EP4221472A4 - Module de caméra - Google Patents

Module de caméra Download PDF

Info

Publication number: EP4221472A4
Authority: EP; European Patent Office
Prior art keywords: camera module; camera; module
Prior art date: 2020-09-28
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Pending

Application number

EP21873015.8A

Other languages

German (de)

English (en)

Other versions

EP4221472A1 (fr

Inventor

Won Seob Shin

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

LG Innotek Co Ltd

Original Assignee

LG Innotek Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2020-09-28

Filing date

2021-09-28

Publication date

2024-10-30

2021-09-28 Application filed by LG Innotek Co Ltd filed Critical LG Innotek Co Ltd

2023-08-02 Publication of EP4221472A1 publication Critical patent/EP4221472A1/fr

2024-10-30 Publication of EP4221472A4 publication Critical patent/EP4221472A4/fr

Status Pending legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0039—Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2081—Compound repelling a metal, e.g. solder

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Multimedia (AREA)
Signal Processing (AREA)
Physics & Mathematics (AREA)
Electromagnetism (AREA)
Manufacturing & Machinery (AREA)
Structure Of Printed Boards (AREA)
Studio Devices (AREA)

EP21873015.8A 2020-09-28 2021-09-28 Module de caméra Pending EP4221472A4 (fr)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
KR1020200125716A KR20220042655A (ko)	2020-09-28	2020-09-28	카메라 모듈
PCT/KR2021/013244 WO2022065987A1 (fr)	2020-09-28	2021-09-28	Module de caméra

Publications (2)

Publication Number	Publication Date
EP4221472A1 EP4221472A1 (fr)	2023-08-02
EP4221472A4 true EP4221472A4 (fr)	2024-10-30

Family

ID=80846790

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP21873015.8A Pending EP4221472A4 (fr)	2020-09-28	2021-09-28	Module de caméra

Country Status (6)

Country	Link
US (2)	US12389529B2 (fr)
EP (1)	EP4221472A4 (fr)
JP (1)	JP2023544563A (fr)
KR (1)	KR20220042655A (fr)
CN (1)	CN116326216A (fr)
WO (1)	WO2022065987A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
KR20240074257A (ko) *	2022-11-21	2024-05-28	현대모비스 주식회사	전원 공급 장치 및 이를 포함하는 램프 어셈블리
US20250147268A1 (en) *	2023-11-08	2025-05-08	Tdk Taiwan Corp.	Driving mechanism
KR102888239B1 (ko) *	2025-03-17	2025-11-20	주식회사 뉴프렉스	도전성 보강 구조를 갖는 회로 기판

Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20120051004A1 (en) *	2010-08-31	2012-03-01	Kota Tokuda	Electronic Apparatus and Flexible Printed Circuit Board
US20150264806A1 (en) *	2014-03-14	2015-09-17	Kabushiki Kaisha Toshiba	Printed wiring board
US20190106607A1 (en) *	2016-05-23	2019-04-11	Tatsuta Electric Wire & Cable Co., Ltd.	Conductive Adhesive Composition
JP2019121803A (ja) *	2018-01-04	2019-07-22	サムソンエレクトロ−メカニックスカンパニーリミテッド．	プリント回路基板及びこれを含むカメラモジュール
KR20200000938A (ko) *	2018-06-26	2020-01-06	엘지이노텍 주식회사	카메라 모듈 및 이를 포함하는 광학 기기

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4289335B2 (ja) *	2005-08-10	2009-07-01	セイコーエプソン株式会社	電子部品、回路基板及び電子機器
JP6499925B2 (ja)	2015-06-02	2019-04-10	タツタ電線株式会社	フレキシブルプリント配線板、フレキシブルプリント配線板用補強部材、及びフレキシブルプリント基板
JP2018006536A (ja) *	2016-06-30	2018-01-11	東洋インキＳｃホールディングス株式会社	部品搭載基板およびその製造方法、積層体、電磁波遮蔽シート並びに電子機器
JPWO2018147424A1 (ja)	2017-02-13	2019-12-12	タツタ電線株式会社	プリント配線板
JP6371460B1 (ja)	2017-12-06	2018-08-08	タツタ電線株式会社	配線基板用補強板

2020
- 2020-09-28 KR KR1020200125716A patent/KR20220042655A/ko active Pending
2021
- 2021-09-28 US US18/246,612 patent/US12389529B2/en active Active
- 2021-09-28 JP JP2023519505A patent/JP2023544563A/ja active Pending
- 2021-09-28 EP EP21873015.8A patent/EP4221472A4/fr active Pending
- 2021-09-28 WO PCT/KR2021/013244 patent/WO2022065987A1/fr not_active Ceased
- 2021-09-28 CN CN202180065911.0A patent/CN116326216A/zh active Pending
2025
- 2025-08-11 US US19/296,489 patent/US20250374418A1/en active Pending

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20120051004A1 (en) *	2010-08-31	2012-03-01	Kota Tokuda	Electronic Apparatus and Flexible Printed Circuit Board
US20150264806A1 (en) *	2014-03-14	2015-09-17	Kabushiki Kaisha Toshiba	Printed wiring board
US20190106607A1 (en) *	2016-05-23	2019-04-11	Tatsuta Electric Wire & Cable Co., Ltd.	Conductive Adhesive Composition
JP2019121803A (ja) *	2018-01-04	2019-07-22	サムソンエレクトロ−メカニックスカンパニーリミテッド．	プリント回路基板及びこれを含むカメラモジュール
KR20200000938A (ko) *	2018-06-26	2020-01-06	엘지이노텍 주식회사	카메라 모듈 및 이를 포함하는 광학 기기

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of WO2022065987A1 *

Also Published As

Publication number	Publication date
CN116326216A (zh)	2023-06-23
KR20220042655A (ko)	2022-04-05
JP2023544563A (ja)	2023-10-24
WO2022065987A1 (fr)	2022-03-31
US20250374418A1 (en)	2025-12-04
US20230371170A1 (en)	2023-11-16
US12389529B2 (en)	2025-08-12
EP4221472A1 (fr)	2023-08-02

Legal Events

Date	Code	Title	Description
2022-04-02	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE
2023-06-30	PUAI	Public reference made under article 153(3) epc to a published international application that has entered the european phase	Free format text: ORIGINAL CODE: 0009012
2023-06-30	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: REQUEST FOR EXAMINATION WAS MADE
2023-08-02	17P	Request for examination filed	Effective date: 20230418
2023-08-02	AK	Designated contracting states	Kind code of ref document: A1 Designated state(s): AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR
2024-01-03	DAV	Request for validation of the european patent (deleted)
2024-01-03	DAX	Request for extension of the european patent (deleted)
2024-09-20	REG	Reference to a national code	Ref country code: DE Ref legal event code: R079 Free format text: PREVIOUS MAIN CLASS: H05K0003000000 Ipc: H04N0023500000
2024-10-30	A4	Supplementary search report drawn up and despatched	Effective date: 20240926
2024-10-30	RIC1	Information provided on ipc code assigned before grant	Ipc: H05K 3/46 20060101ALI20240920BHEP Ipc: H04N 23/57 20230101ALI20240920BHEP Ipc: H05K 9/00 20060101ALI20240920BHEP Ipc: H05K 1/02 20060101ALI20240920BHEP Ipc: H05K 3/00 20060101ALI20240920BHEP Ipc: H04N 23/50 20230101AFI20240920BHEP
2025-12-19	STAA	Information on the status of an ep patent application or granted ep patent	Free format text: STATUS: EXAMINATION IS IN PROGRESS
2026-01-21	17Q	First examination report despatched	Effective date: 20251222

Publication	Publication Date	Title
EP3748946A4 (fr)	2021-10-13	Module de caméra
EP4109173A4 (fr)	2023-03-15	Module de caméra
EP3758357A4 (fr)	2020-12-30	Module de caméra
EP3748428A4 (fr)	2021-12-01	Module de caméra
EP3883232A4 (fr)	2022-08-17	Module de caméra
EP3865938A4 (fr)	2022-07-13	Module de caméra
EP3751835A4 (fr)	2021-06-30	Module de caméra
EP4163717A4 (fr)	2024-07-31	Module de caméra
EP4270923A4 (fr)	2024-06-05	Module de caméra
EP3978999A4 (fr)	2023-07-05	Module de caméra
EP4170425A4 (fr)	2024-07-24	Module de caméra
EP3745701A4 (fr)	2021-10-13	Module de caméra
EP3931549A4 (fr)	2022-11-23	Module de lumière
EP4383004A4 (fr)	2025-08-06	Module de caméra
EP4366318A4 (fr)	2025-05-28	Module de caméra
EP3783430A4 (fr)	2022-01-12	Module de caméra
EP4318118A4 (fr)	2024-09-11	Module de caméra
EP4221472A4 (fr)	2024-10-30	Module de caméra
EP4207729A4 (fr)	2024-02-07	Module de caméra
EP4174573A4 (fr)	2024-07-10	Module de caméra
EP3761097A4 (fr)	2021-04-07	Module de caméra
EP4383003A4 (fr)	2025-05-28	Module de caméra
EP4006637A4 (fr)	2023-02-08	Module de caméra
EP4395345A4 (fr)	2025-08-20	Module de caméra
EP4369093A4 (fr)	2025-05-28	Module de caméra