EP3766097A4 - Planarisierung für verfahren zur herstellung von halbleiterbauelementgehäusen - Google Patents

Planarisierung für verfahren zur herstellung von halbleiterbauelementgehäusen Download PDF

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Publication number
EP3766097A4
EP3766097A4 EP19766870.0A EP19766870A EP3766097A4 EP 3766097 A4 EP3766097 A4 EP 3766097A4 EP 19766870 A EP19766870 A EP 19766870A EP 3766097 A4 EP3766097 A4 EP 3766097A4
Authority
EP
European Patent Office
Prior art keywords
planarization
semiconductor device
manufacturing process
device package
package manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19766870.0A
Other languages
English (en)
French (fr)
Other versions
EP3766097A1 (de
Inventor
Han-Wen Chen
Steven Verhaverbeke
Roman Gouk
Kyuil CHO
Boyi FU
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of EP3766097A1 publication Critical patent/EP3766097A1/de
Publication of EP3766097A4 publication Critical patent/EP3766097A4/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/014—Manufacture or treatment using batch processing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/01—Manufacture or treatment
    • H10W74/016—Manufacture or treatment using moulds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/129—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed forming a chip-scale package [CSP]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
EP19766870.0A 2018-03-15 2019-02-15 Planarisierung für verfahren zur herstellung von halbleiterbauelementgehäusen Pending EP3766097A4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201862643222P 2018-03-15 2018-03-15
PCT/US2019/018154 WO2019177742A1 (en) 2018-03-15 2019-02-15 Planarization for semiconductor device package fabrication processes

Publications (2)

Publication Number Publication Date
EP3766097A1 EP3766097A1 (de) 2021-01-20
EP3766097A4 true EP3766097A4 (de) 2022-04-13

Family

ID=67908338

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19766870.0A Pending EP3766097A4 (de) 2018-03-15 2019-02-15 Planarisierung für verfahren zur herstellung von halbleiterbauelementgehäusen

Country Status (6)

Country Link
EP (1) EP3766097A4 (de)
JP (1) JP7258906B2 (de)
KR (1) KR102521991B1 (de)
CN (1) CN111868920A (de)
TW (1) TWI717690B (de)
WO (1) WO2019177742A1 (de)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11342256B2 (en) 2019-01-24 2022-05-24 Applied Materials, Inc. Method of fine redistribution interconnect formation for advanced packaging applications
IT201900006736A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di fabbricazione di package
IT201900006740A1 (it) 2019-05-10 2020-11-10 Applied Materials Inc Procedimenti di strutturazione di substrati
US11931855B2 (en) 2019-06-17 2024-03-19 Applied Materials, Inc. Planarization methods for packaging substrates
US11862546B2 (en) 2019-11-27 2024-01-02 Applied Materials, Inc. Package core assembly and fabrication methods
US11257790B2 (en) 2020-03-10 2022-02-22 Applied Materials, Inc. High connectivity device stacking
US12136564B2 (en) 2020-03-30 2024-11-05 Canon Kabushiki Kaisha Superstrate and method of making it
US11454884B2 (en) 2020-04-15 2022-09-27 Applied Materials, Inc. Fluoropolymer stamp fabrication method
US11400545B2 (en) 2020-05-11 2022-08-02 Applied Materials, Inc. Laser ablation for package fabrication
US11752519B2 (en) * 2020-06-19 2023-09-12 Canon Kabushiki Kaisha Planarization method and photocurable composition
TWI751600B (zh) * 2020-07-03 2022-01-01 財團法人工業技術研究院 封裝結構
US11232951B1 (en) 2020-07-14 2022-01-25 Applied Materials, Inc. Method and apparatus for laser drilling blind vias
US11676832B2 (en) 2020-07-24 2023-06-13 Applied Materials, Inc. Laser ablation system for package fabrication
US11521937B2 (en) 2020-11-16 2022-12-06 Applied Materials, Inc. Package structures with built-in EMI shielding
US11404318B2 (en) 2020-11-20 2022-08-02 Applied Materials, Inc. Methods of forming through-silicon vias in substrates for advanced packaging
US11705365B2 (en) 2021-05-18 2023-07-18 Applied Materials, Inc. Methods of micro-via formation for advanced packaging
KR102934062B1 (ko) 2021-10-12 2026-03-04 삼성디스플레이 주식회사 표시 장치의 제조장치 및 표시 장치의 제조방법
US12183684B2 (en) 2021-10-26 2024-12-31 Applied Materials, Inc. Semiconductor device packaging methods
US12325046B2 (en) * 2022-06-28 2025-06-10 Canon Kabushiki Kaisha Superstrate including a body and layers and methods of forming and using the same

Citations (9)

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US20010018229A1 (en) * 2000-02-28 2001-08-30 Nbc Corporation Semiconductor device and method for fabricating same
US20090179317A1 (en) * 2008-01-11 2009-07-16 Kabushiki Kaisha Toshiba Semiconductor device and method for manufacturing the same
US20090209052A1 (en) * 2006-08-22 2009-08-20 3D Plus Process for the collective fabrication of 3d electronic modules
JP2011032436A (ja) * 2009-08-05 2011-02-17 Nitto Denko Corp 電子部品封止用のシート状エポキシ樹脂組成物およびそれを用いた電子部品装置
US20110115125A1 (en) * 2009-11-13 2011-05-19 Freescale Semiconductor, Inc Method and apparatus for molding substrate
US20120126395A1 (en) * 2010-11-18 2012-05-24 Stats Chippac, Ltd. Semiconductor Device and Method of Forming Uniform Height Insulating Layer Over Interposer Frame as Standoff for Semiconductor Die
US20150357256A1 (en) * 2014-06-08 2015-12-10 UTAC Headquarters Pte. Ltd. Semiconductor packages and methods of packaging semiconductor devices
US20160126286A1 (en) * 2012-05-30 2016-05-05 Olympus Corporation Method for producing image pickup apparatus and method for producing semiconductor apparatus
US20160148887A1 (en) * 2014-11-26 2016-05-26 Taiwan Semiconductor Manufacturing Company, Ltd. Device Package with Reduced Thickness and Method for Forming Same

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JP3420590B2 (ja) * 1996-11-11 2003-06-23 触媒化成工業株式会社 基材の平坦化方法、被膜付基材および半導体装置の製造方法
JP3556503B2 (ja) * 1999-01-20 2004-08-18 沖電気工業株式会社 樹脂封止型半導体装置の製造方法
US20060003600A1 (en) * 2004-06-30 2006-01-05 Barns Chris E Contact planarization for integrated circuit processing
US20070032083A1 (en) * 2005-08-05 2007-02-08 Hynix Semiconductor, Inc. Planarization method for manufacturing semiconductor device
JP2008114195A (ja) * 2006-11-08 2008-05-22 Tokyo Ohka Kogyo Co Ltd 平坦化塗布方法
CN101836293B (zh) 2007-10-17 2012-02-01 松下电器产业株式会社 安装结构体
US20120064720A1 (en) * 2010-09-10 2012-03-15 Taiwan Semiconductor Manufacturing Company, Ltd. Planarization control for semiconductor devices
JP5961055B2 (ja) * 2012-07-05 2016-08-02 日東電工株式会社 封止樹脂シート、電子部品パッケージの製造方法及び電子部品パッケージ
US9349622B2 (en) * 2013-03-12 2016-05-24 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for planarization of substrate coatings
JP6356581B2 (ja) * 2014-11-19 2018-07-11 信越化学工業株式会社 半導体装置の製造方法
WO2017203888A1 (ja) 2016-05-26 2017-11-30 アピックヤマダ株式会社 樹脂供給方法、樹脂供給装置、樹脂成形装置、樹脂セット方法および樹脂成形方法

Patent Citations (9)

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US20010018229A1 (en) * 2000-02-28 2001-08-30 Nbc Corporation Semiconductor device and method for fabricating same
US20090209052A1 (en) * 2006-08-22 2009-08-20 3D Plus Process for the collective fabrication of 3d electronic modules
US20090179317A1 (en) * 2008-01-11 2009-07-16 Kabushiki Kaisha Toshiba Semiconductor device and method for manufacturing the same
JP2011032436A (ja) * 2009-08-05 2011-02-17 Nitto Denko Corp 電子部品封止用のシート状エポキシ樹脂組成物およびそれを用いた電子部品装置
US20110115125A1 (en) * 2009-11-13 2011-05-19 Freescale Semiconductor, Inc Method and apparatus for molding substrate
US20120126395A1 (en) * 2010-11-18 2012-05-24 Stats Chippac, Ltd. Semiconductor Device and Method of Forming Uniform Height Insulating Layer Over Interposer Frame as Standoff for Semiconductor Die
US20160126286A1 (en) * 2012-05-30 2016-05-05 Olympus Corporation Method for producing image pickup apparatus and method for producing semiconductor apparatus
US20150357256A1 (en) * 2014-06-08 2015-12-10 UTAC Headquarters Pte. Ltd. Semiconductor packages and methods of packaging semiconductor devices
US20160148887A1 (en) * 2014-11-26 2016-05-26 Taiwan Semiconductor Manufacturing Company, Ltd. Device Package with Reduced Thickness and Method for Forming Same

Non-Patent Citations (1)

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Title
See also references of WO2019177742A1 *

Also Published As

Publication number Publication date
WO2019177742A1 (en) 2019-09-19
CN111868920A (zh) 2020-10-30
KR102521991B1 (ko) 2023-04-13
JP2021517360A (ja) 2021-07-15
JP7258906B2 (ja) 2023-04-17
TWI717690B (zh) 2021-02-01
KR20200120766A (ko) 2020-10-21
EP3766097A1 (de) 2021-01-20
TW201946162A (zh) 2019-12-01

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