EP3981836A4 - Composition de résine thermoconductrice et feuille thermoconductrice l'utilisant - Google Patents

Composition de résine thermoconductrice et feuille thermoconductrice l'utilisant Download PDF

Info

Publication number: EP3981836A4
Authority: EP; European Patent Office
Prior art keywords: thermoconductive; same; resin composition; sheet; thermoconductive resin
Prior art date: 2020-06-26
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP21829487.4A

Other languages

German (de)

English (en)

Other versions

EP3981836A1 (fr

EP3981836B1 (fr

Inventor

Masayuki Matsushima

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Dexerials Corp

Original Assignee

Dexerials Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2020-06-26

Filing date

2021-05-24

Publication date

2022-11-23

2021-05-24 Application filed by Dexerials Corp filed Critical Dexerials Corp

2022-04-13 Publication of EP3981836A1 publication Critical patent/EP3981836A1/fr

2022-11-23 Publication of EP3981836A4 publication Critical patent/EP3981836A4/fr

2023-07-12 Application granted granted Critical

2023-07-12 Publication of EP3981836B1 publication Critical patent/EP3981836B1/fr

Status Active legal-status Critical Current

2041-05-24 Anticipated expiration legal-status Critical

Links

Classifications

- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/29—Compounds containing one or more carbon-to-nitrogen double bonds
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/251—Organics
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/02—Organic and inorganic ingredients
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
- C08K7/18—Solid spheres inorganic
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
- C08J2383/07—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2217—Oxides; Hydroxides of metals of magnesium
- C08K2003/222—Magnesia, i.e. magnesium oxide
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives

Landscapes

Chemical & Material Sciences (AREA)
Chemical Kinetics & Catalysis (AREA)
Organic Chemistry (AREA)
Medicinal Chemistry (AREA)
Polymers & Plastics (AREA)
Health & Medical Sciences (AREA)
Engineering & Computer Science (AREA)
Manufacturing & Machinery (AREA)
Materials Engineering (AREA)
Physics & Mathematics (AREA)
Thermal Sciences (AREA)
Combustion & Propulsion (AREA)
Microelectronics & Electronic Packaging (AREA)
Compositions Of Macromolecular Compounds (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

EP21829487.4A 2020-06-26 2021-05-24 Composition de résine thermoconductrice et feuille thermoconductrice l'utilisant Active EP3981836B1 (fr)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2020110874A JP6997834B1 (ja)	2020-06-26	2020-06-26	熱伝導性樹脂組成物及びこれを用いた熱伝導性シート
PCT/JP2021/019617 WO2021261147A1 (fr)	2020-06-26	2021-05-24	Composition de résine thermoconductrice et feuille thermoconductrice l'utilisant

Publications (3)

Publication Number	Publication Date
EP3981836A1 EP3981836A1 (fr)	2022-04-13
EP3981836A4 true EP3981836A4 (fr)	2022-11-23
EP3981836B1 EP3981836B1 (fr)	2023-07-12

Family

ID=79282536

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP21829487.4A Active EP3981836B1 (fr)	2020-06-26	2021-05-24	Composition de résine thermoconductrice et feuille thermoconductrice l'utilisant

Country Status (7)

Country	Link
US (1)	US11692118B2 (fr)
EP (1)	EP3981836B1 (fr)
JP (1)	JP6997834B1 (fr)
KR (1)	KR102595409B1 (fr)
CN (1)	CN114127196B (fr)
TW (1)	TWI891826B (fr)
WO (1)	WO2021261147A1 (fr)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPWO2023120514A1 (fr) *	2021-12-20	2023-06-29
JP2023104751A (ja) *	2022-01-18	2023-07-28	デクセリアルズ株式会社	熱伝導性樹脂組成物およびこれを用いた熱伝導性シート
CN119137215A (zh) *	2022-02-28	2024-12-13	信越化学工业株式会社	导热性有机硅组合物
CN114573990B (zh) *	2022-03-11	2022-11-01	重庆大学	一种硬度、粘性可调节的聚硅氧烷及其制备方法
KR102732553B1 (ko) *	2022-11-21	2024-11-21	주식회사 에이엠텍	전기자동차 배터리용 방열패드 조성물 및 이를 이용한 방열패드
CN119751881B (zh) *	2024-12-16	2025-11-04	广州白云科技股份有限公司	改性基料、隔热型室温硫化硅橡胶及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20200140736A1 (en) *	2017-05-31	2020-05-07	Momentive Performance Materials Japan Llc	Thermally conductive polysiloxane composition

Family Cites Families (26)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4223103A (en)	1979-02-26	1980-09-16	The Firestone Tire & Rubber Company	Polyphosphazene polymers containing substituents derived from thienyl alcohols
JPS608706U (ja)	1983-06-25	1985-01-22	株式会社　エイ・シイ・デイ	コンクリ−ト製コンクリ−ト用型枠およびその製作
JPS6194861U (fr)	1984-11-27	1986-06-18
DE19515947A1 (de) *	1995-05-02	1996-11-07	Huels Silicone Gmbh	Lagerstabile, alkoxyvernetzende RTV1-Systeme
JP3528969B2 (ja) *	1996-12-20	2004-05-24	株式会社スリーボンド	オルガノポリシロキサン組成物
JP3290127B2 (ja)	1998-01-27	2002-06-10	松下電工株式会社	熱伝導性シリコーンゴム組成物及びこの熱伝導性シリコーンゴム組成物によりなる放熱シート
DE19808117A1 (de) *	1998-02-26	1999-09-09	Wacker Chemie Gmbh	RTV-2 Siliconschäume mit niedrigem Druckverformungsrest
JP2004204146A (ja)	2002-12-26	2004-07-22	Henkel Loctite Corp	シリコーン樹脂組成物
JP2005029643A (ja)	2003-07-09	2005-02-03	Henkel Corp	シリコーンシール剤を用いた接着方法
JP2009120732A (ja) *	2007-11-15	2009-06-04	Sekisui Chem Co Ltd	光半導体用樹脂組成物、光半導体素子用封止剤、光半導体素子用ダイボンド材、光半導体素子用アンダーフィル材及びそれらを用いた光半導体素子
JP2010001358A (ja) *	2008-06-19	2010-01-07	Shin-Etsu Chemical Co Ltd	付加硬化型シリコーン組成物、その硬化物及び該組成物からなる光学素子封止材
EP2374833B1 (fr)	2008-12-15	2017-12-06	Teijin Limited	Procede d'utilisation d'un carbodiimide cyclique
JP5767916B2 (ja)	2011-09-06	2015-08-26	日清紡ホールディングス株式会社	電気絶縁性樹脂組成物および金属基板
JP6008706B2 (ja)	2012-11-16	2016-10-19	アイカ工業株式会社	熱伝導性組成物
EP3004229B1 (fr) *	2013-06-04	2019-09-04	SABIC Global Technologies B.V.	Compositions polymères ignifuges thermoconductrices à base de polycarbonate
CN103665850A (zh)	2013-12-07	2014-03-26	天津市华鑫达投资有限公司	一种导热绝缘树脂组合物
JP6194861B2 (ja)	2014-07-28	2017-09-13	信越化学工業株式会社	熱伝導性シリコーン組成物及び熱伝導性シリコーン成型物
US20180179383A1 (en)	2015-07-01	2018-06-28	Showa Denko K. K.	Thermosetting silicone resin composition containing boron nitride, dispersant for silicone resin compositions, and inorganic filler
JP7089876B2 (ja)	2015-09-09	2022-06-23	株式会社カネカ	熱伝導性樹脂組成物
JP6610429B2 (ja) *	2016-05-24	2019-11-27	信越化学工業株式会社	熱伝導性シリコーン組成物、その硬化物及びその製造方法
JP6787210B2 (ja) *	2017-03-23	2020-11-18	味の素株式会社	樹脂組成物
CN109593366A (zh) *	2018-12-19	2019-04-09	江苏中恒电子新材料有限公司	一种电子行业专用高导热系数硅凝胶及其制备方法
CN109553938A (zh) *	2018-12-27	2019-04-02	苏州荣昌复合材料有限公司	一种具有高导热pbt增强材料
JP2020110874A (ja)	2019-01-11	2020-07-27	倉敷紡績株式会社	柔軟物の積み重ね方法、衣服の折り畳みおよび積み重ね方法、ならびにロボットシステム
JP7395111B2 (ja) *	2019-08-01	2023-12-11	株式会社レゾナック	無機粒子分散樹脂組成物及び無機粒子分散樹脂組成物の製造方法
JP7434818B2 (ja) *	2019-11-12	2024-02-21	株式会社レゾナック	珪素含有酸化物被覆窒化アルミニウム粒子の製造方法および放熱性樹脂組成物の製造方法

2020
- 2020-06-26 JP JP2020110874A patent/JP6997834B1/ja active Active
2021
- 2021-05-24 CN CN202180002824.0A patent/CN114127196B/zh active Active
- 2021-05-24 EP EP21829487.4A patent/EP3981836B1/fr active Active
- 2021-05-24 US US17/626,638 patent/US11692118B2/en active Active
- 2021-05-24 KR KR1020217032207A patent/KR102595409B1/ko active Active
- 2021-05-24 WO PCT/JP2021/019617 patent/WO2021261147A1/fr not_active Ceased
- 2021-06-25 TW TW110123339A patent/TWI891826B/zh active

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20200140736A1 (en) *	2017-05-31	2020-05-07	Momentive Performance Materials Japan Llc	Thermally conductive polysiloxane composition

Also Published As

Publication number	Publication date
KR20220001511A (ko)	2022-01-05
EP3981836A1 (fr)	2022-04-13
WO2021261147A1 (fr)	2021-12-30
JP2022024210A (ja)	2022-02-09
KR102595409B1 (ko)	2023-10-30
TW202208550A (zh)	2022-03-01
CN114127196A (zh)	2022-03-01
TWI891826B (zh)	2025-08-01
US20220298402A1 (en)	2022-09-22
JP6997834B1 (ja)	2022-01-24
EP3981836B1 (fr)	2023-07-12
CN114127196B (zh)	2023-04-25
US11692118B2 (en)	2023-07-04

Legal Events

Date	Code	Title	Description
2021-12-31	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE
2022-03-11	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2022-03-11	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE
2022-04-13	17P	Request for examination filed	Effective date: 20220104
2022-04-13	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2022-11-23	A4	Supplementary search report drawn up and despatched	Effective date: 20221026
2022-11-23	RIC1	Information provided on ipc code assigned before grant	Ipc: C08L 83/05 20060101ALI20221020BHEP Ipc: C08K 7/06 20060101ALI20221020BHEP Ipc: C08K 5/5415 20060101ALI20221020BHEP Ipc: C08K 5/29 20060101ALI20221020BHEP Ipc: C08K 3/28 20060101ALI20221020BHEP Ipc: C08K 3/22 20060101ALI20221020BHEP Ipc: C08L 83/07 20060101AFI20221020BHEP
2023-03-15	GRAP	Despatch of communication of intention to grant a patent	Free format text: ORIGINAL CODE: EPIDOSNIGR1
2023-03-15	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: GRANT OF PATENT IS INTENDED
2023-04-12	INTG	Intention to grant announced	Effective date: 20230316
2023-06-02	GRAS	Grant fee paid	Free format text: ORIGINAL CODE: EPIDOSNIGR3
2023-06-09	GRAA	(expected) grant	Free format text: ORIGINAL CODE: 0009210
2023-06-09	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE PATENT HAS BEEN GRANTED
2023-07-12	AK	Designated contracting states	Kind code of ref document: B1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2023-07-14	REG	Reference to a national code	Ref country code: CH Ref legal event code: EP
2023-08-02	REG	Reference to a national code	Ref country code: IE Ref legal event code: FG4D
2023-08-03	REG	Reference to a national code	Ref country code: DE Ref legal event code: R096 Ref document number: 602021003486 Country of ref document: DE
2023-11-10	REG	Reference to a national code	Ref country code: LT Ref legal event code: MG9D
2023-11-15	REG	Reference to a national code	Ref country code: NL Ref legal event code: MP Effective date: 20230712
2023-12-15	REG	Reference to a national code	Ref country code: AT Ref legal event code: MK05 Ref document number: 1587118 Country of ref document: AT Kind code of ref document: T Effective date: 20230712
2023-12-29	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: NL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230712
2024-01-18	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20231013
2024-01-22	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230712
2024-01-23	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20231112
2024-01-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: SE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230712 Ref country code: RS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230712 Ref country code: PT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20231113 Ref country code: NO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20231012 Ref country code: LV Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230712 Ref country code: LT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230712 Ref country code: IS Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20231112 Ref country code: HR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230712 Ref country code: GR Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20231013 Ref country code: FI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230712 Ref country code: ES Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230712 Ref country code: AT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230712
2024-02-29	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: PL Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230712
2024-04-15	REG	Reference to a national code	Ref country code: DE Ref legal event code: R097 Ref document number: 602021003486 Country of ref document: DE
2024-04-30	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: SM Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230712 Ref country code: RO Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230712 Ref country code: EE Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230712 Ref country code: DK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230712 Ref country code: CZ Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230712 Ref country code: SK Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230712
2024-05-17	PLBE	No opposition filed within time limit	Free format text: ORIGINAL CODE: 0009261
2024-05-17	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT
2024-05-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: IT Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230712
2024-06-19	26N	No opposition filed	Effective date: 20240415
2024-07-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: SI Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230712
2024-11-08	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: BG Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230712
2024-11-29	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: BG Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230712
2024-12-30	REG	Reference to a national code	Ref country code: CH Ref legal event code: PL
2025-01-08	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: MC Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230712
2025-01-16	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20240524
2025-01-31	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: MC Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT Effective date: 20230712 Ref country code: LU Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20240524 Ref country code: CH Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20240531
2025-02-21	REG	Reference to a national code	Ref country code: BE Ref legal event code: MM Effective date: 20240531
2025-04-22	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: IE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20240524
2025-04-24	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: BE Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20240531
2025-04-25	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: FR Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20240531
2025-07-09	PGFP	Annual fee paid to national office [announced via postgrant information from national office to epo]	Ref country code: DE Payment date: 20250402 Year of fee payment: 5
2025-09-02	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: CY Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO Effective date: 20210524
2025-09-03	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: HU Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO Effective date: 20210524
2025-09-16	REG	Reference to a national code	Ref country code: DE Ref legal event code: R081 Ref document number: 602021003486 Country of ref document: DE Owner name: SEKISUI CHEMICAL CO., LTD., OSAKA-SHI, JP Free format text: FORMER OWNER: DEXERIALS CORPORATION, SHIMOTSUKE-SHI, TOCHIGI-KEN, JP Ref country code: DE Ref legal event code: R082 Ref document number: 602021003486 Country of ref document: DE Representative=s name: NOVAGRAAF BREVETS, FR
2026-01-28	GBPC	Gb: european patent ceased through non-payment of renewal fee	Effective date: 20250524
2026-04-09	PG25	Lapsed in a contracting state [announced via postgrant information from national office to epo]	Ref country code: GB Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES Effective date: 20250524

Publication	Publication Date	Title
EP3981836A4 (fr)	2022-11-23	Composition de résine thermoconductrice et feuille thermoconductrice l'utilisant
EP3964551A4 (fr)	2022-07-20	Composition de résine thermoconductrice et feuille thermoconductrice l'utilisant
EP3753993A4 (fr)	2021-03-31	Composition thermoconductrice et feuille thermoconductrice l'utilisant
EP3511386A4 (fr)	2020-04-22	Composition d'adhésif, feuille de scellement, et corps de scellement
EP3586957A4 (fr)	2020-01-22	Feuille absorbant l'eau, feuille allongée absorbant l'eau, et article absorbant
EP2578631A4 (fr)	2015-05-06	Composition de résine, pré-imprégné et feuille stratifiée l'utilisant
EP2218753A4 (fr)	2012-07-18	Composition de résine thermoplastique, et corps moulé et feuille faits de la composition
EP2011837A4 (fr)	2013-03-13	Composition de revetement durcissable par rayons d'energie active et article moule ayant un film de revetement durci de la composition
EP3519475A4 (fr)	2019-09-11	Adhésif, film stratifié l'utilisant et composition de polyol pour adhésif
EP2030779A4 (fr)	2015-05-27	Film mince et stratifie de film mince l'utilisant
EP3834789A4 (fr)	2022-05-04	Feuille absorbant l'eau et article absorbant l'eau comprenant celle-ci
EP4137550A4 (fr)	2024-05-22	Composition d'agent adhésif et feuille adhésive
EP3904080A4 (fr)	2022-10-12	Composition d'agent de décollement, feuille de décollement, et film de décollement
BRPI0717190A2 (pt)	2014-04-01	"artigo absorvente e folha composta"
EP2657293A4 (fr)	2014-11-05	Composition de résine absorbant l'eau et stratifié obtenu à l'aide de celle-ci
EP2687562A4 (fr)	2015-04-08	Composition de résine diffusant la lumière et feuille diffusant la lumière l'utilisant
EP2990454A4 (fr)	2016-10-19	Composition adhésive autocollante et feuille adhésive autocollante l'utilisant
EP2289958A4 (fr)	2011-06-15	Composition durcissable et film durci l'utilisant
EP3789438A4 (fr)	2021-09-01	Film de résine polyamide et stratifié de résine l'utilisant
EP3514188A4 (fr)	2020-05-06	Composition de résine, feuille flexible thermoconductrice l'utilisant et structure de dissipation de chaleur
EP2878627A4 (fr)	2016-03-30	Composition de résine thermoplastique et feuille l'utilisant
EP3875494A4 (fr)	2022-08-10	Composition durcissable, film, stratifié et dispositif d'affichage
FR2881432B1 (fr)	2009-10-16	Composition de caoutchouc et bandage pneumatique l'utilisant
EP2163582A4 (fr)	2012-05-30	Composition de résine thermoplastique et article moulé utilisant celle-ci
EP2117049A4 (fr)	2012-11-07	Feuille d'hermétisation de cellule solaire et cellule solaire utilisant celle-ci