EP3447796A4 - IGBT MODULE ASSEMBLY - Google Patents

IGBT MODULE ASSEMBLY Download PDF

Info

Publication number
EP3447796A4
EP3447796A4 EP17785325.6A EP17785325A EP3447796A4 EP 3447796 A4 EP3447796 A4 EP 3447796A4 EP 17785325 A EP17785325 A EP 17785325A EP 3447796 A4 EP3447796 A4 EP 3447796A4
Authority
EP
European Patent Office
Prior art keywords
module assembly
igbt module
igbt
assembly
module
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP17785325.6A
Other languages
German (de)
French (fr)
Other versions
EP3447796A1 (en
EP3447796B1 (en
Inventor
Jing Wang
Shiyong JIANG
Yu Zhang
Keqin LIU
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gree Electric Appliances Inc of Zhuhai
Original Assignee
Gree Electric Appliances Inc of Zhuhai
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gree Electric Appliances Inc of Zhuhai filed Critical Gree Electric Appliances Inc of Zhuhai
Publication of EP3447796A1 publication Critical patent/EP3447796A1/en
Publication of EP3447796A4 publication Critical patent/EP3447796A4/en
Application granted granted Critical
Publication of EP3447796B1 publication Critical patent/EP3447796B1/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
EP17785325.6A 2016-04-22 2017-04-01 Igbt module assembly Active EP3447796B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201610254996.8A CN105789156A (en) 2016-04-22 2016-04-22 IGBT module assembly
PCT/CN2017/079246 WO2017181840A1 (en) 2016-04-22 2017-04-01 Igbt module assembly

Publications (3)

Publication Number Publication Date
EP3447796A1 EP3447796A1 (en) 2019-02-27
EP3447796A4 true EP3447796A4 (en) 2019-10-09
EP3447796B1 EP3447796B1 (en) 2021-03-10

Family

ID=56398328

Family Applications (1)

Application Number Title Priority Date Filing Date
EP17785325.6A Active EP3447796B1 (en) 2016-04-22 2017-04-01 Igbt module assembly

Country Status (5)

Country Link
US (1) US10811333B2 (en)
EP (1) EP3447796B1 (en)
CN (1) CN105789156A (en)
ES (1) ES2878154T3 (en)
WO (1) WO2017181840A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105789156A (en) * 2016-04-22 2016-07-20 珠海格力电器股份有限公司 IGBT module assembly
CN108199120A (en) * 2018-03-20 2018-06-22 华霆（合肥）动力技术有限公司 Heat management device and battery modules
CN112086409B (en) * 2020-09-02 2022-07-22 东莞市柏尔电子科技有限公司 Plastic package type triode and manufacturing process

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140022727A1 (en) * 2010-12-27 2014-01-23 Reel S.R.L. Cooling device for electronic components and control apparatus comprising the cooling device
US20140284783A1 (en) * 2013-03-22 2014-09-25 Kabushiki Kaisha Toshiba Semiconductor device
US20150009626A1 (en) * 2012-02-28 2015-01-08 Toshiba Carrier Corporation Electric equipment and air conditioner
US20150021750A1 (en) * 2012-03-22 2015-01-22 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing the same
CN104729057A (en) * 2013-12-24 2015-06-24 珠海格力电器股份有限公司 Power electronic module and air conditioner with same
US20160035658A1 (en) * 2014-08-01 2016-02-04 Infineon Technologies Ag Encapsulated electronic chip device with mounting provision and externally accessible electric connection structure

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6408937B1 (en) * 2000-11-15 2002-06-25 Sanjay K. Roy Active cold plate/heat sink
CN201623026U (en) * 2009-12-23 2010-11-03 中国北车集团大连机车研究所有限公司 Igbt plate type water cooler
JP5273101B2 (en) * 2010-06-23 2013-08-28 株式会社デンソー Semiconductor module and manufacturing method thereof
JP5588895B2 (en) * 2011-02-28 2014-09-10 日立オートモティブシステムズ株式会社 Power semiconductor module, power semiconductor module manufacturing method, and power conversion device
CN202282938U (en) * 2011-09-21 2012-06-20 联合汽车电子有限公司 Auxiliary water-cooled plate assembly of IGBT power module of novel energy automobile inverter
CN204497219U (en) * 2015-04-21 2015-07-22 永济新时速电机电器有限责任公司 High-power heat-dissipation water-cooling base plate
CN105390460B (en) * 2015-12-11 2018-01-09 无锡方盛换热器股份有限公司 IGBT hybrid heat sinks
US10020243B2 (en) * 2016-03-08 2018-07-10 Toyota Motor Engineering & Manufacturing North America, Inc. Power electronics assemblies having a wide bandgap semiconductor device and an integrated fluid channel system
CN205723509U (en) * 2016-04-22 2016-11-23 珠海格力电器股份有限公司 A kind of IGBT module component
CN105789156A (en) * 2016-04-22 2016-07-20 珠海格力电器股份有限公司 IGBT module assembly

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20140022727A1 (en) * 2010-12-27 2014-01-23 Reel S.R.L. Cooling device for electronic components and control apparatus comprising the cooling device
US20150009626A1 (en) * 2012-02-28 2015-01-08 Toshiba Carrier Corporation Electric equipment and air conditioner
US20150021750A1 (en) * 2012-03-22 2015-01-22 Mitsubishi Electric Corporation Semiconductor device and method for manufacturing the same
US20140284783A1 (en) * 2013-03-22 2014-09-25 Kabushiki Kaisha Toshiba Semiconductor device
CN104729057A (en) * 2013-12-24 2015-06-24 珠海格力电器股份有限公司 Power electronic module and air conditioner with same
US20160035658A1 (en) * 2014-08-01 2016-02-04 Infineon Technologies Ag Encapsulated electronic chip device with mounting provision and externally accessible electric connection structure

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2017181840A1 *

Also Published As

Publication number Publication date
WO2017181840A1 (en) 2017-10-26
EP3447796A1 (en) 2019-02-27
CN105789156A (en) 2016-07-20
US10811333B2 (en) 2020-10-20
US20190131205A1 (en) 2019-05-02
ES2878154T3 (en) 2021-11-18
EP3447796B1 (en) 2021-03-10

Similar Documents

Publication Publication Date Title
EP3472025A4 (en) DRIVE MODULE
EP3352829A4 (en) BOUND ASSEMBLY
EP3411883C0 (en) CABLE ASSEMBLY
EP3660899A4 (en) SEMICONDUCTOR MODULE
EP3498410A4 (en) JUNCTION STRUCTURE
EP3265612A4 (en) BARRIER ASSEMBLY
DK3402947T3 (en) MODULE
DK3464910T3 (en) Fastening device
EP3454367A4 (en) SEMICONDUCTOR MODULE
DK3464336T3 (en) CONNECTIONS
EP3410477A4 (en) SEMICONDUCTOR MODULE
DE102018212047A8 (en) Semiconductor module
EP3416879A4 (en) HANDLEBAR ASSEMBLY
EP3410476A4 (en) SEMICONDUCTOR MODULE
EP4146905C0 (en) DIFFUSER ARRANGEMENT
EP3550599A4 (en) BONDING DEVICE
DE112017005130A5 (en) catalyst assembly
FR3017146B1 (en) SUPPORT ASSEMBLY FOR FACING ELEMENTS
EP3450799A4 (en) PULLEY STRUCTURE
FR3041608B1 (en) DEPLOYABLE ASSEMBLY
EP3413358A4 (en) PHOTOVOLTAIC ASSEMBLY
EP3419392C0 (en) LED module
EP3420274A4 (en) LUMINAIRE ASSEMBLY
FI20160183L (en) Improved semiconductor assembly
EP3447796A4 (en) IGBT MODULE ASSEMBLY

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20181029

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

AX Request for extension of the european patent

Extension state: BA ME

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
A4 Supplementary search report drawn up and despatched

Effective date: 20190911

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 23/367 20060101AFI20190905BHEP

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 602017034414

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: H01L0023367000

Ipc: H01L0025070000

RIC1 Information provided on ipc code assigned before grant

Ipc: H01L 23/367 20060101ALI20200728BHEP

Ipc: H01L 25/07 20060101AFI20200728BHEP

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: GRANT OF PATENT IS INTENDED

INTG Intention to grant announced

Effective date: 20201209

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE PATENT HAS BEEN GRANTED

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 1370759

Country of ref document: AT

Kind code of ref document: T

Effective date: 20210315

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602017034414

Country of ref document: DE

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG9D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210310

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210610

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210610

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210310

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210611

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210310

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 1370759

Country of ref document: AT

Kind code of ref document: T

Effective date: 20210310

REG Reference to a national code

Ref country code: NL

Ref legal event code: MP

Effective date: 20210310

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210310

Ref country code: RS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210310

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210310

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210310

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SM

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210310

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210310

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210310

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210310

REG Reference to a national code

Ref country code: ES

Ref legal event code: FG2A

Ref document number: 2878154

Country of ref document: ES

Kind code of ref document: T3

Effective date: 20211118

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210710

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210712

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210310

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210310

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210310

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602017034414

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210401

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

REG Reference to a national code

Ref country code: BE

Ref legal event code: MM

Effective date: 20210430

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210430

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210310

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210430

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210310

Ref country code: AL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210310

26N No opposition filed

Effective date: 20211213

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210310

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210310

Ref country code: IE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210401

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210710

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: BE

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20210430

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210310

P01 Opt-out of the competence of the unified patent court (upc) registered

Effective date: 20230530

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20170401

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210310

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210310

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20210310

REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Ref document number: 602017034414

Country of ref document: DE

Free format text: PREVIOUS MAIN CLASS: H01L0025070000

Ipc: H10D0080200000

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20250417

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: ES

Payment date: 20250519

Year of fee payment: 9

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: GB

Payment date: 20260323

Year of fee payment: 10

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: FR

Payment date: 20260317

Year of fee payment: 10