EP3255362B1 - Halbleiterkühlanlage - Google Patents

Halbleiterkühlanlage Download PDF

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Publication number
EP3255362B1
EP3255362B1 EP15880937.6A EP15880937A EP3255362B1 EP 3255362 B1 EP3255362 B1 EP 3255362B1 EP 15880937 A EP15880937 A EP 15880937A EP 3255362 B1 EP3255362 B1 EP 3255362B1
Authority
EP
European Patent Office
Prior art keywords
pipe
semiconductor refrigerator
main pipe
hot end
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP15880937.6A
Other languages
English (en)
French (fr)
Other versions
EP3255362A4 (de
EP3255362A1 (de
Inventor
Haibo TAO
Kui Zhang
Jianru Liu
Peng Li
Chunyang Li
Feifei QI
Lisheng JI
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qingdao Haier Co Ltd
Original Assignee
Qingdao Haier Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qingdao Haier Co Ltd filed Critical Qingdao Haier Co Ltd
Publication of EP3255362A1 publication Critical patent/EP3255362A1/de
Publication of EP3255362A4 publication Critical patent/EP3255362A4/de
Application granted granted Critical
Publication of EP3255362B1 publication Critical patent/EP3255362B1/de
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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D19/00—Arrangement or mounting of refrigeration units with respect to devices or objects to be refrigerated, e.g. infrared detectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00—Machines, plants or systems, using electric or magnetic effects
    • F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D11/00—Self-contained movable devices, e.g. domestic refrigerators
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25D—REFRIGERATORS; COLD ROOMS; ICE-BOXES; COOLING OR FREEZING APPARATUS NOT OTHERWISE PROVIDED FOR
    • F25D23/00—General constructional features
    • F25D23/003—General constructional features for cooling refrigerating machinery
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F1/00—Tubular elements; Assemblies of tubular elements
    • F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
    • F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
    • F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
    • F28F1/30—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being attachable to the element
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00—Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02—Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025—Removal of heat
    • F25B2321/0252—Removal of heat by liquids or two-phase fluids
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/18—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes sintered

Definitions

  • EP0592044A2 discloses a refrigerator according to the preamble of claim 1.
  • One object of the present invention is to overcome at least one defect of an existing semiconductor refrigerator by providing a semiconductor refrigerator with high heat radiation efficiency.
  • the present invention provides a semiconductor refrigerator comprising a semiconductor cooling plate and a hot end heat radiating device, wherein the hot end heat radiating device comprises multiple sintered heat pipes, each having a main pipe with both ends closed, wherein the main pipe comprises a first pipe segment thermally connected with a hot end of the semiconductor cooling plate, and a second pipe segment, which is located above the first pipe segment, and from whose one or more portions extend one or more manifolds to radiate heat from the hot end of the semiconductor cooling plate to an ambient environment.
  • each plate fin is provided with a receiving through hole so that each fin group defines a receiving space extending along the axes of the receiving through holes;
  • the hot end heat radiating device further comprises one or two blowers respectively provided in the receiving spaces of the corresponding fin groups and configured such that air flow is sucked from an air inlet area of each blower and is blown to a gap between each two adjacent plate fins of the corresponding fin group.
  • the hot end heat radiating device is configured to radiate the heat from the hot end of the semiconductor cooling plate 150 to ambient air.
  • the hot end heat radiating device may comprise multiple sintered heat pipes 200, each having a main pipe 210 with both ends closed.
  • the main pipe 210 may comprise a first pipe segment 211 and a second pipe segment 212 located above the first pipe segment 211.
  • the first pipe segment 211 is thermally connected with a hot end of the semiconductor cooling plate 150.
  • one or more manifolds 220 extend from one or more portions of the second pipe segment 212 to radiate the heat from the hot end of the semiconductor cooling plate 150 to an ambient environment, which considerably improves the heat radiating efficiency of the semiconductor refrigerator.
  • the length of the connecting pipe segment 213 of one sintered heat pipe 200 at one side of the geometrical symmetry plane is smaller than that of the connecting pipe segment 213 of the other sintered heat pipe 200 at the same side of the geometrical symmetry plane, so that the four sintered heat pipes 200 are reasonably arranged.

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Geometry (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Claims (10)

  1. Halbleiterkühlschrank mit einer Halbleiterkühlplatte (150) und einer Heißes-Ende-Wärmestrahlungsvorrichtung,
    wobei die Heißes-Ende-Wärmestrahlungsvorrichtung mehrere gesinterte Wärmeleitungen (200) aufweist, wobei jede eine Hauptleitung (210) aufweist, bei der beide Enden geschlossen sind,
    wobei die Hauptleitung (210) ein erstes Leitungssegment (211) aufweist, das mit einem heißen Ende der Halbleiterkühlplatte thermisch verbunden ist, und eine zweites Leitungssegment (212), das sich oberhalb des ersten Leitungssegments (211) befindet und von dessen einem oder mehreren Abschnitten sich ein oder mehrere Verteiler (220) erstrecken, um Wärme von dem heißen Ende der Halbleiterkühlplatte (150) in eine Umgebung abzugeben.
  2. Halbleiterkühlschrank nach Anspruch 1, wobei das erste Leitungssegment (211) der Hauptleitung (210) ausgebildet ist, indem es sich von einem unteren Ende der Hauptleitung vertikal nach oben um eine vorbestimmte Länge erstreckt, und
    wobei sich die ersten Leitungssegmente (211) mehrere Hauptleitungen in der gleichen Ebene parallel zueinander befinden und sich zwischen ihnen Lücken befinden, wobei die Ebene parallel zu einer Rückwand eines Innentanks (100) des Halbleiterkühlschranks ist.
  3. Halbleiterkühlschrank nach Anspruch 1, wobei die Heißes-Ende-Wärmestrahlungsvorrichtung aufweist:
    eine fixierte Bodenplatte (310), deren vordere Fläche mit dem heißen Ende der Halbleiterkühlplatte (150) thermisch verbunden ist und deren hinter Fläche mit einer oder mehreren Nuten versehen ist; und
    eine fixierte Abdeckplatte (320), deren vordere Fläche mit einer oder mehreren Nuten versehen ist, und die derart ausgebildet ist, dass sie mit der fixierten Bodenplatte (310) zusammenwirkt, um das erste Leitungssegment (211) der Hauptleitung (210) zwischen den Nuten der fixierten Abdeckplatte und der fixierten Bodenplatte zu klemmen.
  4. Halbleiterkühlschrank nach Anspruch 1, wobei das zweite Leitungssegment (212) der Hauptleitung ausgebildet ist, indem es sich von einem oberen Ende der Hauptleitung vertikal nach unten um eine vorbestimmte Länge erstreckt, und wobei sich die zweiten Leitungssegmente (212) der mehreren Hauptleitungen in der gleichen Ebene parallel zueinander befinden und sich Lücken zwischen ihnen befinden, wobei die Ebene parallel zu der Rückwand des Innentanks (100) des Halbleiterkühlschranks ist; oder
    wobei das zweite Leitungssegment (212) der Hauptleitung ausgebildet ist, indem es sich von dem oberen Ende der Hauptleitung längs nach vorne um eine vorbestimmte Länge erstreckt und anschließend vertikal nach unten um eine vorbestimmte Länge erstreckt, wobei sich die vertikalen Abschnitte der zweiten Leitungssegmente (212) der mehreren Hauptleitungen in der gleichen Ebene parallel zueinander befinden und sich Lücken zwischen ihnen befinden, wobei die Ebene parallel zu der Rückwand des Innentanks (100) des Halbleiterkühlschranks ist, und wobei sich ein Startende des Verteilers (220) der gesinterten Wärmeleitung (200) an dem vertikalen Abschnitt eines entsprechenden zweiten Leitungssegments (212) befindet.
  5. Halbleiterkühlschrank nach Anspruch 1, wobei der Verteiler (220) der gesinterten Wärmeleitung (200) senkrecht zur Rückwand des Innentanks (100) ist.
  6. Halbleiterkühlschrank nach Anspruch 1, wobei sich die Verteiler jeder gesinterten Wärmeleitung an der gleichen Seite der entsprechenden Hauptleitung (210) befinden bzw. sich an den entgegengesetzten Seiten der entsprechenden Hauptleitung (210) befinden.
  7. Halbleiterkühlschrank nach Anspruch 6, wobei die Heißes-Ende-Wärmestrahlungsvorrichtung aufweist:
    eine oder zwei Rippengruppen (400), wobei jede Rippengruppe mehrere entsprechende Plattenrippen aufweist, die parallel und mit Lücken dazwischen angeordnet sind, und wobei jede Rippengruppe an einem Verteiler (220) auf einer entsprechenden Seite der Hauptleitung installiert ist über Leitungslöcher der jeweiligen Plattenrippen.
  8. Halbleiterkühlschrank nach Anspruch 7, wobei die Heißes-Ende-Wärmestrahlungsvorrichtung aufweist:
    ein Gebläse (500), das an einer Querseite der oder oberhalb der mehreren Verteiler (220) angeordnet ist und derart ausgebildet ist, dass ein Lufteinlassbereich des Gebläses einen Luftstrom ansaugt und der Luftstrom zu einer Lücke zwischen den jeweils zwei benachbarten Plattenrippen geblasen wird, oder der Luftstrom von der Lücke zwischen den jeweils zwei benachbarten Plattenrippen angesaugt wird und dann in den Lufteinlassbereich geblasen wird.
  9. Halbleiterkühlschrank nach Anspruch 7, wobei der Mittelabschnitt jeder Plattenrippe eine Aufnahmedurchgangsbohrung aufweist, so dass jede Rippengruppe einen Aufnahmeraum definiert, der sich entlang der Achsen der Aufnahmedurchgangsbohrung erstreckt; und
    wobei die Heißes-Ende-Wärmestrahlungsvorrichtung ferner ein oder zwei Gebläse (500) aufweist, die jeweils in den Aufnahmeräumen der entsprechenden Rippengruppen (400) vorgesehen sind und derart ausgebildet sind, dass der Luftstrom von einem Lufteinlassbereich jedes Gebläses (500) angesaugt wird und zu einer Lücke zwischen jeweils zwei benachbarten Plattenrippen der entsprechenden Rippengruppe (400) geblasen wird.
  10. Halbleiterkühlanlage nach Anspruch 5, wobei die Heißes-Ende-Wärmestrahlungsvorrichtung ferner aufweist:
    mehrere Spiralrippen (450), die jeweils spiralförmig auf einem entsprechenden Verteiler (220) installiert sind, und
    ein Gebläse (500), das an einer Querseite der oder oberhalb der mehreren Verteiler angeordnet ist, so dass sich die Verteiler jeder gesinterten Wärmeleitung (200) an einem Lufteinlassbereich oder einem Luftansaugbereich des Gebläses (500) befinden.
EP15880937.6A 2015-02-03 2015-09-29 Halbleiterkühlanlage Active EP3255362B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201510055838.5A CN104729182B (zh) 2015-02-03 2015-02-03 半导体制冷冰箱
PCT/CN2015/091094 WO2016123995A1 (zh) 2015-02-03 2015-09-29 半导体制冷冰箱

Publications (3)

Publication Number Publication Date
EP3255362A1 EP3255362A1 (de) 2017-12-13
EP3255362A4 EP3255362A4 (de) 2018-08-29
EP3255362B1 true EP3255362B1 (de) 2019-11-13

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EP15880937.6A Active EP3255362B1 (de) 2015-02-03 2015-09-29 Halbleiterkühlanlage

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US (1) US20170328610A1 (de)
EP (1) EP3255362B1 (de)
CN (1) CN104729182B (de)
WO (1) WO2016123995A1 (de)

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CN104729182B (zh) * 2015-02-03 2016-11-23 青岛海尔股份有限公司 半导体制冷冰箱
WO2018183731A1 (en) * 2017-03-29 2018-10-04 Rockwell Collins, Inc. Liquid chilled galley bar unit
JP6640401B1 (ja) * 2019-04-18 2020-02-05 古河電気工業株式会社 ヒートシンク
CN112856615B (zh) * 2021-01-07 2022-06-24 施斌卿 除湿机防结冰控制方法及除湿机
CN115164493B (zh) * 2022-07-15 2024-11-01 青岛海容商用冷链股份有限公司 风冷式半导体冷冻柜及其控制方法
CN117073293A (zh) * 2023-08-28 2023-11-17 浙江汉恒热电科技有限公司 通风式热电温控装置及具备该装置的抽屉式车载冷暖箱

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Also Published As

Publication number Publication date
EP3255362A4 (de) 2018-08-29
WO2016123995A1 (zh) 2016-08-11
CN104729182B (zh) 2016-11-23
CN104729182A (zh) 2015-06-24
EP3255362A1 (de) 2017-12-13
US20170328610A1 (en) 2017-11-16

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