EP3341441A1 - Compositions de résine de siloxane - Google Patents

Compositions de résine de siloxane

Info

Publication number
EP3341441A1
EP3341441A1 EP16806162.0A EP16806162A EP3341441A1 EP 3341441 A1 EP3341441 A1 EP 3341441A1 EP 16806162 A EP16806162 A EP 16806162A EP 3341441 A1 EP3341441 A1 EP 3341441A1
Authority
EP
European Patent Office
Prior art keywords
optionally
units
formula
siloxanes
radicals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP16806162.0A
Other languages
German (de)
English (en)
Other versions
EP3341441B1 (fr
Inventor
Arvid Kuhn
Young-Hyuk JOO
Frank Sandmeyer
Hyun-Kwan Yang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wacker Chemie AG
Original Assignee
Wacker Chemie AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Wacker Chemie AG filed Critical Wacker Chemie AG
Publication of EP3341441A1 publication Critical patent/EP3341441A1/fr
Application granted granted Critical
Publication of EP3341441B1 publication Critical patent/EP3341441B1/fr
Not-in-force legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0016—Plasticisers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/56—Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04—Polysiloxanes
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
    • G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
    • G02B1/041—Lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/80—Siloxanes having aromatic substituents, e.g. phenyl side groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/476—Organic materials comprising silicon

Definitions

  • R 1 per molecule is at least 3, in at least 10 mol% of the
  • Units of formula (I) with a + b + c + d equal to 2 can serve, among other things, to adjust the mechanics since they soften and give flexibility.
  • the siloxanes (A) used according to the invention preferably comprise from 3 to 1000, more preferably from 3 to 150, in particular from 3 to 50, units of the formula (I).
  • the siloxanes (B) optionally used according to the invention preferably contain at least 30 mol% of units of the formula (VIIIb).
  • Component (B) is particularly preferably siloxanes consisting of at least two units selected from R 4 R 5 2 SiO 2/2 , R 4 R 5 R 6 SiO 2 ! / 2 and R 4 R 6 2 SiOi / 2 units and at least one unit selected from R 5 2 Si0 2/2 , R 5 R 6 Si0 2/2 and R 6 2 Si0 2/2 units, where R 4 , R 5 and R s have one of the meanings given above.
  • the siloxanes (C) have at least two radicals R 8 per molecule, at least one radical R 10 is present per molecule and at least one unit of the formula (XIII) and / or (V) is present.
  • the siloxanes (C) used according to the invention preferably contain at least 5 mol% of units of the formula (XI), at least 30 mol% of units of formula (XIII) and at most 20 mol% of units of formula (V).
  • the molar fraction of the silicon atoms carrying at least one aromatic radical R 10 relative to the total number of silicon atoms in the siloxane (C) is preferably at least 30%, preferably 40% to 80%, in particular 50% to 75%.
  • the siloxanes (C) used according to the invention preferably comprise from 3 to 1000 siloxy units, particularly preferably from 8 to 500 units, in particular from 8 to 100 units.
  • the compositions of the invention preferably contain catalyst (D).
  • the compositions according to the invention may contain all other substances which have hitherto been used in addition crosslinkable compositions and which are different from components (A). , (B), (C) and (D) such as fillers (E), coupling agents (F), inhibitors (G), plasticizers (H), additives (K) and organic solvents (L).
  • the optionally used inhibitors (G) can be any known inhibitors and stabilizers known in the field of addition-crosslinking compositions, which serve for the targeted adjustment of the processing time and crosslinking rate of the crosslinkable compositions.
  • Examples of common inhibitors are acetylenically unsaturated alcohols, such as 3-methyl-1-butyn-3-ol, 1-ethynylcyclohexan-1-ol, 3, 5-dimethyl-1-hexyn-3-ol and 3-methyl-1-pentyne 3-ol, polymethylvinylcyclosiloxanes, such as 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, linear vinylsiloxanes, such as 1, 1, 3, 3, tetramethyl-1, 3-divinyl disiloxane and (vinylmethyl) -siloxy-dimethyl-siloxy copolymers, trialkyl cyanurates, alkyl maleates such as dial
  • compositions according to the invention can-in particular, depending on the viscosity of the constituents and filler content-be low-viscosity and pourable, have a pasty consistency, be powdery or even be supple, highly viscous masses, as is known to those skilled in the art as RTV-1, RTV -2, LSR and HTV compositions may be the case.
  • the compositions are preferred low viscosity and may correspond to properties of the compositions referred to in the art as RTV-2.
  • compositions according to the invention have the advantage that they have an excellent adhesion profile.
  • the vinyl content is 1.85 mmol / g.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Silicon Polymers (AREA)
  • Paints Or Removers (AREA)

Abstract

L'invention concerne des compositions de résine de siloxane contenant (A) des organopolysiloxanes constitués par au moins 3 motifs de formule R1aR2bR3cHd(RO)eSiO(4-a-b-c-d-e)/2 (I), à condition que la somme a+b+c+d+e soit inférieure ou égale à 3, que la somme des atomes d'hydrogène liés à Si et des radicaux R1 par molécule vaille au moins 3, que dans au moins 10 % en mole des motifs de formule (I) la somme a+b+c+d soit égale à 0 ou 1 et que dans au moins un motif c soit différent de 0, (B) le cas échéant des organopolysiloxanes constitués par des motifs de formule R4 fR5gR6h(R7O)iSiO(4-f-g-h-i)/2 (VI), à condition que la somme f+g+h+i soit inférieure ou égale à 3, que les siloxanes (B) présentent au moins deux radicaux R4 par molécule, que dans au maximum 4 % en mole des motifs de formule (VI) la somme f+g+h+i soit égale à 0 ou 1 et que dans au moins un motif de formule (VI) h soit différent de 0, (C) des organopolysiloxanes constitués par des motifs de formule R8kR9 lR10 m(R11O)nSiO(4-k-1-m-n)/2 (X), à condition que la somme k+l+m+n soit inférieure ou égale à 3, que les siloxanes (C) présentent au moins deux radicaux R8 par molécule, que dans au moins 10 % en mole des motifs de formule (X) la somme k+l+m+n soit égale à 0 ou 1 et que dans au moins un motif de formule (X) m soit différent de 0, les radicaux et les indices présentant la signification indiquée dans la revendication 1, et éventuellement (D) un catalyseur favorisant l'addition d'hydrogène lié à Si sur des liaisons carbone-carbone aliphatiques multiples, des procédés pour leur préparation ainsi que leur utilisation pour la fabrication de corps façonnés électriquement isolants et d'éléments semi-conducteurs optiques.
EP16806162.0A 2015-12-18 2016-12-07 Compositions de résine de siloxane Not-in-force EP3341441B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102015225921.8A DE102015225921A1 (de) 2015-12-18 2015-12-18 Siloxanharzzusammensetzungen
PCT/EP2016/080087 WO2017102502A1 (fr) 2015-12-18 2016-12-07 Compositions de résine de siloxane

Publications (2)

Publication Number Publication Date
EP3341441A1 true EP3341441A1 (fr) 2018-07-04
EP3341441B1 EP3341441B1 (fr) 2019-02-06

Family

ID=57485516

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16806162.0A Not-in-force EP3341441B1 (fr) 2015-12-18 2016-12-07 Compositions de résine de siloxane

Country Status (8)

Country Link
US (1) US10655014B2 (fr)
EP (1) EP3341441B1 (fr)
JP (1) JP2019506465A (fr)
KR (1) KR102147422B1 (fr)
CN (1) CN108368340A (fr)
DE (1) DE102015225921A1 (fr)
TW (1) TWI623589B (fr)
WO (1) WO2017102502A1 (fr)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI676851B (zh) 2018-08-22 2019-11-11 隆達電子股份有限公司 畫素陣列封裝結構及顯示面板
CN112805334B (zh) * 2018-11-07 2023-08-04 陶氏环球技术有限责任公司 导热组合物以及使用所述组合物的方法和装置
JP7321969B2 (ja) * 2020-05-07 2023-08-07 信越化学工業株式会社 熱硬化性シリコーン樹脂組成物及び光半導体装置用ダイアタッチ材
KR102390970B1 (ko) * 2022-02-22 2022-04-26 주식회사 선한바이오 내열성 및 보존성이 우수한 락토바실러스 플란타럼 sw004 균주 및 이를 이용한 사료첨가제 및 탈취제
US20260015466A1 (en) * 2022-08-05 2026-01-15 Wacker Chemicals AG Silicone composition as an oca-like silicone ocr and method of bonding display panel using the same

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US5162480A (en) * 1990-12-14 1992-11-10 Union Carbide Chemicals & Plastics Technology Corporation Self-curing ceramicizable polysiloxanes
US5753751A (en) * 1996-10-24 1998-05-19 General Electric Company Process for preparing self-curable alkenyl hydride siloxane copolymers and coating composition
JP4908736B2 (ja) 2003-10-01 2012-04-04 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
DE102006030003A1 (de) 2006-05-11 2007-11-15 Wacker Chemie Ag Siliconharzbeschichtung für elektronische Bauteile
JP4911806B2 (ja) 2010-06-08 2012-04-04 積水化学工業株式会社 光半導体装置用ダイボンド材及びそれを用いた光半導体装置
US8519429B2 (en) 2010-06-24 2013-08-27 Sekisui Chemical Co., Ltd. Encapsulant for optical semiconductor device and optical semiconductor device using same
TWI435914B (zh) 2010-12-31 2014-05-01 Eternal Chemical Co Ltd 可固化之有機聚矽氧烷組合物及其製法
JP2012188627A (ja) 2011-03-14 2012-10-04 Sekisui Chem Co Ltd 光半導体装置用レンズ材料、光半導体装置及び光半導体装置の製造方法
JP2012193235A (ja) 2011-03-15 2012-10-11 Sekisui Chem Co Ltd 光半導体装置用コーティング材料及びそれを用いた光半導体装置
US20140191161A1 (en) * 2011-07-07 2014-07-10 Masaaki Amako Curable Silicon Composition, Cured Product Thereof, And Optical Semiconductor Device
DE102011080900A1 (de) * 2011-08-12 2013-02-14 Wacker Chemie Ag Verfahren zur Herstellung von (Hydroxymethyl)polysiloxanen
DE102011081264A1 (de) * 2011-08-19 2013-02-21 Wacker Chemie Ag Vernetzbare Massen auf Basis von organyloxysilanterminierten Polymeren
US8933187B2 (en) * 2011-12-08 2015-01-13 Momentive Performance Material Inc. Self-crosslinking silicone pressure sensitive adhesive compositions, process for making and articles made thereof
DE102012202523A1 (de) * 2012-02-20 2013-08-22 Evonik Industries Ag Verwendung von selbstvernetzten Siloxanen zum Entschäumen von flüssigen Kohlenwasserstoffen
DE102013215102A1 (de) 2013-08-01 2015-02-05 Wacker Chemie Ag Siliconharzzusammensetzung für optische Halbleiter

Also Published As

Publication number Publication date
JP2019506465A (ja) 2019-03-07
KR20180095021A (ko) 2018-08-24
CN108368340A (zh) 2018-08-03
US20180371246A1 (en) 2018-12-27
US10655014B2 (en) 2020-05-19
TWI623589B (zh) 2018-05-11
EP3341441B1 (fr) 2019-02-06
KR102147422B1 (ko) 2020-08-25
WO2017102502A1 (fr) 2017-06-22
TW201723090A (zh) 2017-07-01
DE102015225921A1 (de) 2017-06-22

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