EP3940110A1 - Préparations de complexes de métaux précieux - Google Patents
Préparations de complexes de métaux précieux Download PDFInfo
- Publication number
- EP3940110A1 EP3940110A1 EP20185479.1A EP20185479A EP3940110A1 EP 3940110 A1 EP3940110 A1 EP 3940110A1 EP 20185479 A EP20185479 A EP 20185479A EP 3940110 A1 EP3940110 A1 EP 3940110A1
- Authority
- EP
- European Patent Office
- Prior art keywords
- noble metal
- layer
- substrates
- weight
- application
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000510 noble metal Inorganic materials 0.000 title claims abstract description 61
- 238000002360 preparation method Methods 0.000 title claims abstract description 48
- 239000003446 ligand Substances 0.000 claims abstract description 18
- 239000003960 organic solvent Substances 0.000 claims abstract description 18
- 150000004696 coordination complex Chemical class 0.000 claims abstract description 17
- 125000003118 aryl group Chemical group 0.000 claims abstract description 15
- 150000001993 dienes Chemical class 0.000 claims abstract description 14
- 239000000654 additive Substances 0.000 claims abstract description 13
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical group [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims abstract description 11
- 150000001875 compounds Chemical class 0.000 claims abstract description 11
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical group I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 claims abstract description 8
- 230000000996 additive effect Effects 0.000 claims abstract description 6
- 150000001649 bromium compounds Chemical group 0.000 claims abstract description 6
- 239000010410 layer Substances 0.000 claims description 69
- KDLHZDBZIXYQEI-UHFFFAOYSA-N palladium Substances [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 68
- 239000000758 substrate Substances 0.000 claims description 42
- SJLOMQIUPFZJAN-UHFFFAOYSA-N oxorhodium Chemical compound [Rh]=O SJLOMQIUPFZJAN-UHFFFAOYSA-N 0.000 claims description 28
- 229910003450 rhodium oxide Inorganic materials 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 19
- 239000011247 coating layer Substances 0.000 claims description 17
- HTXDPTMKBJXEOW-UHFFFAOYSA-N dioxoiridium Chemical compound O=[Ir]=O HTXDPTMKBJXEOW-UHFFFAOYSA-N 0.000 claims description 16
- 229910000457 iridium oxide Inorganic materials 0.000 claims description 16
- 239000000203 mixture Substances 0.000 claims description 13
- 239000010948 rhodium Substances 0.000 claims description 9
- 238000005979 thermal decomposition reaction Methods 0.000 claims description 9
- 238000000354 decomposition reaction Methods 0.000 claims description 8
- 239000007921 spray Substances 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000007598 dipping method Methods 0.000 claims description 3
- 238000007669 thermal treatment Methods 0.000 claims description 3
- 239000011111 cardboard Substances 0.000 claims description 2
- 239000004744 fabric Substances 0.000 claims description 2
- 238000009472 formulation Methods 0.000 claims description 2
- 239000011521 glass Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 claims description 2
- 239000000123 paper Substances 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 238000000518 rheometry Methods 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000009736 wetting Methods 0.000 claims description 2
- 239000002023 wood Substances 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 1
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 36
- 229910052763 palladium Inorganic materials 0.000 description 22
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 22
- 239000000243 solution Substances 0.000 description 22
- RRKODOZNUZCUBN-CCAGOZQPSA-N (1z,3z)-cycloocta-1,3-diene Chemical compound C1CC\C=C/C=C\C1 RRKODOZNUZCUBN-CCAGOZQPSA-N 0.000 description 21
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 17
- -1 di- Chemical class 0.000 description 15
- 229920001721 polyimide Polymers 0.000 description 15
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 14
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 14
- SJYNFBVQFBRSIB-UHFFFAOYSA-N norbornadiene Chemical compound C1=CC2C=CC1C2 SJYNFBVQFBRSIB-UHFFFAOYSA-N 0.000 description 14
- 239000012071 phase Substances 0.000 description 14
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 12
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 10
- 150000002763 monocarboxylic acids Chemical group 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 150000002940 palladium Chemical class 0.000 description 8
- 239000003208 petroleum Substances 0.000 description 8
- WLJVXDMOQOGPHL-UHFFFAOYSA-N phenylacetic acid Chemical group OC(=O)CC1=CC=CC=C1 WLJVXDMOQOGPHL-UHFFFAOYSA-N 0.000 description 8
- YJZATOSJMRIRIW-UHFFFAOYSA-N [Ir]=O Chemical compound [Ir]=O YJZATOSJMRIRIW-UHFFFAOYSA-N 0.000 description 7
- CSNNHWWHGAXBCP-UHFFFAOYSA-L Magnesium sulfate Chemical compound [Mg+2].[O-][S+2]([O-])([O-])[O-] CSNNHWWHGAXBCP-UHFFFAOYSA-L 0.000 description 6
- 101150003085 Pdcl gene Proteins 0.000 description 6
- 239000010970 precious metal Substances 0.000 description 6
- 235000002639 sodium chloride Nutrition 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 239000000470 constituent Substances 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 5
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 4
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 4
- 150000002503 iridium Chemical class 0.000 description 4
- 150000003057 platinum Chemical class 0.000 description 4
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 3
- 239000004215 Carbon black (E152) Substances 0.000 description 3
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- 239000008199 coating composition Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- GHVNFZFCNZKVNT-UHFFFAOYSA-N decanoic acid Chemical class CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 3
- MNWFXJYAOYHMED-UHFFFAOYSA-N heptanoic acid group Chemical class C(CCCCCC)(=O)O MNWFXJYAOYHMED-UHFFFAOYSA-N 0.000 description 3
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid group Chemical class C(CCCCC)(=O)O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 3
- 229930195733 hydrocarbon Natural products 0.000 description 3
- 229910052943 magnesium sulfate Inorganic materials 0.000 description 3
- 235000019341 magnesium sulphate Nutrition 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000012074 organic phase Substances 0.000 description 3
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 3
- 150000003283 rhodium Chemical class 0.000 description 3
- VYPDUQYOLCLEGS-UHFFFAOYSA-M sodium;2-ethylhexanoate Chemical compound [Na+].CCCCC(CC)C([O-])=O VYPDUQYOLCLEGS-UHFFFAOYSA-M 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000008096 xylene Substances 0.000 description 3
- OBETXYAYXDNJHR-SSDOTTSWSA-M (2r)-2-ethylhexanoate Chemical compound CCCC[C@@H](CC)C([O-])=O OBETXYAYXDNJHR-SSDOTTSWSA-M 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- OBETXYAYXDNJHR-UHFFFAOYSA-N alpha-ethylcaproic acid Natural products CCCCC(CC)C(O)=O OBETXYAYXDNJHR-UHFFFAOYSA-N 0.000 description 2
- 229940045985 antineoplastic platinum compound Drugs 0.000 description 2
- 239000008346 aqueous phase Substances 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- NZNMSOFKMUBTKW-UHFFFAOYSA-N cyclohexanecarboxylic acid Chemical compound OC(=O)C1CCCCC1 NZNMSOFKMUBTKW-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- KDUIUFJBNGTBMD-VXMYFEMYSA-N cyclooctatetraene Chemical compound C1=C\C=C/C=C\C=C1 KDUIUFJBNGTBMD-VXMYFEMYSA-N 0.000 description 2
- 238000004945 emulsification Methods 0.000 description 2
- 239000000839 emulsion Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 229910052741 iridium Chemical group 0.000 description 2
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical group [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 description 2
- 150000002576 ketones Chemical class 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- FBUKVWPVBMHYJY-UHFFFAOYSA-N nonanoic acid Chemical compound CCCCCCCCC(O)=O FBUKVWPVBMHYJY-UHFFFAOYSA-N 0.000 description 2
- WWZKQHOCKIZLMA-UHFFFAOYSA-N octanoic acid Chemical compound CCCCCCCC(O)=O WWZKQHOCKIZLMA-UHFFFAOYSA-N 0.000 description 2
- 150000003058 platinum compounds Chemical class 0.000 description 2
- 229920000098 polyolefin Polymers 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 229910052703 rhodium Inorganic materials 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 description 1
- PRBHEGAFLDMLAL-UHFFFAOYSA-N 1,5-Hexadiene Natural products CC=CCC=C PRBHEGAFLDMLAL-UHFFFAOYSA-N 0.000 description 1
- VYXHVRARDIDEHS-UHFFFAOYSA-N 1,5-cyclooctadiene Chemical compound C1CC=CCCC=C1 VYXHVRARDIDEHS-UHFFFAOYSA-N 0.000 description 1
- 239000004912 1,5-cyclooctadiene Substances 0.000 description 1
- QIJNJJZPYXGIQM-UHFFFAOYSA-N 1lambda4,2lambda4-dimolybdacyclopropa-1,2,3-triene Chemical compound [Mo]=C=[Mo] QIJNJJZPYXGIQM-UHFFFAOYSA-N 0.000 description 1
- LDMRLRNXHLPZJN-UHFFFAOYSA-N 3-propoxypropan-1-ol Chemical compound CCCOCCCO LDMRLRNXHLPZJN-UHFFFAOYSA-N 0.000 description 1
- YPIFGDQKSSMYHQ-UHFFFAOYSA-N 7,7-dimethyloctanoic acid Chemical compound CC(C)(C)CCCCCC(O)=O YPIFGDQKSSMYHQ-UHFFFAOYSA-N 0.000 description 1
- QYEXBYZXHDUPRC-UHFFFAOYSA-N B#[Ti]#B Chemical compound B#[Ti]#B QYEXBYZXHDUPRC-UHFFFAOYSA-N 0.000 description 1
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- 229910039444 MoC Inorganic materials 0.000 description 1
- 229910001252 Pd alloy Inorganic materials 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910001260 Pt alloy Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 1
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 230000004931 aggregating effect Effects 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 150000001734 carboxylic acid salts Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 150000008280 chlorinated hydrocarbons Chemical class 0.000 description 1
- 229960001701 chloroform Drugs 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- VZFUCHSFHOYXIS-UHFFFAOYSA-N cycloheptane carboxylic acid Natural products OC(=O)C1CCCCCC1 VZFUCHSFHOYXIS-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000001804 emulsifying effect Effects 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 229940052308 general anesthetics halogenated hydrocarbons Drugs 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 239000002638 heterogeneous catalyst Substances 0.000 description 1
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical compound C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 159000000003 magnesium salts Chemical class 0.000 description 1
- 150000002842 nonanoic acids Chemical class 0.000 description 1
- 125000005473 octanoic acid group Chemical class 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- WQIQNKQYEUMPBM-UHFFFAOYSA-N pentamethylcyclopentadiene Chemical compound CC1C(C)=C(C)C(C)=C1C WQIQNKQYEUMPBM-UHFFFAOYSA-N 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229960003424 phenylacetic acid Drugs 0.000 description 1
- 239000003279 phenylacetic acid Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000307 polymer substrate Polymers 0.000 description 1
- XAEFZNCEHLXOMS-UHFFFAOYSA-M potassium benzoate Chemical compound [K+].[O-]C(=O)C1=CC=CC=C1 XAEFZNCEHLXOMS-UHFFFAOYSA-M 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- CASCCINXYVTVRI-UHFFFAOYSA-M sodium;7,7-dimethyloctanoate Chemical compound [Na+].CC(C)(C)CCCCCC([O-])=O CASCCINXYVTVRI-UHFFFAOYSA-M 0.000 description 1
- 239000011877 solvent mixture Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- MTPVUVINMAGMJL-UHFFFAOYSA-N trimethyl(1,1,2,2,2-pentafluoroethyl)silane Chemical compound C[Si](C)(C)C(F)(F)C(F)(F)F MTPVUVINMAGMJL-UHFFFAOYSA-N 0.000 description 1
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/1204—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material inorganic material, e.g. non-oxide and non-metallic such as sulfides, nitrides based compounds
- C23C18/1208—Oxides, e.g. ceramics
- C23C18/1216—Metal oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/12—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of inorganic material other than metallic material
- C23C18/125—Process of deposition of the inorganic material
- C23C18/1295—Process of deposition of the inorganic material with after-treatment of the deposited inorganic material
Definitions
- the present invention relates to preparations of noble metal complexes and the use of the preparations for producing layers comprising noble metal on substrates.
- WO90/07561 A1 discloses platinum complexes of the formula LM[O(CO)R] 2 , where L is a nitrogen-free cyclic polyolefin ligand, preferably cyclooctadiene (COD) or pentamethylcyclopentadiene, and M is platinum or iridium, and where R is benzyl, aryl or alkyl of four or more Carbon atoms, particularly preferably phenyl. It was an object of the present invention to find preparations which can be used to produce layers comprising noble metal, in particular also on temperature-sensitive substrates.
- COD cyclooctadiene
- M platinum or iridium
- R is benzyl, aryl or alkyl of four or more Carbon atoms, particularly preferably phenyl.
- diolefinic ligand compound refers to a compound that provides the noble metal complexes with both or two of their olefinic double bonds complexed to a central noble metal atom or complexed to two central noble metals in a bridging manner.
- n and m generally denote an integer, for example in the range 2 to 5.
- integer n > 1 is generally in the range 2 to 5; in particular, n is then equal to 2 and it is at the noble metal complexes then to binuclear palladium complexes.
- integer m generally ranges from 2 to 5; in particular, m is then equal to 2 and the noble metal complexes are then binuclear rhodium or iridium complexes.
- component (B) is dissolved in component (A). If the optional component (C) is present in a preparation according to the invention, then this component (C) is also preferably present as a solution in component (A).
- the compositions of the invention are organic solutions, more precisely true, i.e. non-colloidal, organic solutions; the same applies when optional component (C) is present in the preferred form, i.e. dissolved in component (A).
- the preparations according to the invention contain 30 to 90% by weight of at least one organic solvent (A).
- the organic solvent or solvents can be selected from a large number of customary organic solvents, since the noble metal complexes have good to unlimited solubility in such organic solvents.
- the organic solvent or solvents are expediently essentially volatile under the processing conditions of the preparations according to the invention; this applies in particular to the stage after application of a preparation according to the invention to a substrate.
- the boiling points of the organic solvent or solvents are in the range from 50 to 200°C or higher, for example 50 to 300°C.
- organic solvents (A) include aliphatics and cycloaliphatics each having 6 to 12 carbon atoms; Halogenated hydrocarbons such as di-, tri- and carbon tetrachloride; aromatics; Araliphatics such as toluene or xylene; alcohols such as ethanol, n-propanol and isopropanol; ether; Glycol ethers such as mono-C1-C4-alkyl glycol ethers and di-C1-C4-alkyl glycol ethers, for example ethylene glycol mono-C1-C4-alkyl ethers, ethylene glycol di-C1-C4-alkyl ethers, diethylene glycol mono-C1-C4-alkyl ethers, diethylene glycol di-C1-C4-alkyl ethers , propylene glycol mono C1-C4 alkyl ether, propylene glycol di-C1-C4 alkyl ether, di-
- Araliphatics such as toluene or xylene, alcohols such as ethanol, n-propanol and isopropanol and glycol ethers such as mono-C1-C4-alkyl glycol ether and di-C1-C4-alkyl glycol ether, for example ethylene glycol mono-C1-C4-alkyl ether, ethylene glycol di-C1-C4-alkyl ether , diethylene glycol mono-C1-C4-alkyl ether, diethylene glycol di-C1-C4-alkyl ether, propylene glycol mono-C1-C4-alkyl ether, propylene glycol di-C1-C4-alkyl ether, dipropylene glycol mono-C1-C4-alkyl ether and dipropylene glycol di-C1-C4-alkyl ether are included preferred.
- Constituent (A) or the at least one organic solvent (A) particularly preferably consists of at least one alcohol, specifically at least one of the alcohols mentioned by way of example, and/or of at least one glycol ether, specifically at least one of the glycol ethers mentioned by way of example.
- At least one alcohol specifically at least one of the alcohols mentioned by way of example
- glycol ether specifically at least one of the glycol ethers mentioned by way of example.
- Corresponding mixtures of 30 to 70 parts by weight of alcohol and the part by weight of glycol ether missing from 100 parts by weight are particularly preferred as component (A).
- the preparations according to the invention contain, as component (B), 10 to 70% by weight of at least one noble metal complex with diolefin and C6-C18 monocarboxylate ligands selected from the group consisting of noble metal complexes of the type [LPd[O(CO)R1] X] n , [LRh[O(CO)R1]] m and [LIr[O(CO)R1]] m , where L is a compound acting as a diolefin ligand, where X is selected from bromide, chloride, iodide and - O (CO)R2, where -O(CO)R1 and -O(CO)R2 are identical or different non-aromatic C6-C18 monocarboxylic acid radicals, each preferably with the exception of a phenylacetic acid radical, and where n is an integer ⁇ 1 and m is an integer number ⁇ 2.
- the noble metal content of a preparation according to the invention originating from the at least one noble metal complex can be, for example, in the range from 2.5 to 25% by weight.
- L is a compound functioning as a diolefin ligand at the central palladium atom;
- X is bromide, chloride, iodide or -O(CO)R2; and -O(CO)R1 and -O(CO)R2 are identical or different non-aromatic C6-C18 monocarboxylic acid residues, each preferably with the exception of a phenylacetic acid residue.
- n is equal to 1 here.
- L is a compound functioning as a diolefin ligand;
- X is bromide, chloride, iodide or -O(CO)R2;
- n is 2, 3, 4 or 5, preferably 2; and
- -O(CO)R1 and -O(CO)R2 are identical or different non-aromatic C6-C18 monocarboxylic acid residues, each preferably with the exception of a phenylacetic acid residue.
- L is a compound functioning as a diolefin ligand; m is 2, 3, 4 or 5, preferably 2; and -O(CO)R1 means one non-aromatic C6-C18 monocarboxylic acid residue, preferably with the exception of a phenylacetic acid residue.
- Said noble metal complexes can be present in the preparations according to the invention in individualized but also in associated form, ie alone or as a mixture of several different species.
- palladium complexes can be present in the preparations according to the invention in individualized or in associated form, ie alone or as a mixture of several different species, each of the [LPd[O(CO)R1]X] n type.
- Rhodium complexes can also be present in the preparations according to the invention in individualized or associated form, ie alone or as a mixture of several different species, each of the [LRh[O(CO)R1]] m type.
- component (B) may be [LPd[O(CO)R1]X] n and/or [LRh[O(CO)R1]] m and/or [LIr[O( CO)R1]] m ;
- component (B) may include compounds of only one, two, or all three types disclosed herein, where each type may be present in only one individual form (individualized) or in more than one individual form (socialized).
- the preparations according to the invention can also comprise platinum compounds of the [LPt[O(CO)R1]X] n type .
- n has the same meaning as in the palladium complexes of the type [LPd[O(CO)R1]X] n .
- platinum compounds are disclosed in PCT application serial number PCT/EP2020/068465 .
- diolefins or compounds of type L capable of functioning as a diolefin ligand examples include hydrocarbons such as COD (1,5-cyclooctadiene), NBD (norbornadiene), COT (cyclooctatetraene) and 1,5-hexadiene, in particular COD and NBD . It is preferably pure hydrocarbons; however, the presence of heteroatoms, for example in the form of functional groups, is also possible.
- X can mean bromide, chloride, iodide or -O(CO)R2, preferably it means chloride or -O(CO)R2, in particular -O(CO)R2.
- non-aromatic monocarboxylic acid residues -O(CO)R1 and -O(CO)R2 mean identical or different non-aromatic C6-C18 monocarboxylic acid residues, in each case preferably with the exception of a phenylacetic acid residue.
- non-aromatic used in this context excludes purely aromatic monocarboxylic acid residues, but not araliphatic monocarboxylic acid residues, the carboxyl function(s) of which is/are attached to aliphatic carbon.
- -O(CO)R1 and -O(CO)R2 preferably do not mean a phenylacetic acid residue.
- -O(CO)R1 and -O(CO)R2 are preferably the same non-aromatic C6-C18 monocarboxylic acid residues, but preferably no phenylacetic acid residues.
- Preferred among the C6-C18 non-aromatic monocarboxylic acid residues are monocarboxylic acid residues having from 8 to 18 carbon atoms, i.e. C8-C18 non-aromatic monocarboxylic acid residues.
- non-aromatic C6-C18 or the preferred C8-C18 monocarboxylic acids with radicals -O(CO)R1 or -O(CO)R2 include the isomeric hexanoic acids including n-hexanoic acid, the isomeric heptanoic acids including n-heptanoic acid, the isomeric octanoic acids including n-octanoic acid and 2-ethylhexanoic acid, the isomeric nonanoic acids including n-nonanoic acid, and the isomeric decanoic acids including n-decanoic acid, to name just a few examples.
- radicals R1 and R2 each bonded to a carboxyl group comprise 5 to 17 and 7 to 17 carbon atoms, respectively; Benzyl radicals are preferably excluded in each case.
- Preferred examples of palladium complexes include [(COD)Pd[O(CO)R1] 2 ] n and [(NBD)Pd[O(CO)R1] 2 ] n where n is 1 or 2, especially 1, and where R1 is a non-aromatic C5-C17 hydrocarbon radical, each preferably with the exception of benzyl.
- rhodium complexes include [(COD)Rh[O(CO)R1]] m and [(NBD)Rh[O(CO)R1]] m where m is 2 and where R1 is non-aromatic C5-C17 -Hydrocarbon radical, in each case preferably with the exception of benzyl.
- iridium complexes include [(COD)Ir[O(CO)R1]] m and [(NBD)Ir[O(CO)R1]] m where m is 2 and where R1 is non-aromatic C5-C17 -Hydrocarbon radical, in each case preferably with the exception of benzyl.
- the noble metal complexes can be prepared in a simple way by ligand exchange, in particular without using carboxylic acid salts of silver.
- the manufacturing process includes mixing or suspending or emulsifying a two-phase system.
- One phase comprises a starting material of the type LPdX 2 or [LRhX] 2 or [LIrX] 2 in each case with X selected from bromide, chloride and iodide, preferably chloride, either as such or preferably in the form of an at least essentially water-immiscible organic solution such an educt.
- Examples of at least essentially water-immiscible organic solvents suitable for producing such an organic solution include aromatics and chlorinated hydrocarbons such as toluene, xylene, dichloromethane, trichloromethane and carbon tetrachloride, as well as oxygen-containing solvents, for example corresponding water-immiscible ketones, esters and ethers.
- the other phase comprises, for example, an aqueous solution of alkali metal salt (particularly sodium or potassium salt) and/or magnesium salt of a C6-C18 monocarboxylic acid of the R1COOH type and optionally also of the R2COOH type.
- the choice of the type of monocarboxylic acid salt or salts depends on the type of noble metal complex to be produced or the group of noble metal complexes to be produced.
- the two phases are thoroughly mixed to form a suspension or emulsion, for example by shaking and/or stirring.
- the mixing is carried out, for example, for a period of 0.5 to 24 hours, for example at a temperature in the range from 20 to 50.degree.
- the ligand exchange takes place, with the noble metal complex or complexes formed dissolving in the organic phase, while the alkali metal salt or MgX 2 salt also formed dissolves in the aqueous phase.
- the organic and aqueous phases are separated from one another.
- the noble metal complex or complexes formed can be obtained from the organic phase and, if appropriate, subsequently purified using customary methods.
- (COD)Pd[O(CO)CH(C 2 H 5 )C 4 H 9 ] 2 can be prepared by co-emulsifying a solution of (COD)PdCl 2 in dichloromethane with an aqueous Solution of sodium 2-ethylhexanoate are prepared. After the end of the emulsification, this can be done by ligand exchange
- the solution containing common salt formed is separated from the dichloromethane phase and the (COD)Pd[O(CO)CH(C 2 H 5 )C 4 H 9 ] 2 is isolated from the latter and, if appropriate, purified by customary purification processes.
- the palladium complex (COD)Pd[O(CO)CH(C 2 H 5 )C 4 H 9 ]Cl can also be prepared analogously, for example with a correspondingly selected stoichiometry.
- an important property in addition to the aforementioned solubility in customary organic solvents, is the comparatively low decomposition temperature of the noble metal complex(es) of component (B), for example from as little as 150.degree. C. to 250.degree. C., often not higher than 200.degree.
- This combination of properties makes it possible to use such noble metal complexes as component (B) of the preparations according to the invention for the production of layers comprising noble metal on substrates;
- the preparation according to the invention represents a coating composition (coating composition), i.e. it is then prepared and usable as a coating composition.
- the preparations according to the invention contain 0 to 10% by weight, preferably 0 to 3% by weight, of at least one additive (C).
- the preparations according to the invention can therefore be additive-free or contain up to 10% by weight of at least one additive.
- additives include wetting additives, rheology additives, defoamers, deaerators, surface tension additives, and odorants.
- Formulations according to the invention can be prepared by simply mixing ingredients (A), (B) and, if desired, (C).
- ingredients (A), (B) and, if desired, (C) The person skilled in the art selects the quantitative ratio of the components adapted to the respective intended use and/or the application method to be used.
- the preparations according to the invention can be used to produce layers comprising noble metal on substrates, in particular also on temperature-sensitive substrates.
- the preparations according to the invention can first be used to produce covering layers (coatings), which can then be subjected to thermal decomposition.
- essentially metallic palladium is formed in the form of a layer during thermal decomposition even in the presence of air as the surrounding atmosphere; during thermal decomposition when working with preparations according to the invention Based on rhodium complexes of the type [LRh[O(CO)R1]] n or based on iridium complexes of the type [LIr[O(CO)R1]] n, on the other hand, when air is present as the ambient atmosphere, essentially corresponding noble metal oxide layers or even of corresponding metallic noble metal free noble metal oxide layers.
- layer comprising precious metal used herein as a layer comprising or consisting essentially or even only of metallic palladium, as a layer comprising or consisting essentially or even only of rhodium oxide or as a layer comprising or consisting essentially or even only of iridium oxide existing layer, briefly stated as a layer comprising or consisting of metallic palladium, rhodium oxide or iridium oxide.
- palladium layers obtainable according to the invention on substrates show the properties to be expected by a person skilled in the art
- layers essentially comprising rhodium oxide or essentially iridium oxide or substrate surfaces equipped therewith which can be obtained according to the invention on substrates can have interesting electrical properties.
- the substrates to be provided with the coating layer in step (1) may be substrates comprising various materials.
- the substrates can only include one or more materials. Examples of materials include, but are not limited to, glass; carbide substrates such as titanium carbide, molybdenum carbide, tungsten carbide, silicon carbide; nitride substrates such as aluminum nitride, titanium nitride, silicon nitride; boride substrates such as titanium boride, zirconium boride; Ceramic substrates, including those based on oxidic ceramics and those customary as catalyst supports in heterogeneous catalysts; semiconductor substrates such as silicon substrates; Metal; Plastic; modified or unmodified polymers of natural origin; carbon substrates; Wood; cardboard and paper.
- the substrates can be provided with the coating layer on inner and/or outer surfaces and/or on inner and/or outer surface portions.
- a first application method is dipping.
- the substrate to be provided with the coating layer or the layer finally to be provided with the precious metal is immersed in and removed from the preparation according to the invention.
- the proportion of the Constituent (A) in dipping ranges from 30 to 90% by weight of the composition of the invention and that of constituent (B) ranges from 10 to 70% by weight.
- a second application method is spray application.
- the substrate to be provided with the coating layer or the layer finally comprising the noble metal is spray-coated with the preparation according to the invention using a conventional spray-coating tool.
- spray coating tools are pneumatic spray guns, airless spray guns, rotary atomizers or the like.
- the proportion of constituent (A) is preferably in the range from 50 to 90% by weight of the preparation according to the invention and that of constituent (B) in the range from 10 to 50% by weight.
- a third application method is printing.
- the substrate to be provided with the coating layer or the final layer comprising the precious metal is printed with the preparation according to the invention.
- a preferred printing method is inkjet printing; the preparation according to the invention represents a coating material in the form of an ink.
- Another preferred printing process is screen printing.
- the proportion of component (A) during printing is preferably in the range from 50 to 90% by weight of the preparation according to the invention and that of component (B) in the range from 10 to 50% by weight.
- a fourth application method is application using an application tool impregnated with the preparation according to the invention, for example a brush, a brush, a felt or a cloth.
- the preparation according to the invention is transferred from the application tool to the substrate to be provided with the coating layer or the layer finally comprising the precious metal.
- the proportion of component (A) is preferably in the range from 30 to 90% by weight of the preparation according to the invention and that of component (B) in the range from 10 to 70% by weight.
- the coating layer comprising at least one component (B) applied from a preparation according to the invention can first be dried and partially or completely freed from the organic solvent (A) before it or the dried residue is subjected to thermal decomposition to form the layer comprising noble metal .
- thermal decomposition taking place thermal treatment includes heating to an object temperature above the decomposition temperature of at least a noble metal complex (B). If several different noble metal complexes (B) are present, the person skilled in the art will choose the object temperature above the decomposition temperature of the noble metal complex of type (B) with the highest decomposition temperature.
- the object is heated briefly to an object temperature above the decomposition temperature, for example for a period of 1 minute to 30 minutes to an object temperature in the range from >150°C to 200°C or from >150 to 250°C or higher, for example up to 1000°C.
- the heating can take place in particular in an oven and/or by infrared radiation.
- an object temperature slightly above the relevant decomposition temperature is chosen.
- heating, more precisely maintaining the object temperature takes no more than 15 minutes.
- Palladium layers obtainable according to the invention are distinguished by a high metallic luster comparable to a mirror, provided that substrates with smooth, not too rough surfaces are used; the palladium layers are homogeneous in the sense of a smooth, non-granular outer surface.
- the thickness of layers comprising noble metal obtainable according to the invention can be for example in the range from 50 nm to 5 ⁇ m and the layers comprising noble metal can have a planar nature with or without desired interruptions within the area or have a desired pattern or design.
- the layers comprising noble metal can even be produced on temperature-sensitive substrates, ie for example on substrates which are not temperature-stable above 200° C.; for example, it may be act temperature-sensitive polymer substrates, such as those based on polyolefin or polyester.
- Example 1 (equipping a polyimide film with a palladium layer):
- Example 2 (equipping a polyimide film with a patterned palladium layer):
- a Kapton ® film was dpi using an inkjet printer with a resolution of 1270 printed in a meander design with the solution from Example. 1
- the film printed in this way was heated to an object temperature of 200° C. in a laboratory oven and held at this temperature for 5 minutes.
- a shiny, electrically conductive layer of palladium had formed on the foil in the form of the meander design with a width of the conductor tracks of 2.5 mm.
- Example 3 (equipping a polyimide film with a palladium layer):
- Example 1 was repeated completely analogously with the only difference that (NBD)PdCl 2 was used instead of (COD)PdCl 2 , so that as a result of the synthesis a yellow residue of (NBD)Pd[O(CO)CH(C 2 H 5 )C 4 H 9 ] 2 and finally one with a palladium layer provided polyimide film corresponding to the coated film obtained in Example 1 was obtained.
- Example 4 (equipping a polyimide film with a patterned palladium layer):
- Example 2 was repeated completely analogously with the only difference that (NBD)PdCl 2 was used instead of (COD)PdCl 2 , so that as a result of the synthesis a yellow residue of (NBD)Pd[O(CO)CH(C 2 H 5 )C 4 H 9 ] 2 and finally a palladium-patterned polyimide film corresponding to the palladium-patterned film obtained in Example 2 was obtained.
- Example 5 (equipping a polyimide film with a rhodium oxide layer):
- Example 6 (equipping a polyimide film with a patterned rhodium oxide layer):
- a Kapton ® film was dpi using an inkjet printer with a resolution of 1270 printed in a meandering design with the solution from Example 5.
- FIG. The film printed in this way was heated to an object temperature of 250° C. in a laboratory oven and held at this temperature for 5 minutes.
- a matt layer of essentially rhodium oxide had formed on the foil in the form of the meander design with a width of the conductor tracks of 2.5 mm.
- Example 7 (equipping a polyimide film with a rhodium oxide layer):
- Example 5 was repeated completely analogously with the only difference that [(NBD)RhCl] 2 was used instead of [(COD)RhCl] 2 , so that as a result of the synthesis a yellow residue of [(NBD)Rh[O(CO )CH(C 2 H 5 )C 4 H 9 ]] m and finally a polyimide film provided with a matt layer of essentially rhodium oxide, which corresponded to the coated film obtained in example 5, was obtained.
- Example 8 (equipping a polyimide film with a patterned rhodium oxide layer):
- Example 6 was repeated completely analogously with the only difference that [(NBD)RhCl] 2 was used instead of [(COD)RhCl] 2 , so that as a result of the synthesis a yellow residue of [(NBD)Rh[O(CO )CH(C 2 H 5 )C 4 H 9 ]] m and finally a substantially rhodium oxide patterned polyimide film corresponding to the substantially rhodium oxide patterned film obtained in Example 6 was obtained.
- Example 9 (equipping a polyimide film with an iridium oxide layer):
- Example 10 (Equipping a polyimide film with a patterned iridium oxide layer):
- a Kapton ® film was dpi using an inkjet printer with a resolution of 1270 printed in a meander design with the solution from Example. 9
- the film printed in this way was heated to an object temperature of 250° C. in a laboratory oven and held at this temperature for 5 minutes.
- On the film had a matte layer of essentially Iridium oxide formed in the shape of the meander design with a 2.5 mm width of the conductor tracks.
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Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP20185479.1A EP3940110A1 (fr) | 2020-07-13 | 2020-07-13 | Préparations de complexes de métaux précieux |
| US18/004,581 US12435425B2 (en) | 2020-07-13 | 2021-04-26 | Preparations of noble metal complexes |
| CN202180042074.XA CN115698378A (zh) | 2020-07-13 | 2021-04-26 | 贵金属络合物的制剂 |
| PCT/EP2021/060795 WO2022012794A1 (fr) | 2020-07-13 | 2021-04-26 | Préparations de complexes de métaux précieux |
| JP2022576209A JP7645289B2 (ja) | 2020-07-13 | 2021-04-26 | 貴金属錯体の調製物 |
| TW110118188A TWI775446B (zh) | 2020-07-13 | 2021-05-20 | 貴金屬錯合物之配製物 |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP20185479.1A EP3940110A1 (fr) | 2020-07-13 | 2020-07-13 | Préparations de complexes de métaux précieux |
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| EP3940110A1 true EP3940110A1 (fr) | 2022-01-19 |
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| EP20185479.1A Pending EP3940110A1 (fr) | 2020-07-13 | 2020-07-13 | Préparations de complexes de métaux précieux |
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| Country | Link |
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| US (1) | US12435425B2 (fr) |
| EP (1) | EP3940110A1 (fr) |
| JP (1) | JP7645289B2 (fr) |
| CN (1) | CN115698378A (fr) |
| TW (1) | TWI775446B (fr) |
| WO (1) | WO2022012794A1 (fr) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102022111991A1 (de) | 2022-05-12 | 2023-11-16 | Heraeus Deutschland GmbH & Co. KG | Nasschemische Edelmetallbeschichtung |
| US12133733B2 (en) | 2020-11-10 | 2024-11-05 | Heraeus Deutschland GmbH & Co. KG | Production method for noble metal electrodes |
| DE102023135112A1 (de) * | 2023-12-14 | 2025-06-18 | Heraeus Medevio GmbH & Co. KG | Flexible Leiterplatte und Verfahren zum Herstellen davon |
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| JP3384228B2 (ja) * | 1996-03-01 | 2003-03-10 | 三菱マテリアル株式会社 | 金属錯体及び金属薄膜形成方法 |
| JP3917037B2 (ja) * | 2002-07-29 | 2007-05-23 | ナミックス株式会社 | 外部電極及びそれを備えた電子部品 |
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| US11319332B2 (en) * | 2017-12-20 | 2022-05-03 | Basf Se | Process for the generation of metal-containing films |
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- 2020-07-13 EP EP20185479.1A patent/EP3940110A1/fr active Pending
-
2021
- 2021-04-26 US US18/004,581 patent/US12435425B2/en active Active
- 2021-04-26 CN CN202180042074.XA patent/CN115698378A/zh active Pending
- 2021-04-26 WO PCT/EP2021/060795 patent/WO2022012794A1/fr not_active Ceased
- 2021-04-26 JP JP2022576209A patent/JP7645289B2/ja active Active
- 2021-05-20 TW TW110118188A patent/TWI775446B/zh active
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| WO2012167198A2 (fr) * | 2011-06-03 | 2012-12-06 | Emory University | Compositions de catalyseur dirhodium et procédés de synthèse s'y rapportant |
| US20130202795A1 (en) * | 2012-02-02 | 2013-08-08 | Xerox Corporation | Composition of palladium unsaturated carboxylate and palladium nanoparticles |
| DE102014222996A1 (de) * | 2014-11-11 | 2016-05-12 | Heraeus Deutschland GmbH & Co. KG | Gold-Zusammensetzung für Dekor mit ausgewählter Metallzusammensetzung sowie Verfahren zur Herstellung derselben |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US12133733B2 (en) | 2020-11-10 | 2024-11-05 | Heraeus Deutschland GmbH & Co. KG | Production method for noble metal electrodes |
| DE102022111991A1 (de) | 2022-05-12 | 2023-11-16 | Heraeus Deutschland GmbH & Co. KG | Nasschemische Edelmetallbeschichtung |
| DE102023135112A1 (de) * | 2023-12-14 | 2025-06-18 | Heraeus Medevio GmbH & Co. KG | Flexible Leiterplatte und Verfahren zum Herstellen davon |
Also Published As
| Publication number | Publication date |
|---|---|
| CN115698378A (zh) | 2023-02-03 |
| US12435425B2 (en) | 2025-10-07 |
| TW202206443A (zh) | 2022-02-16 |
| JP7645289B2 (ja) | 2025-03-13 |
| WO2022012794A1 (fr) | 2022-01-20 |
| TWI775446B (zh) | 2022-08-21 |
| US20230243038A1 (en) | 2023-08-03 |
| JP2023532192A (ja) | 2023-07-27 |
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