EP4122009A1 - Assemblage composite de deux composants - Google Patents

Assemblage composite de deux composants

Info

Publication number
EP4122009A1
EP4122009A1 EP21711205.1A EP21711205A EP4122009A1 EP 4122009 A1 EP4122009 A1 EP 4122009A1 EP 21711205 A EP21711205 A EP 21711205A EP 4122009 A1 EP4122009 A1 EP 4122009A1
Authority
EP
European Patent Office
Prior art keywords
component
nanowires
adhesive
contact surface
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP21711205.1A
Other languages
German (de)
English (en)
Inventor
Olav Birlem
Florian DASSINGER
Sebastian Quednau
Farough ROUSTAIE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nanowired GmbH
Original Assignee
Nanowired GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nanowired GmbH filed Critical Nanowired GmbH
Publication of EP4122009A1 publication Critical patent/EP4122009A1/fr
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/334—Cross-sectional shape, i.e. in side view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/355—Materials of die-attach connectors of outermost layers of multilayered die-attach connectors, e.g. material of a coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01331—Manufacture or treatment of die-attach connectors using blanket deposition
    • H10W72/01333—Manufacture or treatment of die-attach connectors using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating
    • H10W72/01335—Manufacture or treatment of die-attach connectors using blanket deposition in liquid form, e.g. spin coating, spray coating or immersion coating by plating, e.g. electroless plating or electroplating
    • H—ELECTRICITY
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
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    • H10W72/07331—Connecting techniques
    • H10W72/07332—Compression bonding, e.g. thermocompression bonding
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    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07334—Using a reflow oven
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H10W72/07338—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy hardening the adhesive by curing, e.g. thermosetting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07352—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in structures or sizes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07353—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07354—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07351—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting
    • H10W72/07355—Connecting or disconnecting of die-attach connectors characterised by changes in properties of the die-attach connectors during connecting changes in materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/324—Die-attach connectors having multiple side-by-side cores
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/332—Plan-view shape, i.e. in top view
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/331—Shapes of die-attach connectors
    • H10W72/337—Multiple die-attach connectors having different shapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/344—Dispositions of die-attach connectors, e.g. layouts relative to underlying supporting features, e.g. bond pads, RDLs or vias
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/341—Dispositions of die-attach connectors, e.g. layouts
    • H10W72/347—Dispositions of multiple die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/357—Multiple die-attach connectors having different materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/361—Functions of die-attach connectors, other than mechanically connecting
    • H10W72/365—Providing thermal transfer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/361—Functions of die-attach connectors, other than mechanically connecting
    • H10W72/367—Multiple die-attach connectors having different functions
    • H—ELECTRICITY
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu

Definitions

  • the present invention relates to a method for connecting a first component to a second component and to an arrangement of two components connected to one another, in particular with regard to components from electronics.
  • welding Due to its considerable temperature input of regularly up to 1400 ° C, welding has the disadvantage that, on the one hand, it heats the affected body to a considerable extent, so that there is a risk of igniting flammable materials. Optical changes to the surface of the bodies to be connected can also occur, which is particularly the case with pretreated surfaces with paints, foils or coatings can be problematic. In addition, many materials cannot be welded.
  • Brazing of copper can also cause the components involved in the connection to heat up considerably (in particular above 400 ° C.) due to its considerable thermal energy input. This can cause flammable materials to ignite.
  • Soft soldering of copper can have the disadvantage that, on the one hand, the shear strength of the connection is lower than necessary and, on the other hand, that with soft solders, alternating temperature loads lead to segregation of the metal and thus to embrittlement of the connection. This can lead to the connection failing. Furthermore, soft solders have the disadvantage that they have a significantly higher contact resistance of the connection than, for example, pure copper. Another disadvantage of soft solder connections is their low mechanical fatigue strength, which usually only exists up to around 120 ° C. The corrosion resistance of such a connection to acidic media is also often inadequate.
  • a method for connecting a first component to a second component comprises: a) providing a plurality of nanowires on a contact surface of the first component, b) applying an adhesive to the contact surface of the first component and / or to a contact surface of the second component, c) bringing the first component and the second component together, so that the multitude of nanowires in contact with the contact surface of the second component clock is brought and the contact surfaces are connected to one another by the adhesive.
  • the components can be connected to one another at a particularly low temperature and / or with a particularly low application of force.
  • the regularly asked requirement that the temperature of the components does not exceed 250 ° C. during the process and that the components are acted on with a maximum pressure of 20 MPa can be met. It is not necessary that chemically aggressive substances are used.
  • the advantages mentioned are made possible by the formation of a connection via a large number of nanowires.
  • the first component and the second component are preferably electronic components such as semiconductor components, computer chips, microprocessors or circuit boards.
  • the first component and / or the second component are preferably at least partially electrically and / or thermally conductive. By means of the method described, an electrically and / or thermally conductive connection can be obtained between the two components.
  • electrical and / or thermal conductivity in the sense used here is present in particular with metals such as copper, which are generally referred to as “electrically conductive” or equivalent as “electrically conductive” or “thermally conductive” or “thermally conductive”.
  • materials that are generally considered to be electrically or thermally insulating should not be viewed here as being electrically or thermally conductive.
  • the method described is not restricted to applications in the field of electronics.
  • a component such as a sensor (as a first component) on a wall or bracket (as a second component) according to the method described.
  • a mechanically stable and electrically and / or thermally conductive connection can be formed between the first component and the second component.
  • the method described can be used in all areas in which a corresponding connection between two components is required.
  • the method described is not limited to a certain size of the components.
  • the method described is suitable for use in the field of electronics, in particular microelectronics, or for connecting significantly larger components on a macroscopic level.
  • the components can be connected to one another via respective contact surfaces.
  • a contact area is in particular a spatially drawn area of a surface of the respective component.
  • the contact surfaces are characterized by the formation of the connection. This means that the contact surface does not initially differ from the rest of the surface of the component and only emerges when the connection is formed in such a way that the contact surface is the surface on which the connection is formed. In this case, the contact area is initially only delimited from the remaining part of the surface of the component. In the area of the contact surfaces, the nanowires and the adhesive can come into contact with the respective component.
  • the contact surfaces are preferably each simply connected areas of the surface of the respective component.
  • the respective contact surface of the first component and / or of the second component can be subdivided into several separate sub-areas of the surface of the respective component.
  • a contact surface can comprise two or more separate sections of the surface of the respective component.
  • the contact surfaces are preferably electrically and / or thermally conductive.
  • the components are preferably designed to be rigid or have at least one rigid surface on which the respective contact surface is provided. This means in particular that the components (or at least the contact surfaces) are preferably not flexible. With rigid components or contact surfaces, a connection can be formed particularly well using the method described. If, for example, one of the components were designed to be flexible, the connection could break due to stress on the nanowires. Depending on the exact circumstances, the method described can also share with flexible construction or contact surfaces are advantageously used.
  • connection between the components or their contact surfaces is formed on the one hand via a large number of nanowires and on the other hand via an adhesive.
  • a nanowire is understood here to mean any material body that has a wire-like shape and a size in the range from a few nanometers to a few micrometers.
  • a nanowire can, for example, have a circular, oval or polygonal base.
  • a nanowire can have a hexagonal base area. All of the nanowires involved in the connection are preferably formed from the same material.
  • the nanowires are formed from a metal. It is particularly preferred that the nanowires are formed from the material of one of the contact surfaces. It is also preferred that both contact surfaces are formed from the same material. In this case, it is preferred that the nanowires are formed from the same material as the two contact surfaces.
  • the nanowires preferably have a length in the range from 100 nm [nanometers] to 100 gm [micrometers], in particular in the range from 500 nm to 30 gm. Furthermore, the nanowires preferably have a diameter in the range from 10 nm to 10 mih, in particular in the range from 30 nm to 2 mih.
  • the term diameter refers to a circular base area, with a comparable definition of a diameter being used for a base area that differs therefrom. It is particularly preferred that all nanowires used have the same length and the same diameter.
  • connection is preferably formed in particular in that the plurality of nanowires is provided between the respective contact surfaces to be connected. Due to the size of the nanowires in the nanometer range, the surface area of the connection (ie the area over which forces such as the Van der Waals force act at the atomic level) is particularly large. The connection can thus be particularly good electrically and / or thermally conductive.
  • the nanowires can also contribute to the mechanical stability of the connection. The mechanical stability is, however, also and preferably even mainly obtained via the adhesive. It is even possible that the mechanical stability is achieved solely through the adhesive. For a connection that is particularly good electrically and / or thermally conductive, it is preferred that the nanowires are formed from an electrically and / or thermally conductive material.
  • the contact surfaces are also preferably formed from an electrically and / or thermally conductive material, in particular from copper. As described above, the use of copper is not possible, especially for welded connections. Due to the large surface area of the connection obtained by the method described, not only an electrical, but also a thermal conductivity of the connection can be particularly high. This can improve the cooling of the components involved in the connection, for example.
  • the use of copper for the nanowires and / or for the contact surfaces is particularly preferred for this purpose.
  • the connection described can also be formed particularly easily and without tools. In order to connect the contact surfaces via the nanowires, the contact surfaces to be connected only have to be brought together. Pressure can be applied optionally, but is not absolutely necessary. The formation of the connection via the adhesive takes place by simply applying the adhesive to one or both contact surfaces and also by bringing the two contact surfaces together. When the contact surfaces are brought together, they are connected to one another both via the nanowires and via the adhesive.
  • a multiplicity of nanowires is provided on the contact surface of the first component and thus on at least part of the surface of the first component. This can be done in particular by galvanic growth of the nanowires.
  • providing is to be understood as meaning that the nanowires are applied to the contact surface of the first component as part of the method.
  • providing also includes using a first component on which the nanowires are already provided on the contact surface.
  • a correspondingly prepared first component can be obtained from a supplier and used for using the method described.
  • Such loading of a prepared first component is also a provision of the nanowires in the sense used here.
  • the method described has the particular advantage that the nanowires only have to be provided on one of the contact surfaces involved and not on both.
  • the nanowires are preferably provided on the contact surface of the first component in such a way that they are essentially perpendicular (preferably perpendicular) on the contact surface.
  • the entirety of the nanowires provided in accordance with step a) can in particular be referred to as a lawn of nanowires.
  • the nanowires can also be positioned in any orientation on the Contact surface of the first component are provided. It is also possible for the contact surface of the first component to be subdivided into a plurality of subregions (connected to one another or separated from one another), the nanowires being oriented differently in the various subregions.
  • the nanowires can thus make a particularly large contribution to the mechanical stability of the connection, because the nanowires can also withstand shear forces particularly well.
  • step b) of the method described an adhesive is applied to the contact area of the first component and / or to a contact area of the second component.
  • the adhesive is applied only to the contact surface of the first component.
  • the adhesive is applied to the contact surface of the first component in such a way that the nanowires are arranged perpendicular to the contact surface even after the adhesive has been applied. Applying the adhesive does not tip over the nanowires. This can be achieved, for example, by using a sufficiently thin-bodied adhesive through which correspondingly low forces are exerted on the nanowires during application.
  • the adhesive or a chemical precursor thereof can already be applied to the contact surface of the first component during the growth of the nanowires. Steps a) and b) can therefore be carried out at the same time.
  • connection in step c) can be formed in a particularly reliable manner. It is not to be expected that the na- Needle wires are tipped over, kinked or shifted due to the merging of the two components and in particular due to the adhesive.
  • the adhesive located between the nanowires before the two components are brought together stabilizes the nanowires.
  • the ends of the nanowires can also reach the contact surface of the second component particularly reliably in order to come into contact therewith. If the adhesive were not only provided on the contact surface of the first component, the nanowires would have to be immersed in the adhesive in step c). The adhesive could prevent the ends of the nanowires from reaching the contact surface of the second component.
  • the adhesive is only applied to the contact surface of the second component. It is preferred that in step a) nanowires are only provided on the contact surface of the first component. In that case, the adhesive and the nanowires are provided on different of the two contact surfaces.
  • This embodiment allows the method to be carried out in a particularly simple manner, because neither of the two contact surfaces has to be provided with both the adhesive and the nanowires. Steps a) and b) can therefore be carried out independently of one another. If the components are brought together in step c), the nanowires can be pressed into the adhesive until the ends of the nanowires come into contact with the second contact surface. For this purpose, it is preferred that the adhesive is applied to the contact surface of the second component with a sufficiently thin layer.
  • the adhesive is applied both to the contact surface of the first component and to the contact surface of the second component.
  • the advantages of the first and second preferred embodiment can be combined with one another.
  • the adhesive can be applied to the contact surface of the second component with a smaller thickness than would be required according to the second preferred embodiment. This reduces the risk that the ends of the nanowires will not reach the contact surface of the second component due to the adhesive.
  • the amount of adhesive to be applied to the contact surface of the first component is less. Compared to the first embodiment, this makes it easier to carry out the method because less adhesive has to be applied to the contact surface of the first component with the nanowires than would be necessary in accordance with the first preferred embodiment.
  • a two-component adhesive is used.
  • a first component of the two-component adhesive can be applied to the contact surface of the first component and a second component of the two-component adhesive can be applied to the contact surface of the second component. Only when the components are brought together do the two components of the two-component adhesive come into contact with one another. This prevents the two-component adhesive from curing prematurely.
  • step c) of the method described the components or the contact surfaces are brought together, that is, moved towards one another.
  • the nanowires on the contact surface of the first component thereby come into contact with the contact surface of the second component. It is preferred that the ends of the nanowires remote from the contact area of the first component come into contact with the contact area of the second component.
  • the nanowires are connected via a first end to the contact surface of the first component and a second end to the contact surface of the second Component.
  • the connection between the first component and the second component can already be completely formed by step c). This is particularly the case with a fast-curing adhesive.
  • Process steps a) to c) are preferably carried out in the specified order, in particular one after the other.
  • steps a) and b) are preferably carried out and in particular completed before the start of step c).
  • steps a) and b) can also be carried out in whole or in part with a temporal overlap.
  • steps a) and b) can also be carried out independently of one another, provided that the adhesive in step b) is not applied to a contact surface on which nanowires are also provided.
  • step b) can also be carried out before step a).
  • the connection is also established via the nanowires. This takes place in that the nanowires, in particular their ends facing the contact surface of the second component, are connected to this contact surface. This connection is formed at the atomic level. The atomic process is similar to that during sintering.
  • connection obtained can in particular be so tight for gases and / or liquids that corrosion of the connection and / or the interconnected components in the area of the connection can be prevented or at least restricted.
  • This can be reinforced by the adhesive.
  • the connection formed can be viewed as being fully metallic.
  • the formation of the connection via the nanowires can also be referred to as "Velcro welding”. This expresses the fact that the connection is established by a large number of nanowires and thus by a large number of elongated, hair-like structures. Due to the large number of nanowires, unevenness and roughness of the contact surfaces can be compensated for. Together With the formation of the connection via the adhesive, the process can also be referred to as "Velcro glueing".
  • At least some of the nanowires are in contact with the adhesive after the connection has been formed.
  • connection is preferably formed in such a way that the nanowires are arranged in the area of the adhesive. So the nanowires and the adhesive overlap.
  • the connection is thus not formed in such a way that the nanowires are arranged in a first area and the adhesive is arranged in a second area adjoining the first area or at a distance from the first area. Rather, the first area and the second area overlap one another at least partially, preferably even completely. If the first and second areas partially overlap, the nanowires are in contact with the adhesive in the overlap area. If the first and second areas completely overlap, the distinction between the first and second areas is no longer necessary. In this case, the nanowires and the adhesive are arranged in the same area. All of the nanowires are then in contact with the adhesive. If the nanowires are surrounded by the adhesive, the adhesive can protect the nanowires and thus the connection particularly well, in particular against corrosion.
  • connection is formed such that the nanowires are arranged in a first area and the adhesive is arranged in a second area adjoining the first area or spaced apart from the first area. It is particularly preferred that the second area surrounds the first area.
  • the adhesive can protect the nanowires and, in this respect, the connection, in particular against corrosion.
  • the adhesive is liquid when applied in step b).
  • Liquid adhesive can be distributed particularly easily around the nanowires, so that the spaces between the nanowires can be particularly easily filled with the adhesive. On the one hand, this applies in the event that the adhesive is applied to the contact surface of the first component. In this case, liquid adhesive can be distributed particularly easily around the nanowires when it is applied. On the other hand, however, this also applies in the event that the adhesive is applied to the contact surface of the second component. In that case, the nanowires can be introduced into the adhesive particularly easily, so that the adhesive is distributed around the nanowires when the two components are brought together in step c).
  • the adhesive is one of the following: an acylate, an epoxy adhesive, a crosslinking adhesive, an adhesive that can be activated by UV light, a thermally activated adhesive, a two-component adhesive.
  • the adhesive is preferably of low viscosity.
  • the adhesive preferably withstands a peal force of 1 N / mm.
  • a mixture of one or more of the adhesives mentioned can also be used. It has been found that the adhesives mentioned are particularly well suited for the process described. Thus, with all the adhesives mentioned, a particularly mechanically stable connection between the two components can be obtained, with the nanowires at the same time being particularly poor the adhesive will be affected. In particular, it has been found that with the adhesives mentioned, the risk is particularly low that the nanowires are tilted, kinked or displaced due to the joining of the two components and due to the adhesive.
  • a plurality of nanowires is also provided on the contact surface of the second component in step a).
  • the components are brought together in step c) in such a way that the nanowires on the contact surface of the second component are brought into contact with the contact surface of the first component.
  • connection through the nanowires takes place in that the nanowires of the contact surface of the first component come into contact with the contact surface of the second component and that the nanowires of the contact surface of the second component come into contact with the contact surface of the first component.
  • the present embodiment produces a reinforced connection by means of the nanowires.
  • the connection can be particularly good electrically and / or thermally conductive.
  • the contribution of the nanowires to the mechanical stability of the connection can also be particularly large.
  • the adhesive is applied to both contact surfaces. As a result, only a comparatively small amount of the adhesive is required on each contact surface. Alternatively, it is preferred that the adhesive is only applied to one of the two contact surfaces. This makes it easier to carry out the method because both adhesive and nanowires are provided on only one of the two contact surfaces.
  • steps a) to c) are preferably carried out as follows: a) providing a first plurality of nanowires on a contact surface of the first component and a second plurality of nanowires on a contact surface of the second component, b) applying an adhesive the contact surface of the first component and / or on the contact surface of the second component, c) merging the first component and the second component so that the first plurality of nanowires is brought into contact with the contact surface of the second component, the second plurality of nanowires with the contact surface of the second component is brought into contact and the contact surfaces are connected to one another by the adhesive.
  • At least the contact surface of the second component is heated to a temperature of at least 90 ° C. and / or a maximum of 270 ° C. in step c).
  • step c) at least the contact surface of the second component is preferably heated to a temperature in the range from 150.degree. C. to 270.degree.
  • the heating can harden the adhesive.
  • the connection between the nanowires and the contact surface of the second component can be strengthened by the heating. Accordingly, it is sufficient that only the contact surface of the second component is heated. In practice, in the case of such heating, it is usually not possible to distinguish whether the contact surface of the first component, the contact surface of the second component, the nanowires, the adhesive, the first component partially or entirely and / or the second component be partially or entirely heated. This is particularly the case when thermally conductive materials are used.
  • (co-) heating of components other than the contact surface of the second component is not necessary, but also not a hindrance.
  • step c) At least the contact surface of the second component and the adhesive are preferably heated to a temperature in the range from 150.degree. C. to 270.degree.
  • the heating according to step c) can in particular take place in that the first component and the second component as a whole including the nanowires and the adhesive are heated, for example in an oven.
  • the minimum temperature of 150 ° C described is reached once at least for a short time. It is not necessary to maintain the minimum temperature. However, it is preferred that the temperature at which the heating is carried out in step c) is maintained for at least ten seconds, preferably at least 30 seconds. This ensures that the connection is made as desired. Maintaining the temperature for a longer period is generally not harmful.
  • step c) the first component and the second component are pressed towards one another in step c) with a pressure of at least 2 MPa, in particular at least 10 MPa, and / or of at most 200 MPa, in particular at most 20 MPa.
  • the pressure used is preferably in the range from 2 to 200 MPa, in particular in the range from 10 to 70 MPa. A pressure of 15 MPa is particularly preferred.
  • connection through the adhesive can be made particularly mechanically stable.
  • connection via the nanowires can be strengthened by exerting the pressure.
  • the pressure is preferably above the specified lower limit at least in a period of time in which the temperature exceeds the lower limit mentioned for this. To this extent, at least the nanowires and the contact surface of the second component are exposed to both a corresponding pressure and a corresponding temperature, at least in this time segment. As a result, the connection can be formed by the action of pressure and temperature.
  • an arrangement which comprises a first component and a second component, a contact surface of the first component and a contact surface of the second component being connected to one another by means of an adhesive and a plurality of nanowires.
  • the adhesive is preferably one of the following: an acylate, an epoxy adhesive, a crosslinking adhesive, an adhesive that can be activated by UV light, a thermally activated adhesive, a two-component adhesive.
  • spaces between the nanowires are filled with the adhesive.
  • the nanowires are preferably sheathed with the adhesive. This means that the outer surfaces of the nanowires are completely covered with the adhesive. The end faces of the nanowires are not in contact with the adhesive, but with the contact surfaces.
  • the contact surfaces are electrically and / or thermally conductively connected to one another by the nanowires.
  • An electrically and / or thermally conductive connection between the two contact surfaces can be achieved via the nanowires in particular in that the nanowires are formed from an electrically and / or thermally conductive material and the nanowires extend over the entire distance between the two contact surfaces.
  • the latter means that a respective first end of the nanowires is in contact with the contact surface of the first component and that a respective second end of the nanowires is in contact with the contact surface of the second component.
  • the nanowires In this embodiment in particular, it is therefore possible for the nanowires to extend over the entire distance between the two contact surfaces.
  • the contact surfaces and therefore also the components can be brought into contact with one another via the nanowires.
  • FIG. 2 an illustration of an arrangement according to the invention of two components connected to one another according to the method from FIG. 1.
  • the method comprises: a) Providing a plurality of nanowires 1 on a contact surface 4 of the first component 2 and optionally also on a contact surface 5 of the second component 3, b) applying an adhesive 6 to the contact surface 4 of the first component 2 and / or to a contact surface 5 of the second component 3, the adhesive Substance 6 is preferably liquid when applied, wherein one of the following is preferably used as an adhesive:
  • the adhesive 6 is preferably heated to a temperature of at least 150.degree. C. and / or a maximum of 270.degree.
  • the first component 2 and the second component 3 are preferably pressed towards one another with a pressure of at least 2 MPa and / or of at most 200 MPa.
  • FIG. 2 shows an arrangement 7 which can be obtained with the method from FIG. 1.
  • the arrangement 7 comprises a first component 2 and a second component 3.
  • the two components 2, 3 each have a contact surface 4, 5.
  • the contact surfaces 4, 5 are connected to one another by means of an adhesive 6 and by means of a multiplicity of nanowires 1. Gaps between the nanowires 1 are filled with the adhesive 6. All nanowires 1 are in contact with the adhesive 6.
  • the contact surfaces 4, 5 are connected to one another in an electrically and thermally conductive manner by the nanowires 1.
  • the contact surfaces 4.5 are aligned parallel to one another and the nanowires 1 are aligned perpendicular to the contact surfaces 4.5. List of reference symbols

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
  • Die Bonding (AREA)

Abstract

L'invention concerne un procédé permettant d'assembler un premier composant (2) et un second composant (3), ledit procédé comprenant a) agencer une pluralité de nanofils (1) sur une surface de contact (4) du premier composant (2), b) appliquer un adhésif (6) sur la surface de contact (4) du premier composant (2) et/ou sur une surface de contact (5) du second composant (3), c) réunir le premier composant (2) et le second composant (3), de sorte que la pluralité de nanofils (1) sont mis en contact avec la surface de contact (5) du second composant (3) et que les surfaces de contact (4, 5) sont reliées les unes aux autres par l'adhésif (6). Au moins une partie des nanofils (1) peut être en contact avec l'adhésif (6) après réalisation de l'assemblage. Des interstices situés entre les nanofils (1) peuvent être remplis avec l'adhésif (6). En variante, les nanofils (1) peuvent être agencés dans une première zone et l'adhésif (6) peut être placé dans une seconde zone jouxtant la première zone ou située à distance de la première zone, la seconde zone pouvant entourer la première zone. L'adhésif (6) peut être liquide lors de l'application à l'étape b). À l'étape a), une pluralité de nanofils (1) peuvent en outre être disposés sur la surface de contact (5) du second composant (3), les composants (2, 3) étant réunis de sorte que les nanofils (1) situés sur la surface de contact (5) du second composant (3) sont mis en contact avec la surface de contact (4) du premier composant (2). À l'étape c) au moins la surface de contact (5) du second composant (3) peut être portée à une température d'au moins 90°C et/ou au maximum de 270°C et/ou le premier composant (2) et le second composant (3) peuvent être pressés l'un sur l'autre à une pression d'au moins 2 MPa et/ou plus de 200 MPa. Les surfaces de contact (4, 5) peuvent être reliées entre elles de manière électriquement et/ou thermiquement conductrices. Le premier composant (2) et le second composant (3) peuvent être des composants électroniques comme par exemple des composants semi-conducteurs, des puces d'ordinateur, des microprocesseurs ou des cartes de circuits imprimés. Il est également possible de monter un composant tel qu'un capteur (comme premier composant (2)) sur une paroi ou un support (comme second composant (3)).
EP21711205.1A 2020-03-17 2021-03-08 Assemblage composite de deux composants Pending EP4122009A1 (fr)

Applications Claiming Priority (2)

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DE102020107240.6A DE102020107240A1 (de) 2020-03-17 2020-03-17 Kompositverbindung zweier Bauteile
PCT/EP2021/055801 WO2021185617A1 (fr) 2020-03-17 2021-03-08 Assemblage composite de deux composants

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EP4122009A1 true EP4122009A1 (fr) 2023-01-25

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JP (1) JP7496886B2 (fr)
KR (1) KR102795850B1 (fr)
DE (1) DE102020107240A1 (fr)
TW (1) TWI904144B (fr)
WO (1) WO2021185617A1 (fr)

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WO2023202931A1 (fr) 2022-04-21 2023-10-26 Biotronik Se & Co. Kg Jonction à énergie réduite et automatisable au moyen d'un nanocâblage pour la mise en contact de composants électriques et mécaniques d'implants actifs et de surveillance
DE102022119479A1 (de) 2022-08-03 2024-02-08 Audi Aktiengesellschaft Bauteilanordnung für eine Hochvoltbatterie und Verfahren zum Herstellen einer Bauteilanordnung
EP4529946A1 (fr) 2023-09-28 2025-04-02 BIOTRONIK SE & Co. KG Assemblage à énergie réduite et automatisable au moyen de nanostructures pour la mise en contact de composants électriques et mécaniques d'implants actifs et de surveillance

Family Cites Families (16)

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JP4760070B2 (ja) 2005-03-16 2011-08-31 日立化成工業株式会社 接着剤、回路接続用接着剤、接続体及び半導体装置
US7402909B2 (en) * 2005-04-28 2008-07-22 Intel Corporation Microelectronic package interconnect and method of fabrication thereof
JP4744360B2 (ja) * 2006-05-22 2011-08-10 富士通株式会社 半導体装置
CN101542705B (zh) * 2006-11-28 2011-10-12 松下电器产业株式会社 电子部件安装结构体及其制造方法
DE102010005465B4 (de) 2009-01-26 2014-11-20 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Elektrisches oder elektronisches Bauelement und Verfahren zum Herstellen eines Anschlusses
TWI477438B (zh) * 2010-06-23 2015-03-21 Hon Hai Prec Ind Co Ltd 奈米線薄膜及其製造方法
FR3018628A1 (fr) * 2014-03-11 2015-09-18 Commissariat Energie Atomique Procede d'hybridation par collage de deux elements microelectroniques
US20160060492A1 (en) * 2014-09-02 2016-03-03 3M Innovative Properties Company Protection of new electro-conductors based on nano-sized metals using direct bonding with optically clear adhesives
US9871014B2 (en) 2015-09-08 2018-01-16 Invensas Corporation 3D-joining of microelectronic components with conductively self-adjusting anisotropic matrix
DE102017104922A1 (de) 2017-03-08 2018-09-13 Olav Birlem Verbindung von elektrischen Leitern
DE102017104923A1 (de) 2017-03-08 2018-09-13 Olav Birlem Verbindung für einen Halbleiterchip
DE102017104926A1 (de) * 2017-03-08 2018-09-13 Olav Birlem Verbindung für einen Sensor
DE102017104921A1 (de) * 2017-03-08 2018-09-13 Olav Birlem Verbindung von thermischen Leitern
CA2985254A1 (fr) * 2017-11-14 2019-05-14 Vuereal Inc Integration et liaison de micro-dispositifs dans un substrat de systeme
DE102017126724A1 (de) * 2017-11-14 2019-05-16 Nanowired Gmbh Verfahren und Verbindungselement zum Verbinden von zwei Bauteilen sowie Anordnung von zwei verbundenen Bauteilen
DE102019107355A1 (de) 2019-03-22 2020-09-24 Harting Electric Gmbh & Co. Kg Werkzeuglose Kontaktierung eines elektrischen Leiters

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WO2021185617A1 (fr) 2021-09-23
JP2023518075A (ja) 2023-04-27
JP7496886B2 (ja) 2024-06-07
KR20230020944A (ko) 2023-02-13
TW202229000A (zh) 2022-08-01
KR102795850B1 (ko) 2025-04-14
DE102020107240A1 (de) 2021-09-23
TWI904144B (zh) 2025-11-11

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