EP3576139A4 - Film zur herstellung von komponenten, werkzeug zur herstellung von komponenten und verfahren zur herstellung von komponenten - Google Patents

Film zur herstellung von komponenten, werkzeug zur herstellung von komponenten und verfahren zur herstellung von komponenten Download PDF

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Publication number
EP3576139A4
EP3576139A4 EP18744191.0A EP18744191A EP3576139A4 EP 3576139 A4 EP3576139 A4 EP 3576139A4 EP 18744191 A EP18744191 A EP 18744191A EP 3576139 A4 EP3576139 A4 EP 3576139A4
Authority
EP
European Patent Office
Prior art keywords
components
manufacture
tool
film
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP18744191.0A
Other languages
English (en)
French (fr)
Other versions
EP3576139A1 (de
EP3576139B1 (de
Inventor
Eiji Hayashishita
Hirokazu Takahashi
Kazuhide FUKURA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsui Chemicals Tohcello Inc
Original Assignee
Mitsui Chemicals Tohcello Inc
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Filing date
Publication date
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Publication of EP3576139A1 publication Critical patent/EP3576139A1/de
Publication of EP3576139A4 publication Critical patent/EP3576139A4/de
Application granted granted Critical
Publication of EP3576139B1 publication Critical patent/EP3576139B1/de
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    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
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    • B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2274/00—Thermoplastic elastomer material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54—Yield strength; Tensile strength
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/50—Properties of the layers or laminate having particular mechanical properties
    • B32B2307/546—Flexural strength; Flexion stiffness
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/72—Density
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2467/00—Presence of polyester
    • C09J2467/006—Presence of polyester in the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/742—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Pens And Brushes (AREA)
EP18744191.0A 2017-01-30 2018-01-26 Film zur herstellung von komponenten, werkzeug zur herstellung von komponenten und verfahren zur herstellung von komponenten Active EP3576139B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017014808 2017-01-30
PCT/JP2018/002585 WO2018139612A1 (ja) 2017-01-30 2018-01-26 部品製造用フィルム、部品製造用具及び部品製造方法

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EP3576139A1 EP3576139A1 (de) 2019-12-04
EP3576139A4 true EP3576139A4 (de) 2020-11-25
EP3576139B1 EP3576139B1 (de) 2022-10-26

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US (1) US11251062B2 (de)
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JP (1) JP6979037B2 (de)
KR (1) KR102352925B1 (de)
CN (1) CN110235236B (de)
TW (1) TWI773727B (de)
WO (1) WO2018139612A1 (de)

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JP7644591B2 (ja) * 2020-12-11 2025-03-12 アールエム東セロ株式会社 電子部品の製造方法、電子部品製造装置
KR102469241B1 (ko) * 2021-07-27 2022-11-18 에스케이씨 주식회사 필름, 광투과 적층체, 커버필름 및 다중층 전자 장비
JP7825346B2 (ja) 2021-07-27 2026-03-06 マイクロワークス株式会社 フィルム、光透過積層体、カバーフィルム及び多重層電子装備
KR102469245B1 (ko) * 2021-07-27 2022-11-18 에스케이씨 주식회사 필름, 필름의 제조방법, 커버필름 및 다중층 전자 장비
JP7759759B2 (ja) * 2021-10-11 2025-10-24 三井化学Ictマテリア株式会社 電子部品の製造装置及び電子部品の製造方法

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WO2016125683A1 (ja) * 2015-02-06 2016-08-11 リンテック株式会社 粘着シートおよび半導体装置の製造方法
WO2017002610A1 (ja) * 2015-06-29 2017-01-05 三井化学東セロ株式会社 半導体部品製造用フィルム

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KR0174773B1 (ko) 1995-03-31 1999-04-01 모리시다 요이치 반도체장치의 검사방법
JP3097619B2 (ja) 1997-10-02 2000-10-10 日本電気株式会社 電界放射冷陰極の製造方法
JP5058428B2 (ja) * 2003-01-15 2012-10-24 日立化成工業株式会社 接着シートならびに半導体装置およびその製造方法
JP4549239B2 (ja) 2005-06-22 2010-09-22 日東電工株式会社 ダイシング用粘着シート
KR100922226B1 (ko) 2007-12-10 2009-10-20 주식회사 엘지화학 접착 필름, 다이싱 다이본딩 필름 및 반도체 장치
JP5582836B2 (ja) * 2010-03-26 2014-09-03 古河電気工業株式会社 ダイシング・ダイボンディングテープ
JP5158907B1 (ja) * 2012-04-02 2013-03-06 古河電気工業株式会社 接着シート
JP6190197B2 (ja) * 2012-11-14 2017-08-30 東京パーツ工業株式会社 触覚型ソレノイド
JP5902114B2 (ja) * 2013-03-22 2016-04-13 株式会社東芝 半導体装置及びその製造方法
JP6250949B2 (ja) * 2013-04-15 2017-12-20 日本特殊陶業株式会社 半導体製造装置用部品及びその製造方法

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WO2016125683A1 (ja) * 2015-02-06 2016-08-11 リンテック株式会社 粘着シートおよび半導体装置の製造方法
WO2017002610A1 (ja) * 2015-06-29 2017-01-05 三井化学東セロ株式会社 半導体部品製造用フィルム

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Publication number Publication date
KR102352925B1 (ko) 2022-01-18
WO2018139612A1 (ja) 2018-08-02
EP3576139A1 (de) 2019-12-04
JPWO2018139612A1 (ja) 2019-11-21
TWI773727B (zh) 2022-08-11
TW201841299A (zh) 2018-11-16
US11251062B2 (en) 2022-02-15
EP3576139B1 (de) 2022-10-26
US20190371645A1 (en) 2019-12-05
CN110235236B (zh) 2023-06-30
CN110235236A (zh) 2019-09-13
JP6979037B2 (ja) 2021-12-08
KR20190100966A (ko) 2019-08-29

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