EP3956629A4 - Messsystem und verfahren zur beugung von licht - Google Patents

Messsystem und verfahren zur beugung von licht Download PDF

Info

Publication number
EP3956629A4
EP3956629A4 EP20791522.4A EP20791522A EP3956629A4 EP 3956629 A4 EP3956629 A4 EP 3956629A4 EP 20791522 A EP20791522 A EP 20791522A EP 3956629 A4 EP3956629 A4 EP 3956629A4
Authority
EP
European Patent Office
Prior art keywords
measurement system
diffraction method
light diffraction
light
measurement
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP20791522.4A
Other languages
English (en)
French (fr)
Other versions
EP3956629A1 (de
Inventor
Jinxin FU
Yifei Wang
Ian Matthew Mcmackin
Rutger MEYER TIMMERMAN THIJSSEN
Ludovic Godet
Joseph C. Olson
Morgan Evans
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Applied Materials Inc
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US16/539,930 external-priority patent/US10801890B1/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of EP3956629A1 publication Critical patent/EP3956629A1/de
Publication of EP3956629A4 publication Critical patent/EP3956629A4/de
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/02—Testing optical properties
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02015—Interferometers characterised by the beam path configuration
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B9/00—Measuring instruments characterised by the use of optical techniques
    • G01B9/02—Interferometers
    • G01B9/02041—Interferometers characterised by particular imaging or detection techniques
    • G01B9/02048—Rough and fine measurement
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J3/00—Spectrometry; Spectrophotometry; Monochromators; Measuring colours
    • G01J3/02—Details
    • G01J3/0205—Optical elements not provided otherwise, e.g. optical manifolds, diffusers, windows
    • G01J3/0237—Adjustable, e.g. focussing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
    • G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
    • G01M11/02—Testing optical properties
    • G01M11/0242—Testing optical properties by measuring geometrical properties or aberrations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/10—Beam splitting or combining systems
    • G02B27/1006—Beam splitting or combining systems for splitting or combining different wavelengths
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/283—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising used for beam splitting or combining
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
    • G02B27/28—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising
    • G02B27/286—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00 for polarising for controlling or changing the state of polarisation, e.g. transforming one polarisation state into another
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
    • G02B7/04—Mountings, adjusting means, or light-tight connections, for optical elements for lenses with mechanism for focusing or varying magnification
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B2210/00—Aspects not specifically covered by any group under G01B, e.g. of wheel alignment, caliper-like sensors
    • G01B2210/56—Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N2021/9511—Optical elements other than lenses, e.g. mirrors

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Geometry (AREA)
  • Length Measuring Devices By Optical Means (AREA)
EP20791522.4A 2019-04-15 2020-04-06 Messsystem und verfahren zur beugung von licht Pending EP3956629A4 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962834219P 2019-04-15 2019-04-15
US16/539,930 US10801890B1 (en) 2018-12-17 2019-08-13 Measurement system and a method of diffracting light
PCT/US2020/026829 WO2020214444A1 (en) 2019-04-15 2020-04-06 Measurement system and a method of diffracting light

Publications (2)

Publication Number Publication Date
EP3956629A1 EP3956629A1 (de) 2022-02-23
EP3956629A4 true EP3956629A4 (de) 2023-01-04

Family

ID=72838385

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20791522.4A Pending EP3956629A4 (de) 2019-04-15 2020-04-06 Messsystem und verfahren zur beugung von licht

Country Status (6)

Country Link
EP (1) EP3956629A4 (de)
JP (1) JP7702880B2 (de)
KR (1) KR102903935B1 (de)
CN (2) CN117387912B (de)
TW (2) TWI900398B (de)
WO (1) WO2020214444A1 (de)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7786946B2 (ja) * 2018-11-07 2025-12-16 アプライド マテリアルズ インコーポレイテッド 導波計測のための方法及び装置
KR20240035921A (ko) * 2021-08-13 2024-03-18 어플라이드 머티어리얼스, 인코포레이티드 도파관 결합기들 및 메타표면들을 위한 풀-필드 계측 툴
KR102742601B1 (ko) * 2022-04-08 2024-12-16 한양대학교 산학협력단 기하학적 위상 프리즘 어레이 및 이의 제작 방법
CN116718346A (zh) * 2023-06-05 2023-09-08 中光学(上海)科技有限公司 一种用于光栅光波导的快速检测装置及其检测方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003035521A (ja) * 2001-07-23 2003-02-07 Mitsutoyo Corp 格子周期計測装置及び格子周期計測方法
US20130301042A1 (en) * 2010-12-27 2013-11-14 Hitachi High-Technologies Corporation Defect inspection method and defect inspection apparatus
US9068917B1 (en) * 2006-03-14 2015-06-30 Kla-Tencor Technologies Corp. Systems and methods for inspection of a specimen

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6313918B1 (en) * 1998-09-18 2001-11-06 Zygo Corporation Single-pass and multi-pass interferometery systems having a dynamic beam-steering assembly for measuring distance, angle, and dispersion
TW440682B (en) * 2000-03-17 2001-06-16 Cheng Jou Phase difference measuring apparatus and heterodyne interference measuring system using this apparatus
TW445369B (en) * 2000-04-18 2001-07-11 Cheng Jou Heterodyne interferometer phase measurement system
US6487019B2 (en) * 2000-03-27 2002-11-26 Chromaplex, Inc. Optical diffraction grating structure with reduced polarization sensitivity
US6577786B1 (en) * 2000-06-02 2003-06-10 Digital Lightwave, Inc. Device and method for optical performance monitoring in an optical communications network
JP4810053B2 (ja) * 2000-08-10 2011-11-09 ケーエルエー−テンカー・コーポレーション 複数ビーム検査装置および方法
US6809809B2 (en) * 2000-11-15 2004-10-26 Real Time Metrology, Inc. Optical method and apparatus for inspecting large area planar objects
CN1253699C (zh) * 2002-03-18 2006-04-26 株式会社三丰 对偏移具有低灵敏度的光学位移传感装置
US20040263959A1 (en) * 2003-06-30 2004-12-30 Dixon Arthur E. Scanning beam optical imaging system for macroscopic imaging of an object
JP4458513B2 (ja) 2003-08-18 2010-04-28 株式会社リガク 特定高分子結晶の評価装置
WO2006078471A2 (en) * 2005-01-07 2006-07-27 Filmetrics, Inc. Determining wafer orientation in spectral imaging
JP5032396B2 (ja) * 2008-05-20 2012-09-26 信越化学工業株式会社 薄膜欠陥検査用標準基板、その製造方法、および薄膜欠陥検査方法
JP5331586B2 (ja) 2009-06-18 2013-10-30 株式会社日立ハイテクノロジーズ 欠陥検査装置および検査方法
JP2011242292A (ja) 2010-05-19 2011-12-01 Katsura Opto Systems Co Ltd 厚さチルトセンサ
US8629407B2 (en) * 2011-04-13 2014-01-14 Taiwan Semiconductor Manufacturing Company, Ltd. Contamination inspection
US9404872B1 (en) * 2011-06-29 2016-08-02 Kla-Tencor Corporation Selectably configurable multiple mode spectroscopic ellipsometry
JP2014215059A (ja) 2013-04-23 2014-11-17 株式会社ニコン 評価装置、評価方法、および半導体装置
JP6271278B2 (ja) 2014-02-13 2018-01-31 株式会社ミツトヨ 位置計測装置および位置計測方法
CN103940796A (zh) * 2014-04-22 2014-07-23 浙江大学 新型多角度多模式快速切换环状光学照明显微成像系统
CN104280215B (zh) * 2014-10-11 2017-02-15 哈尔滨工程大学 一种y波导的双通道光学性能双向多对轴角度自动测试装置
FR3029633B1 (fr) * 2014-12-09 2025-05-16 Bioaxial Procede et dispositif de mesure optique
US9612212B1 (en) * 2015-11-30 2017-04-04 Samsung Electronics Co., Ltd. Ellipsometer and method of inspecting pattern asymmetry using the same
JP6732543B2 (ja) 2016-06-02 2020-07-29 Dmg森精機株式会社 変位検出装置
CN109186945A (zh) * 2018-09-12 2019-01-11 武汉理工大学 大口径光栅衍射效率光谱及其均匀性的测量装置和方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003035521A (ja) * 2001-07-23 2003-02-07 Mitsutoyo Corp 格子周期計測装置及び格子周期計測方法
US9068917B1 (en) * 2006-03-14 2015-06-30 Kla-Tencor Technologies Corp. Systems and methods for inspection of a specimen
US20130301042A1 (en) * 2010-12-27 2013-11-14 Hitachi High-Technologies Corporation Defect inspection method and defect inspection apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2020214444A1 *

Also Published As

Publication number Publication date
TW202519826A (zh) 2025-05-16
TWI900398B (zh) 2025-10-01
CN117387912B (zh) 2025-02-28
JP7702880B2 (ja) 2025-07-04
KR20210140774A (ko) 2021-11-23
JP2022529608A (ja) 2022-06-23
TWI882997B (zh) 2025-05-11
CN117387912A (zh) 2024-01-12
TW202045893A (zh) 2020-12-16
KR102903935B1 (ko) 2025-12-23
WO2020214444A1 (en) 2020-10-22
EP3956629A1 (de) 2022-02-23
CN113677952A (zh) 2021-11-19

Similar Documents

Publication Publication Date Title
EP3754295A4 (de) System zum dreidimensionalen messen und verfahren zum dreidimensionalen messen
EP3524954A4 (de) System zur präzisionsmessung einer struktur und verfahren dafür
EP3792660A4 (de) Verfahren, vorrichtung und system zur messung der entfernung
EP4075849A4 (de) Verfahren und vorrichtung zur strahlmessung
EP4357741A4 (de) Verfahren und system zur messung der spektralen reflektivität
EP3445230A4 (de) Verfahren und system zur messung der transpiration
EP3678530A4 (de) Verfahren und system zur messung der binokularen ausrichtung
EP3741042A4 (de) System und verfahren zur messung von periodischen strahlfehlern
EP3650874A4 (de) System zur transformatorsimulation und verfahren zur messung einer einstellwertsimulation
EP3698116C0 (de) System und verfahren zur bestimmung der integrität von behältern durch optische messung
EP3534109A4 (de) Verfahren und system zur tiefenmessung
EP3400660A4 (de) System und verfahren zur erzeugung eines verschleierten optischen signals
EP4044720A4 (de) Testverfahren, -vorrichtung und -system
EP3948228A4 (de) Spektroskopiesystem und verfahren zur durchführung von spektroskopie
EP3956629A4 (de) Messsystem und verfahren zur beugung von licht
EP3663711A4 (de) Abstandsmessverfahren und abstandsmesssystem
EP3798603A4 (de) System zur messung des bremsstaubes und verfahren zur messung des bremsstaubes
EP4063844A4 (de) System und verfahren zur messung von metalleigenschaften
EP3384265A4 (de) Verfahren und system zur messung der verformung einer oberfläche
EP4083647A4 (de) Messvorrichtung und messverfahren
EP4269938A4 (de) Optisches messsystem und optisches messverfahren
EP3938758A4 (de) Messsystem
EP4067861A4 (de) Dreidimensionales härteverteilungsmessverfahren und dreidimensionales härteverteilungsmesssystem
EP3561468A4 (de) Stressmessverfahren, stressmessvorrichtung und stressmesssystem
EP4053345A4 (de) Arbeitsmaschine, messverfahren und system

Legal Events

Date Code Title Description
STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE

PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE

17P Request for examination filed

Effective date: 20210918

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR

DAV Request for validation of the european patent (deleted)
DAX Request for extension of the european patent (deleted)
REG Reference to a national code

Ref country code: DE

Ref legal event code: R079

Free format text: PREVIOUS MAIN CLASS: G01B0009020000

Ipc: G01B0011020000

A4 Supplementary search report drawn up and despatched

Effective date: 20221205

RIC1 Information provided on ipc code assigned before grant

Ipc: G01J 3/02 20060101ALI20221129BHEP

Ipc: G03F 7/20 20060101ALI20221129BHEP

Ipc: G02B 27/28 20060101ALI20221129BHEP

Ipc: G02B 27/10 20060101ALI20221129BHEP

Ipc: G01N 21/95 20060101ALI20221129BHEP

Ipc: G01M 11/00 20060101ALI20221129BHEP

Ipc: G01B 11/02 20060101AFI20221129BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: EXAMINATION IS IN PROGRESS

17Q First examination report despatched

Effective date: 20240522