EP3778069A4 - Pâte au cuivre, procédé de collage et procédé de production de corps collé - Google Patents

Pâte au cuivre, procédé de collage et procédé de production de corps collé Download PDF

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Publication number
EP3778069A4
EP3778069A4 EP19775134.0A EP19775134A EP3778069A4 EP 3778069 A4 EP3778069 A4 EP 3778069A4 EP 19775134 A EP19775134 A EP 19775134A EP 3778069 A4 EP3778069 A4 EP 3778069A4
Authority
EP
European Patent Office
Prior art keywords
copper paste
body production
gluing
production method
glued body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP19775134.0A
Other languages
German (de)
English (en)
Other versions
EP3778069A1 (fr
Inventor
Haruyuki NAKAJO
Takayuki Ogawa
Ya ZHANG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Harima Chemicals Inc
Original Assignee
Harima Chemicals Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harima Chemicals Inc filed Critical Harima Chemicals Inc
Publication of EP3778069A1 publication Critical patent/EP3778069A1/fr
Publication of EP3778069A4 publication Critical patent/EP3778069A4/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/07—Metallic powder characterised by particles having a nanoscale microstructure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/14—Treatment of metallic powder
    • B22F1/145—Chemical treatment, e.g. passivation or decarburisation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/16—Metallic particles coated with a non-metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • B22F2007/042—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal characterised by the layer forming method
    • B22F2007/047—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal characterised by the layer forming method non-pressurised baking of the paste or slurry containing metal powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Dispersion Chemistry (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Nanotechnology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Ceramic Products (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)
EP19775134.0A 2018-03-29 2019-03-18 Pâte au cuivre, procédé de collage et procédé de production de corps collé Withdrawn EP3778069A4 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018065201 2018-03-29
PCT/JP2019/011213 WO2019188511A1 (fr) 2018-03-29 2019-03-18 Pâte au cuivre, procédé de collage et procédé de production de corps collé

Publications (2)

Publication Number Publication Date
EP3778069A1 EP3778069A1 (fr) 2021-02-17
EP3778069A4 true EP3778069A4 (fr) 2022-04-06

Family

ID=68061545

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19775134.0A Withdrawn EP3778069A4 (fr) 2018-03-29 2019-03-18 Pâte au cuivre, procédé de collage et procédé de production de corps collé

Country Status (4)

Country Link
EP (1) EP3778069A4 (fr)
JP (2) JPWO2019188511A1 (fr)
TW (1) TWI798404B (fr)
WO (1) WO2019188511A1 (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7391678B2 (ja) * 2020-01-24 2023-12-05 大陽日酸株式会社 接合材
JP7651822B2 (ja) * 2020-02-14 2025-03-27 株式会社レゾナック 接合用金属ペースト、接合体、半導体装置、及び接合体の製造方法
JP7026739B2 (ja) * 2020-08-04 2022-02-28 石原ケミカル株式会社 接合方法、銅焼結体及び銅ペースト
JP2022169965A (ja) * 2021-04-28 2022-11-10 ＬＧ Ｊａｐａｎ Ｌａｂ株式会社 酸化銅ナノワイヤーを用いた接合材料とその製造方法及び接合方法
JPWO2023190450A1 (fr) * 2022-03-30 2023-10-05
KR102674086B1 (ko) * 2022-04-01 2024-06-14 (주)호전에이블 구리 소결 페이스트 조성물 및 이의 제조방법
WO2023210449A1 (fr) * 2022-04-28 2023-11-02 三井金属鉱業株式会社 Pâte de cuivre pour assemblage, procédé d'assemblage d'un corps à assembler, procédé de production d'un corps assemblé et procédé de production d'une pâte de cuivre pour assemblage
EP4306234A1 (fr) 2022-07-15 2024-01-17 Technische Hochschule Ingolstadt Pâte de frittage et procédé de production d'une pâte de frittage
KR20240080255A (ko) 2022-11-29 2024-06-07 (주)창성 세라믹 칩 부품용 구리 페이스트 조성물
JPWO2024142582A1 (fr) * 2022-12-28 2024-07-04
WO2026034277A1 (fr) * 2024-08-09 2026-02-12 セントラル硝子株式会社 Pâte d'oxyde d'argent et procédé de fabrication de dispositif à semi-conducteur l'utilisant
CN120452884B (zh) * 2025-07-11 2025-09-05 鄂尔多斯市隆基光伏科技有限公司 铜浆料及制备方法、铜电极、太阳能电池及光伏组件

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1021744A (ja) * 1996-06-28 1998-01-23 Mitsuboshi Belting Ltd 銅導体ペースト及び該銅導体ペーストを印刷した基板
JP2005298903A (ja) * 2004-04-12 2005-10-27 Dowa Mining Co Ltd 銅粉末の製造方法および銅粉末並びに導電性ペースト
US7368070B2 (en) * 2004-03-30 2008-05-06 Shoei Chemical Inc. Conductive paste for terminal electrode of multilayer ceramic electronic part
JP2011094236A (ja) * 2010-12-07 2011-05-12 Dowa Holdings Co Ltd 低温焼成用銅粉または導電ペースト用銅粉
JP2014152338A (ja) * 2013-02-05 2014-08-25 Murata Mfg Co Ltd ナノワイヤ付き微粒子およびその製造方法
JP2017103180A (ja) * 2015-12-04 2017-06-08 日立化成株式会社 無加圧接合用銅ペースト、接合体、及び半導体装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120201759A1 (en) 2011-02-03 2012-08-09 Massachusetts Institute Of Technology Tunable multiscale structures comprising bristly, hollow metal/metal oxide particles, methods of making and articles incorporating the structures
JP6199048B2 (ja) 2013-02-28 2017-09-20 国立大学法人大阪大学 接合材
JP6794987B2 (ja) * 2015-09-07 2020-12-02 昭和電工マテリアルズ株式会社 接合用銅ペースト、接合体の製造方法及び半導体装置の製造方法
JP6659026B2 (ja) 2015-10-14 2020-03-04 国立大学法人大阪大学 銅粒子を用いた低温接合方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1021744A (ja) * 1996-06-28 1998-01-23 Mitsuboshi Belting Ltd 銅導体ペースト及び該銅導体ペーストを印刷した基板
US7368070B2 (en) * 2004-03-30 2008-05-06 Shoei Chemical Inc. Conductive paste for terminal electrode of multilayer ceramic electronic part
JP2005298903A (ja) * 2004-04-12 2005-10-27 Dowa Mining Co Ltd 銅粉末の製造方法および銅粉末並びに導電性ペースト
JP2011094236A (ja) * 2010-12-07 2011-05-12 Dowa Holdings Co Ltd 低温焼成用銅粉または導電ペースト用銅粉
JP2014152338A (ja) * 2013-02-05 2014-08-25 Murata Mfg Co Ltd ナノワイヤ付き微粒子およびその製造方法
JP2017103180A (ja) * 2015-12-04 2017-06-08 日立化成株式会社 無加圧接合用銅ペースト、接合体、及び半導体装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2019188511A1 *

Also Published As

Publication number Publication date
JP2022046765A (ja) 2022-03-23
TWI798404B (zh) 2023-04-11
WO2019188511A1 (fr) 2019-10-03
TW201942372A (zh) 2019-11-01
JPWO2019188511A1 (ja) 2020-12-03
JP7220310B2 (ja) 2023-02-09
EP3778069A1 (fr) 2021-02-17

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