished to have a flatness of 10 micrometers or smaller and such flatness of quartz plate can be preserved for a long time, use of a quartz plane plate is most recommended.
  • Example 1 As shown in Fig. 2 , a tray of a square pellicle container made of polycarbonate and having an external measure of 200 mm by 200 mm was manufactured by mold injection. Also, a quartz plane plate 7 measuring 150 mm by 116 mm by 6.35 mm (in thickness) was provided on top of a pellicle mount 6, which was in the middle of the tray. The flatness of this quartz plane plate 7 was 7 micrometers.
  • a pellicle was let to sit alone for a predetermined period of time on the quartz plane plate 7 with the agglutinant layer 4 covered with its protective separator film 5 lying directly on the quartz plane plate 7. Then, the pellicle was removed from this pellicle container 1 and the flatness of the surface of the agglutinant layer 4 was measured and it was found that the value of the flatness had changed by only 10 micrometers during the sitting. Also, this pellicle was adhered to a mask via the agglutinant layer, and the mask was scarcely deformed by the pellicle.
  • Example 2 similarly as in Example 1, a polycarbonate tray of a pellicle container was used, and on the middle of it was provided a quartz plane plate 7 measuring 150 mm by 116 mm by 6. 35 mm (in thickness) and having a flatness of 10 micrometers. Then, a pellicle was let to sit alone for a predetermined period of time on the quartz plane plate 7 with the agglutinant layer 4 covered with the separator film 5 lying directly on the quartz plane plate 7. Then, the pellicle was removed from this pellicle container and the flatness of the surface of the agglutinant layer 4 was measured and it was found that the value of the flatness had changed by only 12 micrometers during the sitting. Also, this pellicle was adhered to a mask via the agglutinant layer, and the mask was scarcely deformed by the pellicle.
  • Comparative Example 1 As shown in Fig. 4 , a tray of a square pellicle container 1 made of polycarbonate and having an external measure of 200 mm by 200 mm was manufactured by mold injection.
  • the pellicle mount 6 in the middle of the tray was measured for its flatness, and as is read from the graph of Fig. 6 , the maximum height was about 80 micrometers, which means the flatness of the pellicle mount 6 was bad.
  • a pellicle was let to sit alone for a predetermined period of time on the pellicle mount 6 with the agglutinant layer 4 covered with its protective separator film 5 lying directly on the pellicle mount 6. Then, the pellicle was removed from this pellicle container 1 and the flatness of the surface of the agglutinant layer 4 was measured and it was found that the value of the flatness had changed by 30 micrometers during the sitting. Also, this pellicle was adhered to a mask via the agglutinant layer, and the mask underwent a substantial deformation induced by the pellicle.
  • a pellicle container for storing a pellicle used in lithography, having a tray and a cover between which the pellicle is stored, and the tray has a pellicle mount section on which the pellicle is used to be mounted, but the tray of this container further has a plane plate, preferably a quartz plane plate, having a flatness of 10 micrometers or smaller provided on top of the pellicle mount so as to stabilize the flatness of the pellicle, especially its agglutinant layer.

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Public Health (AREA)
  • Health & Medical Sciences (AREA)
  • Epidemiology (AREA)
  • Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Packaging Frangible Articles (AREA)
  • Library & Information Science (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Claims (2)

  1. Récipient pour stocker une pellicule (2) utilisée en lithographie,
    comprenant un plateau et un couvercle entre lesquels une pellicule est stockée, ledit plateau ayant un support (6) de pellicule pour supporter la pellicule,
    caractérisé en ce qu'une plaque (7) plane ayant une planéité de 10 micromètres ou moins est prévue sur le dessus du support de pellicule.
  2. Récipient selon la revendication 1, dans lequel ladite plaque plane est une plaque plane de quartz.
EP15197003.5A 2014-12-18 2015-11-30 Récipient pour stocker une pellicule pour lithographie Not-in-force EP3043207B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014255838A JP6308676B2 (ja) 2014-12-18 2014-12-18 リソグラフィ用ペリクル容器。

Publications (2)

Publication Number Publication Date
EP3043207A1 EP3043207A1 (fr) 2016-07-13
EP3043207B1 true EP3043207B1 (fr) 2017-02-15

Family

ID=54707701

Family Applications (1)

Application Number Title Priority Date Filing Date
EP15197003.5A Not-in-force EP3043207B1 (fr) 2014-12-18 2015-11-30 Récipient pour stocker une pellicule pour lithographie

Country Status (5)

Country Link
US (1) US10634991B2 (fr)
EP (1) EP3043207B1 (fr)
JP (1) JP6308676B2 (fr)
KR (1) KR102619269B1 (fr)
TW (1) TWI585517B (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102172218B1 (ko) 2018-07-31 2020-10-30 주식회사 시엠테크놀로지 펠리클 수납용기
KR102172217B1 (ko) 2018-07-31 2020-10-30 주식회사 시엠테크놀로지 펠리클 수납용기 및 이를 이용한 파티클 제거 방법
KR102172221B1 (ko) 2018-07-31 2020-10-30 주식회사 시엠테크놀로지 Dlc 코팅층을 구비한 펠리클 수납용기

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Also Published As

Publication number Publication date
TWI585517B (zh) 2017-06-01
JP2016114905A (ja) 2016-06-23
JP6308676B2 (ja) 2018-04-11
TW201632987A (zh) 2016-09-16
KR102619269B1 (ko) 2023-12-28
US20160178998A1 (en) 2016-06-23
EP3043207A1 (fr) 2016-07-13
US10634991B2 (en) 2020-04-28
KR20160074402A (ko) 2016-06-28

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