EP4315376A1 - Procédé de fabrication d'une structure plane et dispositif - Google Patents

Procédé de fabrication d'une structure plane et dispositif

Info

Publication number
EP4315376A1
EP4315376A1 EP22713642.1A EP22713642A EP4315376A1 EP 4315376 A1 EP4315376 A1 EP 4315376A1 EP 22713642 A EP22713642 A EP 22713642A EP 4315376 A1 EP4315376 A1 EP 4315376A1
Authority
EP
European Patent Office
Prior art keywords
green body
carrier substrate
temperature gradient
temperature
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22713642.1A
Other languages
German (de)
English (en)
Inventor
Stefan Denneler
Carsten Schuh
Thomas Soller
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens AG
Siemens Corp
Original Assignee
Siemens AG
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens AG, Siemens Corp filed Critical Siemens AG
Publication of EP4315376A1 publication Critical patent/EP4315376A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/14—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates
    • H01F41/16—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for applying magnetic films to substrates the magnetic material being applied in the form of particles, e.g. by serigraphy, to form thick magnetic films or precursors therefor
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02K—DYNAMO-ELECTRIC MACHINES
    • H02K15/00—Processes or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines
    • H02K15/02—Processes or apparatus specially adapted for manufacturing, assembling, maintaining or repairing of dynamo-electric machines of stator or rotor bodies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0206—Manufacturing of magnetic cores by mechanical means
    • H01F41/0233—Manufacturing of magnetic circuits made from sheets

Definitions

  • the invention relates to a method for producing a planar structure according to the preamble of patent claim 1 and a device for carrying out the method according to patent claim 12.
  • a new process for the production of planar structures is screen or stencil printing.
  • a printing paste is first produced, which is then printed using a screen and/or stencil printing technique processed into a green body in a thick layer and then the resulting green body is converted into a metallically structured component, hereinafter referred to as a planar structure, by thermal treatment such as debinding and sintering.
  • a planar structure can be an electrical steel sheet, for example, with a stacking of a large number of these electrical steel sheets leading to a magnetic sheet stack for an electrical machine.
  • Such a method is described, for example, in WO 2020/099052A1.
  • the green body is printed onto a carrier substrate, with good wetting and thus adhesion of the printing paste to the substrate being desirable in order to ensure a flawless printed image.
  • the green body Before thermal processing, the green body must then be detached from the carrier substrate.
  • the release of the bond between the carrier and the green body represents a critical process step insofar as the green body, which is typically around 100 ⁇ m thick, can easily be damaged if the force is too great or unfavorable.
  • the iron particles essentially a polymer-based matrix and filler particles, so that it can be handled in itself, but has a certain sensitivity. It is thus easily possible to induce cracks due to the mechanical stresses introduced, which are disadvantageous in the further course of the process with regard to the dimensional accuracy or the freedom from defects of the resulting planar structure.
  • the object of the invention is to provide a process technology that is more reliable than the prior art and to reduce the scrap rate in the production of planar structures.
  • the method according to claim 1 comprises the following steps:
  • the carrier substrate is tempered in such a way that a temperature gradient is generated on its surface under the green body
  • a planar structure is an essentially flat, sheet-like structure that is significantly larger in its extent in a plane of propagation than in its height.
  • a green body is understood to be a preliminary body for subsequent heat treatment.
  • a green body is in itself Generally mechanically self-supporting and with limited mechanical loading capacity.
  • the heat treatment in particular in the form of a sintering process, in which, unlike in a melting process, individual grains in the green body form a cohesive, materially connected structure through diffusion processes, the green body is converted into a sintered body. After the heat treatment described and the resulting mechanical hardening, the structure is said to be planar.
  • a screen printing process is understood to mean a process in which a paste is applied to a substrate, for example by means of a squeegee, resulting in a layer which usually has a thickness in the range between 70 gm and 150 gm.
  • the paste is only printed on the substrate in certain uncovered areas that are kept free by means of a stencil. As a rule, the paste is printed through a screen, but this is not absolutely necessary. Stencil printing without using a screen is also subsumed under the term screen printing process.
  • a carrier substrate is a self-supporting structure with a surface that is as smooth as possible.
  • the surface is intended to be used to print the green body on it, with another thin layer being optionally applied between the surface and the green body, for example in the form of an adhesion promoter layer. In this case, too, it is said that the green body is printed onto the surface of the carrier substrate.
  • the carrier substrate can also have other elements such as a frame, a carrier plate and/or temperature control elements, which are joined together accordingly.
  • the surface of the carrier substrate extends in a surface plane that is as planar as possible. The method described makes it possible to detach the green body from the carrier substrate safely and cleanly.
  • tensile and/or compressive and/or shearing stresses are generated due to the different coefficients of thermal expansion of the substrate and the green body, which support detachment of the green body from the substrate.
  • the intensity of these tensile, compressive and shear stresses is selected by the value ranges described with regard to the temperature gradient and with regard to the expansion thereof in such a way that they just support detachment of the green body from the surface, but do not represent any damage to the green body itself .
  • the temperature gradient extends over a distance of at least 10 mm.
  • the temperature gradient runs as far as possible over the entire surface level of the carrier substrate under the green body.
  • the temperature gradient is allowed to run to the opposite end of the green body.
  • the temperature gradient over the described extension has an absolute value of 100 K.
  • the tensile, compressive and shearing stresses that occur under the green body over this temperature range are suitable for detaching it.
  • temperature gradients between 70 K and 150 K are well suited to achieve the described effect.
  • This alternating temperature gradient should therefore be at least 10 mm and after at least another 10 mm (i.e. after a total propagation of at least 20 mm) with a reversed sign, until it can assume the original sign again after a further 10 mm, for example.
  • local tensile, compressive and shear stresses are induced due to the different coefficients of expansion, with the absolute temperature gradient being kept comparatively small.
  • the 10 mm intervals mentioned are a lower limit within which the desired effect can still be achieved in a technically feasible manner.
  • These can also be selected to be higher, in particular in the case of alternating temperature gradients, these can also be higher than the 0.5 K/mm described, for example 1 K/mm.
  • the surface of the carrier substrate prefferably has an average roughness Ra which is less than 0.5 gm, particularly preferably less than 0.2 gm and very particularly preferably less than 0.09 gm.
  • the abbreviation Ra for the arithmetic average roughness is standardized according to DIN EN ISO 4287:2010. To determine this measured value, the surface is scanned over a defined measuring section and all differences in height and depth of the surface are recorded. After calculating the specific integral of this roughness curve on the measuring section, this result is finally divided by the length of the measuring section.
  • a very smooth surface of the carrier substrate supports the removability of the green body from the surface in addition to the measures mentioned using temperature gradients.
  • the finer the surface the easier it is to remove the green body.
  • this is also on the surface surface of the carrier substrate adheres, so that the application of a bonding agent layer between the surface of the carrier substrate and the green body to be printed on it is expedient.
  • the feature according to claim 1, according to which the green body is printed on the surface of the carrier substrate is also to be understood in such a way that the described adhesion-promoting layer can also be arranged between the surface of the carrier substrate and the green body.
  • temperature control elements to be arranged underneath the carrier substrate.
  • These temperature control elements are preferably Peltier elements.
  • the green body is expedient for the green body to be dried on the carrier substrate after the green body has been printed. Drying the green body on the carrier substrate also facilitates removal of the green body and is an advantage over drying after the green body has been removed.
  • planar structures are produced according to the method described and these are stacked one on top of the other to form a three-dimensional structure. This is particularly useful for constructing a laminated core for an electrical machine.
  • the planar structures are designed as magnetic sheets.
  • a further component of the invention is a device for carrying out a method according to one of the preceding claims.
  • This device comprises a carrier substrate with a surface for applying a green body by means of a screen printing process and a surface opposite lying substrate underside, wherein tempering elements are arranged on or in the Substratun underside.
  • the device described has the same advantages that have already been presented for the method explained above. It is expedient here if the temperature control elements are designed in the form of Peltier elements or in the form of fluid channels.
  • FIG. 3 shows a plan view of a carrier substrate with a screen printing stencil
  • FIG. 4 shows a plan view of a carrier substrate with a green body printed thereon and the representation of a temperature gradient
  • FIG. 5 shows an analog representation according to FIG. 4 with a different temperature gradient
  • FIG. 6 shows a representation analogous to FIG. 4 with radial temperature gradients
  • FIG. 7 shows a three-dimensional representation of a typical planar structure
  • FIG. 8 shows a three-dimensional structure composed of a large number of planar structures in the form of a laminated core for an electrical machine
  • FIG. 9 shows a laminated core similar to that in FIG. 8 mounted on a shaft as a rotor for an electrical machine.
  • individual method steps for producing a planar structure 2 are shown in sub-figures a), b) and c).
  • a screen printing process 4 is described schematically in FIG.
  • a printing paste not shown here, is printed by the squeegee 4 through a printing template 38 (cf. FIG. 3), so that the green body 6 adheres to a surface 8 of the carrier substrate.
  • the printing template 38 is mounted in a printing frame 36 according to FIG. 3, with a screen being able to be clamped in the printing frame 36, which screen is not illustrated here.
  • the screen serves to distribute the printing paste evenly on the surface 8 of the strate 10 Suspend. Whether a screen is used or not depends on the rheological properties of the printing paste. Therefore, the term “stencil printing” is generally subsumed under the generic term "screen printing”.
  • the method described is based on the task of simplifying the separation of the printed green body as much as possible.
  • the green body there is also the need for the green body to adhere well to the surface 8 of the substrate during printing.
  • an adhesion-promoting layer 18 is often applied for this purpose (cf. FIGS. 2a) and 2b)).
  • the surface 8 is a polished metal surface which has an average roughness Ra of 0.3 ⁇ m.
  • the drying device 40 can be an infrared heater, for example.
  • a heat treatment furnace in the form of a continuous furnace 42 is also shown schematically.
  • the Continuous furnace 42 has a heating chamber 43 through which the green bodies 6 detached from the carrier substrate are conveyed on a conveyor belt 44 and are thereby subjected to a heat treatment process in the form of a sintering process. After the green bodies 6 have left the heating chamber 43 , they are referred to as planar structures 2 .
  • the continuous furnace 42 can also include areas that are at a lower temperature and can contribute to debinding or additional drying of the green body.
  • Temperature control elements 20 are attached to or in a substrate underside 30 of the carrier substrate 10 .
  • the tempering elements 20 are in the form of Peltier elements 22, which are arranged on the underside 30.
  • Each of the Peltier elements 22 can be controlled in such a way that a very specific temperature can be applied to the carrier substrate 10 and then to its surface 8 or perpendicular to the carrier substrate 10 on its surface plane 16 . Since each Peltier element 22 can generate a different temperature by electrical control, it is possible to represent a temperature gradient 14 in the surface plane 16 len. The different temperature gradients 14 and their configuration are explained in FIGS. 4-6 by way of example.
  • FIG. 2b An alternative embodiment of the temperature control elements 20 is shown in FIG. 2b) in the form of fluid channels 32.
  • the fluid channels 32 are integrated in the underside 30 of the carrier substrate 10 .
  • the fluid channels 32 run, for example, in a meandering or circular manner, depending on the design of the temperature gradient 14.
  • a temperature gradient 14 can be created by introducing a fluid at a specific temperature into the fluid channel 32 are generated because the fluid constantly emits heat to the carrier substrate 10 as it passes through the meander-shaped fluid channel 32 and thus increasingly has a lower temperature.
  • the temperature gradient 14 runs in the surface plane 16 of the carrier substrate 10 from one end of the green body 6 to its other end. This is a single specific propagation direction of the temperature gradient 14.
  • a relatively high absolute temperature gradient over the entire surface plane 16 can be achieved with a temperature gradient of 0.5 K/mm ( temperature gradients between 70 K and 150 K are desirable. If the green body 6 has a diameter of 150 mm, for example, the temperature gradient 14 over its dimension 17 is 75° C. at a gradient of 0.5 K/mm Surface 8 below the Grünkör pers 6 at the beginning of the temperature gradient, for example 20°
  • the absolute value of the temperature difference is 105 K when the temperature gradient is 140.7 K/mm.
  • the temperature gradient 14 mentioned and the absolute temperatures occurring therein are harmless for the mechanical properties of the green body 6 .
  • the green body is larger, for example 250 mm in diameter, then with a gradient of 0.5 K/mm, there is a temperature difference of 175° C. This could already lead to changes in the structure of the green body.
  • This temperature gradient 14 and 14' according to FIG. 5 can of course also be increased, so that a temperature gradient in the range between 70 and 150° C. also occurs in the extent 17 described here, for example if the temperature gradient is 4 K/mm.
  • the design of the temperature gradients 14 and 14′ can always be adapted based on the expansion coefficients of the material used for the carrier substrate 10 and the green body 6 produced.
  • a polished metal disc for example a stainless steel disc, is usually used as the material for the carrier substrate.
  • FIG. 1 An alternative embodiment of the temperature gradient 14 and 14' is shown in FIG. This temperature gradient serves 14 and 14' is configured alternately as in FIG. 5, but in the form of concentric circles which run from the center point of the green body to its outside.
  • the temperature gradients described support the safe separation of the green body 6 from the substrate.
  • mechanical support is usually required.
  • the separation of the green body 6 from the surface 8 of the carrier substrate 10 can be used in addition to the described temperature gradient 14 using other tools, for example a a vacuum gripper or an electromagnetic gripper, as well as being assisted by a suction roller or by a peeling device such as a wire or a knife.
  • FIG. 7 shows an example of a planar structure 2 produced according to the method described and designed in the form of a magnetic sheet 29 .
  • a large number of these magnetic sheets 29 are stacked together to form a three-dimensional structure 26 in the form of a sheet metal package 28 .
  • Such a laminated core 28 in turn can be mounted on a shaft 46 and thus forms the rotor of an electrical machine, not shown.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Manufacturing Cores, Coils, And Magnets (AREA)
  • Manufacture Of Motors, Generators (AREA)
  • Powder Metallurgy (AREA)
  • Producing Shaped Articles From Materials (AREA)
  • Printing Methods (AREA)

Abstract

L'invention concerne un procédé de fabrication d'une structure plane (2), comprenant les étapes suivantes consistant à : - imprimer un corps vert (6) de la structure (2) sur une surface (8) d'un substrat de support (10) au moyen d'un procédé de sérigraphie (4) ; - retirer le corps vert (6) du substrat de support (10) ; et - traiter thermiquement le corps vert afin de le transformer en structure plane ; caractérisé en ce que la régulation de la température du substrat de support (10) est effectuée de telle sorte qu'un gradient de température (14) est produit sur la surface (8) du substrat de support en dessous du corps vert (6), ce gradient étant au moins égal à 0,5 K/mm le long d'un plan de surface (16) et ayant une étendue (17) dans le plan de surface (16) qui est au moins égale à 10 mm.
EP22713642.1A 2021-05-05 2022-03-10 Procédé de fabrication d'une structure plane et dispositif Pending EP4315376A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
EP21172177.4A EP4086928A1 (fr) 2021-05-05 2021-05-05 Procédé de fabrication d'une structure planaire et dispositif
PCT/EP2022/056212 WO2022233480A1 (fr) 2021-05-05 2022-03-10 Procédé de fabrication d'une structure plane et dispositif

Publications (1)

Publication Number Publication Date
EP4315376A1 true EP4315376A1 (fr) 2024-02-07

Family

ID=75825469

Family Applications (2)

Application Number Title Priority Date Filing Date
EP21172177.4A Withdrawn EP4086928A1 (fr) 2021-05-05 2021-05-05 Procédé de fabrication d'une structure planaire et dispositif
EP22713642.1A Pending EP4315376A1 (fr) 2021-05-05 2022-03-10 Procédé de fabrication d'une structure plane et dispositif

Family Applications Before (1)

Application Number Title Priority Date Filing Date
EP21172177.4A Withdrawn EP4086928A1 (fr) 2021-05-05 2021-05-05 Procédé de fabrication d'une structure planaire et dispositif

Country Status (7)

Country Link
US (1) US20240243644A1 (fr)
EP (2) EP4086928A1 (fr)
JP (1) JP2024522054A (fr)
KR (1) KR20240004884A (fr)
CN (1) CN117242536A (fr)
CA (1) CA3217462A1 (fr)
WO (1) WO2022233480A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP4541487A1 (fr) * 2023-10-19 2025-04-23 Siemens Aktiengesellschaft Procédé de fabrication d'une tôle magnétique, bande de support, paquet de tôles pour une machine électrique et machine électrique

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3686784B2 (ja) * 1999-06-03 2005-08-24 京セラ株式会社 半導体レーザ素子搭載用サブキャリアおよび半導体レーザモジュール
US10097054B2 (en) * 2015-01-30 2018-10-09 Honeywell International Inc. Methods for manufacturing high temperature laminated stator cores
KR102070996B1 (ko) * 2018-10-02 2020-01-29 공주대학교 산학협력단 인쇄 및 레이저 소결 공정을 이용한 세라믹 필름 포함 유연성 소자의 제조방법
EP3654356A1 (fr) * 2018-11-16 2020-05-20 Siemens Aktiengesellschaft Tôle électrique imprimée
EP3723249A1 (fr) * 2019-04-09 2020-10-14 Siemens Aktiengesellschaft Procédé de fabrication d'une tôle magnétique et d'un empilement de tôles magnétiques ainsi que machine électrique et véhicule électrique
EP3809560A1 (fr) * 2019-10-16 2021-04-21 Siemens Aktiengesellschaft Tôle de rotor, procédé de fabrication d'une tôle de rotor et machine électrique
CN111845140B (zh) * 2020-08-12 2025-02-25 天津城建大学 一种无模板激光纳米原位图形化方法及设备
DE202021100809U1 (de) * 2021-02-18 2021-04-26 At&S Austria Technologie & Systemtechnik Aktiengesellschaft Trägervorrichtung zum Tragen einer Komponententrägerstruktur

Also Published As

Publication number Publication date
JP2024522054A (ja) 2024-06-11
CN117242536A (zh) 2023-12-15
US20240243644A1 (en) 2024-07-18
WO2022233480A1 (fr) 2022-11-10
EP4086928A1 (fr) 2022-11-09
KR20240004884A (ko) 2024-01-11
CA3217462A1 (fr) 2022-11-10

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