EP3419050A1 - Emballage résistant aux rayonnements pour un dispositif électronique et procédé de production d'un emballage résistant aux rayonnements - Google Patents

Emballage résistant aux rayonnements pour un dispositif électronique et procédé de production d'un emballage résistant aux rayonnements Download PDF

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Publication number
EP3419050A1
EP3419050A1 EP17177707.1A EP17177707A EP3419050A1 EP 3419050 A1 EP3419050 A1 EP 3419050A1 EP 17177707 A EP17177707 A EP 17177707A EP 3419050 A1 EP3419050 A1 EP 3419050A1
Authority
EP
European Patent Office
Prior art keywords
electronic device
nanomaterial
carrier
package
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP17177707.1A
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German (de)
English (en)
Inventor
Jens Hofrichter
Guy Meynants
Josef Pertl
Thomas Troxler
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams International AG
Original Assignee
Ams International AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ams International AG filed Critical Ams International AG
Priority to EP17177707.1A priority Critical patent/EP3419050A1/fr
Priority to US16/624,484 priority patent/US11276619B2/en
Priority to CN201880041947.3A priority patent/CN111066141B/zh
Priority to PCT/EP2018/065685 priority patent/WO2018234120A1/fr
Publication of EP3419050A1 publication Critical patent/EP3419050A1/fr
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/804—Containers or encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W42/00—Arrangements for protection of devices
    • H10W42/20—Arrangements for protection of devices protecting against electromagnetic or particle radiation, e.g. light, X-rays, gamma-rays or electrons
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/124—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed the encapsulations having cavities other than that occupied by chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • H10W74/473—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins containing a filler
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/40—Fillings or auxiliary members in containers, e.g. centering rings
    • H10W76/42—Fillings
    • H10W76/48—Fillings including materials for absorbing or reacting with moisture or other undesired substances
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/5434—Dispositions of bond wires the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Definitions

  • the present invention relates to the field of electronic devices, in particular imaging devices for the detection of high-energy radiation such as X-rays or gamma rays. More specifically, it relates to the fields of computed tomography imaging systems, X-ray flat panel detectors, fluoroscopy, mammography, angiography, positron emission tomography, gamma cameras and other variants of medical imaging devices involving electromagnetic radiation of very short wavelength and ionizing radiation. It also relates to space applications (e. g. satellites), failure analysis or security applications.
  • space applications e. g. satellites
  • Shields of a metal with large atomic number, such as tungsten or lead, may be employed for this purpose. The use of such materials are avoided if they are poisonous or too expensive.
  • US 2007/0189350 A1 discloses a vertical-cavity surface-emitting laser (VCSEL) with a saturable absorber including one or more layers of quantum dots.
  • VCSEL vertical-cavity surface-emitting laser
  • US 2012/0250351 A1 discloses a package including a light-emitting diode and a quantum dot layer absorbing a portion of the light-emitted by the diode and emitting light of a different colour.
  • US 2013/0016499 A1 discloses a package of a light-emitting diode using an optical device including a quantum dot layer formed at an upper surface of a thin film layer.
  • US 2012/0235198 A1 discloses a package of a light-emitting diode with a housing comprising a wavelength transformation material.
  • US 2011/0227110 A1 discloses a package of a light-emitting device with reflective layers having a plurality of dielectric layers of different refractive indices.
  • US 2008/0011349 A1 discloses a photovoltaic device comprising an array of quantum dots and quantum dashes.
  • US 2015/0153504 A1 discloses a package of light-emitting diodes, at least one of which is covered with an insulating layer formed at least partially of a fluorescent material.
  • US 2010/0213440 A1 discloses a photodetector comprising a gate dielectric of a nano-structural silicon-base membrane, which is used as infrared light absorber.
  • WO 2016/097850 A1 discloses a pixel detector including an absorber wafer, which is bonded to a silicon wafer comprising CMOS processed readout electronics.
  • nanomaterial is meant to include any material comprising nanoparticles.
  • the nanomaterial can especially comprise nanodots, nanorods, nanowires, quantum dots, quantum rods or any combination thereof.
  • carrier is meant to include a printed circuit board (PCB), a laminate, a flex circuit, a substrate or an interposer.
  • PCB printed circuit board
  • laminate a laminate
  • flex circuit a substrate or an interposer
  • nanoparticles can be tuned to absorb radiation of defined wavelengths, like X-ray radiation, for instance, by appropriately selecting their material, material composition, size and shape. Furthermore, nanoparticles can easily be mixed with polymers, glues and other organic substances that are used to form housings of packages, like glob tops or injection-molded covers. These properties of nanoparticles may be employed in a radiation-hardened package.
  • the package for an electronic device comprises a carrier, an electronic device arranged on the carrier, and a cover on the carrier, the carrier and the cover forming a cavity accommodating the electronic device.
  • the cover comprises nanomaterial or is provided with an absorber film comprising nanomaterial.
  • the cover may especially be a glob top or part of a glob top.
  • the cover may instead be injection-molded.
  • the cover may also comprise plastic or ceramic.
  • An embodiment of the package comprises an adhesive layer between the carrier and the electronic device, the adhesive layer comprising nanomaterial.
  • the package for an electronic device comprises a carrier, an electronic device arranged on the carrier and an adhesive layer arranged between the carrier and the electronic device.
  • the adhesive layer comprises nanomaterial.
  • the adhesive layer serves to fasten the electronic device to the carrier.
  • the package for an electronic device comprises a carrier, an electronic device arranged on the carrier and an absorber film comprising nanomaterial.
  • the absorber film is arranged on the electronic device on a side facing away from the carrier.
  • a further electronic device is arranged on the carrier on a side opposite the electronic device.
  • the further electronic device is provided with a cover comprising nanomaterial, with an absorber film comprising nanomaterial, or with an adhesive layer comprising nanomaterial.
  • a further embodiment comprises an integrated circuit in the electronic device and a photodiode in the further electronic device, the integrated circuit being configured as a read-out circuit for the photodiode.
  • a further embodiment comprises an interconnection in the carrier, the interconnection electrically connecting the electronic device and the further electronic device.
  • the nanomaterial may comprise PbS, PbSe, ZnS, ZnS, CdSe, CdTe, copper sulfide, copper oxide, organic perovskites or inorganic perovskites, or any combination thereof.
  • the nanomaterial may include nanodots, nanorods, nanowires, or any combination thereof.
  • the nanorods, nanowires and nanodots may be formed to have at least one dimension that is smaller than 1000 nm, smaller than 100 nm, or even smaller than 10 nm.
  • the method of producing a package for an electronic device comprises arranging an electronic device on a carrier and applying a glob top or an injection-molded cover over the electronic device, the glob top or injection-molded cover being formed to include nanomaterial.
  • the method of producing a package for an electronic device comprises arranging an electronic device on a carrier, applying a glob top or an injection-molded cover over the electronic device, and applying an absorber film that is formed from nanomaterial on the glob top or injection-molded cover.
  • the method of producing a package for an electronic device comprises mounting an electronic device on a carrier by means of an adhesive layer, and forming the adhesive layer including nanomaterial.
  • the method of producing a package for an electronic device comprises arranging an electronic device on a carrier, and applying an absorber film formed from nanomaterial on the electronic device on a side facing away from the carrier.
  • Figure 1 is a cross section of a radiation-hardened package with a glob top comprising a nanomaterial.
  • the electronic device 2 is mounted on a carrier 1, which may be a printed circuit board (PCB), a laminate, a flex circuit, a substrate or an interposer, for instance.
  • a cover 3 comprising nanomaterial is arranged on or above the carrier 1.
  • the electronic device 2 is located in a cavity 4 formed by the cover 3.
  • the cover 3 may comprise a plastic or flexible basic material, in particular a material that is suitable for a glob top, such as a polymer, for instance.
  • the cavity 4 is optionally filled with a further material. If the cover 3 is formed from a sufficiently rigid material, the volume of the cavity 4 surrounding the electronic device 2 can be filled with a gas or vacuum.
  • the package according to Figure 1 may be produced by embedding the electronic device 2 in a glob top and applying the cover 3 on the glob top.
  • the cavity 4 is filled with the material of the glob top.
  • the basic material of the cover 3 may be a material that is also suitable for a glob top like a polymer, for instance.
  • the cover 3 may especially contain nanoparticles for X-ray absorption, in particular scintillating nanoparticles, which absorb X-ray radiation and re-emit visible light.
  • the electronic device 2 may be encapsulated in a conventional black, non-transparent glob top filling the cavity 4, and the cover 3 may be provided for enhanced X-ray absorption.
  • the electronic device 2 may comprise a substrate 5 of semiconductor material with a BEOL (back end of line) layer 6 including at least one wiring. Solder balls 7 can be provided for electric connections by bonding wires 8, for instance. The bonding wires 8 may be connected to interconnections 31 arranged in the carrier 1 for external electric connection, for instance.
  • the electronic device 2 may comprise various integrated components, like a photodetector 9, an integrated circuit 10 and a guard ring 11, as shown in Figure 1 by way of example.
  • the integrated components may particularly be provided for a computed tomography (CT) detector, for instance.
  • CT computed tomography
  • Figure 2 is a cross section of a radiation-hardened package with an injection-molded cover comprising nanomaterial. Elements of the embodiment according to Figure 2 that correspond to elements of the embodiment according to Figure 1 are designated with the same reference numerals.
  • the cover 3 is an injection-molded cover 3.
  • the volume of the cavity 4 surrounding the electronic device 2 may be left empty, or it may be filled with a solid material, in particular with a suitable blackout material, like a polymer, for instance.
  • An absorber film 13 comprising nanomaterial may be applied on the cover 3.
  • a film thickness of 1 mm is maximally required if radiation having an energy of not more than 150 keV is to be shielded by a quantum dot absorber film with hexagonal closest packing.
  • the cover 3 may be formed from any material that is conventionally used for an injection-molded cover.
  • the absorber film 13 may especially comprise nanoparticles absorbing X-radiation, while the injection-molded cover 3 may absorb visible, ultraviolet or infrared light. If no absorber film 13 is applied, the injection-molded cover 3 is at least partially formed from nanomaterial.
  • Figure 3 is a cross section of a further radiation-hardened package with an injection-molded cover. Elements of the embodiment according to Figure 3 that correspond to elements of the embodiment according to Figure 2 are designated with the same reference numerals.
  • electric connections between the integrated components of the electronic device 2 and the interconnections 31 in the carrier 1 are provided by solder balls 12 at the bottom of the substrate 5, which comprises through-substrate vias forming electric interconnections between the integrated components and the solder balls 12.
  • the injection-molded cover 3 may comprise nanomaterial.
  • An absorber film 13 comprising nanomaterial may instead or additionally be applied as in the embodiment according to Figure 2 .
  • Figure 4 is a cross section of a radiation-hardened package with an adhesive layer comprising nanomaterial. Elements of the embodiment according to Figure 4 that correspond to elements of the embodiment according to Figure 2 are designated with the same reference numerals.
  • the electronic device 2 and in particular the substrate 5 is mounted on the carrier 1 by means of an adhesive layer 15 comprising nanomaterial.
  • the adhesive layer 15 may especially comprise an electrically conductive glue comprising nanoparticles.
  • the cover 3 may be an injection-molded cover, as shown in Figure 4 by way of example, or a glob top as in the embodiment according to Figure 1 .
  • the cover 3 may also comprise nanomaterial, which may include the same kind of nanoparticles as the adhesive layer 15 or a different kind of nanoparticles.
  • An absorber film 13 comprising nanomaterial may instead or additionally be applied as in the embodiment according to Figure 3 .
  • pads 7 and wire bonds 8 may be provided for the electric connections between components of an integrated circuit 14 and the interconnections 31 in the carrier 1.
  • solder balls 12 at the bottom of the substrate 5 may be used as in the embodiment according to Figure 3 .
  • the solder balls 12 can be arranged in openings of the adhesive layer 15. If the adhesive layer 15 is electrically conductive, it may be structured to form individual electric connections between the electronic device 2 and interconnections of the carrier 1.
  • Figure 4 shows further solder balls 16 at the bottom surface of the carrier 1 for external electric connection.
  • Figure 5 is a cross section of a radiation-hardened package with an absorber film comprising nanomaterial applied to a semiconductor chip, wafer level chip scale package or die.
  • the electronic device 2 is mounted on a carrier 1, which may be a printed circuit board (PCB), a laminate, a flex circuit, a substrate or an interposer, for instance.
  • the electronic device 2 may comprise a substrate 5 of semiconductor material with a BEOL (back end of line) layer 6 including a wiring.
  • Solder balls 12 providing electric connections can be arranged at the bottom of the substrate 5 and electrically connected to interconnections 31 in the carrier 1, for instance.
  • the electronic device 2 may comprise various integrated components, like a photodetector 9, an integrated circuit 10 and a guard ring 11, as shown in Figure 5 by way of example.
  • Figure 5 shows a solution with bump bonds at the bottom, such as may be used in practice with wafer level packaging technology, in combination with through silicon vias (TSVs) and a backside redistribution layer to connect the bond pads to the wire bumps.
  • TSVs through silicon vias
  • Other packaging techniques could be used, such as wire bonding (similar to Figure 7 ) or flip chip technology.
  • the absorber film may be deposited on wafer during or at the end of the wafer processing, or during assembly of the chip in its package.
  • An absorber film 23 comprising nanomaterial is applied on or above the shield 22.
  • the shield 22 and the absorber film 23 may especially be arranged on a partial area of the upper surface of the electronic device 2.
  • Figure 5 shows the shield 22 and the absorber film 23 arranged above the integrated circuit 10, by way of example.
  • the shield 22 prevents light emitted by the nanomaterial of the absorber film 23 from influencing the integrated circuit 10.
  • FIG. 6 is a cross section of a further radiation-hardened package with an absorber film comprising nanomaterial. Elements of the embodiment according to Figure 6 that correspond to elements of the embodiment according to Figure 5 are designated with the same reference numerals.
  • a shield 32 in particular a light shield, which may be formed from aluminum, copper, tungsten, or any combination thereof, is arranged in the BEOL layer 6.
  • the shield 32 may especially be formed by a metallization layer of a wiring.
  • An absorber film 33 comprising nanomaterial is applied on the BEOL layer 6 above the shield 32.
  • the shield 32 and the absorber film 33 may especially be arranged above a transistor 17, which forms a component of the integrated circuit 10, for example.
  • the shield 32 prevents light emitted by the nanomaterial of the absorber film 33 from influencing the transistor 17 or other components of the integrated circuit 10.
  • Figure 7 is a cross section of an assembly of radiation-hardened packages with adhesive layers 15, 30 comprising nanomaterial.
  • the electronic device 2 and a further electronic device 20 are mounted on opposite surfaces of the carrier 1.
  • Each of the electronic devices 2, 20 may particularly be any of the embodiments described above.
  • the electronic device 2 comprises an integrated circuit 14, and the further electronic device 20 comprises photodetectors 19, 29 and guard rings 21, 24.
  • the electric connections include pads 7, 27 and wire bonds 8, 28 to the interconnections 31 in the carrier 1.
  • terminals of the electronic device 2 and further terminals of the further electronic device 20 may thus be interconnected, as shown in Figure 7 .
  • the electric connections may differ from the example shown in Figure 7 , according to the requirements of individual embodiments and applications.
  • the upper surface of the further electronic device 20 is provided for incidence of radiation 18.
  • the electronic devices 2, 20 are both mounted to the carrier 1 by means of adhesive layers 15, 30 comprising nanomaterial.
  • the adhesive layers 15, 30 can comprise the same nanomaterial or different kinds of nanomaterial.
  • Figure 8 is a cross section of an assembly of radiation-hardened packages with adhesive layers comprising nanomaterial and a glob top comprising nanomaterial. Elements of the embodiment according to Figure 8 that correspond to elements of the embodiment according to Figure 7 are designated with the same reference numerals.
  • the electronic device 2 is covered by a glob top, and the cover 3 comprising nanomaterial is applied on the glob top.
  • the cover 3 may instead be an injection-molded cover, and the cavity 4 formed by the cover 3 may be left empty, according to some of the embodiments described above.
  • the electronic device 2 is mounted to the carrier 1 by means of an adhesive layer 15, which may also comprise nanomaterial.
  • the further electronic device 20 is mounted to the carrier 1 by means of a further adhesive layer 30, which may also comprise nanomaterial.
  • the adhesive layers 15, 30 and the cover 3 can comprise the same nanomaterial or different kinds of nanomaterial.
  • the substrate 25 of the further electronic device 20 does not extend laterally over the package formed by the electronic device 2 and its cover 3. Electric connections by pads 7, 27, wire bonds 8, 28 and interconnections 31 of the carrier 1 are only schematically indicated in Figure 8 as examples and may be varied according to the requirements of individual embodiments and applications.
  • the described package improves the shielding of electronic devices from X-ray radiation at low cost. It can be produced by method steps known per se in semiconductor technology, in particular from the manufacture of consumer electronics.

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Light Receiving Elements (AREA)
EP17177707.1A 2017-06-23 2017-06-23 Emballage résistant aux rayonnements pour un dispositif électronique et procédé de production d'un emballage résistant aux rayonnements Pending EP3419050A1 (fr)

Priority Applications (4)

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EP17177707.1A EP3419050A1 (fr) 2017-06-23 2017-06-23 Emballage résistant aux rayonnements pour un dispositif électronique et procédé de production d'un emballage résistant aux rayonnements
US16/624,484 US11276619B2 (en) 2017-06-23 2018-06-13 Radiation-hardened package for an electronic device
CN201880041947.3A CN111066141B (zh) 2017-06-23 2018-06-13 用于电子器件的抗辐射封装件
PCT/EP2018/065685 WO2018234120A1 (fr) 2017-06-23 2018-06-13 Boîtier protégé contre les rayonnements pour dispositif électronique

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US11276619B2 (en) 2022-03-15
CN111066141B (zh) 2023-10-10
CN111066141A (zh) 2020-04-24
WO2018234120A1 (fr) 2018-12-27

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