EP3677105A1 - Elektronisches gerät mit kühlvorrichtung und ein zugehöriges montageverfahren - Google Patents
Elektronisches gerät mit kühlvorrichtung und ein zugehöriges montageverfahrenInfo
- Publication number
- EP3677105A1 EP3677105A1 EP18815550.1A EP18815550A EP3677105A1 EP 3677105 A1 EP3677105 A1 EP 3677105A1 EP 18815550 A EP18815550 A EP 18815550A EP 3677105 A1 EP3677105 A1 EP 3677105A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- housing part
- housing
- electronic device
- carrier
- spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 title claims description 4
- 239000004033 plastic Substances 0.000 claims abstract description 39
- 238000000465 moulding Methods 0.000 claims abstract description 4
- 238000005538 encapsulation Methods 0.000 claims 1
- 230000002349 favourable effect Effects 0.000 abstract description 6
- 230000006978 adaptation Effects 0.000 abstract 1
- 238000009434 installation Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 description 7
- 229920009788 PA66 GF30 Polymers 0.000 description 6
- 229920006497 PA66-GF30 Polymers 0.000 description 5
- 239000004952 Polyamide Substances 0.000 description 5
- 229920002647 polyamide Polymers 0.000 description 5
- 239000004944 Liquid Silicone Rubber Substances 0.000 description 4
- 229920002379 silicone rubber Polymers 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 229910000831 Steel Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000005338 heat storage Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000007765 extrusion coating Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
- H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0043—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units comprising a frame housing mating with two lids wherein the PCB is flat mounted on the frame housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
- H05K5/0069—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having connector relating features for connecting the connector pins with the PCB or for mounting the connector body with the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/724—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits containing contact members forming a right angle
Definitions
- the invention relates to an electronic device with
- Cooling device in particular control device, which is arranged in a housing and comprises a arranged on a support plate electronic circuit, wherein the
- Housing has at least a first housing part and a second housing part and therein a with the housing
- Carrier plate mechanically and thermally contacted via at least one first plastic spring.
- EP 2 429 273 A2 is known from the prior art, in which a cooling device for an electrical device and an associated manufacturing method is described.
- the electrical device comprises a on a support plate
- the cooling device consists of cooling elements, which are arranged in the housing, the support plate and the housing mechanically and thermally contact and cause heat dissipation through the housing.
- AT 518126 A1 is known, in which an electronic device is disclosed in which a carrier plate is provided in a housing. By means of a spring carrier which has plastic springs, the carrier plate is braced in the housing.
- a plug From a housing opening protrudes a plug.
- a separate sheath which protects contact pins guided by the plug is provided, i. the housing itself is not formed in the region of the plug as a connector tray.
- the invention is therefore based on the object of specifying an improved compared to the prior art electronic device, the one to an available space budget
- this object is achieved with a
- Plug trough which is designed as a molding of the housing has,
- At least first connector well at least a first contacting element, which is connected to the carrier plate, is arranged, and
- a cooling body designed as an insert of the at least first housing part contacts the carrier plate.
- the housing is on the shell side as the first connector socket
- Dismantling facilitates, since the first housing part together with the preassembled heat sink with the
- Support plate can be connected or detached from the support plate. Furthermore, this is an exact
- a frame-shaped third housing part wherein the at least first connector shell is formed as a shape of the third housing part.
- the first housing part can, for example, as a base plate, the second
- Housing part as a lid and the third housing part as
- Recording for plug and be designed as a spacer for the arrangement of the carrier plate and the spring carrier.
- Contacting element in the housing causes and at the same time the housing in the region of the first connector well sealed, i. protected against penetration of moisture and particles etc.
- Connection means between the carrier plate and the contacting element e.g.
- Housing part is formed.
- the spring carrier also acts as a lid or base plate. On additional covers or base plates can be omitted.
- Support plate on the housing improved.
- the third housing part is screwed to the at least first housing part and the second housing part.
- the invention is based on
- Fig. 1 An oblique view of a first exemplary
- Embodiment of an electronic device according to the invention wherein a housing having a first housing part, a second housing part and a third housing part, which has a first connector well and a second connector well, is shown,
- Fig. 2 An oblique view of the first exemplary
- Embodiment of an inventive electronic device in an exploded view, wherein a first housing part, a second housing part, a third housing part and a support plate and a spring carrier are shown,
- Fig. 3 An oblique view of the first exemplary
- Fig. 4 An oblique view of the first exemplary
- Fig. 5 An oblique view of the first exemplary
- Fig. 6 A side elevation of a detail of the first
- Fig. 7 An oblique view of a second exemplary
- Embodiment of an electronic device according to the invention wherein a housing having a first housing part, designed as a spring carrier second housing part and a third housing part having a first connector well and a second connector well, is shown,
- Fig. 8 An oblique view of the second exemplary
- Fig. 9 An oblique view of a third exemplary
- Embodiment of an electronic device according to the invention wherein a housing having a first housing part, which has a first connector shell, and a designed as a spring carrier second housing part is shown,
- Fig. 10 An oblique view of the third exemplary
- Embodiment of an inventive electronic device in a sectional view wherein a first housing part, a second housing part and a support plate and a heat sink are shown, and
- Fig. 11 An oblique view of a detail of the third
- FIG. 1 shows a perspective view of a first exemplary embodiment of an electronic device according to the invention in an assembled state.
- the electronic device which as a control unit of a not shown
- Motor vehicle has a housing 1 with a first housing part 3, a second housing part 4 and a third housing part 5.
- the first housing part 3 and the second housing part 4 are each formed as a metallic cover or base plate or base plate and executed in aluminum AlMg3.
- aluminum AlMg3 aluminum
- Heat storage capacity e.g. Copper, use.
- the third housing part 5 is designed as a polyamide PA66-GF30 executed plastic frame, the shell side or at the front thereof has a first connector well 8 and a second connector tray 9.
- the third housing part 5, the first connector well 8 and the second connector well 9 are made in one piece, i. the first connector well 8 and the second connector well 9 are as a shape of the third
- the first housing part 3 and the second housing part 4 are screwed by means of a first screw 16 made of steel and by means of further screws with the third housing part 5.
- the first housing part 3 has a first mounting tab 17 and a second mounting tab 18, which is a first
- Mounting tab 18, the electronic device according to the invention can be mounted in an engine compartment of the motor vehicle, not shown.
- Fig. 2 is that variant of an embodiment
- the electronic device has a housing 1 with a first housing part 3, a second housing part 4 and a third housing part 5 as well as a support plate 2 and a spring support 6.
- the carrier plate 2 is executed in composite material with epoxy resin and fiberglass fabric Flame Retardant 4 (FR-4) and comprises components of an electronic circuit.
- the spring carrier 6 has a cuboid first
- Plastic spring 7 made of liquid silicone rubber (LSR) and other plastic springs, which are provided for heat dissipation from the support plate 2 via the spring support 6 and the housing 1 in an environment. Accordingly, the spring carrier 6, together with the first plastic spring 7 and the other plastic springs, functions as an exemplary variant of a heat sink 11 designed as an insert, as also described in connection with FIGS. 10 and 11.
- LSR liquid silicone rubber
- a first seal 14 is arranged in the area of a first end face 20 of the third housing part 5 shown in FIG. 2 above.
- a second seal 15 disclosed in FIG. 6 is in the region of a second one shown in FIG. 2 below
- End face 21 is provided.
- Fig. 3 shows a first mounting state of those
- Embodiment of a device according to the invention which is also shown in Fig. 1 and Fig. 2. Therefore, the same reference numerals as in FIG. 1 and in FIG. 2 are used.
- a carrier plate 2 is inserted into a third housing part 5 of a housing 1.
- Fig. 4 shows a second mounting state of those
- Embodiment of a device according to the invention which is also shown in Fig. 1, Fig. 2 and Fig. 3.
- the same reference numerals are therefore used as in FIG. 1 or in FIGS. 2 and 3.
- a support plate 2 is inserted into a third housing part 5 of a housing 1 and a first housing part 3 is screwed to the third housing part 5.
- Fig. 5 shows a third mounting state of those
- Embodiment of a device according to the invention which is also shown in Fig. 1, Fig. 2, Fig. 3 and Fig. 4.
- the same reference numerals are therefore used as in FIG. 1 or in FIGS. 2, 3 and 4.
- a support plate 2 is inserted into a third housing part 5 of a housing 1 and a first housing part 3 is screwed to the third housing part 5.
- a spring carrier 6 is inserted into the third housing part 5 and a first plastic spring 7 and other plastic springs, which in Fig. 2, Fig. 3 and Fig. 4th
- a second housing part 4 is placed to close the housing 1 on the third housing part 5 and the spring support 6 and screwed by a first screw 16 and other screws with the third housing part 5. Because of a
- the spring support 6 is clamped in or with the housing 1. It is characterized a gap-free contact between the first plastic spring 7 and the other plastic springs on the one hand and the
- Support plate 2 on the other hand, and thus an effective Heat dissipation from the support plate 2 via the spring support 6 and the second housing part 4 achieved in an environment, the support plate 2 is effectively cooled.
- FIG. 6 discloses a detail of the first embodiment variant of an electronic device according to the invention, which is also shown in FIGS. 1, 2, 3, 4 and 5.
- a housing 1 has a first housing part 3 and a second housing part 4 shown in FIGS. 1, 2, 3, 4 and 5, each of which is a cover
- a frame-shaped third housing part 5 is arranged between the first housing part 3 and the second housing part 4 and screwed thereto.
- As a shape of the third housing part 5 is a first connector well. 8
- first contacting element 10 In the first connector well 8 and in the base 22 are a first contacting element 10 and others
- the third housing part 5 and the first connector tray 8 are made in one piece, in
- Polyamide PA66-GF30 executed. The first
- Contacting elements are encapsulated with PA66-GF30 and thus fixed to the first connector well 8 and the third
- Contacting elements are designed angled at 90 °.
- Housing part 5 arranged and pressed on the first housing part 3 support plate 2 is pressed in a manner that the support plate 2, the first connector tray 8 mechanically contacted and thus stored safe and low-stress in the housing 1.
- the carrier plate 2 is parallel to the male terminal and the horizontal portions of the first
- a first seal 14 is arranged, in the region of a second end face 21 of the third housing part 5 shown in FIG. 6 below, a second seal 15. Due to the first seal 14 and the second seal 15 is the third housing part 5 in contact with the first housing part 3 and the second housing part 4th
- the housing is protected against penetration of moisture and particles etc.
- Fig. 7 discloses a second exemplary
- Embodiment of an electronic device according to the invention with a housing 1 in the assembled state which is executed in terms of operation and constructive details similar to that variant, which in Fig. 1, Fig. 2, Fig. 3, Fig. 4, Fig. 5 and Fig. 6 is shown.
- Polyamide PA66-GF30 designed spring carrier 6, which is designed as a second housing part 4, i. acts as a lid.
- the spring carrier 6 is provided with a frame-shaped third housing part 5, which has a first plug-in tub 8 and a second plug-in tub 9, in which a first
- Contacting element 10 and further contacting elements are arranged, has screwed.
- Fig. 8 is that variant of a
- the electronic device is partially assembled.
- a first housing part 3 of a housing 1 is screwed to a third housing part 5.
- a spring carrier 6, which is designed as a second housing part 4, has a first
- the first plastic spring 7 is cuboid, the other
- Plastic springs are partially cuboid, partially cylindrical.
- the spring carrier 6 is in a not shown
- Fig. 9 shows a third embodiment of a
- Electronic device which is designed as a control unit of a motor vehicle, not shown.
- the device has a housing 1 made of polyamide PA66-GF30 and comprises a first housing part 3 and a second housing part 4, which are screwed together by means of a first screw 16 made of steel and other screws.
- the second housing part 4 is designed as a spring carrier 6.
- the first housing part 3 has a first connector well 8, which is formed as a molding of the first housing part 3, i. the first housing part 3 and the first connector pan 8 are made of one piece.
- Fig. 10 is a section through that embodiment of an electronic device according to the invention disclosed, the is also shown in Fig. 9. Therefore, some of the same reference numerals as in Fig. 9 are used.
- a housing 1 has a first housing part 3, which is screwed to a second housing part 4.
- the first housing part 3 and the second housing part 4 is to protect the electronic device
- a first connector well 8 which is formed as a shell of the first housing part 3 on the shell side or on a front side of the housing 1, are a first
- the first connector well 8 has a base 22 and a
- the first contacting element 10 and the other contacting elements which are designed angled at 90 °, are encapsulated with housing material (polyamide PA66 GF30) and thus firmly connected to the housing 1. Furthermore, the first contacting element 10 and the further contacting elements are connected to a carrier plate 2, which has mounting elements and which is arranged in the housing 1.
- the second housing part 4 is a spring support 6, which is a cylindrical first plastic spring 7 and more
- the spring carrier 6 thus acts as a lid of the device.
- Plastic springs contact the carrier plate 2 on a first carrier plate side 12 mechanically and thermally.
- the heat sink 11 it is also conceivable to use other materials with high thermal conductivity and heat storage capacity, such as copper, for the heat sink 11.
- the other plastic springs and the heat sink 11 is heat from the support plate 2 via the housing 1 in an environment
- the first plastic spring 7, the other plastic springs and the heat sink 11 contact the carrier plate 2 in areas in which no placement elements are provided or are arranged and dimensioned in such a way that the placement elements are not damaged.
- the support plate 2 is inserted into the first housing part 3 with the heat sink 11 and with the first contacting element 10 and the
- Housing part 3 braced.
- the support plate 2 is stored safely and without excessive loads in the housing 1.
- Fig. 11 shows a first housing part 3 of a housing 1 and a heat sink 11 that variant of a
- the heat sink 11 is designed as a metallic and detachable insert of the first housing part 3.
- the heat sink 11 has a recess 24 in which a first
- Contacting element 10 and further contacting elements are provided, which with a first connector well 8 and are connected to a disclosed in Fig. 10 support plate 2.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ATA50988/2017A AT520694B1 (de) | 2017-11-29 | 2017-11-29 | Elektronisches Gerät mit Kühlvorrichtung und ein zugehöriges Montageverfahren |
| PCT/EP2018/082722 WO2019105941A1 (de) | 2017-11-29 | 2018-11-27 | Elektronisches gerät mit kühlvorrichtung und ein zugehöriges montageverfahren |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| EP3677105A1 true EP3677105A1 (de) | 2020-07-08 |
Family
ID=64661292
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP18815550.1A Pending EP3677105A1 (de) | 2017-11-29 | 2018-11-27 | Elektronisches gerät mit kühlvorrichtung und ein zugehöriges montageverfahren |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP3677105A1 (de) |
| AT (1) | AT520694B1 (de) |
| WO (1) | WO2019105941A1 (de) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4340280C2 (de) * | 1993-09-13 | 1996-08-29 | Duerrwaechter E Dr Doduco | Bauteilesatz für ein Gehäuse aus Kunststoff zum Aufnehmen von elektrischen Bauelementen |
| DE19855389C2 (de) * | 1998-12-01 | 2002-10-31 | Siemens Ag | Elektronische Vorrichtung |
| AUPQ729400A0 (en) * | 2000-05-04 | 2000-05-25 | Robert Bosch Gmbh | An electronic control module for a vehicle |
| JP3748253B2 (ja) * | 2002-11-14 | 2006-02-22 | 三菱電機株式会社 | 車載電子機器の筐体構造 |
| JP4867280B2 (ja) * | 2005-10-18 | 2012-02-01 | 株式会社ジェイテクト | コーティング剤塗布方法 |
| JP4789997B2 (ja) * | 2008-11-20 | 2011-10-12 | 三菱電機株式会社 | 電子基板装置 |
| AT510389B1 (de) * | 2010-09-13 | 2014-03-15 | Melecs Ews Gmbh & Co Kg | Kühlvorrichtung für ein elektrisches gerät und zugehöriges herstellungsverfahren |
| DE102013204029A1 (de) * | 2013-03-08 | 2014-09-11 | Zf Friedrichshafen Ag | Vorrichtung zum Kühlen eines elektrischen Gerät und zugehöriges Herstellungsverfahren |
| US9293870B1 (en) * | 2015-03-10 | 2016-03-22 | Continental Automotive Systems, Inc. | Electronic control module having a cover allowing for inspection of right angle press-fit pins |
| AT518126B1 (de) * | 2015-12-01 | 2020-01-15 | Melecs Ews Gmbh | Elektronisches Gerät mit Kühlvorrichtung und ein zugehöriges Montageverfahren |
-
2017
- 2017-11-29 AT ATA50988/2017A patent/AT520694B1/de active
-
2018
- 2018-11-27 WO PCT/EP2018/082722 patent/WO2019105941A1/de not_active Ceased
- 2018-11-27 EP EP18815550.1A patent/EP3677105A1/de active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| AT520694A1 (de) | 2019-06-15 |
| WO2019105941A1 (de) | 2019-06-06 |
| AT520694B1 (de) | 2020-01-15 |
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