EP3782191A4 - Panneau d'affichage et appareil d'affichage grand format le comprenant - Google Patents

Panneau d'affichage et appareil d'affichage grand format le comprenant Download PDF

Info

Publication number
EP3782191A4
EP3782191A4 EP19829907.5A EP19829907A EP3782191A4 EP 3782191 A4 EP3782191 A4 EP 3782191A4 EP 19829907 A EP19829907 A EP 19829907A EP 3782191 A4 EP3782191 A4 EP 3782191A4
Authority
EP
European Patent Office
Prior art keywords
unit including
large format
display unit
display panel
format display
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19829907.5A
Other languages
German (de)
English (en)
Other versions
EP3782191A1 (fr
Inventor
Kyungwoon Jang
Wonsoon PARK
Dongmyung SON
Sangmin Shin
Changjoon LEE
Youngki Jung
Seongphil CHO
Gyun Heo
Soonmin HONG
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Priority claimed from PCT/KR2019/008230 external-priority patent/WO2020009501A1/fr
Publication of EP3782191A1 publication Critical patent/EP3782191A1/fr
Publication of EP3782191A4 publication Critical patent/EP3782191A4/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/441—Interconnections, e.g. scanning lines
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H10D86/60—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs wherein the TFTs are in active matrices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
    • H10K85/10—Organic polymers or oligomers
    • H10K85/111—Organic polymers or oligomers comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
    • H10K85/113—Heteroaromatic compounds comprising sulfur or selene, e.g. polythiophene
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Geometry (AREA)
EP19829907.5A 2018-07-04 2019-07-04 Panneau d'affichage et appareil d'affichage grand format le comprenant Pending EP3782191A4 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR20180077668 2018-07-04
KR1020190075904A KR102151099B1 (ko) 2018-07-04 2019-06-25 디스플레이 패널 및 이를 이용한 대형 디스플레이 장치
PCT/KR2019/008230 WO2020009501A1 (fr) 2018-07-04 2019-07-04 Panneau d'affichage et appareil d'affichage grand format le comprenant

Publications (2)

Publication Number Publication Date
EP3782191A1 EP3782191A1 (fr) 2021-02-24
EP3782191A4 true EP3782191A4 (fr) 2021-06-16

Family

ID=69153034

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19829907.5A Pending EP3782191A4 (fr) 2018-07-04 2019-07-04 Panneau d'affichage et appareil d'affichage grand format le comprenant

Country Status (4)

Country Link
EP (1) EP3782191A4 (fr)
KR (1) KR102151099B1 (fr)
CN (1) CN112335045B (fr)
TW (1) TWI829715B (fr)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102828397B1 (ko) * 2020-02-19 2025-07-02 삼성디스플레이 주식회사 표시 장치
KR102829217B1 (ko) * 2020-03-03 2025-07-04 삼성전자주식회사 측면 배선이 형성된 글라스 기판을 구비한 디스플레이 모듈 및 디스플레이 모듈 제조 방법
TWI804720B (zh) * 2020-03-27 2023-06-11 南韓商太特思股份有限公司 Led顯示模組及其顯示器
KR102793953B1 (ko) * 2020-04-13 2025-04-14 엘지전자 주식회사 디스플레이 장치와 그의 제조 방법, 및 그를 이용한 멀티 스크린 디스플레이 장치
WO2021225341A1 (fr) 2020-05-08 2021-11-11 삼성전자주식회사 Module d'affichage comprenant un substrat en verre renfermant des câblages latéraux, et procédé de fabrication afférent
KR102542344B1 (ko) * 2020-05-08 2023-06-13 삼성전자주식회사 측면 배선이 형성된 글라스 기판을 구비한 디스플레이 모듈 및 그 제조 방법
KR102740408B1 (ko) * 2020-05-13 2024-12-11 보에 테크놀로지 그룹 컴퍼니 리미티드 구동 기판, 구동 기판의 제작 방법 및 표시 장치
TWI742681B (zh) * 2020-05-21 2021-10-11 友達光電股份有限公司 顯示裝置
KR102955215B1 (ko) 2020-07-17 2026-04-22 삼성전자주식회사 디스플레이 장치, 발광 다이오드 모듈
CN111951697B (zh) 2020-08-10 2022-02-01 Tcl华星光电技术有限公司 拼接显示屏
CN113644085B (zh) * 2020-08-14 2023-06-02 友达光电股份有限公司 电子装置及电子装置的制造方法
TWI737520B (zh) * 2020-08-14 2021-08-21 友達光電股份有限公司 顯示面板
KR20220039448A (ko) * 2020-09-22 2022-03-29 삼성전자주식회사 측면 배선을 구비한 디스플레이 모듈 및 그 제조 방법
KR102904020B1 (ko) * 2020-10-23 2025-12-26 삼성전자주식회사 디스플레이 모듈 및 그 제조 방법
KR102328078B1 (ko) 2021-04-13 2021-11-18 주식회사 에이맵플러스 디스플레이 패널, 디스플레이 장치 및 그 제조방법
US20250040049A1 (en) * 2022-02-21 2025-01-30 BOE MLED Technology Co., Ltd. Wiring board and manufacturing method thereof, and functional backplane
KR20240099847A (ko) 2022-12-22 2024-07-01 삼성전자주식회사 디스플레이 모듈
TWI832687B (zh) * 2023-01-30 2024-02-11 友達光電股份有限公司 側面電路結構及其製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2426718A1 (fr) * 2010-09-02 2012-03-07 Sony Corporation Dispositif semi-conducteur, son procédé de fabrication et appareil électronique
US20150029684A1 (en) * 2013-07-25 2015-01-29 Samsung Display Co., Ltd. Flat panel display apparatus and method for manufacturing the same
JP2015175969A (ja) * 2014-03-14 2015-10-05 日本放送協会 タイル型ディスプレイ及びその作製方法
KR20150110910A (ko) * 2014-03-21 2015-10-05 주식회사 루멘스 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제조 방법
EP3316302A1 (fr) * 2016-10-28 2018-05-02 LG Display Co., Ltd. Afficheur à diodes électroluminescentes

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US6456354B2 (en) * 1999-08-06 2002-09-24 Rainbow Displays, Inc. Design features optimized for tiled flat-panel displays
JP2007080853A (ja) * 2005-09-09 2007-03-29 Toshiba Corp 素子形成基板、アクティブマトリクス基板及びその製造方法
JP5476701B2 (ja) * 2008-10-31 2014-04-23 株式会社大林組 階段
JP5341982B2 (ja) * 2009-03-17 2013-11-13 パイオニア株式会社 有機elモジュールおよびその製造方法
US9029880B2 (en) * 2012-12-10 2015-05-12 LuxVue Technology Corporation Active matrix display panel with ground tie lines
US20150282293A1 (en) * 2014-02-07 2015-10-01 Google Technology Holdings LLC Display, display assembly and device
US9841548B2 (en) * 2015-06-30 2017-12-12 Apple Inc. Electronic devices with soft input-output components
US10026721B2 (en) * 2015-06-30 2018-07-17 Apple Inc. Electronic devices with soft input-output components
KR20170059523A (ko) * 2015-11-20 2017-05-31 삼성디스플레이 주식회사 표시 장치, 타일형 표시 장치 및 이의 제조 방법
KR102740814B1 (ko) * 2016-12-20 2024-12-09 엘지디스플레이 주식회사 표시 장치와 이를 포함하는 멀티 스크린 표시 장치
KR102515399B1 (ko) * 2017-12-12 2023-03-28 엘지디스플레이 주식회사 배선 필름 및 그를 포함한 표시 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2426718A1 (fr) * 2010-09-02 2012-03-07 Sony Corporation Dispositif semi-conducteur, son procédé de fabrication et appareil électronique
US20150029684A1 (en) * 2013-07-25 2015-01-29 Samsung Display Co., Ltd. Flat panel display apparatus and method for manufacturing the same
JP2015175969A (ja) * 2014-03-14 2015-10-05 日本放送協会 タイル型ディスプレイ及びその作製方法
KR20150110910A (ko) * 2014-03-21 2015-10-05 주식회사 루멘스 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제조 방법
EP3316302A1 (fr) * 2016-10-28 2018-05-02 LG Display Co., Ltd. Afficheur à diodes électroluminescentes

Also Published As

Publication number Publication date
TWI829715B (zh) 2024-01-21
CN112335045A (zh) 2021-02-05
TW202006448A (zh) 2020-02-01
EP3782191A1 (fr) 2021-02-24
KR102151099B1 (ko) 2020-09-02
CN112335045B (zh) 2024-08-30
KR20200004751A (ko) 2020-01-14

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