EP3064827B1 - Arrangement d'un montage d'un module led sur une surface d'un corps de refroidissement et montage led - Google Patents

Arrangement d'un montage d'un module led sur une surface d'un corps de refroidissement et montage led Download PDF

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Publication number
EP3064827B1
EP3064827B1 EP16158385.1A EP16158385A EP3064827B1 EP 3064827 B1 EP3064827 B1 EP 3064827B1 EP 16158385 A EP16158385 A EP 16158385A EP 3064827 B1 EP3064827 B1 EP 3064827B1
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EP
European Patent Office
Prior art keywords
led module
heat sink
arrangement
screw
pressing element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP16158385.1A
Other languages
German (de)
English (en)
Other versions
EP3064827A1 (fr
Inventor
Michael Eidam
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Zumtobel Lighting GmbH Austria
Zumtobel Lighting GmbH
Original Assignee
Zumtobel Lighting GmbH Austria
Zumtobel Lighting GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Zumtobel Lighting GmbH Austria, Zumtobel Lighting GmbH filed Critical Zumtobel Lighting GmbH Austria
Publication of EP3064827A1 publication Critical patent/EP3064827A1/fr
Application granted granted Critical
Publication of EP3064827B1 publication Critical patent/EP3064827B1/fr
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/10—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening
    • F21V17/12—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages characterised by specific fastening means or way of fastening by screwing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
    • F21V17/005—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages with keying means, i.e. for enabling the assembling of component parts in distinctive positions, e.g. for preventing wrong mounting
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F21V7/06—Optical design with parabolic curvature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Definitions

  • the invention relates to an arrangement for mounting an LED module (LED: light-emitting diode) on a surface of a heat sink, as well as an LED arrangement with such an arrangement for mounting an LED module
  • LED light-emitting diode
  • the device comprises an annular retaining element, which is held by means of rivets and springs on the heat sink.
  • An arrangement which comprises an LED module which is kept pressed by a ring-like pressure element against a heat sink.
  • the pressure element can be connected during assembly of the arrangement only in a certain rotational position with the LED module.
  • the invention has for its object to provide an improved arrangement for mounting an LED module on a surface of a heat sink.
  • this arrangement should be suitable for generating a pressing force of the LED module against the surface of the heat sink, which is particularly constant over a long period of time.
  • an LED array with such an arrangement for mounting an LED module to be specified.
  • an arrangement for mounting an LED module on a surface of a heat sink which has a pressure element for pressing the LED module against the surface.
  • this arrangement has a spring element for a floating mounting of the pressure element relative to the surface.
  • the pressure element is designed annular, so that in this way an opening for the arrangement of the LED module is formed, wherein the pressure element is designed in particular as a frame for the LED module. In this way, a particularly uniform pressure of the LED module against the surface of the heat sink can be generated by the pressure element.
  • the pressure element has a particular annular pressure surface for pressing the LED module against the surface. In this way, a particularly suitable and uniform transfer of pressure from the pressure element on the LED module can be generated.
  • the arrangement further comprises a screw for a screw connection with the heat sink, wherein the screw has a head and the spring element is intended to be arranged on the one hand to the head of the screw and on the other hand on the pressure element.
  • the pressing force can produce manufacturing technology particularly advantageous.
  • the screw also has a shoulder surface for engagement with the surface of the heat sink. This can be achieved that by screwing in the screw until contacting the shoulder surface with the surface of the heat sink, a fixed distance for the two ends of the spring element in a simple and reliable manner is produced.
  • the arrangement further comprises at least one further spring element and at least one further screw, wherein the at least one further spring element and the at least one further screw are designed analogously to the first-mentioned spring element and the first-mentioned screw.
  • the at least one further spring element and the at least one further screw are designed analogously to the first-mentioned spring element and the first-mentioned screw.
  • the pressure element on a particular circumferential trained web to form an optical labyrinth.
  • the pressure element has a recess for receiving a protrusion formed on the LED module and pointing in a normal direction with respect to the surface of the heat sink.
  • the design is such that the projection of the LED module can only be introduced as intended in the recess when the LED module with respect to the pressure element - with respect to an axis parallel to the normal direction - occupies a certain intended rotational position. In this way it is particularly easy to establish a fixed orientation of the LED module with respect to the pressure element.
  • this is the pressure element to form a particularly uniform pressure force of metal.
  • an LED arrangement which has an LED module, a heat sink with a surface and an inventive arrangement for mounting the LED module on the surface of the Heatsink.
  • the pressure element is arranged by means of the spring element floatingly mounted relative to the surface.
  • the pressure element has a recess and the LED module has a projection corresponding to the recess, which is arranged engaging in the recess.
  • the LED arrangement preferably also has an optical element, in particular in the form of a reflector, which has an in particular circumferentially formed web for forming the optical labyrinth, the optical labyrinth preferably being formed by the web of the pressure element and the web of the optical element. This makes it particularly suitable to achieve a good light-tightness.
  • Fig. 1 shows a perspective sketch of an arrangement for mounting an LED module 1 on a surface of a heat sink, here also referred to briefly as a mounting arrangement.
  • the LED module 1 serves to generate a light during operation.
  • Fig. 6 shows by way of example a corresponding heat sink 2 with a surface 21, wherein the LED module 1 is mounted as intended on the surface 21 by means of the mounting arrangement.
  • the surface 21 is, in particular, a plane surface region of the heat sink 2.
  • the heat sink 2 serves to dissipate heat that arises during operation of the LED module 1. The heat is transmitted via an immediate contact between the LED module 1 and the surface 21 of the heat sink 2 of the LED module 1 to the heat sink 2.
  • the LED module 1 for example, a planar light emitting surface 19 for emitting the light, further preferably a main emission direction L of the light is normal to the light emitting surface 19.
  • the plane light emission surface 19 is aligned parallel to the planar surface region of the heat sink 2.
  • the mounting arrangement has a pressure element 3, which is designed to keep the LED module 1 pressed against the surface 21 of the heat sink 2. By the pressure element 3, therefore, a pressing force is generated, which presses the LED module 1 against the surface 21 of the heat sink 2.
  • the pressure element 3 as shown by way of example - annular, in particular circular shaped, so that in this way an opening is formed, in which the LED module 1 can be arranged engaging.
  • Fig. 2 which shows a corresponding sectional view.
  • the light emitting surface 19 of the LED module 1 is arranged so that the light generated by the LED module 1 is surrounded by the edge of the opening.
  • the pressure element 3 can be designed as a frame for the LED module 1.
  • the opening of the pressure element 3 is only slightly larger than the light emitting surface 19 of the LED module 1. In this way, the pressure element 3 can transmit the pressing force particularly concentrated on the LED module 1.
  • the area defined by the opening of the pressure element 3 is greater than the light emission area 19 by a factor x, where 1 ⁇ x ⁇ 5, preferably 1 ⁇ x ⁇ 3.
  • the mounting arrangement has a spring element 4, which is designed to form a floating mounting of the pressure element 3 with respect to the surface 21 of the heat sink 2.
  • the spring element 4 may be, for example, a compression spring, in particular a helical compression spring.
  • the mounting arrangement has a screw 5 for a screw connection of the mounting arrangement with the heat sink 2.
  • Fig. 5 shows a perspective sectional view of the mounting arrangement, and the heat sink 2, wherein the screw 5 is screwed as provided in a corresponding threaded opening 29 of the heat sink 2.
  • an optical element shown here in the form of a reflector 6. The reflector 6 is in this case arranged so that it influences the light emitted by the LED module 1 light.
  • the screw 5 has one, for example in Fig. 2 designated head 51, wherein the design is such that the spring element 4 arranged on the one hand to the head 51 of the screw 5 and on the other hand fitting against the pressure element 3, in particular can be clamped.
  • a first engagement surface for the spring element 4 is formed by the head 51 of the screw 5 and a second engagement surface by the pressure element.
  • the pressure element 3 has a passage opening which is provided for the passage of the screw 5, that is, a through hole without threaded engagement for the screw 5, so that the screw 5, passing through the passage opening, move back and forth parallel to its main axis without rotation leaves.
  • the corresponding second engagement surface for the spring element 4 is formed by the edge of the passage opening.
  • the pressure element 3 preferably has a particular circular pressure surface 31.
  • This pressure surface 31 is preferably designed such that it surrounds the light emitting surface 19 of the LED module 1 in particular closed annular with mounted LED module 1.
  • a particularly uniform pressure force can be achieved with which the LED module 1 is kept pressed against the surface 21 of the heat sink 2.
  • the pressure element 3 to achieve a suitable dimensional stability of metal.
  • the pressure element 3 in one piece, so be formed of only one piece.
  • the screw 5 further comprises a shoulder surface 52 for engagement with the surface 21 of the heat sink 2.
  • the shoulder surface 52 is designed so that the spring element 4 has a designated length along the normal direction N to achieve the desired pressure force when the screw 5 so with the heat sink 2 is connected, that is screwed so far into the threaded opening 29, that the shoulder surface 52 of the screw 5, the surface 21 of the heat sink 2 contacted.
  • the intended length of the spring element 4 can be produced in a simple and reliable manner.
  • the mounting arrangement preferably has at least one further spring element 4 'and at least one further screw 5', wherein the at least one further spring element 4 'and the at least one further screw 5' analogous to the first mentioned spring element 4 and the first-mentioned screw 5 are designed.
  • further corresponding threaded openings are provided in the heat sink 2.
  • Fig. 3 shows a sectional view showing the mounting arrangement in connection with the LED module 1 and the above-mentioned reflector 6;
  • Fig. 4 shows a detail Fig. 3 ,
  • the pressure element 3 also has a recess 33 for receiving a projection 11 formed on the LED module 1.
  • the design can be such that the projection 11 of the LED module 1 can only be introduced into the recess 33 as intended when the LED module 1 faces the pressure element 3 with reference to an axis parallel to the normal direction N. - occupies a certain intended rotational position.
  • the pressure element 3 further comprises a particular circumferentially formed web 32 for forming an optical labyrinth.
  • the ridge 32 is shaped to extend around the light emitting surface 19.
  • the optical labyrinth is preferably formed by the web 32 of the pressure element 3 and the web 61 of the optical element.
  • the LED module 1 may have lateral channels 17 which serve to supply power.
  • the lateral channels 17 are preferably designed such that corresponding lines can be arranged for power supply so that they do not enforce the surface 21 of the heat sink 2;
  • the channels 17 may be formed at least substantially perpendicular to the normal direction N or to the main emission direction L oriented.
  • the mounting arrangement can be achieved that the LED module is pressed with a pressing force against the heat sink, which is particularly constant over a long period, for example, a lifetime of a corresponding lighting device. This allows a constant heat transfer to be achieved permanently.
  • the LED module can be easily and safely mounted on the heat sink.
  • the LED module can be easily replaced if necessary.
  • light-tightness can be achieved in a particularly suitable manner.

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Claims (10)

  1. Agencement destiné au montage d'un module LED sur la surface d'un corps de refroidissement, présentant
    un élément de pression pour presser le module LED contre la surface,
    un élément de ressort pour une disposition variable de l'élément de pression vis à vis de la surface,
    où l'élément de pression est conçu en forme de bague circulaire de sorte qu'une ouverture pour l'agencement du module LED se mettant en prise est ainsi formée,
    où l'élément de pression présente une cavité pour l'admission d'une protubérance formée sur le module LED, pointant dans une direction normale par rapport à la surface du corps de refroidissement, où la conception est telle que la protubérance du module LED ne peut s'insérer dans la cavité comme prévu que si le module LED adopte une position de rotation prévue définie vis à vis de l'élément de pression par rapport à un axe parallèle à la direction normale,
    caractérisé par
    une vis pour une liaison par vis avec le corps de refroidissement, où la vis présente une tête et où l'élément de ressort est prévu pour, d'une part, être disposé sur la tête de la vis et d'autre part, être disposé sur l'élément de pression.
  2. Agencement selon la revendication 1,
    chez lequel l'élément de pression est conçu en tant que cadre pour le module LED.
  3. Agencement selon la revendication 1 ou la revendication 2,
    chez lequel l'élément de pression présente en particulier une surface de pression en forme d'anneau pour presser le module LED contre la surface.
  4. Agencement selon l'une des revendications précédentes,
    chez lequel la vis présente en outre une surface d'épaulement pour une mise en place sur la surface du corps de refroidissement.
  5. Agencement selon la revendication 4, présentant en outre au moins un autre élément de ressort et au moins une autre vis,
    où l'au moins un autre élément de ressort et l'au moins une autre vis sont conçus de manière analogue à l'élément de ressort cité en premier lieu et à la vis cité en premier lieu.
  6. Agencement selon l'une des revendications précédentes,
    chez lequel l'élément de pression présente une tige en particulier conçue de manière circonférentielle pour la formation d'un labyrinthe optique.
  7. Agencement selon l'une des revendications précédentes,
    chez lequel l'élément de pression est constitué de métal.
  8. Agencement à LED, présentant
    un module LED,
    un corps de refroidissement doté d'une surface, et
    un agencement selon l'une des revendications précédentes pour le montage du module LED sur la surface du corps de refroidissement,
    où l'élément de pression est disposé de manière variable vis à vis de la surface à l'aide de l'élément de ressort.
  9. Agencement à LED selon la revendication 8,
    chez lequel l'élément de pression présente une cavité et le module LED présente une protubérance correspondant à la cavité qui est disposée en se mettant en prise dans la cavité.
  10. Agencement à LED selon la revendication 8 ou la revendication 9,
    où l'agencement présente les caractéristiques citées dans la revendication 6 pour le montage du module LED, présentant en outre
    un élément optique, notamment sous la forme d'un réflecteur qui présente une tige conçue de manière circonférentielle pour la formation d'un labyrinthe optique, où le labyrinthe optique est de préférence formé par la tige de l'élément de pression et la tige de l'élément optique.
EP16158385.1A 2015-03-04 2016-03-03 Arrangement d'un montage d'un module led sur une surface d'un corps de refroidissement et montage led Active EP3064827B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE202015101026.5U DE202015101026U1 (de) 2015-03-04 2015-03-04 Anordnung zur Montage eines LED-Moduls auf einer Oberfläche eines Kühlkörpers sowie LED-Anordnung

Publications (2)

Publication Number Publication Date
EP3064827A1 EP3064827A1 (fr) 2016-09-07
EP3064827B1 true EP3064827B1 (fr) 2019-05-08

Family

ID=55451125

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16158385.1A Active EP3064827B1 (fr) 2015-03-04 2016-03-03 Arrangement d'un montage d'un module led sur une surface d'un corps de refroidissement et montage led

Country Status (2)

Country Link
EP (1) EP3064827B1 (fr)
DE (1) DE202015101026U1 (fr)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130051009A1 (en) * 2009-09-24 2013-02-28 Molex Incorporated Light module system

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006310138A (ja) * 2005-04-28 2006-11-09 Matsushita Electric Ind Co Ltd 発光ユニット、照明装置及び表示装置
EP1780804A1 (fr) * 2005-10-25 2007-05-02 L&C Lighting Technology Corp. Dispositif à diodes électroluminescentes avec un dispositif de dissipation de chaleur actif
US7182627B1 (en) * 2006-01-06 2007-02-27 Advanced Thermal Devices, Inc. High illumosity lighting assembly
CN101210664A (zh) * 2006-12-29 2008-07-02 富准精密工业(深圳)有限公司 发光二极管灯具
DE202010004776U1 (de) * 2010-04-09 2011-09-02 Zumtobel Lighting Gmbh Leuchte mit schwenkbarer LED
DE102010033092A1 (de) * 2010-08-02 2012-02-02 Osram Opto Semiconductors Gmbh Optoelektronisches Leuchtmodul und Kfz-Scheinwerfer
US10104812B2 (en) * 2011-09-01 2018-10-16 Infineon Technologies Ag Elastic mounting of power modules
DE202011051187U1 (de) * 2011-09-02 2012-12-07 Zumtobel Lighting Gmbh Kühlkörper für ein Downlight, sowie Downlight
ITMI20112061A1 (it) * 2011-11-14 2013-05-15 A A G Stucchi Srl Portamodulo ed elemento dissipatore, particolarmente per moduli led e simili
CN104302974B (zh) * 2012-05-21 2017-07-28 欧司朗股份有限公司 用于照明源的安装装置及相关方法

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20130051009A1 (en) * 2009-09-24 2013-02-28 Molex Incorporated Light module system

Also Published As

Publication number Publication date
EP3064827A1 (fr) 2016-09-07
DE202015101026U1 (de) 2016-06-07

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