EP4146607A4 - Procédé pour la fabrication d'un verre ayant au moins une traversée électriquement et/ou thermiquement conductrice, verre ayant au moins une traversée électriquement et/ou thermiquement conductrice et utilisation d'un verre ayant au moins une traversée électriquement et/ou thermiquement conductrice - Google Patents
Procédé pour la fabrication d'un verre ayant au moins une traversée électriquement et/ou thermiquement conductrice, verre ayant au moins une traversée électriquement et/ou thermiquement conductrice et utilisation d'un verre ayant au moins une traversée électriquement et/ou thermiquement conductrice Download PDFInfo
- Publication number
- EP4146607A4 EP4146607A4 EP20934816.8A EP20934816A EP4146607A4 EP 4146607 A4 EP4146607 A4 EP 4146607A4 EP 20934816 A EP20934816 A EP 20934816A EP 4146607 A4 EP4146607 A4 EP 4146607A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- glass
- electrically
- thermally conductive
- manufacturing
- thermally
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
- C03C27/02—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing by fusing glass directly to metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
- H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
- H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
- H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/63—Vias, e.g. via plugs
- H10W70/635—Through-vias
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/69—Insulating materials thereof
- H10W70/692—Ceramics or glasses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/14—Conductive material dispersed in non-conductive inorganic material
- H01B1/16—Conductive material dispersed in non-conductive inorganic material the conductive material comprising metals or alloys
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Dispersion Chemistry (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Joining Of Glass To Other Materials (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2020/088633 WO2021223070A1 (fr) | 2020-05-06 | 2020-05-06 | Procédé pour la fabrication d'un verre ayant au moins une traversée électriquement et/ou thermiquement conductrice, verre ayant au moins une traversée électriquement et/ou thermiquement conductrice et utilisation d'un verre ayant au moins une traversée électriquement et/ou thermiquement conductrice |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP4146607A1 EP4146607A1 (fr) | 2023-03-15 |
| EP4146607A4 true EP4146607A4 (fr) | 2024-07-03 |
Family
ID=78467758
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP20934816.8A Pending EP4146607A4 (fr) | 2020-05-06 | 2020-05-06 | Procédé pour la fabrication d'un verre ayant au moins une traversée électriquement et/ou thermiquement conductrice, verre ayant au moins une traversée électriquement et/ou thermiquement conductrice et utilisation d'un verre ayant au moins une traversée électriquement et/ou thermiquement conductrice |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP4146607A4 (fr) |
| CN (1) | CN115776975A (fr) |
| WO (1) | WO2021223070A1 (fr) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2167482A (en) * | 1936-05-15 | 1939-07-25 | Gen Electric | Glass-to-metal seal |
| US3445211A (en) * | 1966-05-10 | 1969-05-20 | Sylvania Electric Prod | Process for sealing connectors in a planar structure |
| US3515530A (en) * | 1966-06-01 | 1970-06-02 | Tokyo Shibaura Electric Co | Process for sealing metal body to glass body |
| AT306274B (de) * | 1968-06-14 | 1973-04-10 | Floatglas Gmbh | Verfahren und Anlage zum Herstellen eines Drahtglasbandes nach dem Floatverfahren |
| JPS51100112A (en) * | 1975-02-28 | 1976-09-03 | Asahi Glass Co Ltd | Hokyosareta furootogarasuno seizohoho |
| JPS5393140A (en) * | 1977-01-26 | 1978-08-15 | Central Glass Co Ltd | Anticorrosive method of glass plate holding metallic wire and anticorrosive structure |
| JP2002124845A (ja) * | 2000-08-07 | 2002-04-26 | Nippon Sheet Glass Co Ltd | 水晶振動子パッケージ及びその製造方法 |
| JP2010235356A (ja) * | 2009-03-30 | 2010-10-21 | Central Glass Co Ltd | 金属線入り板ガラスの製造方法 |
| CN102070120B (zh) * | 2010-12-31 | 2012-09-05 | 东南大学 | 用于微电子系统级封装的高密度转接板的制备方法 |
| DE102015109764A1 (de) * | 2015-06-18 | 2016-12-22 | Infineon Technologies Ag | Eine Laminarstruktur, ein Halbleiterbauelementund Verfahren zum Bilden von Halbleiterbauelementen |
-
2020
- 2020-05-06 EP EP20934816.8A patent/EP4146607A4/fr active Pending
- 2020-05-06 CN CN202080100576.9A patent/CN115776975A/zh active Pending
- 2020-05-06 WO PCT/CN2020/088633 patent/WO2021223070A1/fr not_active Ceased
Non-Patent Citations (1)
| Title |
|---|
| No further relevant documents disclosed * |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021223070A1 (fr) | 2021-11-11 |
| CN115776975A (zh) | 2023-03-10 |
| EP4146607A1 (fr) | 2023-03-15 |
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Legal Events
| Date | Code | Title | Description |
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| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
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| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
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| STAA | Information on the status of an ep patent application or granted ep patent |
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| 17P | Request for examination filed |
Effective date: 20221205 |
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| AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR |
|
| DAV | Request for validation of the european patent (deleted) | ||
| DAX | Request for extension of the european patent (deleted) | ||
| RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 21/60 20060101ALI20240311BHEP Ipc: H01B 1/22 20060101ALI20240311BHEP Ipc: C03C 4/00 20060101ALI20240311BHEP Ipc: C03C 27/00 20060101AFI20240311BHEP |
|
| A4 | Supplementary search report drawn up and despatched |
Effective date: 20240605 |
|
| RIC1 | Information provided on ipc code assigned before grant |
Ipc: H01L 21/60 20060101ALI20240530BHEP Ipc: H01B 1/22 20060101ALI20240530BHEP Ipc: C03C 4/00 20060101ALI20240530BHEP Ipc: C03C 27/00 20060101AFI20240530BHEP |
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| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: EXAMINATION IS IN PROGRESS |
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| 17Q | First examination report despatched |
Effective date: 20260312 |