EP3841304A1 - Ensemble pompe à fluide - Google Patents

Ensemble pompe à fluide

Info

Publication number
EP3841304A1
EP3841304A1 EP19758378.4A EP19758378A EP3841304A1 EP 3841304 A1 EP3841304 A1 EP 3841304A1 EP 19758378 A EP19758378 A EP 19758378A EP 3841304 A1 EP3841304 A1 EP 3841304A1
Authority
EP
European Patent Office
Prior art keywords
fluid pump
fluid
pump arrangement
circuit board
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP19758378.4A
Other languages
German (de)
English (en)
Inventor
Dirk NEUNZIG
Rajko Colic
Lothar Schröder
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Schaeffler Technologies AG and Co KG
Original Assignee
Vitesco Technologies GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vitesco Technologies GmbH filed Critical Vitesco Technologies GmbH
Publication of EP3841304A1 publication Critical patent/EP3841304A1/fr
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/5813—Cooling the control unit
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B17/00—Pumps characterised by combination with, or adaptation to, specific driving engines or motors
    • F04B17/03—Pumps characterised by combination with, or adaptation to, specific driving engines or motors driven by electric motors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B53/00—Component parts, details or accessories not provided for in, or of interest apart from, groups F04B1/00 - F04B23/00 or F04B39/00 - F04B47/00
    • F04B53/08—Cooling; Heating; Preventing freezing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D13/00—Pumping installations or systems
    • F04D13/02—Units comprising pumps and their driving means
    • F04D13/06—Units comprising pumps and their driving means the pump being electrically driven
    • F04D13/0606—Canned motor pumps

Definitions

  • the present invention relates to a fluid pump arrangement, in particular for a motor vehicle, with an electrical circuit board, and a motor vehicle with the Fluidpumpenan arrangement and a method for cooling the electrical circuit board.
  • electrical printed circuit boards can be exposed to high thermal loads from the environment, in particular an internal combustion engine, and / or loss (from) heat of electrical components arranged on the printed circuit board, so that in the case of purely convective cooling by ambient air Performance and / or life of the circuit board can be impaired.
  • the object of the present invention is to improve a fluid pump arrangement or its operation.
  • a fluid pump arrangement in particular an assembly, has (at least) a fluid pump and (at least) an electric motor which drives the pump, in one embodiment a rotor of the pump, or is provided for this purpose, in particular it is set up or .
  • the electric motor is coupled to the pump rotor or is integrally formed.
  • the pump conveys cooling fluid and / or water or is provided for this purpose, in particular it is set up or is used for this purpose, and can therefore be an (electrical) cooling water pump in particular. Additionally or alternatively, in one embodiment, it supplies an internal combustion engine or is provided for this purpose, in particular is set up, or is used for this purpose. Additionally or alternatively, the fluid pump arrangement is or is arranged in a motor vehicle or
  • the fluid pump arrangement has (at least) an electrical circuit board on which one embodiment has one or more electrical, in particular electronic, components, and in one embodiment at least one electrical (on) component of power electronics.
  • the printed circuit board in particular the at least one component, controls the electric motor and / or supplies it with electricity or is provided for this, in particular set up, or is used for this purpose.
  • the present invention can be used here with particular advantage.
  • the fluid pump arrangement has (at least) a one-piece or multi-piece or one-piece, in one embodiment electrically insulating, heat-conducting pad which touches the electrical circuit board, in particular the at least one electrical (on) component arranged thereon or against this, preferably over a large area, in particular over a large area.
  • the thermal pad covers at least 2%, in particular at least 5%, in one embodiment at least 10% of an end face, in particular a surface, the circuit board and / or at least 25%, in particular at least 50%, in one embodiment at least 90% End face, in particular a special surface of the arranged thereon
  • an, in particular opposite, contact surface of the heat-conducting pad touches that in one embodiment at least 10%, in particular at least 15%, in one embodiment at least 25% of an end face, in particular an (outer) surface, of the heat meleitpads amounts to or forms an (upper) surface of the fluid pump arrangement or.
  • assembly in particular the fluid pump, the electric motor or one directly or indirectly connected to the fluid pump and / or the electric motor and / or together with the fluid pump and / or the electric motor in one, in particular partially or completely within, a housing (s) the element arranged in the fluid pump arrangement (“fluid pump arrangement surface”) such that, in particular in at least one (intended) operating state, in particular in a normal or design operating state, heat is dissipated from the printed circuit board to or into this fluid pump arrangement surface, or is provided for this, in particular set up, or is used for this purpose.
  • advantageous cooling of the printed circuit board or of the electrical (on) component arranged thereon can be realized in one embodiment. Additionally or alternatively, in one embodiment this can also provide mechanical support for the printed circuit board or the electrical (on) component arranged thereon on the fluid pump arrangement surface, and in particular thus dampen vibrations.
  • a contact surface of the heat-conducting pad which is opposite in one embodiment of the printed circuit board, defines or defines, in particular seals, at least 10%, in particular at least 15%, in one embodiment at least 25% of an end face , in particular an (outer) surface, of the heat-conducting pad is or forms a fluid chamber of the pump such that, in particular in at least one (intended) operating state, in particular in a normal or design operating state, heat from the Printed circuit board, in particular directly or immediately, to or in, in one embodiment is derived in the fluid space by fluid conveyed by the fluid pump, or is provided for this purpose, in particular is set up, or is used for this purpose.
  • the contact surface of the thermal pad partially or completely covers an (passage) opening (in an element, in particular the pot, of the fluid pump arrangement) to the fluid space or closes this (passage) opening.
  • the fluid pump arrangement surface is a surface of an element, in particular in at least one (provided) operating state, in particular in a normal or design operating state, in particular by a fluid-cooled element of the fluid pump arrangement, in particular a fluid-side or fluid, cooled by the fluid pump - Surface facing away from a wall, which delimits, in particular seals, a fluid chamber of the pump.
  • One embodiment is therefore based on the idea of dissipating heat from the printed circuit board or the component via the heat-conducting pad to fluid conveyed by the fluid pump and for this purpose directly contacting the fluid with the heat-conducting pad or a fluid-loaded wall, in particular its fluid-facing outer surface, as a heat sink use.
  • the fluid pump arrangement surface can also be actively cooled in another way or set up for this purpose or be used, for example, by a heat exchanger or the like.
  • cooling of the printed circuit board or of the electrical (on) component arranged thereon can be (further) improved in one embodiment.
  • the fluid pump assembly surface is made entirely or partially of metal.
  • the fluid pump arrangement surface in one embodiment is a surface of an insert in a pot of the fluid pump arrangement, the insert being produced separately in one embodiment and being or being frictionally, positively and / or materially connected to the pot in one embodiment an archetype of the pot or insert.
  • the pot delimits a fluid space of the fluid pump arrangement or is provided for this, in particular set up, or is used for this purpose.
  • this can improve heat conduction from the heat conduction pad into the fluid pump arrangement surface.
  • the thermal pad is or is connected to the printed circuit board in a form-fitting and / or integral manner.
  • the heat-conducting pad is or is frictionally, positively and / or cohesively connected to the fluid pump arrangement surface and / or an edge of one or the opening at least partially covered by the contact surface to the fluid space, in one embodiment a primary shaping of the fluid pump arrangement surface and / or the thermal pad.
  • the heat-conducting pad can therefore be cast into the bottom of a pot of the fluid pump arrangement.
  • the heat-conducting pad is or is clamped or clamped, in particular elastically deformed, in particular compressed, between the printed circuit board and the fluid pump arrangement surface and / or one or the edge of an opening or at least partially covered by the contact surface to the fluid space.
  • heat conduction and / or mechanical support and / or assembly can be improved in one embodiment.
  • the thermal pad in particular at 20 ° C., has a thermal conductivity of at least 1 W / mK, in particular in particular at least 2.5 W / mK, in one embodiment at least 5 W / mK, and / or at most 100 W / mK, in particular at most 50 W / mK, in one version at most 15 W / mK. In one embodiment, it is flexible and / or flat.
  • the heat-conducting pad in one embodiment has silicone, polyurethane (PU) and / or ceramic, in particular aluminum oxide ceramic.
  • heat conduction and / or mechanical support and / or assembly can be improved in one embodiment.
  • the heat-conducting pad in one embodiment has a, in particular ceramic, filling, in one embodiment aluminum oxide ceramics, and a sheath enveloping it, which in one embodiment has silicone and / or polyurethane.
  • the electrical circuit board and / or the heat-conducting pad and / or the fluid pump arrangement surface and / or the fluid space is arranged in one, in particular completely or partially, within a one-part or multi-part housing (s) of the fluid pump arrangement.
  • the present invention can be used with particular advantage in such housed parts.
  • the fluid space is completely or partially filled with fluid conveyed by the fluid pump in one embodiment or is provided for this purpose, in particular is set up or is used for this purpose.
  • Fig. 1 a part of a fluid pump arrangement according to a
  • FIG. 1 shows a part of a fluid pump arrangement according to an embodiment of the present invention in an axial or meridian section.
  • the fluid pump arrangement has a multi-part housing 100, in which a fluid pump or pump stage, of which its ring channel 2 is indicated in FIG. 1, and an electric motor for driving the pump, of which its stator 1 is indicated in FIG. 1, are arranged are.
  • the fluid pump arrangement further has an electrical circuit board 20 with an electronic component 21 arranged thereon and a pot 30 which seals a fluid chamber 40 of the fluid pump arrangement, which is flowed through during operation of fluid 41 conveyed by the fluid pump, against the electrical circuit board 20.
  • a disk-shaped metal insert 31 is inserted in a pot bottom, the surface of which on the fluid side (above in FIG. 1) seals the fluid space 40 and the surface of which faces away from the fluid forms a fluid pump arrangement surface 32.
  • a thermal pad 50 is clamped between the circuit board 20 and the fluid pump arrangement surface 32 such that it contacts the circuit board 20 and the electronic component 21 arranged thereon and an opposite contact surface 51 of the
  • Thermal pads touch the fluid pump assembly surface 32 on its entire face.
  • the thermal pad 50 conducts heat from the printed circuit board 20, in particular the component 21, to the fluid pump arrangement surface 32 of the metal insert 31 and via this to fluid conveyed by the fluid pump in the fluid space 40.
  • the elastically compressed thermal pad 50 mechanically supports the printed circuit board 20 on the fluid pump arrangement surface 32 and can in particular dampen vibrations and protect the component 21.
  • the metal insert 31 is omitted. Instead, the heat-conducting pad 50 is inserted or cast into the through opening in the pot (bottom) which is free in this way such that its contact surface 51 contacts the fluid chamber 40 of the pump, which in operation is pumped by the fluid pump Fluid 41 is flowed through, seals against the electrical circuit board 20.
  • the heat-conducting pad 50 dissipates heat from the printed circuit board 20, in particular the component 21, directly to fluid 41 in the fluid space 40, which fluid pump is conveying it.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Details Of Reciprocating Pumps (AREA)

Abstract

L'invention concerne un ensemble pompe à fluide, en particulier destiné à un véhicule automobile. L'ensemble pompe à fluide comporte une pompe à fluide, un moteur électrique (1) servant à entraîner la pompe, une carte de circuits imprimés (20) électrique et un coussin thermoconducteur (50), qui est en contact avec la carte de circuits imprimés électrique, en particulier avec au moins un composant (21) électrique disposé sur celle-ci. Une surface de contact (51) du coussin thermoconducteur est en contact avec une surface (32) de l'ensemble pompe à fluide et/ou délimite un espace de fluide (40) de la pompe pour dissiper de la chaleur de la carte de circuits imprimés.
EP19758378.4A 2018-08-21 2019-08-20 Ensemble pompe à fluide Pending EP3841304A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102018214079.0A DE102018214079A1 (de) 2018-08-21 2018-08-21 Fluidpumpenanordnung
PCT/EP2019/072272 WO2020038946A1 (fr) 2018-08-21 2019-08-20 Ensemble pompe à fluide

Publications (1)

Publication Number Publication Date
EP3841304A1 true EP3841304A1 (fr) 2021-06-30

Family

ID=67734651

Family Applications (1)

Application Number Title Priority Date Filing Date
EP19758378.4A Pending EP3841304A1 (fr) 2018-08-21 2019-08-20 Ensemble pompe à fluide

Country Status (3)

Country Link
EP (1) EP3841304A1 (fr)
DE (1) DE102018214079A1 (fr)
WO (1) WO2020038946A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119435470A (zh) * 2023-07-28 2025-02-14 浙江三花汽车零部件有限公司 电动泵

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0913910A1 (fr) * 1997-10-31 1999-05-06 Siemens Canada Limited Moteur de pompe avec système de refroidissement par liquide
US5923108A (en) * 1996-07-30 1999-07-13 Ebara Corporation Canned motor
DE102012222358A1 (de) * 2012-12-05 2014-06-05 Mahle International Gmbh Elektrische Flüssigkeitspumpe
CN104362799A (zh) * 2014-12-09 2015-02-18 程夏林 泵用调速电机
DE202016004596U1 (de) * 2015-07-28 2016-11-10 Industrie Saleri Italo S.P.A. Pumpengruppenpumpe mit Trägergehäuse und Stützplatte
US20170302124A1 (en) * 2016-04-15 2017-10-19 Bühler Motor GmbH Pump motor with a heat dissipation containment shell
DE102016122702A1 (de) * 2016-11-24 2018-05-24 Nidec Gpm Gmbh Elektrische Kühlmittelpumpe mit ECU-Kühlung

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10052797A1 (de) * 2000-10-25 2002-05-08 Bosch Gmbh Robert Elektromotorisch angetriebene Pumpe und Verfahren zur Herstellung einer solchen Pumpe
JP2008128076A (ja) * 2006-11-20 2008-06-05 Aisan Ind Co Ltd 流体ポンプ
JP6361451B2 (ja) * 2014-10-16 2018-07-25 株式会社デンソー 電気装置および電気装置の製造方法
DE212016000048U1 (de) * 2015-02-04 2017-10-05 Industrie Saleri Italo S.P.A. Pumpengruppe mit gekühlter elektronischer Steuervorrichtung

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5923108A (en) * 1996-07-30 1999-07-13 Ebara Corporation Canned motor
EP0913910A1 (fr) * 1997-10-31 1999-05-06 Siemens Canada Limited Moteur de pompe avec système de refroidissement par liquide
DE102012222358A1 (de) * 2012-12-05 2014-06-05 Mahle International Gmbh Elektrische Flüssigkeitspumpe
CN104362799A (zh) * 2014-12-09 2015-02-18 程夏林 泵用调速电机
DE202016004596U1 (de) * 2015-07-28 2016-11-10 Industrie Saleri Italo S.P.A. Pumpengruppenpumpe mit Trägergehäuse und Stützplatte
US20170302124A1 (en) * 2016-04-15 2017-10-19 Bühler Motor GmbH Pump motor with a heat dissipation containment shell
DE102016122702A1 (de) * 2016-11-24 2018-05-24 Nidec Gpm Gmbh Elektrische Kühlmittelpumpe mit ECU-Kühlung

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2020038946A1 *

Also Published As

Publication number Publication date
DE102018214079A1 (de) 2020-02-27
WO2020038946A1 (fr) 2020-02-27

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