EP3956629A4 - MEASUREMENT SYSTEM AND LIGHT DIFFRACTION METHOD - Google Patents
MEASUREMENT SYSTEM AND LIGHT DIFFRACTION METHOD Download PDFInfo
- Publication number
- EP3956629A4 EP3956629A4 EP20791522.4A EP20791522A EP3956629A4 EP 3956629 A4 EP3956629 A4 EP 3956629A4 EP 20791522 A EP20791522 A EP 20791522A EP 3956629 A4 EP3956629 A4 EP 3956629A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- measurement system
- diffraction method
- light diffraction
- light
- measurement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02015—Interferometers characterised by the beam path configuration
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B9/00—Measuring instruments characterised by the use of optical techniques
- G01B9/02—Interferometers
- G01B9/02041—Interferometers characterised by particular imaging or detection techniques
- G01B9/02048—Rough and fine measurement
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
- G01J3/02—Details
- G01J3/0205—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows
- G01J3/0237—Adjustable, e.g. focussing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
- G01M11/0242—Testing optical properties by measuring geometrical properties or aberrations
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/1006—Beam splitting or combining systems for splitting or combining different wavelengths
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
- G02B27/283—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
- G02B27/286—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising for controlling or changing the state of polarisation, e.g. transforming one polarisation state into another
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70605—Workpiece metrology
- G03F7/70616—Monitoring the printed patterns
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
- G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N2021/9511—Optical elements other than lenses, e.g. mirrors
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Geometry (AREA)
- Length Measuring Devices By Optical Means (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962834219P | 2019-04-15 | 2019-04-15 | |
| US16/539,930 US10801890B1 (en) | 2018-12-17 | 2019-08-13 | Measurement system and a method of diffracting light |
| PCT/US2020/026829 WO2020214444A1 (en) | 2019-04-15 | 2020-04-06 | Measurement system and a method of diffracting light |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP3956629A1 EP3956629A1 (en) | 2022-02-23 |
| EP3956629A4 true EP3956629A4 (en) | 2023-01-04 |
Family
ID=72838385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP20791522.4A Pending EP3956629A4 (en) | 2019-04-15 | 2020-04-06 | MEASUREMENT SYSTEM AND LIGHT DIFFRACTION METHOD |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP3956629A4 (en) |
| JP (1) | JP7702880B2 (en) |
| KR (1) | KR102903935B1 (en) |
| CN (2) | CN117387912B (en) |
| TW (2) | TWI900398B (en) |
| WO (1) | WO2020214444A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7786946B2 (en) * | 2018-11-07 | 2025-12-16 | アプライド マテリアルズ インコーポレイテッド | Method and apparatus for guided wave measurements |
| KR20240035921A (en) * | 2021-08-13 | 2024-03-18 | 어플라이드 머티어리얼스, 인코포레이티드 | Full-field metrology tool for waveguide couplers and metasurfaces |
| KR102742601B1 (en) * | 2022-04-08 | 2024-12-16 | 한양대학교 산학협력단 | Method of geometric phase prism array and method of manufacturing the same |
| CN116718346A (en) * | 2023-06-05 | 2023-09-08 | 中光学(上海)科技有限公司 | A rapid detection device for grating optical waveguide and its detection method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003035521A (en) * | 2001-07-23 | 2003-02-07 | Mitsutoyo Corp | Device and method for measuring grid cycle |
| US20130301042A1 (en) * | 2010-12-27 | 2013-11-14 | Hitachi High-Technologies Corporation | Defect inspection method and defect inspection apparatus |
| US9068917B1 (en) * | 2006-03-14 | 2015-06-30 | Kla-Tencor Technologies Corp. | Systems and methods for inspection of a specimen |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6313918B1 (en) * | 1998-09-18 | 2001-11-06 | Zygo Corporation | Single-pass and multi-pass interferometery systems having a dynamic beam-steering assembly for measuring distance, angle, and dispersion |
| TW440682B (en) * | 2000-03-17 | 2001-06-16 | Cheng Jou | Phase difference measuring apparatus and heterodyne interference measuring system using this apparatus |
| TW445369B (en) * | 2000-04-18 | 2001-07-11 | Cheng Jou | Heterodyne interferometer phase measurement system |
| US6487019B2 (en) * | 2000-03-27 | 2002-11-26 | Chromaplex, Inc. | Optical diffraction grating structure with reduced polarization sensitivity |
| US6577786B1 (en) * | 2000-06-02 | 2003-06-10 | Digital Lightwave, Inc. | Device and method for optical performance monitoring in an optical communications network |
| JP4810053B2 (en) * | 2000-08-10 | 2011-11-09 | ケーエルエー−テンカー・コーポレーション | Multiple beam inspection apparatus and method |
| US6809809B2 (en) * | 2000-11-15 | 2004-10-26 | Real Time Metrology, Inc. | Optical method and apparatus for inspecting large area planar objects |
| CN1253699C (en) * | 2002-03-18 | 2006-04-26 | 株式会社三丰 | Optical displacement sensing apparatus with low sensibility to bias |
| US20040263959A1 (en) * | 2003-06-30 | 2004-12-30 | Dixon Arthur E. | Scanning beam optical imaging system for macroscopic imaging of an object |
| JP4458513B2 (en) | 2003-08-18 | 2010-04-28 | 株式会社リガク | Equipment for evaluating specific polymer crystals |
| WO2006078471A2 (en) * | 2005-01-07 | 2006-07-27 | Filmetrics, Inc. | Determining wafer orientation in spectral imaging |
| JP5032396B2 (en) * | 2008-05-20 | 2012-09-26 | 信越化学工業株式会社 | Standard substrate for thin film defect inspection, its manufacturing method, and thin film defect inspection method |
| JP5331586B2 (en) | 2009-06-18 | 2013-10-30 | 株式会社日立ハイテクノロジーズ | Defect inspection apparatus and inspection method |
| JP2011242292A (en) | 2010-05-19 | 2011-12-01 | Katsura Opto Systems Co Ltd | Thickness tilt sensor |
| US8629407B2 (en) * | 2011-04-13 | 2014-01-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | Contamination inspection |
| US9404872B1 (en) * | 2011-06-29 | 2016-08-02 | Kla-Tencor Corporation | Selectably configurable multiple mode spectroscopic ellipsometry |
| JP2014215059A (en) | 2013-04-23 | 2014-11-17 | 株式会社ニコン | Evaluation device, evaluation method, and semiconductor device |
| JP6271278B2 (en) | 2014-02-13 | 2018-01-31 | 株式会社ミツトヨ | Position measuring apparatus and position measuring method |
| CN103940796A (en) * | 2014-04-22 | 2014-07-23 | 浙江大学 | Novel multi-angle and multi-mode quick switching circular optical illumination microscopic imaging system |
| CN104280215B (en) * | 2014-10-11 | 2017-02-15 | 哈尔滨工程大学 | Dual-channel optical performance bi-directional multi-alignment-angle automatic testing device for Y waveguide |
| FR3029633B1 (en) * | 2014-12-09 | 2025-05-16 | Bioaxial | OPTICAL MEASURING METHOD AND DEVICE |
| US9612212B1 (en) * | 2015-11-30 | 2017-04-04 | Samsung Electronics Co., Ltd. | Ellipsometer and method of inspecting pattern asymmetry using the same |
| JP6732543B2 (en) | 2016-06-02 | 2020-07-29 | Dmg森精機株式会社 | Displacement detection device |
| CN109186945A (en) * | 2018-09-12 | 2019-01-11 | 武汉理工大学 | The measuring device and method of heavy-caliber optical grating diffraction efficiency spectrum and its uniformity |
-
2020
- 2020-04-06 JP JP2021560248A patent/JP7702880B2/en active Active
- 2020-04-06 CN CN202311318201.1A patent/CN117387912B/en active Active
- 2020-04-06 KR KR1020217036259A patent/KR102903935B1/en active Active
- 2020-04-06 WO PCT/US2020/026829 patent/WO2020214444A1/en not_active Ceased
- 2020-04-06 CN CN202080027552.5A patent/CN113677952A/en active Pending
- 2020-04-06 EP EP20791522.4A patent/EP3956629A4/en active Pending
- 2020-04-14 TW TW114101974A patent/TWI900398B/en active
- 2020-04-14 TW TW109112439A patent/TWI882997B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003035521A (en) * | 2001-07-23 | 2003-02-07 | Mitsutoyo Corp | Device and method for measuring grid cycle |
| US9068917B1 (en) * | 2006-03-14 | 2015-06-30 | Kla-Tencor Technologies Corp. | Systems and methods for inspection of a specimen |
| US20130301042A1 (en) * | 2010-12-27 | 2013-11-14 | Hitachi High-Technologies Corporation | Defect inspection method and defect inspection apparatus |
Non-Patent Citations (1)
| Title |
|---|
| See also references of WO2020214444A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202519826A (en) | 2025-05-16 |
| TWI900398B (en) | 2025-10-01 |
| CN117387912B (en) | 2025-02-28 |
| JP7702880B2 (en) | 2025-07-04 |
| KR20210140774A (en) | 2021-11-23 |
| JP2022529608A (en) | 2022-06-23 |
| TWI882997B (en) | 2025-05-11 |
| CN117387912A (en) | 2024-01-12 |
| TW202045893A (en) | 2020-12-16 |
| KR102903935B1 (en) | 2025-12-23 |
| WO2020214444A1 (en) | 2020-10-22 |
| EP3956629A1 (en) | 2022-02-23 |
| CN113677952A (en) | 2021-11-19 |
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Legal Events
| Date | Code | Title | Description |
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| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
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| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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| STAA | Information on the status of an ep patent application or granted ep patent |
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| 17P | Request for examination filed |
Effective date: 20210918 |
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| DAV | Request for validation of the european patent (deleted) | ||
| DAX | Request for extension of the european patent (deleted) | ||
| REG | Reference to a national code |
Ref country code: DE Ref legal event code: R079 Free format text: PREVIOUS MAIN CLASS: G01B0009020000 Ipc: G01B0011020000 |
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| A4 | Supplementary search report drawn up and despatched |
Effective date: 20221205 |
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| RIC1 | Information provided on ipc code assigned before grant |
Ipc: G01J 3/02 20060101ALI20221129BHEP Ipc: G03F 7/20 20060101ALI20221129BHEP Ipc: G02B 27/28 20060101ALI20221129BHEP Ipc: G02B 27/10 20060101ALI20221129BHEP Ipc: G01N 21/95 20060101ALI20221129BHEP Ipc: G01M 11/00 20060101ALI20221129BHEP Ipc: G01B 11/02 20060101AFI20221129BHEP |
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| STAA | Information on the status of an ep patent application or granted ep patent |
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| 17Q | First examination report despatched |
Effective date: 20240522 |