EP4139622A1 - Wärmerohr für elektronische vorrichtung und herstellungsverfahren dafür - Google Patents

Wärmerohr für elektronische vorrichtung und herstellungsverfahren dafür

Info

Publication number: EP4139622A1
Authority: EP; European Patent Office
Prior art keywords: module; heat pipe; layer; polymeric layer; foldable portion
Prior art date: 2020-05-18
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP20742636.2A

Other languages

English (en)

French (fr)

Other versions

EP4139622B1 (de

EP4139622B8 (de

Inventor

Junwei MU

Guo IANG

Sviataslau Alehavich FILATAU

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Huawei Technologies Co Ltd

Original Assignee

Huawei Technologies Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2020-05-18

Filing date

2020-05-18

Publication date

2023-03-01

2020-05-18 Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd

2023-03-01 Publication of EP4139622A1 publication Critical patent/EP4139622A1/de

2025-01-01 Publication of EP4139622B1 publication Critical patent/EP4139622B1/de

2025-03-26 Application granted granted Critical

2025-03-26 Publication of EP4139622B8 publication Critical patent/EP4139622B8/de

Status Active legal-status Critical Current

2040-05-18 Anticipated expiration legal-status Critical

Links

Classifications

- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0241—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the tubes being flexible

Definitions

the porous layer having the plurality of holes complementary to the plurality of projections in the first module allows the porous layer to be properly arranged on the first module inside the internal volume. Presence of the porous layer provides effective circulation of the working fluid inside the internal volume which helps in more effective heat dissipation in the electronic device.
the one or more grooves are formed on the outer surface of each of the first module and the second module in the foldable portion.
the one or more grooves allows bending of the heat pipe while reducing formation of large cracks in the body of the heat pipe. Further, the one or more grooves controls the location of formation of cracks by restricting the cracks around the foldable portion in the heat pipe.
the metallic layer comprises one or more indentations complementary to the one or more grooves formed in the foldable portion of each of the first module and the second module, of the body.
the body is fabricated by at least one of: sintering, soldering and welding process
the thickness of the metallic layer in range of 0.04 to 25 ⁇ m provides an effective layer that reduces permeability of the working fluid in the internal volume though the polymeric layer, without substantially increasing the size and cost of the heat pipe.
the second set of projections 202B is an array of horizontal pillars with respect to length of the body 102 extending vertically from the first module 102A aiong the axial direction (parallel to axis CC'), and arranged between the first module 102A and the second module 102B when assembled together to form the body 102.
the second set of projections (such as, the second set of projections 202B) may be arranged on all such foldable portions.

Landscapes

Engineering & Computer Science (AREA)
Life Sciences & Earth Sciences (AREA)
Sustainable Development (AREA)
Physics & Mathematics (AREA)
Thermal Sciences (AREA)
Mechanical Engineering (AREA)
General Engineering & Computer Science (AREA)
Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

EP20742636.2A 2020-05-18 2020-05-18 Wärmerohr für elektronische vorrichtung und herstellungsverfahren dafür Active EP4139622B8 (de)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
PCT/BY2020/000004 WO2021232134A1 (en)	2020-05-18	2020-05-18	Heat pipe for electronic device, and method of manufacturing therefor

Publications (3)

Publication Number	Publication Date
EP4139622A1 true EP4139622A1 (de)	2023-03-01
EP4139622B1 EP4139622B1 (de)	2025-01-01
EP4139622B8 EP4139622B8 (de)	2025-03-26

Family

ID=71670014

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP20742636.2A Active EP4139622B8 (de)	2020-05-18	2020-05-18	Wärmerohr für elektronische vorrichtung und herstellungsverfahren dafür

Country Status (2)

Country	Link
EP (1)	EP4139622B8 (de)
WO (1)	WO2021232134A1 (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN118401802A (zh) *	2021-12-06	2024-07-26	大日本印刷株式会社	蒸发室和电子设备
EP4438986A1 (de)	2023-03-27	2024-10-02	Siemens Aktiengesellschaft	Faltbare kühlvorrichtung, umrichter, faltbares elektronikgerät und simulationsprogrammprodukt

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2007147226A (ja) *	2005-11-30	2007-06-14	Matsushita Electric Ind Co Ltd	フレキシブルヒートパイプおよびその製造方法
US8069907B2 (en) *	2007-09-13	2011-12-06	3M Innovative Properties Company	Flexible heat pipe
KR101801823B1 (ko) *	2017-03-06	2017-11-27	한국과학기술원	폴리머 기반 진동형 히트 파이프 및 제작방법

2020
- 2020-05-18 EP EP20742636.2A patent/EP4139622B8/de active Active
- 2020-05-18 WO PCT/BY2020/000004 patent/WO2021232134A1/en not_active Ceased

Also Published As

Publication number	Publication date
WO2021232134A1 (en)	2021-11-25
EP4139622B1 (de)	2025-01-01
EP4139622B8 (de)	2025-03-26

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