EP3276042A4 - Verfahren zur herstellung eines plattierten artikels - Google Patents

Verfahren zur herstellung eines plattierten artikels Download PDF

Info

Publication number: EP3276042A4
Authority: EP; European Patent Office
Prior art keywords: plated article; producing plated; producing; article; plated
Prior art date: 2015-03-24
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP16768841.5A

Other languages

English (en)

French (fr)

Other versions

EP3276042A1 (de

EP3276042B1 (de

Inventor

Yoshiyuki Nishimura

Rie MIYAKE

Chisa FUKUDA

Masao Takamizawa

Yutaka Mitooka

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

OM SANGYO CO Ltd

Original Assignee

OM SANGYO CO Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2015-03-24

Filing date

2016-03-23

Publication date

2018-11-07

2016-03-23 Application filed by OM SANGYO CO Ltd filed Critical OM SANGYO CO Ltd

2018-01-31 Publication of EP3276042A1 publication Critical patent/EP3276042A1/de

2018-11-07 Publication of EP3276042A4 publication Critical patent/EP3276042A4/de

2024-01-31 Application granted granted Critical

2024-01-31 Publication of EP3276042B1 publication Critical patent/EP3276042B1/de

Status Active legal-status Critical Current

2036-03-23 Anticipated expiration legal-status Critical

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1612—Process or apparatus coating on selected surface areas by direct patterning through irradiation means
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1635—Composition of the substrate
- C23C18/1639—Substrates other than metallic, e.g. inorganic or organic or non-conductive
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1655—Process features
- C23C18/1664—Process features with additional means during the plating process
- C23C18/1667—Radiant energy, e.g. laser
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1862—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by radiant energy
- C23C18/1868—Radiation, e.g. UV, laser
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1886—Multistep pretreatment
- C23C18/1893—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/54—Contact plating, i.e. electroless electrochemical plating

Landscapes

Chemical & Material Sciences (AREA)
Metallurgy (AREA)
Mechanical Engineering (AREA)
General Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Organic Chemistry (AREA)
Health & Medical Sciences (AREA)
Toxicology (AREA)
Physics & Mathematics (AREA)
Optics & Photonics (AREA)
Inorganic Chemistry (AREA)
Chemically Coating (AREA)
Surface Treatment Of Glass (AREA)
Manufacturing Of Printed Wiring (AREA)

EP16768841.5A 2015-03-24 2016-03-23 Verfahren zur herstellung eines plattierten artikels Active EP3276042B1 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2015061779		2015-03-24
PCT/JP2016/059264 WO2016152938A1 (ja)	2015-03-24	2016-03-23	めっき品の製造方法

Publications (3)

Publication Number	Publication Date
EP3276042A1 EP3276042A1 (de)	2018-01-31
EP3276042A4 true EP3276042A4 (de)	2018-11-07
EP3276042B1 EP3276042B1 (de)	2024-01-31

Family

ID=56978210

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP16768841.5A Active EP3276042B1 (de)	2015-03-24	2016-03-23	Verfahren zur herstellung eines plattierten artikels

Country Status (5)

Country	Link
US (1)	US20170191165A1 (de)
EP (1)	EP3276042B1 (de)
JP (1)	JP6264596B2 (de)
CN (1)	CN106460177A (de)
WO (1)	WO2016152938A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP6458285B2 (ja) *	2015-03-24	2019-01-30	オーエム産業株式会社	デバイスの製造方法
JP2019026879A (ja) *	2017-07-27	2019-02-21	株式会社クオルテック	電子部品の製造方法及び電子部品
US11266025B2 (en)	2017-11-21	2022-03-01	Qualtec Co., Ltd.	Electronic-component manufacturing method and electronic components
CN110306213B (zh) *	2019-07-08	2020-08-04	广州三孚新材料科技股份有限公司	一种太阳能电池用镀锡液及其制备方法
JP6745560B1 (ja) *	2020-03-25	2020-08-26	株式会社イオックス	パターン形状の無電解めっき層を有するめっき物
LT7117B (lt)	2023-06-01	2025-01-27	Valstybinis mokslinių tyrimų institutas Fizinių ir technologijos mokslų centras	Selektyvus metalo padengimo ant gaminio, pagaminto iš neorganinio dielektriko arba puslaidininkinės medžiagos, paviršiaus būdas

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4637862A (en) *	1985-12-16	1987-01-20	General Motors Corporation	Wire-glass composite and method of making same
EP0501095A1 (de) *	1991-03-01	1992-09-02	Lucien Diégo Laude	Verfahren zur Metallisierung metallhaltiger dielektrischer Oberflächen
US6238749B1 (en) *	1993-10-11	2001-05-29	U.S. Philips Corporation	Method of providing a metal pattern on an electrically insulating substrate in an electroless process

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JPS50112231A (de) *	1974-02-15	1975-09-03
JPS60149782A (ja) *	1984-01-17	1985-08-07	Inoue Japax Res Inc	選択的メツキ方法
US5260108A (en) *	1992-03-10	1993-11-09	International Business Machines Corporation	Selective seeding of Pd by excimer laser radiation through the liquid
JPH06235169A (ja) *	1993-02-05	1994-08-23	Teijin Ltd	ポリエステル繊維の表面金属化法
TW300879B (de) *	1993-11-10	1997-03-21	Ibm
JP3742872B2 (ja) *	2001-07-05	2006-02-08	独立行政法人科学技術振興機構	光固定された微粒子を触媒とする無電解メッキ法
JP4332736B2 (ja) *	2005-02-18	2009-09-16	セイコーエプソン株式会社	配線基板の製造方法
JP2007243037A (ja) *	2006-03-10	2007-09-20	Seiko Epson Corp	配線基板の製造方法
JP2007243034A (ja) *	2006-03-10	2007-09-20	Seiko Epson Corp	配線基板の製造方法
JP4997548B2 (ja) *	2006-08-07	2012-08-08	独立行政法人理化学研究所	金属配線形成方法
JP4706690B2 (ja) *	2007-11-05	2011-06-22	パナソニック電工株式会社	回路基板及びその製造方法
US7816220B2 (en) *	2008-02-27	2010-10-19	President & Fellows Of Harvard College	Laser-induced structuring of substrate surfaces
EP2233608B1 (de) *	2009-03-23	2016-03-23	ATOTECH Deutschland GmbH	Vorbehandlungsverfahren für die stromfreie Nickelplattierung
JP4996653B2 (ja) *	2009-07-10	2012-08-08	三共化成株式会社	成形回路部品の製造方法
US8676545B2 (en) *	2010-07-07	2014-03-18	Rite-Hite Holding Corporation	Methods and apparatus to determine air duct system configurations

2016
- 2016-03-23 US US15/314,761 patent/US20170191165A1/en not_active Abandoned
- 2016-03-23 JP JP2017508399A patent/JP6264596B2/ja active Active
- 2016-03-23 EP EP16768841.5A patent/EP3276042B1/de active Active
- 2016-03-23 CN CN201680001511.2A patent/CN106460177A/zh active Pending
- 2016-03-23 WO PCT/JP2016/059264 patent/WO2016152938A1/ja not_active Ceased

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* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4637862A (en) *	1985-12-16	1987-01-20	General Motors Corporation	Wire-glass composite and method of making same
EP0501095A1 (de) *	1991-03-01	1992-09-02	Lucien Diégo Laude	Verfahren zur Metallisierung metallhaltiger dielektrischer Oberflächen
US6238749B1 (en) *	1993-10-11	2001-05-29	U.S. Philips Corporation	Method of providing a metal pattern on an electrically insulating substrate in an electroless process

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2016152938A1 *

Also Published As

Publication number	Publication date
US20170191165A1 (en)	2017-07-06
WO2016152938A1 (ja)	2016-09-29
JPWO2016152938A1 (ja)	2017-10-12
EP3276042A1 (de)	2018-01-31
EP3276042B1 (de)	2024-01-31
CN106460177A (zh)	2017-02-22
JP6264596B2 (ja)	2018-01-24

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