EP3707971A4 - Rückplatten-fussabdruck für elektrische steckverbinder mit hoher geschwindigkeit und hoher dichte - Google Patents

Rückplatten-fussabdruck für elektrische steckverbinder mit hoher geschwindigkeit und hoher dichte Download PDF

Info

Publication number
EP3707971A4
EP3707971A4 EP18875264.6A EP18875264A EP3707971A4 EP 3707971 A4 EP3707971 A4 EP 3707971A4 EP 18875264 A EP18875264 A EP 18875264A EP 3707971 A4 EP3707971 A4 EP 3707971A4
Authority
EP
European Patent Office
Prior art keywords
electrical connectors
density electrical
high speed
high density
backplane footprint
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP18875264.6A
Other languages
English (en)
French (fr)
Other versions
EP3707971A1 (de
Inventor
Marc Robert CHARBONNEAU
Jose Ricardo PANIAGUA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Amphenol Corp
Original Assignee
Amphenol Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US15/807,444 external-priority patent/US10201074B2/en
Application filed by Amphenol Corp filed Critical Amphenol Corp
Publication of EP3707971A1 publication Critical patent/EP3707971A1/de
Publication of EP3707971A4 publication Critical patent/EP3707971A4/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0224—Patterned shielding planes, ground planes or power planes
    • H05K1/0225—Single or multiple openings in a shielding, ground or power plane
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0245—Lay-out of balanced signal pairs, e.g. differential lines or twisted lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09409—Multiple rows of pads, lands, terminals or dummy patterns; Multiple rows of mounted components

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
EP18875264.6A 2017-11-08 2018-11-08 Rückplatten-fussabdruck für elektrische steckverbinder mit hoher geschwindigkeit und hoher dichte Pending EP3707971A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US15/807,444 US10201074B2 (en) 2016-03-08 2017-11-08 Backplane footprint for high speed, high density electrical connectors
PCT/US2018/059757 WO2019094549A1 (en) 2017-11-08 2018-11-08 Backplane footprint for high speed, high density electrical connectors

Publications (2)

Publication Number Publication Date
EP3707971A1 EP3707971A1 (de) 2020-09-16
EP3707971A4 true EP3707971A4 (de) 2021-07-28

Family

ID=66438088

Family Applications (1)

Application Number Title Priority Date Filing Date
EP18875264.6A Pending EP3707971A4 (de) 2017-11-08 2018-11-08 Rückplatten-fussabdruck für elektrische steckverbinder mit hoher geschwindigkeit und hoher dichte

Country Status (3)

Country Link
EP (1) EP3707971A4 (de)
CN (1) CN111602472B (de)
WO (1) WO2019094549A1 (de)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050247482A1 (en) * 2004-05-10 2005-11-10 Fujitsu Limited Wiring base board, method of producing thereof, and electronic device
EP3200572A1 (de) * 2014-09-22 2017-08-02 Fujikura, Ltd. Leiterplatte

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4806107A (en) * 1987-10-16 1989-02-21 American Telephone And Telegraph Company, At&T Bell Laboratories High frequency connector
US6388206B2 (en) * 1998-10-29 2002-05-14 Agilent Technologies, Inc. Microcircuit shielded, controlled impedance “Gatling gun”via
SE523511C2 (sv) 2001-11-26 2004-04-27 Tetra Laval Holdings & Finance Förfarande och anordning för sterilisering av ett förpackningsmaterial med hjälp av ett steriliseringsmedel i flytande form
US20040115968A1 (en) * 2002-12-17 2004-06-17 Cohen Thomas S. Connector and printed circuit board for reducing cross-talk
CN101112135B (zh) * 2004-11-29 2010-12-29 Fci公司 改进的匹配阻抗表面贴装技术基底面
US7794278B2 (en) 2007-04-04 2010-09-14 Amphenol Corporation Electrical connector lead frame
CN103428991B (zh) * 2009-03-25 2016-05-04 莫列斯公司 高数据率连接器系统
US8885357B2 (en) * 2012-01-06 2014-11-11 Cray Inc. Printed circuit board with reduced cross-talk
US9545003B2 (en) * 2012-12-28 2017-01-10 Fci Americas Technology Llc Connector footprints in printed circuit board (PCB)
CN103260348B (zh) * 2013-04-01 2016-02-10 广州兴森快捷电路科技有限公司 高速pcb板以及差分过孔阻抗控制方法
US9807869B2 (en) * 2014-11-21 2017-10-31 Amphenol Corporation Mating backplane for high speed, high density electrical connector
US9930772B2 (en) * 2015-12-30 2018-03-27 Te Connectivity Corporation Printed circuit and circuit board assembly configured for quad signaling
CN109076700B (zh) 2016-03-08 2021-07-30 安费诺公司 用于高速、高密度电连接器的背板占板区

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050247482A1 (en) * 2004-05-10 2005-11-10 Fujitsu Limited Wiring base board, method of producing thereof, and electronic device
EP3200572A1 (de) * 2014-09-22 2017-08-02 Fujikura, Ltd. Leiterplatte

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2019094549A1 *

Also Published As

Publication number Publication date
CN111602472A (zh) 2020-08-28
WO2019094549A1 (en) 2019-05-16
CN111602472B (zh) 2024-02-06
EP3707971A1 (de) 2020-09-16

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