EP3296725A3 - Defektinspektionsverfahren und -vorrichtung mit verwendung einer mikrolinsenmatrix - Google Patents

Defektinspektionsverfahren und -vorrichtung mit verwendung einer mikrolinsenmatrix Download PDF

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Publication number
EP3296725A3
EP3296725A3 EP17191253.8A EP17191253A EP3296725A3 EP 3296725 A3 EP3296725 A3 EP 3296725A3 EP 17191253 A EP17191253 A EP 17191253A EP 3296725 A3 EP3296725 A3 EP 3296725A3
Authority
EP
European Patent Office
Prior art keywords
substrate
light
receiving
defect detection
optical waveguide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP17191253.8A
Other languages
English (en)
French (fr)
Other versions
EP3296725B1 (de
EP3296725A2 (de
Inventor
Qiang Wu
Wei Xiong
Xuan Li
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Manufacturing International Shanghai Corp
Semiconductor Manufacturing International Beijing Corp
Original Assignee
Semiconductor Manufacturing International Shanghai Corp
Semiconductor Manufacturing International Beijing Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Manufacturing International Shanghai Corp, Semiconductor Manufacturing International Beijing Corp filed Critical Semiconductor Manufacturing International Shanghai Corp
Publication of EP3296725A2 publication Critical patent/EP3296725A2/de
Publication of EP3296725A3 publication Critical patent/EP3296725A3/de
Application granted granted Critical
Publication of EP3296725B1 publication Critical patent/EP3296725B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T5/00—Image enhancement or restoration
    • G06T5/80—Geometric correction
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B3/00—Simple or compound lenses
    • G02B3/0006—Arrays
    • G02B3/0037—Arrays characterized by the distribution or form of lenses
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/0008—Industrial image inspection checking presence/absence
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2201/00—Features of devices classified in G01N21/00
    • G01N2201/06—Illumination; Optics
    • G01N2201/063—Illuminating optical parts
    • G01N2201/0638—Refractive parts
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/10—Image acquisition modality
    • G06T2207/10052—Images from lightfield camera
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30121—CRT, LCD or plasma display
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T2207/00—Indexing scheme for image analysis or image enhancement
    • G06T2207/30—Subject of image; Context of image processing
    • G06T2207/30108—Industrial image inspection
    • G06T2207/30148—Semiconductor; IC; Wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
    • H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Quality & Reliability (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Biochemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Geometry (AREA)
  • Solid State Image Pick-Up Elements (AREA)
EP17191253.8A 2016-09-18 2017-09-15 Defektinspektionsvorrichtung mit verwendung einer mikrolinsenmatrix Active EP3296725B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610826112.1A CN107845583B (zh) 2016-09-18 2016-09-18 基板表面缺陷检测装置、图像畸变校正方法和装置以及基板表面缺陷检测设备

Publications (3)

Publication Number Publication Date
EP3296725A2 EP3296725A2 (de) 2018-03-21
EP3296725A3 true EP3296725A3 (de) 2018-06-13
EP3296725B1 EP3296725B1 (de) 2021-08-04

Family

ID=59895156

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17191253.8A Active EP3296725B1 (de) 2016-09-18 2017-09-15 Defektinspektionsvorrichtung mit verwendung einer mikrolinsenmatrix

Country Status (3)

Country Link
US (2) US10416091B2 (de)
EP (1) EP3296725B1 (de)
CN (1) CN107845583B (de)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107845583B (zh) 2016-09-18 2020-12-18 中芯国际集成电路制造(上海)有限公司 基板表面缺陷检测装置、图像畸变校正方法和装置以及基板表面缺陷检测设备
CN108734700B (zh) * 2018-04-24 2021-06-11 信利（惠州）智能显示有限公司 基板盲区缺陷检测方法、装置、计算机和存储介质
WO2019214064A1 (zh) * 2018-05-11 2019-11-14 苏州源泽光电科技有限公司 一种复眼检测装置
CN111292228B (zh) * 2020-01-16 2023-08-11 宁波舜宇仪器有限公司 镜头缺陷检测方法
JP7409988B2 (ja) * 2020-07-29 2024-01-09 株式会社ニューフレアテクノロジー パターン検査装置及び輪郭線同士のアライメント量取得方法
KR102655947B1 (ko) * 2020-09-03 2024-04-11 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
CN112596134B (zh) * 2020-12-04 2022-03-22 西安交通大学 一种光波导微透镜阵列的制备及光学性能检测方法
CN115629076B (zh) * 2022-09-27 2025-02-18 威海华菱光电股份有限公司 一种阵列式图像检测装置
CN115829977B (zh) * 2022-12-09 2025-12-30 厦门大学 基于微透镜阵列曝光工艺的质量检测方法及参数调节方法

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WO2000044181A1 (en) * 1999-01-21 2000-07-27 Intel Corporation Software correction of image distortion in digital cameras
US6192168B1 (en) * 1999-04-09 2001-02-20 The United States Of America As Represented By The Secretary Of The Navy Reflectively coated optical waveguide and fluidics cell integration
US6618494B1 (en) * 1998-11-27 2003-09-09 Wuestec Medical, Inc. Optical distortion correction in digital imaging
WO2009107041A1 (en) * 2008-02-25 2009-09-03 Koninklijke Philips Electronics N.V. Optical sensor for measuring emission light from an analyte
US20110168918A1 (en) * 2008-09-25 2011-07-14 Koninklijke Philips Electronics N.V. Detection system and method

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US6924816B2 (en) * 2000-03-17 2005-08-02 Sun Microsystems, Inc. Compensating for the chromatic distortion of displayed images
JP2004327713A (ja) * 2003-04-24 2004-11-18 Sharp Corp 画像読取装置及びその製造方法
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GB0326005D0 (en) * 2003-11-07 2003-12-10 Koninkl Philips Electronics Nv Waveguide for autostereoscopic display
US7399421B2 (en) * 2005-08-02 2008-07-15 International Business Machines Corporation Injection molded microoptics
US20070126892A1 (en) * 2005-11-30 2007-06-07 Haike Guan Correcting an image captured through a lens
DK2391451T3 (en) * 2009-02-02 2018-10-15 Opko Diagnostics Llc STRUCTURES FOR MANAGING LIGHT INTERACTION WITH MICROFLUIDIC DEVICES
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CN102256100B (zh) * 2011-07-19 2013-02-13 中国科学技术大学 基于微透镜阵列和平板显示集成的双向成像-显示系统
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JP6321953B2 (ja) * 2013-12-05 2018-05-09 株式会社日立エルジーデータストレージ レーザ投射表示装置
TWI511086B (zh) * 2014-04-18 2015-12-01 Altek Semiconductor Corp 鏡頭失真校正方法
JP2017112514A (ja) * 2015-12-17 2017-06-22 ソニー株式会社 信号処理方法、及び撮像装置
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CN107845583B (zh) 2016-09-18 2020-12-18 中芯国际集成电路制造(上海)有限公司 基板表面缺陷检测装置、图像畸变校正方法和装置以及基板表面缺陷检测设备

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US6011860A (en) * 1997-02-12 2000-01-04 Nec Corporation Small reliable image input apparatus incorporated in finger-print collation system of personal identification
WO1999029117A1 (en) * 1997-12-02 1999-06-10 Sarnoff Corporation Modular display system
US6618494B1 (en) * 1998-11-27 2003-09-09 Wuestec Medical, Inc. Optical distortion correction in digital imaging
WO2000044181A1 (en) * 1999-01-21 2000-07-27 Intel Corporation Software correction of image distortion in digital cameras
US6192168B1 (en) * 1999-04-09 2001-02-20 The United States Of America As Represented By The Secretary Of The Navy Reflectively coated optical waveguide and fluidics cell integration
WO2009107041A1 (en) * 2008-02-25 2009-09-03 Koninklijke Philips Electronics N.V. Optical sensor for measuring emission light from an analyte
US20110168918A1 (en) * 2008-09-25 2011-07-14 Koninklijke Philips Electronics N.V. Detection system and method

Also Published As

Publication number Publication date
US20190346377A1 (en) 2019-11-14
CN107845583B (zh) 2020-12-18
EP3296725B1 (de) 2021-08-04
US20180080883A1 (en) 2018-03-22
CN107845583A (zh) 2018-03-27
US10416091B2 (en) 2019-09-17
EP3296725A2 (de) 2018-03-21
US11085884B2 (en) 2021-08-10

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