EP3392688A4 - Optische verbindungsvorrichtung und verfahren - Google Patents

Optische verbindungsvorrichtung und verfahren Download PDF

Info

Publication number
EP3392688A4
EP3392688A4 EP16885500.5A EP16885500A EP3392688A4 EP 3392688 A4 EP3392688 A4 EP 3392688A4 EP 16885500 A EP16885500 A EP 16885500A EP 3392688 A4 EP3392688 A4 EP 3392688A4
Authority
EP
European Patent Office
Prior art keywords
coupling device
optical coupling
optical
coupling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
EP16885500.5A
Other languages
English (en)
French (fr)
Other versions
EP3392688A1 (de
Inventor
Qing Zhao
Xiaolu SONG
Li Zeng
Ruiqiang JI
Yanbo Li
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of EP3392688A1 publication Critical patent/EP3392688A1/de
Publication of EP3392688A4 publication Critical patent/EP3392688A4/de
Ceased legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4206—Optical features
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/36—Mechanical coupling means
    • G02B6/3608—Fibre wiring boards, i.e. where fibres are embedded or attached in a pattern on or to a substrate, e.g. flexible sheets
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4249—Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/13—Integrated optical circuits characterised by the manufacturing method

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Optical Integrated Circuits (AREA)
  • Semiconductor Lasers (AREA)
  • Light Receiving Elements (AREA)
EP16885500.5A 2016-01-18 2016-01-18 Optische verbindungsvorrichtung und verfahren Ceased EP3392688A4 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2016/071208 WO2017124227A1 (zh) 2016-01-18 2016-01-18 一种光耦合装置和方法

Publications (2)

Publication Number Publication Date
EP3392688A1 EP3392688A1 (de) 2018-10-24
EP3392688A4 true EP3392688A4 (de) 2019-01-23

Family

ID=59361229

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16885500.5A Ceased EP3392688A4 (de) 2016-01-18 2016-01-18 Optische verbindungsvorrichtung und verfahren

Country Status (5)

Country Link
US (1) US10422967B2 (de)
EP (1) EP3392688A4 (de)
JP (1) JP2019502167A (de)
CN (1) CN107924034B (de)
WO (1) WO2017124227A1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2018022319A1 (en) * 2016-07-29 2018-02-01 Corning Optical Communications LLC Waveguide connector elements and optical assemblies incorporating the same
CN109254363A (zh) * 2018-11-08 2019-01-22 武汉光迅科技股份有限公司 一种倒装硅光芯片的耦合封装结构及方法
JP7107194B2 (ja) * 2018-12-03 2022-07-27 日本電信電話株式会社 光接続構造
US20220404568A1 (en) * 2021-06-17 2022-12-22 Intel Corporation Package with optical waveguide in a glass core
US20240329344A1 (en) * 2023-03-31 2024-10-03 Advanced Semiconductor Engineering, Inc. Semiconductor package and method for manufacturing the same
CN120294907A (zh) * 2024-09-30 2025-07-11 上海诣岳科技有限公司 异质集成光芯片、异质光芯片集成方法、装置及可读存储介质

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1378777A2 (de) * 2002-07-02 2004-01-07 Omron Corporation Optische Wellenleitervorrichtung sowie Verfahren zur Herstellung selbiger und optische Kommunikationsvorrichtung
US20040190832A1 (en) * 2003-03-27 2004-09-30 Infineon Technologies Ag Optical coupling unit
US20080226222A1 (en) * 2007-03-16 2008-09-18 Jin Tae Kim Opto-electric bus module and method of manufacturing the same
US20090317035A1 (en) * 2006-03-27 2009-12-24 Fujitsu Limited Optical module,optical transmission system, and fabrication method for optical module
US20110129231A1 (en) * 2008-05-07 2011-06-02 Marco Fiorentino Optical engine for point-to-point communications
US20110299808A1 (en) * 2009-02-25 2011-12-08 Yasunobu Matsuoka Optical Waveguide and Optical Waveguide Module
US20140203175A1 (en) * 2011-12-30 2014-07-24 Mauro J. Kobrinsky Optical i/o system using planar light-wave integrated circuit
US20150268419A1 (en) * 2014-03-21 2015-09-24 Imec Vzw Method for optical coupling between a photonic integrated circuit and an external optical element
US20150370015A1 (en) * 2014-06-19 2015-12-24 Fujitsu Limited Optical module, manufacturing method of optical module, and optical device
WO2016177243A1 (en) * 2015-05-04 2016-11-10 Huawei Technologies Co., Ltd. Three-dimensional (3d) photonic chip-to-fiber interposer

Family Cites Families (14)

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Publication number Priority date Publication date Assignee Title
US5761181A (en) * 1996-02-06 1998-06-02 Board Of Regents The University Of Texas System Hyperspeed electro-optical digital data storage and retrieval system
KR100302424B1 (ko) * 1996-10-14 2001-09-28 니시무로 타이죠 논리하이브리드메모리용반도체메모리
US6470117B1 (en) * 1998-12-04 2002-10-22 Radiant Photonics, Inc. Compression-molded three-dimensional tapered universal waveguide couplers
DE19934179A1 (de) * 1999-07-21 2001-01-25 Siemens Ag Optische Kopplungseinrichtung
JP2003248135A (ja) * 2002-02-25 2003-09-05 Matsushita Electric Works Ltd 調芯用アクチュエータ内蔵式光デバイス
CA2465024A1 (en) * 2003-04-17 2004-10-17 National Research Council Of Canada Low-loss optical connector
US20050249256A1 (en) * 2004-05-10 2005-11-10 Lightip Technologies Inc. Wavelength switchable semiconductor laser
JP4351130B2 (ja) * 2004-09-07 2009-10-28 学校法人東海大学 光接続装置の製造法及びその光接続装置
JP2006201014A (ja) * 2005-01-20 2006-08-03 Keio Gijuku 光導波路型センサーとその作製方法
EP2131235A4 (de) * 2007-03-30 2012-08-22 Konica Minolta Opto Inc Vorrichtung zur erzeugung von zweiten oberschwingungen und verfahren zu ihrer herstellung
JP5568044B2 (ja) * 2011-03-29 2014-08-06 株式会社日立製作所 光インターコネクトモジュールおよび光電気ハイブリッド混載ボード
US8903205B2 (en) * 2012-02-23 2014-12-02 Karlsruhe Institute of Technology (KIT) Three-dimensional freeform waveguides for chip-chip connections
US8534927B1 (en) 2012-03-23 2013-09-17 International Business Machines Corporation Flexible fiber to wafer interface
US9459177B1 (en) * 2015-05-15 2016-10-04 Alcatel Lucent Wafer-level testing of optical circuit devices

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1378777A2 (de) * 2002-07-02 2004-01-07 Omron Corporation Optische Wellenleitervorrichtung sowie Verfahren zur Herstellung selbiger und optische Kommunikationsvorrichtung
US20040190832A1 (en) * 2003-03-27 2004-09-30 Infineon Technologies Ag Optical coupling unit
US20090317035A1 (en) * 2006-03-27 2009-12-24 Fujitsu Limited Optical module,optical transmission system, and fabrication method for optical module
US20080226222A1 (en) * 2007-03-16 2008-09-18 Jin Tae Kim Opto-electric bus module and method of manufacturing the same
US20110129231A1 (en) * 2008-05-07 2011-06-02 Marco Fiorentino Optical engine for point-to-point communications
US20110299808A1 (en) * 2009-02-25 2011-12-08 Yasunobu Matsuoka Optical Waveguide and Optical Waveguide Module
US20140203175A1 (en) * 2011-12-30 2014-07-24 Mauro J. Kobrinsky Optical i/o system using planar light-wave integrated circuit
US20150268419A1 (en) * 2014-03-21 2015-09-24 Imec Vzw Method for optical coupling between a photonic integrated circuit and an external optical element
US20150370015A1 (en) * 2014-06-19 2015-12-24 Fujitsu Limited Optical module, manufacturing method of optical module, and optical device
WO2016177243A1 (en) * 2015-05-04 2016-11-10 Huawei Technologies Co., Ltd. Three-dimensional (3d) photonic chip-to-fiber interposer

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2017124227A1 *

Also Published As

Publication number Publication date
CN107924034B (zh) 2019-12-17
EP3392688A1 (de) 2018-10-24
US20180321451A1 (en) 2018-11-08
US10422967B2 (en) 2019-09-24
CN107924034A (zh) 2018-04-17
JP2019502167A (ja) 2019-01-24
WO2017124227A1 (zh) 2017-07-27

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