EP3252187B1 - Bague collectrice à bruit de contact reduit - Google Patents

Bague collectrice à bruit de contact reduit Download PDF

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Publication number
EP3252187B1
EP3252187B1 EP16197807.7A EP16197807A EP3252187B1 EP 3252187 B1 EP3252187 B1 EP 3252187B1 EP 16197807 A EP16197807 A EP 16197807A EP 3252187 B1 EP3252187 B1 EP 3252187B1
Authority
EP
European Patent Office
Prior art keywords
layer
nickel
copper
substrate
gold
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP16197807.7A
Other languages
German (de)
English (en)
Other versions
EP3252187A1 (fr
Inventor
Christian Holzapfel
Peter HEINBUCH
Sascha Christmann
Michael Ritz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Umicore Galvanotechnik GmbH
Schleifring GmbH
Original Assignee
Umicore Galvanotechnik GmbH
Schleifring GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Umicore Galvanotechnik GmbH, Schleifring GmbH filed Critical Umicore Galvanotechnik GmbH
Publication of EP3252187A1 publication Critical patent/EP3252187A1/fr
Application granted granted Critical
Publication of EP3252187B1 publication Critical patent/EP3252187B1/fr
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C25D3/40—Electroplating: Baths therefor from solutions of copper from cyanide baths, e.g. with Cu+
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Definitions

  • the invention relates to a method for producing a gold-plated slip ring contact, a sliding contact and a galvanic bath.
  • US 4,398,113 discloses a slip ring assembly which has a conventional slip ring contact.
  • a copper layer (from 0.1 ⁇ m to 4 ⁇ m layer thickness) is successively applied to a mechanically processed copper-containing substrate material as an activation layer, if necessary a nickel and / or nickel-phosphor layer (each from 1 ⁇ m to 10 ⁇ m layer thickness) as a diffusion barrier. , Support and corrosion protection layer and a hard gold layer (from 1 ⁇ m to 15 ⁇ m) as contact material.
  • Galvanic application of several layers to a substrate material is described, for example, in EP 2 581473 A1 , JP H03 223486 A , US 2003/135981 A1 and CN 101 696 512 A. disclosed.
  • the object of the invention is to improve the electrical behavior, in particular the noise behavior, of the sliding contact.
  • the process for producing a gold-plated slip ring contact has the following process steps: provision of an electrically conductive substrate, galvanic application of a copper layer on the substrate, galvanic application of a nickel and / or nickel-phosphorus layer on the copper layer, and galvanic application of a gold layer on the nickel and / or nickel-phosphor layer.
  • provision of an electrically conductive substrate galvanic application of a copper layer on the substrate
  • galvanic application of a nickel and / or nickel-phosphorus layer on the copper layer
  • galvanic application of a gold layer on the nickel and / or nickel-phosphor layer is used.
  • Such sliding contacts establish an electrical connection between moving parts.
  • Such a sliding contact can be used either as a fixed part or as a moving part.
  • Such a sliding contact can of course also be used both as a fixed part and as a moving part of a grinding module.
  • E.g. such a sliding contact can also be used as a brush or as a sliding track.
  • the absence of the brightener means that the copper layer deposited on the brass-containing substrate has a higher roughness than in the prior art.
  • Sa or Sq values according to EN ISO 25178 can be used to characterize the layer roughness.
  • the Sq value is the effective value or the square mean of the profile height of the surface.
  • the Sa value is an average of the absolute values of the profile height of the surface.
  • Typical Sa or Sq values for copper baths of the prior art are in the order of magnitude of 10 to 50 nm.
  • the layer roughness of the deposited copper layer becomes Sa or Sq values of 200 nm to 1 ⁇ m increased.
  • a certain leveling can take place depending on the intermediate layer and final layer used.
  • the Sa and Sq values of the final layer according to the invention are typically a factor of 5 to 20 higher and thus rougher compared to conventional final layers.
  • a gold layer produced in this way has improved electrical properties, in particular reduced contact noise.
  • a sliding contact thus also has these improved electrical properties, in particular a reduced contact noise.
  • such a layer structure with a rough uppermost gold layer can be used either on the brush or on the brush wires or on the sliding track or both on the brush or on the brush wires and on the sliding track.
  • electrical noise values differ, e.g. measured as the 90% percentile of the peak-to-peak noise value over 5 revolutions over the lifetime, typically at least by a factor of 2.
  • a pure potassium copper cyanide solution is used as the electroplating bath in the galvanic application of the copper layer.
  • the copper layer is preferably applied to the substrate with a layer thickness of up to 4 ⁇ m. In a particularly advantageous embodiment, it is a copper layer with a layer thickness of up to 10 ⁇ m.
  • the nickel and / or nickel-phosphorus layer is preferably applied with a layer thickness between 5 and 10 ⁇ m.
  • the gold layer is electroplated onto the nickel and / or nickel phosphor layer
  • the gold layer is preferably applied with a layer thickness between 3 and 9 ⁇ m, particularly preferably 6 ⁇ m.
  • the process for producing a gold-plated slip ring contact produces a slip ring contact which has the following layer sequence: an electrically conductive substrate, a copper layer on the substrate, a nickel and / or nickel-phosphor layer on the copper layer, and a gold layer on the nickel and / or nickel-phosphor layer.
  • the substrate has brass. It is further preferred that the substrate is made of brass.
  • This slip ring contact which e.g. can be attached to a brush or on a sliding track, as already described above, is characterized by improved electrical properties.
  • a galvanic bath is used for the deposition of copper, in which no brightener is used in the galvanic bath.
  • an electrolyte based on potassium copper cyanide is preferably used as the electroplating bath in the galvanic application of the copper layer 12 to the substrate 10.
  • the copper layer 12 is preferably applied to the substrate with a layer thickness of up to 4 ⁇ m.
  • the copper layer 12 is a copper layer with a layer thickness of up to 10 ⁇ m.
  • Figure 3 shows the third step of the method according to the invention for producing a gold-plated slip ring contact.
  • a nickel and / or nickel-phosphor layer 14 is applied galvanically to the copper layer 12.
  • the nickel and / or nickel-phosphor layer 14 is preferably applied with a layer thickness between 5 and 10 ⁇ m.
  • Figure 4 shows the fourth and last step of the method according to the invention for producing a gold-plated slip ring contact.
  • a gold layer 16 is galvanically applied to the nickel and / or nickel-phosphor layer 14.
  • the gold layer 16 is preferably applied with a layer thickness between 3 and 9 ⁇ m, particularly preferably 6 ⁇ m.
  • Figure 4 thus likewise shows a sliding contact according to the invention with the layer sequence described above on the substrate 10.
  • the sliding contact has a rougher surface than sliding contacts from the prior art.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Electroplating Methods And Accessories (AREA)

Claims (6)

  1. Procédé de fabrication d'un contact de bague collectrice doré comprenant les étapes suivantes :
    - fourniture d'un substrat électriquement conducteur (10) ;
    - dépôt électrolytique d'une couche de cuivre (12) sur le substrat (10) ;
    - dépôt électrolytique d'une couche de nickel et/ou de nickel-phosphore (14) sur la couche de cuivre (12) ; et
    - dépôt électrolytique d'une couche d'or (16) sur la couche de nickel et/ou de nickel-phosphore (14) ;
    caractérisé en ce que
    le substrat (10) est réalisé en laiton et, lors du dépôt électrolytique de la couche de cuivre (12) sur le substrat (10), un électrolyte constitué d'une solution pure de cyanure de cuivre et de potassium est utilisé comme bain galvanique.
  2. Procédé selon la revendication précédente,
    caractérisé en ce que
    lors du dépôt électrolytique de la couche de cuivre (12) sur le substrat (10), la couche de cuivre (12) est appliquée avec une épaisseur de couche allant jusqu'à 4 µm.
  3. Procédé selon l'une des revendications précédentes,
    caractérisé en ce que
    lors du dépôt électrolytique de la couche de cuivre (12) sur le substrat (10), la couche de cuivre (12) est appliquée avec une épaisseur de couche allant jusqu'à 10 µm.
  4. Procédé selon l'une des revendications précédentes,
    caractérisé en ce que
    lors du dépôt électrolytique de la couche de nickel et/ou de nickel-phosphore (14) sur la couche de cuivre (12), la couche de nickel et/ou de nickel-phosphore (14) est appliquée avec une épaisseur de couche comprise entre 5 et 10 µm.
  5. Procédé selon l'une des revendications précédentes,
    caractérisé en ce que
    lors du dépôt électrolytique de la couche d'or (16) sur la couche de nickel-phosphore (14), la couche d'or (16) est appliquée avec une épaisseur de couche comprise entre 3 et 9 µm, de préférence de 6 µm.
  6. Contact frottant présentant :
    un substrat électriquement conducteur (10) ;
    une couche de cuivre (12) sur le substrat (10) ;
    une couche de nickel-phosphore (14) sur la couche de cuivre (12) ; et
    une couche d'or (16) sur la couche de nickel-phosphore (14) ;
    caractérisé en ce que
    le substrat (10) est réalisé en laiton et, lors du dépôt électrolytique de la couche de cuivre (12) sur le substrat (10), un électrolyte constitué d'une solution pure de cyanure de cuivre et de potassium est utilisé comme bain galvanique et une rugosité de couche de la couche de cuivre déposée (12) présente des valeurs Sa ou Sq de 200 nm à 1 µm.
EP16197807.7A 2016-05-30 2016-11-08 Bague collectrice à bruit de contact reduit Active EP3252187B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP16172007 2016-05-30

Publications (2)

Publication Number Publication Date
EP3252187A1 EP3252187A1 (fr) 2017-12-06
EP3252187B1 true EP3252187B1 (fr) 2020-04-29

Family

ID=56112831

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16197807.7A Active EP3252187B1 (fr) 2016-05-30 2016-11-08 Bague collectrice à bruit de contact reduit

Country Status (1)

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EP (1) EP3252187B1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114361592B (zh) * 2021-12-28 2023-08-01 大连中比动力电池有限公司 一种添加剂及其在钠离子电池电解液中的应用
CN116103711A (zh) * 2022-12-29 2023-05-12 安徽智备工业科技有限公司 一种正逆向脉冲电解镍磷合金溶液、配制方法、电镀方法和镍磷合金镀层

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4398113A (en) 1980-12-15 1983-08-09 Litton Systems, Inc. Fiber brush slip ring assembly
JPH0663111B2 (ja) * 1990-01-25 1994-08-17 日本アビオニクス株式会社 銅張積層板の摺動部材の表面処理方法
US6984915B2 (en) * 2002-01-22 2006-01-10 Electro-Tec Corp. Electrical slip ring platter multilayer printed circuit board and method for making same
CN101696512A (zh) * 2009-11-13 2010-04-21 江苏省如高高压电器有限公司 高压触头、触指的镀金工艺
DE102011115802B4 (de) * 2011-10-12 2015-03-12 C. Hafner Gmbh + Co. Kg Verfahren zur Korrosionsschutzbehandlung eines Werkstücks aus einem Aluminiumwerkstoff, insbesondere aus einer Aluminiumknetlegierung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
None *

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