EP3977492A4 - Module à composant magnétique monté en surface - Google Patents
Module à composant magnétique monté en surface Download PDFInfo
- Publication number
- EP3977492A4 EP3977492A4 EP20836917.3A EP20836917A EP3977492A4 EP 3977492 A4 EP3977492 A4 EP 3977492A4 EP 20836917 A EP20836917 A EP 20836917A EP 3977492 A4 EP3977492 A4 EP 3977492A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- magnetic component
- surface mounted
- component module
- mounted magnetic
- module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/06—Fixed inductances of the signal type with magnetic core with core substantially closed in itself, e.g. toroid
- H01F17/062—Toroidal core with turns of coil around it
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/022—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/26—Fastening parts of the core together; Fastening or mounting the core on casing or support
- H01F27/266—Fastening or mounting the core on casing or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2895—Windings disposed upon ring cores
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2814—Printed windings with only part of the coil or of the winding in the printed circuit board, e.g. the remaining coil or winding sections can be made of wires or sheets
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Coils Or Transformers For Communication (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201962871847P | 2019-07-09 | 2019-07-09 | |
| PCT/US2020/041351 WO2021007404A1 (fr) | 2019-07-09 | 2020-07-09 | Module à composant magnétique monté en surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP3977492A1 EP3977492A1 (fr) | 2022-04-06 |
| EP3977492A4 true EP3977492A4 (fr) | 2022-08-10 |
Family
ID=74114991
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP20836917.3A Pending EP3977492A4 (fr) | 2019-07-09 | 2020-07-09 | Module à composant magnétique monté en surface |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP3977492A4 (fr) |
| CN (1) | CN114097049B (fr) |
| WO (1) | WO2021007404A1 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20250182948A1 (en) * | 2023-11-30 | 2025-06-05 | Allegro Microsystems, Llc | Leadless transformer packages |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4524342A (en) * | 1981-12-28 | 1985-06-18 | Allied Corporation | Toroidal core electromagnetic device |
| US20070290783A1 (en) * | 2004-12-07 | 2007-12-20 | Multi-Fineline Electronix, Inc. | Miniature circuitry and inductive components and methods for manufacturing same |
| WO2011149523A1 (fr) * | 2010-05-26 | 2011-12-01 | Tyco Electronics Corporation | Dispositifs inducteurs planaires |
| US20110291785A1 (en) * | 2010-05-27 | 2011-12-01 | Advanced Semiconductor Engineering, Inc. | Power inductor structure |
| US20140085033A1 (en) * | 2012-12-03 | 2014-03-27 | Shanghai Zhuo Kai Electronic Technology Co., Ltd | Planar magnetic component and method for manufacturing the same |
| WO2016100988A1 (fr) * | 2014-12-19 | 2016-06-23 | Texas Instruments Incorporated | Ensemble bobine incorporée et son procédé de fabrication |
| WO2016100987A1 (fr) * | 2014-12-19 | 2016-06-23 | Texas Instruments Incorporated | Ensemble bobine intégrée et son procédé de production |
| US20170222563A1 (en) * | 2014-11-12 | 2017-08-03 | Murata Manufacturing Co., Ltd. | Power supply module and mounting structure therefor |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH097844A (ja) * | 1995-06-15 | 1997-01-10 | Murata Mfg Co Ltd | 複合部品及びそれを用いたdc−dc変換器 |
| JP4030028B2 (ja) * | 1996-12-26 | 2008-01-09 | シチズン電子株式会社 | Smd型回路装置及びその製造方法 |
| JP4910826B2 (ja) * | 2007-03-28 | 2012-04-04 | Fdk株式会社 | 巻線部品 |
| US7868431B2 (en) * | 2007-11-23 | 2011-01-11 | Alpha And Omega Semiconductor Incorporated | Compact power semiconductor package and method with stacked inductor and integrated circuit die |
| CN101587769A (zh) * | 2008-05-21 | 2009-11-25 | 台达电子工业股份有限公司 | 磁性元件 |
| US7982572B2 (en) * | 2008-07-17 | 2011-07-19 | Pulse Engineering, Inc. | Substrate inductive devices and methods |
| CN101814485B (zh) * | 2009-02-23 | 2012-08-22 | 万国半导体股份有限公司 | 具堆栈式电感和ic芯片的小型功率半导体封装及方法 |
| CN103367331B (zh) * | 2012-03-27 | 2016-12-14 | 南亚科技股份有限公司 | 封装结构 |
| DE102012216101B4 (de) * | 2012-09-12 | 2016-03-24 | Festo Ag & Co. Kg | Verfahren zum Herstellen einer in einem Substrat integrierten Spule, Verfahren zur Herstellung einer mehrschichtigen Leiterplatte und elektronisches Gerät |
| CN103021889A (zh) * | 2012-12-17 | 2013-04-03 | 北京工业大学 | 一种再布线aaqfn封装器件的制造方法 |
| CN203536199U (zh) * | 2013-09-26 | 2014-04-09 | 特通科技有限公司 | 打金线式的变压器结构 |
| CN103915235A (zh) * | 2014-03-21 | 2014-07-09 | 华为技术有限公司 | 一种平面磁性元件及其制作方法 |
| CN208570297U (zh) * | 2018-04-29 | 2019-03-01 | 深南电路股份有限公司 | 变压器和电磁器件 |
-
2020
- 2020-07-09 CN CN202080049986.5A patent/CN114097049B/zh active Active
- 2020-07-09 EP EP20836917.3A patent/EP3977492A4/fr active Pending
- 2020-07-09 WO PCT/US2020/041351 patent/WO2021007404A1/fr not_active Ceased
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4524342A (en) * | 1981-12-28 | 1985-06-18 | Allied Corporation | Toroidal core electromagnetic device |
| US20070290783A1 (en) * | 2004-12-07 | 2007-12-20 | Multi-Fineline Electronix, Inc. | Miniature circuitry and inductive components and methods for manufacturing same |
| WO2011149523A1 (fr) * | 2010-05-26 | 2011-12-01 | Tyco Electronics Corporation | Dispositifs inducteurs planaires |
| US20110291785A1 (en) * | 2010-05-27 | 2011-12-01 | Advanced Semiconductor Engineering, Inc. | Power inductor structure |
| US20140085033A1 (en) * | 2012-12-03 | 2014-03-27 | Shanghai Zhuo Kai Electronic Technology Co., Ltd | Planar magnetic component and method for manufacturing the same |
| US20170222563A1 (en) * | 2014-11-12 | 2017-08-03 | Murata Manufacturing Co., Ltd. | Power supply module and mounting structure therefor |
| WO2016100988A1 (fr) * | 2014-12-19 | 2016-06-23 | Texas Instruments Incorporated | Ensemble bobine incorporée et son procédé de fabrication |
| WO2016100987A1 (fr) * | 2014-12-19 | 2016-06-23 | Texas Instruments Incorporated | Ensemble bobine intégrée et son procédé de production |
Non-Patent Citations (1)
| Title |
|---|
| See also references of WO2021007404A1 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114097049B (zh) | 2025-04-22 |
| WO2021007404A1 (fr) | 2021-01-14 |
| CN114097049A (zh) | 2022-02-25 |
| EP3977492A1 (fr) | 2022-04-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
|
| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE |
|
| 17P | Request for examination filed |
Effective date: 20211231 |
|
| AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
| A4 | Supplementary search report drawn up and despatched |
Effective date: 20220707 |
|
| RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01F 27/06 20060101ALI20220701BHEP Ipc: H01F 27/02 20060101ALI20220701BHEP Ipc: H01F 27/28 20060101ALI20220701BHEP Ipc: H01F 17/06 20060101ALI20220701BHEP Ipc: H01F 27/26 20060101AFI20220701BHEP |
|
| DAV | Request for validation of the european patent (deleted) | ||
| DAX | Request for extension of the european patent (deleted) | ||
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: EXAMINATION IS IN PROGRESS |
|
| 17Q | First examination report despatched |
Effective date: 20250303 |