EP3558505A4 - Procédé permettant de déposer un matériau fonctionnel sur un substrat - Google Patents

Procédé permettant de déposer un matériau fonctionnel sur un substrat Download PDF

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Publication number
EP3558505A4
EP3558505A4 EP16924766.5A EP16924766A EP3558505A4 EP 3558505 A4 EP3558505 A4 EP 3558505A4 EP 16924766 A EP16924766 A EP 16924766A EP 3558505 A4 EP3558505 A4 EP 3558505A4
Authority
EP
European Patent Office
Prior art keywords
deposition
substrate
functional material
functional
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP16924766.5A
Other languages
German (de)
English (en)
Other versions
EP3558505A1 (fr
Inventor
Rob Jacob HENDRIKS
Paul Abel
Erica COENEN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NCC Nano LLC
Original Assignee
NCC Nano LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NCC Nano LLC filed Critical NCC Nano LLC
Publication of EP3558505A1 publication Critical patent/EP3558505A1/fr
Publication of EP3558505A4 publication Critical patent/EP3558505A4/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
    • H05K3/207—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using a prefabricated paste pattern, ink pattern or powder pattern
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09736—Varying thickness of a single conductor; Conductors in the same plane having different thicknesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1275—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Printing Plates And Materials Therefor (AREA)
  • Printing Methods (AREA)
  • Decoration By Transfer Pictures (AREA)
  • Electroluminescent Light Sources (AREA)
EP16924766.5A 2016-12-21 2016-12-21 Procédé permettant de déposer un matériau fonctionnel sur un substrat Pending EP3558505A4 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/US2016/068100 WO2018118052A1 (fr) 2016-12-21 2016-12-21 Procédé permettant de déposer un matériau fonctionnel sur un substrat

Publications (2)

Publication Number Publication Date
EP3558505A1 EP3558505A1 (fr) 2019-10-30
EP3558505A4 true EP3558505A4 (fr) 2020-08-19

Family

ID=62627846

Family Applications (1)

Application Number Title Priority Date Filing Date
EP16924766.5A Pending EP3558505A4 (fr) 2016-12-21 2016-12-21 Procédé permettant de déposer un matériau fonctionnel sur un substrat

Country Status (6)

Country Link
EP (1) EP3558505A4 (fr)
JP (1) JP6851649B2 (fr)
KR (1) KR102239833B1 (fr)
CN (2) CN121604292A (fr)
CA (1) CA3047376A1 (fr)
WO (1) WO2018118052A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3889319A1 (fr) * 2020-04-01 2021-10-06 Nederlandse Organisatie voor toegepast- natuurwetenschappelijk Onderzoek TNO Dépôt contrôlé d'un matériau fonctionnel sur une surface cible

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5326619A (en) * 1993-10-28 1994-07-05 Minnesota Mining And Manufacturing Company Thermal transfer donor element comprising a substrate having a microstructured surface
US20090169809A1 (en) * 2007-12-26 2009-07-02 Semiconductor Energy Laboratory Co., Ltd. Evaporation Donor Substrate, Method for Manufacturing the Same, and Method for Manufacturing Light-Emitting Device
WO2013129425A1 (fr) * 2012-02-27 2013-09-06 東レ株式会社 Substrat donneur de transfert et procédé de fabrication de dispositifs
US20150086705A1 (en) * 2012-05-02 2015-03-26 Nederlandse Organisatie Voor Toegepast- Natuurwetenschappelijk Onderzoek Tno Donor sheet and method for light induced forward transfer manufacturing

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JPS516200A (en) * 1974-07-05 1976-01-19 Central Glass Co Ltd Kaatsukadatsusuihonyoru chitansankarisenino seizohoho
CA1255142A (fr) * 1985-03-11 1989-06-06 Edward C. Fredericks Methode et compose pour accroitre la definition des conducteurs dans les circuits microelectroniques
TW388083B (en) * 1995-02-20 2000-04-21 Hitachi Ltd Resist pattern-forming method using anti-reflective layer, resist pattern formed, and method of etching using resist pattern and product formed
GB9714531D0 (en) * 1997-07-11 1997-09-17 Trikon Equip Ltd Forming a layer
DE50111796D1 (de) * 2000-03-30 2007-02-15 Aurentum Innovationstechnologi Druckverfahren und druckmaschine hierfür
JP2004304097A (ja) * 2003-04-01 2004-10-28 Sharp Corp パターン形成方法および半導体装置の製造方法
KR100643684B1 (ko) * 2005-11-04 2006-11-10 한국과학기술원 폴리머 또는 레지스트 패턴 및 이를 이용한 금속 박막패턴, 금속 패턴, 플라스틱 몰드 및 이들의 형성방법
GB0620955D0 (en) * 2006-10-20 2006-11-29 Speakman Stuart P Methods and apparatus for the manufacture of microstructures
CN101246914A (zh) * 2007-02-14 2008-08-20 北京行者多媒体科技有限公司 薄膜太阳能电池的背反射层
US9120245B1 (en) * 2007-05-09 2015-09-01 The United States Of America As Represented By The Secretary Of The Air Force Methods for fabrication of parts from bulk low-cost interface-defined nanolaminated materials
US20110070462A1 (en) * 2008-05-16 2011-03-24 Showa Denko K.K. Pattern forming method
JP5137917B2 (ja) * 2009-08-07 2013-02-06 株式会社半導体エネルギー研究所 成膜用基板、成膜方法及び発光素子の作製方法
JP2011103362A (ja) * 2009-11-10 2011-05-26 Toshiba Corp パターン形成方法
WO2016145337A1 (fr) * 2015-03-11 2016-09-15 Exogenesis Corporation Procédé pour traitement par faisceau neutre basé sur une technologie de faisceau ionique d'agrégats de gaz et articles ainsi produits
JP2012094500A (ja) * 2010-09-30 2012-05-17 Toray Ind Inc 転写用ドナー基板およびこれを用いたデバイスの製造方法
JP5971938B2 (ja) * 2011-12-19 2016-08-17 キヤノン株式会社 硬化物の製造方法およびパターン形成方法
JP6305058B2 (ja) * 2013-03-05 2018-04-04 キヤノン株式会社 感光性ガス発生剤、光硬化性組成物
KR20150017602A (ko) * 2013-08-07 2015-02-17 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
CN105705671B (zh) * 2013-10-14 2019-10-29 奥宝科技股份有限公司 多组成材料结构的lift印刷
CN106116180A (zh) * 2016-06-15 2016-11-16 上海交通大学 一种在拉锥光纤上沉积二维材料的方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5326619A (en) * 1993-10-28 1994-07-05 Minnesota Mining And Manufacturing Company Thermal transfer donor element comprising a substrate having a microstructured surface
US20090169809A1 (en) * 2007-12-26 2009-07-02 Semiconductor Energy Laboratory Co., Ltd. Evaporation Donor Substrate, Method for Manufacturing the Same, and Method for Manufacturing Light-Emitting Device
WO2013129425A1 (fr) * 2012-02-27 2013-09-06 東レ株式会社 Substrat donneur de transfert et procédé de fabrication de dispositifs
US20150086705A1 (en) * 2012-05-02 2015-03-26 Nederlandse Organisatie Voor Toegepast- Natuurwetenschappelijk Onderzoek Tno Donor sheet and method for light induced forward transfer manufacturing

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2018118052A1 *

Also Published As

Publication number Publication date
CN121604292A (zh) 2026-03-03
JP6851649B2 (ja) 2021-03-31
CN110198780A (zh) 2019-09-03
CA3047376A1 (fr) 2018-06-28
KR102239833B1 (ko) 2021-04-13
WO2018118052A1 (fr) 2018-06-28
JP2020514094A (ja) 2020-05-21
KR20190099483A (ko) 2019-08-27
EP3558505A1 (fr) 2019-10-30

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