EP4061576C0 - Dispositif de polissage d'un échantillon - Google Patents

Dispositif de polissage d'un échantillon

Info

Publication number
EP4061576C0
EP4061576C0 EP20815891.5A EP20815891A EP4061576C0 EP 4061576 C0 EP4061576 C0 EP 4061576C0 EP 20815891 A EP20815891 A EP 20815891A EP 4061576 C0 EP4061576 C0 EP 4061576C0
Authority
EP
European Patent Office
Prior art keywords
polishing
sample
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP20815891.5A
Other languages
German (de)
English (en)
Other versions
EP4061576A1 (fr
EP4061576B1 (fr
Inventor
Arto Peltola
Tatu Peltola
Teemu Simola
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Arata Technologies Oy
Original Assignee
Arata Technologies Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Arata Technologies Oy filed Critical Arata Technologies Oy
Publication of EP4061576A1 publication Critical patent/EP4061576A1/fr
Application granted granted Critical
Publication of EP4061576C0 publication Critical patent/EP4061576C0/fr
Publication of EP4061576B1 publication Critical patent/EP4061576B1/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/14—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the temperature during grinding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/16—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the load
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
EP20815891.5A 2019-11-18 2020-11-16 Dispositif de polissage d'un échantillon Active EP4061576B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FI20195982A FI130973B1 (en) 2019-11-18 2019-11-18 Device and method for polishing a specimen
PCT/FI2020/050764 WO2021099681A1 (fr) 2019-11-18 2020-11-16 Dispositif et procédé de polissage d'un échantillon

Publications (3)

Publication Number Publication Date
EP4061576A1 EP4061576A1 (fr) 2022-09-28
EP4061576C0 true EP4061576C0 (fr) 2025-10-22
EP4061576B1 EP4061576B1 (fr) 2025-10-22

Family

ID=73598895

Family Applications (1)

Application Number Title Priority Date Filing Date
EP20815891.5A Active EP4061576B1 (fr) 2019-11-18 2020-11-16 Dispositif de polissage d'un échantillon

Country Status (10)

Country Link
US (1) US20220395955A1 (fr)
EP (1) EP4061576B1 (fr)
JP (1) JP7672159B2 (fr)
KR (1) KR20220134521A (fr)
CN (1) CN114728397B (fr)
AU (1) AU2020385654B2 (fr)
CA (1) CA3161142A1 (fr)
FI (1) FI130973B1 (fr)
TW (1) TWI890707B (fr)
WO (1) WO2021099681A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102934997B1 (ko) * 2021-02-25 2026-03-09 주식회사 케이씨텍 기판 연마 장치
KR20250023368A (ko) * 2022-06-15 2025-02-18 투룬 일리오피스토 연마 패드 습윤 장치 및 방법
CN117245551A (zh) * 2023-09-07 2023-12-19 上海华力集成电路制造有限公司 Cmp研磨结构及其使用方法
WO2025176938A1 (fr) * 2024-02-23 2025-08-28 ARATA Technologies Oy Agencement et procédé d'humidification d'un tampon de polissage

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5081421A (en) * 1990-05-01 1992-01-14 At&T Bell Laboratories In situ monitoring technique and apparatus for chemical/mechanical planarization endpoint detection
US5700180A (en) * 1993-08-25 1997-12-23 Micron Technology, Inc. System for real-time control of semiconductor wafer polishing
JP3311203B2 (ja) * 1995-06-13 2002-08-05 株式会社東芝 半導体装置の製造方法及び半導体製造装置、半導体ウェーハの化学的機械的ポリッシング方法
JPH1034535A (ja) * 1996-07-24 1998-02-10 Sony Corp 研磨方法及び研磨装置
US6007405A (en) * 1998-07-17 1999-12-28 Promos Technologies, Inc. Method and apparatus for endpoint detection for chemical mechanical polishing using electrical lapping
JP2000311876A (ja) 1999-04-27 2000-11-07 Hitachi Ltd 配線基板の製造方法および製造装置
EP1080841A3 (fr) * 1999-09-02 2001-07-11 Mitsubishi Materials Corporation Tête de support, dispositif de polissage utilisant la tête, et procédé permettant de déceler l'état de la surface polie
US6626736B2 (en) * 2000-06-30 2003-09-30 Ebara Corporation Polishing apparatus
US6623329B1 (en) * 2000-08-31 2003-09-23 Micron Technology, Inc. Method and apparatus for supporting a microelectronic substrate relative to a planarization pad
US6257953B1 (en) * 2000-09-25 2001-07-10 Center For Tribology, Inc. Method and apparatus for controlled polishing
US6722943B2 (en) * 2001-08-24 2004-04-20 Micron Technology, Inc. Planarizing machines and methods for dispensing planarizing solutions in the processing of microelectronic workpieces
DE10303407A1 (de) * 2003-01-27 2004-08-19 Friedrich-Schiller-Universität Jena Verfahren und Vorrichtung zur hochgenauen Bearbeitung der Oberfläche eines Objektes, insbesondere zum Polieren und Läppen von Halbleitersubstraten
US7513818B2 (en) * 2003-10-31 2009-04-07 Applied Materials, Inc. Polishing endpoint detection system and method using friction sensor
WO2008115987A2 (fr) * 2007-03-19 2008-09-25 Gt Angel, Llc Toile de matelas détectant les fluides et système de surveillance
JP2008290182A (ja) * 2007-05-24 2008-12-04 Nikon Corp 研磨装置
TW200916261A (en) * 2007-09-07 2009-04-16 Cabot Microelectronics Corp CMP sensor and control system
JP5248127B2 (ja) * 2008-01-30 2013-07-31 株式会社荏原製作所 研磨方法及び研磨装置
JP2010141155A (ja) * 2008-12-12 2010-06-24 Sony Corp ウェーハ研磨装置及びウェーハ研磨方法
CN102782814A (zh) * 2010-04-30 2012-11-14 应用材料公司 垫片状态化刮扫力矩模式化以达成恒定移除率
US8758085B2 (en) * 2010-10-21 2014-06-24 Applied Materials, Inc. Method for compensation of variability in chemical mechanical polishing consumables
JP5722619B2 (ja) 2010-12-28 2015-05-27 株式会社荏原製作所 研磨装置及び研磨方法
WO2013181474A1 (fr) * 2012-05-30 2013-12-05 Medisens Wireless, Inc. Systèmes biométriques reposant sur une signature-pression, ensembles capteurs et procédés
US9863902B2 (en) * 2014-03-07 2018-01-09 Stmicroelectronics Asia Pacific Pte Ltd. Microelectronic fluid detector
US11103970B2 (en) * 2017-08-15 2021-08-31 Taiwan Semiconductor Manufacturing Co, , Ltd. Chemical-mechanical planarization system
US10857651B2 (en) * 2017-11-20 2020-12-08 Taiwan Semiconductor Manufacturing Company Ltd. Apparatus of chemical mechanical polishing and operating method thereof
JP7098311B2 (ja) * 2017-12-05 2022-07-11 株式会社荏原製作所 研磨装置、及び研磨方法
JP7136904B2 (ja) * 2018-03-07 2022-09-13 アプライド マテリアルズ インコーポレイテッド 研磨流体添加物の濃度を測定する装置、及びかかる装置に関連する方法
TWI838459B (zh) * 2019-02-20 2024-04-11 美商應用材料股份有限公司 化學機械拋光裝置及化學機械拋光方法
TWI754915B (zh) * 2019-04-18 2022-02-11 美商應用材料股份有限公司 用於溫度控制的化學機械拋光溫度掃描設備

Also Published As

Publication number Publication date
FI20195982A1 (en) 2021-05-19
KR20220134521A (ko) 2022-10-05
TW202122213A (zh) 2021-06-16
TWI890707B (zh) 2025-07-21
FI130973B1 (en) 2024-06-25
JP7672159B2 (ja) 2025-05-07
CA3161142A1 (fr) 2021-05-27
EP4061576A1 (fr) 2022-09-28
US20220395955A1 (en) 2022-12-15
AU2020385654A1 (en) 2022-05-26
AU2020385654B2 (en) 2025-11-20
CN114728397A (zh) 2022-07-08
CN114728397B (zh) 2024-08-13
JP2023503280A (ja) 2023-01-27
EP4061576B1 (fr) 2025-10-22
WO2021099681A1 (fr) 2021-05-27

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