EP3230924A4 - Fingerabdrucksensor - Google Patents
Fingerabdrucksensor Download PDFInfo
- Publication number
- EP3230924A4 EP3230924A4 EP15867305.3A EP15867305A EP3230924A4 EP 3230924 A4 EP3230924 A4 EP 3230924A4 EP 15867305 A EP15867305 A EP 15867305A EP 3230924 A4 EP3230924 A4 EP 3230924A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- sensing device
- fingerprint sensing
- fingerprint
- sensing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/048—Interaction techniques based on graphical user interfaces [GUI]
- G06F3/0487—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser
- G06F3/0488—Interaction techniques based on graphical user interfaces [GUI] using specific features provided by the input device, e.g. functions controlled by the rotation of a mouse with dual sensing arrangements, or of the nature of the input device, e.g. tap gestures based on pressure sensed by a digitiser using a touch-screen or digitiser, e.g. input of commands through traced gestures
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
- G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
- G06V10/147—Details of sensors, e.g. sensor lenses
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/198—Contact-type image sensors [CIS]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/804—Containers or encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Vascular Medicine (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| SE1451527 | 2014-12-11 | ||
| PCT/SE2015/051318 WO2016093763A1 (en) | 2014-12-11 | 2015-12-09 | Fingerprint sensing device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| EP3230924A1 EP3230924A1 (de) | 2017-10-18 |
| EP3230924A4 true EP3230924A4 (de) | 2018-08-22 |
| EP3230924B1 EP3230924B1 (de) | 2020-02-12 |
Family
ID=56107806
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP15867305.3A Active EP3230924B1 (de) | 2014-12-11 | 2015-12-09 | Fingerabdrucksensor |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9576177B2 (de) |
| EP (1) | EP3230924B1 (de) |
| JP (1) | JP2017538933A (de) |
| KR (1) | KR101868859B1 (de) |
| CN (1) | CN106030611B (de) |
| TW (1) | TWI630532B (de) |
| WO (1) | WO2016093763A1 (de) |
Families Citing this family (31)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8485442B2 (en) | 2009-07-02 | 2013-07-16 | Biometric Payment Solutions | Electronic transaction verification system with biometric authentication |
| CN105453109B (zh) * | 2013-08-23 | 2018-05-29 | 指纹卡有限公司 | 用于指纹感测装置的连接垫 |
| CN105260043A (zh) * | 2014-06-13 | 2016-01-20 | 宸鸿科技(厦门)有限公司 | 具有指纹识别功能的触控面板 |
| CN105468187A (zh) * | 2014-06-18 | 2016-04-06 | 宸鸿科技(厦门)有限公司 | 具有指纹识别功能的触控面板 |
| CN104809448B (zh) * | 2015-05-08 | 2017-03-15 | 京东方科技集团股份有限公司 | 指纹传感器及显示装置 |
| WO2018000429A1 (zh) * | 2016-07-01 | 2018-01-04 | 华为技术有限公司 | 一种防水指纹识别模组和电子设备 |
| CN206178863U (zh) * | 2016-08-12 | 2017-05-17 | 广东欧珀移动通信有限公司 | 指纹按键、发光提示结构及终端设备 |
| CN106295590A (zh) | 2016-08-16 | 2017-01-04 | 广东欧珀移动通信有限公司 | 指纹模组、指纹模组制作方法及移动终端 |
| EP3285207A1 (de) * | 2016-08-16 | 2018-02-21 | Guangdong Oppo Mobile Telecommunications Corp., Ltd | Eingabeanordnung und herstellungsverfahren |
| US10395164B2 (en) * | 2016-12-15 | 2019-08-27 | Fingerprint Cards Ab | Fingerprint sensing module and method for manufacturing the fingerprint sensing module |
| US11610429B2 (en) * | 2016-12-15 | 2023-03-21 | Fingerprint Cards Anacatum Ip Ab | Fingerprint sensing module and method for manufacturing the fingerprint sensing module |
| US11023702B2 (en) * | 2016-12-15 | 2021-06-01 | Fingerprint Cards Ab | Fingerprint sensing module and method for manufacturing the fingerprint sensing module |
| CN108205650B (zh) * | 2016-12-20 | 2021-11-30 | 致伸科技股份有限公司 | 指纹辨识模块 |
| TWI597671B (zh) * | 2017-03-01 | 2017-09-01 | 映智科技股份有限公司 | 指紋偵測方法及電路 |
| WO2018164634A1 (en) * | 2017-03-10 | 2018-09-13 | Fingerprint Cards Ab | Fingerprint sensor module and a method for manufacturing such a fingerprint sensor module |
| CN108629253B (zh) * | 2017-03-24 | 2022-07-19 | 敦泰电子有限公司 | 指纹辨识装置 |
| FR3069081B1 (fr) * | 2017-07-17 | 2021-08-20 | Safran Identity & Security | Carte electronique comprenant un capteur d'empreinte et procede de fabrication d'une telle carte |
| KR102200517B1 (ko) * | 2017-08-07 | 2021-01-11 | 크루셜텍 (주) | 커버부를 가진 방수 지문 센서 모듈 |
| CN109427696B (zh) * | 2017-08-25 | 2020-06-05 | 致伸科技股份有限公司 | 指纹感测芯片封装结构 |
| TWI626599B (zh) * | 2017-09-26 | 2018-06-11 | 速博思股份有限公司 | 小曲率半徑指紋偵測器結構 |
| CN107979669B (zh) * | 2017-12-12 | 2023-10-03 | 江苏凯尔生物识别科技有限公司 | 用于智能手机的触控指纹组件 |
| KR102415468B1 (ko) | 2018-02-14 | 2022-07-01 | 삼성전자주식회사 | 디스플레이의 아래에 배치된 생체 센서와 디스플레이 사이의 공간을 채우기 위한 충진재를 포함하는 전자 장치 |
| KR102658176B1 (ko) * | 2018-04-24 | 2024-04-18 | 삼성디스플레이 주식회사 | 표시장치 |
| JP7071234B2 (ja) * | 2018-06-29 | 2022-05-18 | キヤノン株式会社 | 電子機器 |
| WO2020237546A1 (zh) * | 2019-05-29 | 2020-12-03 | 深圳市汇顶科技股份有限公司 | 指纹识别装置和电子设备 |
| CN110692135B (zh) * | 2019-06-14 | 2021-03-19 | 深圳市汇顶科技股份有限公司 | 芯片封装结构和电子设备 |
| WO2021095193A1 (ja) * | 2019-11-14 | 2021-05-20 | 株式会社ティエーブル | イメージセンサモジュール、及び、イメージセンサモジュールの製造方法 |
| TWI771725B (zh) * | 2020-02-18 | 2022-07-21 | 神盾股份有限公司 | 指紋感測裝置 |
| FR3111215B1 (fr) * | 2020-06-04 | 2022-08-12 | Linxens Holding | Module de capteur biométrique pour carte à puce et procédé de fabrication d’un tel module |
| US11495042B1 (en) * | 2021-05-10 | 2022-11-08 | Image Match Design Inc. | Voltage sensing fingerprint recognition device and fingerprint recognition method thereof |
| CN114745850A (zh) * | 2022-04-13 | 2022-07-12 | 业成科技(成都)有限公司 | 指纹识别装置和指纹识别装置的制造方法 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050231213A1 (en) * | 2004-04-16 | 2005-10-20 | Chou Bruce C S | Chip-type sensor against ESD and stress damages and contamination interference |
| US20110254108A1 (en) * | 2010-04-15 | 2011-10-20 | Authentec, Inc. | Finger sensor including capacitive lens and associated methods |
| CN104051367A (zh) * | 2014-07-01 | 2014-09-17 | 苏州晶方半导体科技股份有限公司 | 指纹识别芯片封装结构和封装方法 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6028773A (en) | 1997-11-14 | 2000-02-22 | Stmicroelectronics, Inc. | Packaging for silicon sensors |
| WO2001091193A2 (en) * | 2000-05-23 | 2001-11-29 | Atmel Corporation | Integrated ic chip package for electronic image sensor die |
| US6653723B2 (en) * | 2002-03-09 | 2003-11-25 | Fujitsu Limited | System for providing an open-cavity low profile encapsulated semiconductor package |
| TWI250591B (en) * | 2004-03-18 | 2006-03-01 | Advanced Semiconductor Eng | Sliding type fingerprint sensor package |
| US8325159B2 (en) * | 2004-04-14 | 2012-12-04 | Elo Touch Solutions, Inc. | Acoustic touch sensor |
| TWI310521B (en) * | 2005-06-29 | 2009-06-01 | Egis Technology Inc | Structure of sweep-type fingerprint sensing chip capable of resisting electrostatic discharge (esd) and method of fabricating the same |
| TWI328776B (en) * | 2006-12-26 | 2010-08-11 | Egis Technology Inc | Sweep-type fingerprint sensing device and method of packaging the same |
| US9437478B2 (en) | 2010-05-11 | 2016-09-06 | Xintec Inc. | Chip package and method for forming the same |
| US8952501B2 (en) * | 2010-05-11 | 2015-02-10 | Xintec, Inc. | Chip package and method for forming the same |
| CN102244047B (zh) * | 2010-05-11 | 2015-09-23 | 精材科技股份有限公司 | 晶片封装体及其形成方法 |
| KR101503183B1 (ko) * | 2010-06-18 | 2015-03-16 | 오쎈테크, 인코포레이티드 | 감지 영역 위에 캡슐화 층을 포함하는 핑거 센서 및 관련 방법 |
| JP5406161B2 (ja) * | 2010-10-20 | 2014-02-05 | アルプス電気株式会社 | 入力装置及び入力装置の製造方法 |
| US8836478B2 (en) * | 2011-09-25 | 2014-09-16 | Authentec, Inc. | Electronic device including finger sensor and related methods |
| KR20140052539A (ko) * | 2012-10-24 | 2014-05-07 | 크루셜텍 (주) | 지문센서 패키지 및 이를 구비한 휴대용 전자기기 |
| CN103207984A (zh) * | 2012-11-27 | 2013-07-17 | 鹤山世达光电科技有限公司 | 指纹传感装置和方法 |
| CN205540791U (zh) * | 2013-04-15 | 2016-08-31 | Ip城市株式会社 | 指纹传感器模块 |
| CN105453109B (zh) * | 2013-08-23 | 2018-05-29 | 指纹卡有限公司 | 用于指纹感测装置的连接垫 |
| TWI534962B (zh) * | 2013-12-09 | 2016-05-21 | 茂丞科技股份有限公司 | 具有外觀隱藏的耦合電極之近接式感測器及其製造方法 |
-
2015
- 2015-10-29 US US14/926,327 patent/US9576177B2/en active Active
- 2015-11-10 TW TW104136978A patent/TWI630532B/zh active
- 2015-12-09 CN CN201580008560.4A patent/CN106030611B/zh active Active
- 2015-12-09 JP JP2017528516A patent/JP2017538933A/ja active Pending
- 2015-12-09 KR KR1020177013484A patent/KR101868859B1/ko not_active Expired - Fee Related
- 2015-12-09 WO PCT/SE2015/051318 patent/WO2016093763A1/en not_active Ceased
- 2015-12-09 EP EP15867305.3A patent/EP3230924B1/de active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050231213A1 (en) * | 2004-04-16 | 2005-10-20 | Chou Bruce C S | Chip-type sensor against ESD and stress damages and contamination interference |
| US20110254108A1 (en) * | 2010-04-15 | 2011-10-20 | Authentec, Inc. | Finger sensor including capacitive lens and associated methods |
| CN104051367A (zh) * | 2014-07-01 | 2014-09-17 | 苏州晶方半导体科技股份有限公司 | 指纹识别芯片封装结构和封装方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3230924B1 (de) | 2020-02-12 |
| JP2017538933A (ja) | 2017-12-28 |
| TW201636805A (zh) | 2016-10-16 |
| KR101868859B1 (ko) | 2018-06-19 |
| EP3230924A1 (de) | 2017-10-18 |
| CN106030611B (zh) | 2017-10-10 |
| US9576177B2 (en) | 2017-02-21 |
| KR20170082539A (ko) | 2017-07-14 |
| US20160171271A1 (en) | 2016-06-16 |
| CN106030611A (zh) | 2016-10-12 |
| WO2016093763A1 (en) | 2016-06-16 |
| TWI630532B (zh) | 2018-07-21 |
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