EP3363044A4 - Système de support de substrat - Google Patents

Système de support de substrat Download PDF

Info

Publication number: EP3363044A4
Authority: EP; European Patent Office
Prior art keywords: support system; substrate support; substrate; support
Prior art date: 2015-10-15
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP16856168.6A

Other languages

German (de)

English (en)

Other versions

EP3363044B1 (fr

EP3363044A1 (fr

Inventor

Jeffrey Tobin

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Applied Materials Inc

Original Assignee

Applied Materials Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2015-10-15

Filing date

2016-10-13

Publication date

2019-06-12

2016-10-13 Application filed by Applied Materials Inc filed Critical Applied Materials Inc

2018-08-22 Publication of EP3363044A1 publication Critical patent/EP3363044A1/fr

2019-06-12 Publication of EP3363044A4 publication Critical patent/EP3363044A4/fr

2021-12-15 Application granted granted Critical

2021-12-15 Publication of EP3363044B1 publication Critical patent/EP3363044B1/fr

Status Active legal-status Critical Current

2036-10-13 Anticipated expiration legal-status Critical

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
- H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
- H10P72/0606—Position monitoring, e.g. misposition detection or presence detection
- H10P72/0608—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7612—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by lifting arrangements, e.g. lift pins
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7626—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

EP16856168.6A 2015-10-15 2016-10-13 Système de support de substrat Active EP3363044B1 (fr)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
US201562242174P	2015-10-15	2015-10-15
PCT/US2016/056798 WO2017066418A1 (fr)	2015-10-15	2016-10-13	Système de support de substrat

Publications (3)

Publication Number	Publication Date
EP3363044A1 EP3363044A1 (fr)	2018-08-22
EP3363044A4 true EP3363044A4 (fr)	2019-06-12
EP3363044B1 EP3363044B1 (fr)	2021-12-15

Family

ID=58518570

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP16856168.6A Active EP3363044B1 (fr)	2015-10-15	2016-10-13	Système de support de substrat

Country Status (6)

Country	Link
US (1)	US9929029B2 (fr)
EP (1)	EP3363044B1 (fr)
JP (1)	JP6942121B2 (fr)
KR (1)	KR102615853B1 (fr)
TW (1)	TWI691006B (fr)
WO (1)	WO2017066418A1 (fr)

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US10755955B2 (en) *	2018-02-12	2020-08-25	Applied Materials, Inc.	Substrate transfer mechanism to reduce back-side substrate contact
WO2019212651A1 (fr) *	2018-05-03	2019-11-07	Applied Materials, Inc	Commande d'inclinaison de substrat dans une trieuse rotative à grande vitesse
US11499666B2 (en) *	2018-05-25	2022-11-15	Applied Materials, Inc.	Precision dynamic leveling mechanism with long motion capability
JP7003905B2 (ja)	2018-12-27	2022-01-21	株式会社Sumco	気相成長装置
JP7147551B2 (ja)	2018-12-27	2022-10-05	株式会社Sumco	気相成長装置及びこれに用いられるキャリア
JP7163764B2 (ja)	2018-12-27	2022-11-01	株式会社Sumco	気相成長装置
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JP7188250B2 (ja) *	2019-04-11	2022-12-13	株式会社Sumco	気相成長装置及びこれに用いられるキャリア
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JP7188256B2 (ja)	2019-04-18	2022-12-13	株式会社Sumco	気相成長方法及び気相成長装置
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WO2021044623A1 (fr) *	2019-09-06	2021-03-11	キヤノンアネルバ株式会社	Dispositif de verrouillage de charge
JP7264038B2 (ja) *	2019-12-19	2023-04-25	株式会社Sumco	気相成長装置及び気相成長処理方法
JP7192756B2 (ja) *	2019-12-19	2022-12-20	株式会社Sumco	気相成長装置及び気相成長方法
JP7205458B2 (ja)	2019-12-25	2023-01-17	株式会社Sumco	気相成長装置
CN114724994A (zh) *	2022-04-02	2022-07-08	北京北方华创微电子装备有限公司	晶圆校准装置及腔室、半导体工艺设备及校准方法
US20250085056A1 (en) *	2023-09-07	2025-03-13	Applied Materials, Inc.	Process chamber substrate transfer

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US20110318142A1 (en) *	2008-12-11	2011-12-29	Christopher Gage	Minimum contact area wafer clamping with gas flow for rapid wafer cooling

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2016
- 2016-10-13 KR KR1020187013702A patent/KR102615853B1/ko active Active
- 2016-10-13 JP JP2018519317A patent/JP6942121B2/ja active Active
- 2016-10-13 EP EP16856168.6A patent/EP3363044B1/fr active Active
- 2016-10-13 US US15/292,680 patent/US9929029B2/en active Active
- 2016-10-13 WO PCT/US2016/056798 patent/WO2017066418A1/fr not_active Ceased
- 2016-10-14 TW TW105133136A patent/TWI691006B/zh active

Patent Citations (1)

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Publication number	Priority date	Publication date	Assignee	Title
US20110318142A1 (en) *	2008-12-11	2011-12-29	Christopher Gage	Minimum contact area wafer clamping with gas flow for rapid wafer cooling

Also Published As

Publication number	Publication date
KR102615853B1 (ko)	2023-12-21
US20170110352A1 (en)	2017-04-20
EP3363044B1 (fr)	2021-12-15
JP2018536986A (ja)	2018-12-13
JP6942121B2 (ja)	2021-09-29
TWI691006B (zh)	2020-04-11
US9929029B2 (en)	2018-03-27
EP3363044A1 (fr)	2018-08-22
TW201725645A (zh)	2017-07-16
KR20180056790A (ko)	2018-05-29
WO2017066418A1 (fr)	2017-04-20

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