EP4259997A1 - Cellules chauffantes unitaires ultraminces et flexibles pour furtivité infrarouge - Google Patents

Cellules chauffantes unitaires ultraminces et flexibles pour furtivité infrarouge

Info

Publication number
EP4259997A1
EP4259997A1 EP21835664.0A EP21835664A EP4259997A1 EP 4259997 A1 EP4259997 A1 EP 4259997A1 EP 21835664 A EP21835664 A EP 21835664A EP 4259997 A1 EP4259997 A1 EP 4259997A1
Authority
EP
European Patent Office
Prior art keywords
heat dissipation
conductive tracks
element according
dissipation elements
surface element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP21835664.0A
Other languages
German (de)
English (en)
Other versions
EP4259997B1 (fr
EP4259997C0 (fr
Inventor
Louis GILON
Philippe Guaino
Jules FORTERRE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Centre de Recherches Metallurgiques CRM ASBL
Original Assignee
Centre de Recherches Metallurgiques CRM ASBL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Centre de Recherches Metallurgiques CRM ASBL filed Critical Centre de Recherches Metallurgiques CRM ASBL
Publication of EP4259997A1 publication Critical patent/EP4259997A1/fr
Application granted granted Critical
Publication of EP4259997B1 publication Critical patent/EP4259997B1/fr
Publication of EP4259997C0 publication Critical patent/EP4259997C0/fr
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F41—WEAPONS
    • F41H—ARMOUR; ARMOURED TURRETS; ARMOURED OR ARMED VEHICLES; MEANS OF ATTACK OR DEFENCE, e.g. CAMOUFLAGE, IN GENERAL
    • F41H3/00—Camouflage, i.e. means or methods for concealment or disguise
    • F41H3/02—Flexible, e.g. fabric covers, e.g. screens, nets characterised by their material or structure

Definitions

  • the present invention relates to a multilayer, ultra-thin and flexible system of unit heater cells, obtained by printed electronic technology, for infrared (IR) stealth.
  • IR infrared
  • the invention could also be used in applications in fields like aeronautics or automotive industry, for providing customized heating parts regarding localized areas, such as for example in defrost applications.
  • the idea at the basis of the present invention is therefore to be able to couple both camouflage in the visible while being stealthy in the infrared, either by blending into the environment (i.e. becoming “invisible”) or by adjusting the thermal signature to dupe the enemy.
  • Document US 8,077,071 B2 discloses a number of systems and assemblies for simultaneous adaptive camouflage, concealment and deception.
  • the assemblies that can be used in the systems include a vinyl substrate layer and a miniaturized thermoelectric device array secured to the vinyl substrate layer.
  • the miniaturized thermoelectric device array is configured to provide an adaptive thermal signature to a side of the miniaturized thermoelectric device array that faces outward from the vinyl substrate layer.
  • a flexible image display matrix can be secured on the vinyl substrate layer, said flexible image display matrix being configured to display visual images.
  • a laminate layer can be secured over the vinyl substrate layer covering the flexible image display matrix and the miniaturized thermoelectric device array to provide protection and strengthen the assemblies.
  • One or more nanomaterials can be disposed on the vinyl substrate layer or the laminate layer to provide thermal or radar suppression.
  • thermoelectric (Peltier effect) modules disposed between the target object and an IR detector.
  • the screen formed of a number of thermoelectric units, is coupled to the target object, and the thermoelectric unit includes a thermoelectric cooler (TEC) module coupled to a plate formed of a material selected from aluminium, copper, or aluminium with copper, the plate being substantially larger than the TEC module.
  • TEC thermoelectric cooler
  • Document WO 2012/169958 A1 discloses a device for signature adaptation, comprising at least one surface element arranged to assume a determined thermal distribution, wherein said surface element comprises at least one temperature generating element arranged to generate a predetermined temperature gradient to a portion of said surface element.
  • the surface element also comprises at least one radar suppressing element, wherein said radar suppressing element is arranged to suppress reflections of incident radio waves.
  • the invention also concerns an object provided with a device for signature adaptation. A full coverage is obtained thanks to interchangeable and honeycomb-like hexagonal unitary panels structure, with good spatial resolution.
  • this solution is complex, expensive to develop, not easy to attach on site and does not provide visible dissimulation (not embedded).
  • Document US 9,777,998 B1 discloses a device provided for camouflaging an object from an infrared detection apparatus.
  • the device includes a cloak positionable between the object and the infrared detection apparatus.
  • the cloak includes a layer of infrared absorptive material including a plurality of silicon nanowires.
  • a flexible substrate has a first surface operatively connected to an inner surface of the layer.
  • the substrate includes a heat dissipation arrangement for dissipating heat generated by the cloak during operation.
  • An array of infrared emitters is operatively connected to a second surface of the substrate. The array of infrared emitters selectively radiates an infrared pattern to disguise the object to the infrared detection apparatus.
  • the heat dissipation arrangement includes a channel formed in the flexible substrate and adapted for receiving a cooling fluid therein.
  • the heat dissipation arrangement further includes a pump for recirculating the cooling fluid through the channel.
  • Each IR emitter is electrically connected to a corresponding contact by a corresponding line, each contact is operatively connected to a processing unit, e.g. a controller.
  • the controller is configured to selectively actuate each IR emitter such that each actuated IR emitter transmits an infrared signal that is visible to IR reader.
  • Document FR 2 733 311 A1 discloses a fibre optics network having a grid of fibre optic cables with a section having the sleeve removed and fed from an input point. Different infrared bands are generated and radiated from one of the optical lines. The system measures the background radiance in the different infrared bands and sets the radiated levels to provide camouflage. The optical cables are embedded in a flexible outer section.
  • Document CN 110058428 A relates to a carbon material based double-sided active infrared emissivity adjustment thin film, in particular to a thin film material based on a carbon material (including graphene, carbon nanotubes, amorphous carbon, carbon black and the like) and ionic liquid.
  • a flexible device with double-sided infrared radiation control can be realized through a voltage regulation mode, with low working voltage and power consumption, large emissivity adjusting amplitude and simple structure.
  • the adjustment thin film is suitable for large-scale production, has good mechanical bending performance, can be widely applied to infrared camouflage or stealth on the surfaces of automobiles, ships, airplanes, satellites and the like, and can also be applied to the surfaces of batteries, micro-nano satellites and the like to realize temperature control.
  • the present invention aims to provide an efficient active IR stealth system, which is inexpensive, light and not bulky as well.
  • Another goal of the invention is to provide a flexible, easy-to-attach, embedded, customizable in terms of shape and/or pattern and object-matching solution.
  • the invention is intended to provide a spatial IR mapping with suitable resolution.
  • a first aspect of the present invention relates to an ultrathin, multilayer and encapsulated surface element for providing thermal signature adaptation with the purpose of infrared stealthing, and being also suited for camouflage in the visible, the element being flexible and comprising :
  • an intermediate layer comprising a plurality of conductive tracks connectable to a power supply ;
  • each dissipation element comprises an electric conductive path extending between a first connection and a second connection connecting respectively said dissipation element to least two of the conductive tracks, said element dissipating providing the temperature increase throughout said path from the first connection to the second connection when the current is fed, the heat dissipation elements and the conductive tracks being printed on the insulation substrate ;
  • the heat dissipation elements having a size and being organized according to a spatial arrangement so as to provide a predetermined infrared spatial resolution, when a current is fed into said dissipation elements.
  • the surface element additionally comprises one or a suitable combination of the following features :
  • the spatial arrangement is a two-dimensional array of cells or pixels comprising heat dissipation elements regularly spaced in two orthogonal directions, each cell or pixel being independently connectable to the power supply via the conductive tracks ;
  • the spatial arrangement is a two-dimensional array of cells or pixels comprising heat dissipation elements regularly spaced in two orthogonal directions, each cell or pixel being connectable in a multiplexed manner to the power supply via the conductive tracks ;
  • the heat dissipation elements are made of carbon containing material, PTC ferroelectric material or any resistive material having a resistance higher than the resistance of the conductive tracks ;
  • the carbon-containing heat dissipation elements are made of carbon black, amorphous carbon, graphite, graphene nanoplatelets or carbon nanotubes ;
  • the resistive material having a resistance higher than the conductive tracks is made of tungsten, a metallic alloy such as nichrome (NiCr), a transparent conducting oxide (TCO) film material such as aluminium-doped zinc oxide (AZO) or indium tin oxide (ITO), or a transparent conducting polymer such as Poly(3,4-ethylenedioxythiophene) PEDOT: poly(styrene sulfonate) PSS ;
  • the conductive tracks are made of silver, gold, copper, aluminium or zinc ;
  • the heat dissipation elements and the conductive tracks attachment to the substrate is obtained by inkjet, screen printing or serigraphy, flexography or sintering or other printing electronic deposition methods, possibly combined with heating or radiation such as oven, IPL, IR, UV, laser, and in particular 3D printing electronic deposition methods, such as spray with stencil, micro spray, 3D inkjet or ink dispensing ;
  • the insulation substrate is made of a glass plate or of a polyimide film ;
  • each cell comprises a module of conductive tracks having an input electrode and an output electrode, said input electrode and said output electrode having the form of interdigitated combs, and comprising an array of heat dissipation elements having the form of studs connected between the respective teeth of the interdigitated combs ;
  • each cell or pixel is obtained by firstly printing the module of conductive tracks on the insulation substrate and secondly printing the array of heat dissipation elements onto both insulation substrate and module of conductive tracks, so that the heat dissipation elements are brought into close electrical contact with the module of conductive tracks ;
  • each heat dissipation element has an essentially squared shape with an upper surface and a lower surface, said lower surface being provided with a side recess on two parallel edges, so that the heat dissipation element can be inserted between adjacent teeth of the first electrode and the second electrode respectively ;
  • each cell or pixel has an independent input connection, respectively an independent output connection with the power supply ;
  • each cell or pixel has a multiplexed connection with the power supply, it means that each cell or pixel of the two-dimensional array is powered by selecting respective row and column powering tracks corresponding to the (X, Y) position of the cell in the two-dimensional array ;
  • a flat or surface-mounted (SMD) diode is mounted on each pixel output, so that no leakage current could pass to an adjacent pixel and improperly lighten in whole or in part the corresponding row and column ;
  • a second aspect of the present invention relates to the use of one or more surface elements as described above, for providing an object or a person with a cover, sheet, blanket, casing or roofing capable of adapting the thermal signature of said object or person with the purpose of infrared stealthing, deception, camouflage, decoying or concealment.
  • the plurality of heat dissipation elements selectively radiate a surface infrared pattern allowing to avoid the person or the object covered by said one or more surface elements to be detected by an infrared detection device.
  • FIG. 1 schematically represents the principle of an active system of heating resistors printed on a thermally and electrically resistive substrate, according to the present invention.
  • FIG. 2A and FIG. 2B schematically represent architectures for an active system according to the present invention, under the form of 3X3 independent heater modules, respectively of 10x10 multiplexed modules.
  • FIG. 3A and FIG. 3B schematically represent embodiments according to FIG. 1 , wherein the thermally and electrically resistive substrate is a metal substrate covered with a dielectric layer, respectively a glass substrate.
  • FIG. 4A schematically represents an embodiment according to FIG. 1 , wherein the active material is a ferroelectric positive temperature coefficient (PTC) material.
  • FIG. 4B schematically represents a module comprising the active material of FIG. 4A, wherein the module is obtained by the superposition of a conductive layout and a T-dependent resistive layout.
  • PTC ferroelectric positive temperature coefficient
  • FIG. 5A schematically represents an embodiment according to FIG. 4A, wherein the substrate is made of glass.
  • FIG. 5B is a picture of a demonstrator according to FIG. 5A, with 3x3 independent heater modules.
  • FIG. 6A schematically represent an embodiment especially designed to be used in the case of multiplexed modules and wherein the substrate is made of a polyimide layer (Kapton®).
  • FIG. 6B represents a detail view showing the dielectric elements provided for track separation in the embodiment of FIG. 6A.
  • FIG. 7 shows a video excerpt of a IR pattern radiated using a 3x3 independent cells demonstrator according to an embodiment of the invention, said pattern being visualized with a computer equipped with a IR camera.
  • FIG. 8 shows a multiplexed cells demonstrator in which the activation of a pixel induces leakage current and residual lightning in the row and the column corresponding to this pixel.
  • FIG. 9 is a picture of a demonstrator corresponding to the configuration of FIG. 8, in which a SMD diode has been inserted at the output of each pixel in order to solve the above-mentioned leakage issue.
  • FIG. 10 shows an example of IR pattern radiated using a multiplexed cells demonstrator according to an embodiment of the invention, said pattern being visualized with a tablet computer equipped with a thermal camera (FLIR Systems, Inc.).
  • the present invention is based on an active (i.e. controllable) system 1 of heating resistors 2 printed on a thermally and electrically resistive substrate 3, as shown in FIG. 1 .
  • the resistive heating layer 2 printed on the resistive substrate 3 can be made of metal itself (e.g. silver conductive paste) or of a carbon-based material with power feeds under the form of a conductive layer 4 made of silver (or copper, aluminium, etc.).
  • the underlying principle is that the heating element 2 is based on different resistivity between carbon and silver.
  • Useful printing techniques are for example serigraphy (also called screen printing or silkscreen), inkjet, flexography, sintering and other printing electronic deposition methods, possibly combined with heating or radiation (oven, IPL, IR, UV, laser, etc.).
  • other new 3D printing electronic deposition methods can also be used, such as spray (with stencil), micro spray, 3D inkjet , ink dispensing, etc.
  • direct printing can be performed on 3D objects.
  • the whole multilayer system is finally encapsulated by an insulating protective layer 5 obtained for example by serigraphy or spraying and made of off-the-shelf dielectric components such as oxides (e.g. AI2O3, ZnO, TiO2, etc.), polymers (polycarbonate, polyimide, PE, PP, PET, PVC, etc.) or ceramic-based materials.
  • the IR stealth technology according to the invention is intended to provide two functions :
  • FIG. 2A shows 3x3 independent modules 10 (from the point of view of power feeding) and a second example (FIG. 2B) shows 10x10 multiplexed modules 100.
  • the independent modules 10 have each an independent power feed while in the multiplexed module 100, a specific module is chosen by power feeding a specific line and a specific column (matrix power feed).
  • one module 10 equals one pixel (FIG. 2A).
  • the resistive elements 2 e.g. made of carbon containing material
  • conductive tracks 4 e.g. made of silver
  • each cell or pixel 10 can be activated independently.
  • each module may comprise 4 pixels.
  • a power supply distributes the current to the pixels either sequentially or by selecting/programming a specific pixel to heat in a matrix way (selection of a row and a column).
  • Each cell or pixel has a multiplexed connection with the power supply, it means that each cell or pixel of the two-dimensional array is connected to a “column” input electrode and to a “row” output electrode (or vice versa) so that a determined pixel in position (X, Y) is powered by selecting respective row and column powering tracks in the two- dimensional array.
  • Row and column powering tracks suitably overlap in the array thanks to positioning dielectric elements 7 preventing electric contacts at the crossover points of the row and column powering tracks (see below).
  • a metallic support 3 as a substrate covered with an insulating layer (dielectric) 6.
  • the dielectric layer 6 was a PVC material layer having a thickness up to 200pm.
  • Conductive tracks 4 were obtained by screen printing of silver-based microparticles.
  • the layout (architecture) was made of linear simple tracks. Simulations showed an important heat dissipation through the underlying metal substrate and a non-uniform increase of temperature in a hexagonal full silver motif/heater module was observed (not shown).
  • an active material 20 under the form of a ferroelectric positive temperature coefficient (PTC) material, was used as carbon resistive material, in combination with conductive silver tracks 4, as described above (FIG. 4A).
  • PTC ferroelectric positive temperature coefficient
  • Each cell belongs to an array making a heat dissipation element and is obtained by the superposition of a silver layout 4 on a carbon layout 20 (FIG. 4B), which will be described with more details here below.
  • Each cell 10, 100 comprises a module of conductive tracks 4 having an input electrode 11 , 101 and an output electrode 12, 102, having the form of two interdigitated combs, and comprising an array of heat dissipation elements 20 connected between the respective teethes 13, 103 of the interdigitated combs.
  • respective 10, 11 , 12, etc. and 100, 101 , 102, etc. reference signs refer to the embodiments with 3X3 independent heater modules and 10x10 multiplexed heater modules.
  • the “cell” element can also be referred to as a “pixel” with reference to the IR spatial resolution of the device.
  • each cell or pixel 10, 100 is obtained by firstly printing, for example by screen printing, the module of conductive tracks 4 on the insulating substrate 3, 30 and secondly printing the array of heat dissipation elements 20 onto both insulation substrate 3, 30 and module of conductive tracks 4, so that the heat dissipation elements are brought into close electrical contact with the module of conductive tracks 4.
  • Each heat dissipation element has preferably a squared shape with an upper surface and a lower surface, said lower surface being provided with a side recess 21 on two edges, so that the heat dissipation element can be inserted between adjacent teethes 13, 103 of the first electrode 11 , 101 and the second electrode 12, 102 respectively (see FIG. 4A).
  • the non-multiplexed heater motif size is: 4x4 cm 2 (see FIG. 5A and FIG. 5B).
  • the material is composed of silver tracks having outside input/output electrode width of 10mm and interdigitated width of 0.4mm.
  • the PTC carbon resistor is made of 100 small square units (2x2mm 2 ).
  • a temperature of about 50°C was obtained after 30s with a current of 210mA.
  • a high spatial resolution is obtained with self-regulation, low current, homogeneity.
  • the drawbacks are wide current feeds and a non-flexible substrate (glass).
  • Kapton® polyimide film, DuPontTM
  • PTC ferroelectrics
  • a heater motif of 4x4cm 2 is provided with 9 stealth cells with Ag tracks of 10mm width, Ag interdigitated tracks of 0.4 mm width and 100 units PTC-C resistors pixels of 2x2mm 2 .
  • the substrate is Kapton®.
  • FIG. 7 An example of obtainable IR pattern is shown on FIG. 7.
  • the architecture is a 10x10 multiplexed configuration.
  • the multiplexed solution has a number of advantages : save space, reduce the number of connectors needed to power the device (for 10x10 multiplexed, 20 connectors instead of 200 connectors for 10x10 independent cells and no space available in the center), easier control of IR cartography.
  • a dielectric layer 7 e.g. AI2O3 is provided for electrode separation (FIG. 6B).
  • the stealth cells are provided with Ag tracks of 1 mm width, Ag interdigitated of 0.4 mm width and 9 units PTC-C resistors pixels of 2x2mm 2 .
  • the substrate is Kapton®.
  • the heater motif unit is 1.2x1.2cm 2 .

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Surface Heating Bodies (AREA)

Abstract

La présente invention concerne un élément de surface ultramince, multicouche et encapsulé (1) destiné à fournir une adaptation de signature thermique avec pour but la furtivité infrarouge, et étant également approprié pour le camouflage dans le visible, l'élément comprenant : une couche inférieure constituée d'un substrat isolant (3, 30) ; une couche intermédiaire comprenant une pluralité de pistes conductrices (4) pouvant être connectées à une alimentation électrique ; une pluralité d'éléments actifs de dissipation de chaleur (2, 20) connectés aux pistes conductrices (4) dans la couche intermédiaire et capables de fournir une augmentation de température dans un intervalle de temps donné lorsqu'un courant est amené dans lesdits éléments de dissipation de chaleur ; une couche supérieure constituée d'une couche protectrice (5). L'invention est caractérisée en ce que les éléments de dissipation de chaleur (2, 20) et les pistes conductrices (4) sont imprimés sur le substrat isolant (3, 30) et en ce que les éléments de dissipation de chaleur (2) ont une taille et sont organisés selon un agencement spatial de manière à fournir une résolution spatiale infrarouge prédéterminée, lorsqu'un courant est amené dans lesdits éléments de dissipation.
EP21835664.0A 2020-12-10 2021-12-07 Cellules d'unité de chauffage multicouche ultra mince et souple pour camouflage infrarouge Active EP4259997B1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP20213140.5A EP4012325A1 (fr) 2020-12-10 2020-12-10 Cellules d'unité de chauffage multicouche ultra mince et souple pour camouflage infrarouge
PCT/EP2021/084634 WO2022122753A1 (fr) 2020-12-10 2021-12-07 Cellules chauffantes unitaires ultraminces et flexibles pour furtivité infrarouge

Publications (3)

Publication Number Publication Date
EP4259997A1 true EP4259997A1 (fr) 2023-10-18
EP4259997B1 EP4259997B1 (fr) 2024-11-06
EP4259997C0 EP4259997C0 (fr) 2024-11-06

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Family Applications (2)

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EP20213140.5A Withdrawn EP4012325A1 (fr) 2020-12-10 2020-12-10 Cellules d'unité de chauffage multicouche ultra mince et souple pour camouflage infrarouge
EP21835664.0A Active EP4259997B1 (fr) 2020-12-10 2021-12-07 Cellules d'unité de chauffage multicouche ultra mince et souple pour camouflage infrarouge

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP20213140.5A Withdrawn EP4012325A1 (fr) 2020-12-10 2020-12-10 Cellules d'unité de chauffage multicouche ultra mince et souple pour camouflage infrarouge

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EP (2) EP4012325A1 (fr)
WO (1) WO2022122753A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116086246B (zh) * 2023-01-19 2025-01-24 中国人民解放军军事科学院国防工程研究院 一种自适应红外伪装的仿山石薄壳及其制作方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2733311B1 (fr) 1992-12-15 1998-01-02 Thomson Brandt Armements Dispositif de camouflage auto-adaptatif
US7102814B1 (en) * 2004-08-30 2006-09-05 The United States Of America As Represented By The Secretary Of The Navy Personal portable blankets as an infrared shielding device for field activities
IL186320A (en) 2007-09-25 2014-09-30 Eltics Ltd Adjustable active thermal concealment system
US8077071B2 (en) * 2008-05-06 2011-12-13 Military Wraps Research And Development, Inc. Assemblies and systems for simultaneous multispectral adaptive camouflage, concealment, and deception
SE536136C2 (sv) * 2011-06-07 2013-05-28 Bae Systems Haegglunds Ab Anordning och metod för signaturanpassning
SE536137C2 (sv) 2011-06-07 2013-05-28 Bae Systems Haegglunds Ab Anordning för signaturanpassning
SE538960C2 (sv) * 2013-07-09 2017-03-07 BAE Systems Hägglunds AB Anordning för signaturanpassning och objekt försett med anordning för signaturanpassning
US9777998B1 (en) 2016-09-21 2017-10-03 Wisconsin Alumni Research Foundation Device for camouflaging an object from infrared and low light cameras
CN110058428B (zh) 2019-03-22 2022-12-27 中国空间技术研究院 一种双面主动红外发射率调节薄膜及其制备方法和应用
CN110398180B (zh) * 2019-08-13 2022-04-26 杨婷 一种基于石墨烯超表面的反射式隐身方法

Also Published As

Publication number Publication date
EP4259997B1 (fr) 2024-11-06
EP4012325A1 (fr) 2022-06-15
WO2022122753A1 (fr) 2022-06-16
EP4259997C0 (fr) 2024-11-06

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