EP4333048A1 - Bloc de refroidissement pour refroidir un composant électronique générant de la chaleur et son procédé de fabrication - Google Patents

Bloc de refroidissement pour refroidir un composant électronique générant de la chaleur et son procédé de fabrication Download PDF

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Publication number
EP4333048A1
EP4333048A1 EP22306277.9A EP22306277A EP4333048A1 EP 4333048 A1 EP4333048 A1 EP 4333048A1 EP 22306277 A EP22306277 A EP 22306277A EP 4333048 A1 EP4333048 A1 EP 4333048A1
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EP
European Patent Office
Prior art keywords
passage
pin
pins
sinusoidal
pin row
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP22306277.9A
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German (de)
English (en)
Other versions
EP4333048B1 (fr
Inventor
Hadrien Bauduin
Ali Chehade
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OVH SAS
Original Assignee
OVH SAS
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Filing date
Publication date
Application filed by OVH SAS filed Critical OVH SAS
Priority to EP22306277.9A priority Critical patent/EP4333048B1/fr
Priority to US18/236,559 priority patent/US20240074107A1/en
Priority to CA3209876A priority patent/CA3209876A1/fr
Priority to CN202311093358.9A priority patent/CN117631788A/zh
Priority to KR1020230113242A priority patent/KR20240031112A/ko
Publication of EP4333048A1 publication Critical patent/EP4333048A1/fr
Application granted granted Critical
Publication of EP4333048B1 publication Critical patent/EP4333048B1/fr
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23C—MILLING
    • B23C3/00—Milling particular work; Special milling operations; Machines therefor
    • B23C3/28—Grooving workpieces
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/022—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being wires or pins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20254—Cold plates transferring heat from heat source to coolant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/30—Arrangements for thermal protection or thermal control wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid
    • H10W40/305—Arrangements for thermal protection or thermal control wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid the fluid being a liquefied gas, e.g. liquid nitrogen
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/47—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing liquids, e.g. forced water cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23C—MILLING
    • B23C2220/00—Details of milling processes
    • B23C2220/36—Production of grooves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23C—MILLING
    • B23C2220/00—Details of milling processes
    • B23C2220/48—Methods of milling not otherwise provided for
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0029—Heat sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2210/00—Heat exchange conduits
    • F28F2210/02—Heat exchange conduits with particular branching, e.g. fractal conduit arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2210/00—Heat exchange conduits
    • F28F2210/10—Particular layout, e.g. for uniform temperature distribution
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2215/00—Fins
    • F28F2215/04—Assemblies of fins having different features, e.g. with different fin densities
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

Definitions

  • the present technology relates to cooling blocks and methods for manufacturing thereof.
  • Heat dissipation is an important consideration for computer systems.
  • a processor also referred to as central processing unit (CPU)
  • CPU central processing unit
  • Similar considerations arise for systems other than computer systems (e.g., power management systems).
  • different types of cooling solutions are implemented to promote heat dissipation from heat-generating electronic components, with the objective being to collect and conduct thermal energy away from these heat-generating electronic components.
  • multiple electronic systems e.g., servers, networking equipment, power equipment
  • such cooling solutions may be particularly important.
  • a cooling solution is a heat sink which relies on a heat transfer medium (e.g., a gas or liquid) to carry away the heat generated by a heat-generating electronic component.
  • a cooling block (sometimes referred to as a "water block” or “cold plate”) can be thermally coupled to a heat-generating electronic component and water (or other fluid) is made to flow through a conduit in the cooling block to absorb heat from the heat-generating electronic component. As water flows out of the cooling block, so does the thermal energy collected thereby.
  • efficient cooling blocks may be difficult and/or expensive to manufacture.
  • a cooling block for cooling a heat-generating electronic component.
  • the cooling block comprises a body having a thermal transfer surface configured to be placed in thermal contact with the heat-generating electronic component, the body defining a fluid conduit for circulating a cooling fluid therein, the fluid conduit having an inlet for receiving the cooling fluid and an outlet for discharging the cooling fluid, the body comprising a plurality of pins for deflecting the cooling fluid within the fluid conduit; the fluid conduit comprising at least one passage extending from a first point to a second point along a longitudinal direction of the cooling block, the second point being downstream from the first point, wherein, for each passage of the at least one passage: the passage is defined in part by first and second internal sidewalls extending from the first point to the second point, each internal sidewall of the first and second internal sidewalls having a scalloped or undulating shape such that the internal sidewall comprises a plurality of rounded sections, a width of the passage being measured between the first and second internal sidewalls in
  • each pin of the at least one pin row has a lanceolate profile.
  • the pins of each pin row are symmetric about the corresponding linear pin axis.
  • the at least one pin row is a single pin row; the first and second internal sidewalls are symmetric about the linear pin axis; and each passage of the at least one passage is catenulate.
  • each passage of the at least one passage comprises a plurality of constricted portions and a plurality of expanded portions; the constricted portions have a first width measured in the lateral direction; the expanded portions have a second width measured in the lateral direction, the second width being greater than the first width; and the constricted and expanded portions are disposed alternatingly in the longitudinal direction.
  • the pins of each pin row are disposed along the expanded portions.
  • consecutive ones of the pins of each pin row have different widths measured along the lateral direction.
  • each pin has a first pointed end and a second pointed end; the linear pin axis extends through one of the first pointed end and the second pointed end of each pin; the pins of the pin row are asymmetric about the linear pin axis; and consecutive ones of the pins of the pin row are symmetric to each other about a plane normal to the linear axis and extending between the consecutive ones of the pins.
  • the at least one pin row is a single pin row; the at least one passage is a plurality of passages including a first passage and a second passage consecutive to the first passage; the linear pin axis of the pin row defining the first passage is parallel to the linear pin axis of the pin row defining the second passage; and the pins of the pin row defining the second passage are offset, in the longitudinal direction, from the pins of the pin row defining the first passage.
  • the at least one pin row is a plurality of pin rows; each internal sidewall of the first and second internal sidewalls has an undulating shape; and each internal sidewall of the first and second internal sidewalls comprises a plurality of convex undulations and a plurality of concave undulations disposed alternatingly; the concave undulations of the first internal sidewall are aligned, in the longitudinal direction, with the convex undulations of the second internal sidewall; and the concave undulations of the second internal sidewall are aligned, in the longitudinal direction, with the convex undulations of the first internal sidewall.
  • the at least one passage is a plurality of passages; each two consecutive passages of the plurality of passages include a first passage and a second passage consecutive to the first passage; the second internal sidewall defining the first passage is adjacent to the first internal sidewall defining the second passage; the concave undulations of the second internal sidewall defining the first passage are aligned in the longitudinal direction with the convex undulations of the first internal sidewall defining the second passage; and the concave undulations of the second internal sidewall defining the first passage are partly aligned, in the lateral direction, with the concave undulations of the first internal sidewall defining the second passage.
  • the at least one pin row is a plurality of pin rows; and for each two consecutive pin rows of the plurality of pin rows: the linear axis traversing the pins of a first one of the two consecutive pin rows is parallel to the linear axis traversing the pins of a second one of the two consecutive pin rows; and the pins of the first one of the two consecutive pin rows are offset, in the longitudinal direction, from the pins of the second one of the two consecutive pin rows.
  • the at least one passage is a plurality of passages.
  • the plurality of pin rows includes first, second and third pin rows, the second pin row being disposed between the first and third pin rows along the lateral direction; each passage of the at least one passage comprises a plurality of constricted portions and a plurality of expanded portions; the constricted portions have a first width measured in the lateral direction; the expanded portions have a second width measured in the lateral direction, the second width being greater than the first width; the constricted and expanded portions are disposed alternatingly in the longitudinal direction; the pins of the second pin row are disposed at the constricted portions of each passage of the at least one passage; and the pins of the first and third pin rows are disposed at the expanded portions of each passage of the at least one passage.
  • each passage of the at least one passage is symmetric about a central linear axis bisecting a width of the passage.
  • a method for manufacturing a cooling block configured to cool a heat-generating electronic component, the method comprising: providing a base for forming part of the cooling block; forming each passage of at least one passage of a fluid conduit of the cooling block by: milling a first channel on a surface of the base following a path defined by a first sinusoidal spline; and milling a second channel on the surface of the base following a path defined by a second sinusoidal spline, the first and second sinusoidal splines extending in a longitudinal direction of the cooling block and being arranged such that the first channel and the second channel are interconnected to each other such that, in use, cooling fluid flowing within the passage flows within the first channel and the second channel; said milling of the first and second channels forming a pin row comprising a plurality of pins aligned such that a linear pin axis extending in the longitudinal direction traverses each pin of the pin row, the pins of the pin row being spaced from each other
  • the first sinusoidal spline and the second sinusoidal spline are symmetric about the linear pin axis.
  • the first sinusoidal spline extends from a first end to a second end; the second sinusoidal spline extends from a first end to a second end; and the first end of the first sinusoidal spline and the first end of the second sinusoidal spline are coincident.
  • said forming the at least one passage further comprises milling the base to remove the pins.
  • each of the first and second sinusoidal splines is centered about a respective linear axis extending in the longitudinal direction, the linear axes about which the first and second sinusoidal splines are centered being spaced from each other in a lateral direction normal to the longitudinal direction.
  • the first and second sinusoidal splines are centered about a common linear axis; and the first and second sinusoidal splines are less than a quarter of a wavelength from being completely out of phase with each other.
  • the at least one passage is a plurality of passages including a first passage and a second passage parallel to the first passage; and each passage of the first and second passages is bounded by first and second internal sidewalls of the passage such that, in use, cooling fluid flowing in the passage is bounded to the passage by the first and second internal sidewalls.
  • the first and second sinusoidal splines are symmetric to each other; the pin row is a first pin row and the plurality of pins is a first plurality of pins; the linear pin axis is a first linear pin axis; forming the at least one passage further comprises milling a third channel on the surface of the base following a third path described by a third sinusoidal spline; the third sinusoidal spline extends in the longitudinal direction of the cooling block and being arranged such that the second channel and the third channel are interconnected to each other such that, in use, cooling fluid flowing within the passage flows within the first, second and third channels; and said milling of the second and third channels forms a pin row comprising a second plurality of pins aligned such that a second linear axis extending in the longitudinal direction traverses each pin of the second pin row, the pins of the second pin row being spaced from each other along the longitudinal direction.
  • a cooling block for cooling a heat-generating electronic component comprising: a body having a thermal transfer surface configured to be placed in thermal contact with the heat-generating electronic component, the body defining a fluid conduit for circulating a cooling fluid therein, the fluid conduit having an inlet for receiving the cooling fluid and an outlet for discharging the cooling fluid; the fluid conduit comprising at least one passage extending from a first point to a second point along a longitudinal direction of the cooling block, the second point being downstream from the first point, wherein, for each passage of the at least one passage: the passage is defined in part by first and second internal sidewalls extending from the first point to the second point, each internal sidewall of the first and second internal sidewalls having a scalloped or undulating shape such that the internal sidewall comprises a plurality of rounded sections, a width of the passage being measured between the first and second internal sidewalls in a lateral direction normal to the longitudinal direction.
  • Embodiments of the present technology each have at least one of the above-mentioned object and/or aspects, but do not necessarily have all of them. It should be understood that some aspects of the present technology that have resulted from attempting to attain the above-mentioned object may not satisfy this object and/or may satisfy other objects not specifically recited herein.
  • Figs. 1 and 2 illustrate a cooling block 100 in accordance with an embodiment of the present technology.
  • the cooling block 100 is configured for cooling a heat-generating electronic component 50 (illustrated schematically in Fig. 2 ).
  • the heat-generating electronic component 50 is a central processing unit (CPU).
  • the heat-generating electronic component 50 may be part of a server operating within a data center.
  • the heat-generating electronic component 50 generates a significant amount of heat and can therefore benefit from cooling.
  • the heat-generating electronic component 50 could be any other suitable heat-generating electronic component (e.g., a graphics processing unit (GPU), a semiconductor, a memory unit, etc.).
  • the cooling block 100 is configured, via the design of a fluid conduit 115 thereof, to promote turbulent flow of cooling fluid within the fluid conduit 115. Increased turbulent flow within the fluid conduit 115 can optimize the heat absorption capability of the cooling block 100, therefore resulting in the cooling block 100 more efficiently absorbing heat from the heat-generating electronic component 50.
  • the cooling block 100 has a body 102 including a base 104 and a cover 106 which are connected to each other.
  • the cover 106 is welded to the base 104 (e.g., via laser welding).
  • the cover 106 may be fixed to the base 104 differently in other embodiments.
  • the base 104 includes a thermal transfer surface 108 disposed on a lower side of the base 104.
  • the thermal transfer surface 108 is configured to be placed in thermal contact with the heat-generating electronic component 50.
  • the thermal transfer surface 108 can be in thermal contact with the heat-generating electronic component 50 whether the thermal transfer surface is in direct contact with the heat-generating electronic component 50 or a thermal interface material (e.g., a thermal paste, a thermal pad, a graphite sheet, etc.) is disposed therebetween with the express intention of improving the heat transfer between the heat-generating electronic component 50 and the cooling block 100.
  • a thermal interface material e.g., a thermal paste, a thermal pad, a graphite sheet, etc.
  • the base 104 and the cover 106 define the internal fluid conduit 115 within which a cooling fluid is circulated to absorb heat from the heat-generating electronic component 50.
  • the internal fluid conduit 115 extends from an inlet 110 to an outlet 112.
  • the inlet 110 and the outlet 112 are disposed near opposite corners of the cooling block 100.
  • the inlet 110 and the outlet 112 could be disposed at different locations in other embodiments.
  • the cooling fluid circulated through the internal fluid conduit 115 is demineralized water.
  • the cooling fluid may be any other suitable cooling fluid (e.g., a refrigerant) in other embodiments.
  • the cooling fluid may be capable of two-phase flow such that the cooling fluid can change phases from liquid to gas and vice-versa based on a temperature thereof.
  • the cooling fluid circulating within the cooling block 100 will thus, at some point, be in the liquid phase, however the cooling fluid may not necessarily be in liquid phase throughout (e.g., the cooling fluid may evaporate from liquid to gas when its temperature reaches a certain value).
  • the cover 106 is received in a pocket 120 ( Fig. 2 ) defined by the base 104 such that a lower surface 114 of the cover 104 is in contact with an upper surface 116 of the base 104.
  • the upper surface 116 and a rim portion 117 of the base 104 define the pocket 120 of the base 104 in which the cover 106 is received.
  • the upper surface 116 is disposed on an upper side of the base 104 (i.e., on an opposite side from the thermal transfer surface 108) and therefore is offset from the thermal transfer surface 108 in a height direction (i.e., along the Z-axis) of the cooling block 100 that is normal to the thermal transfer surface 108.
  • the base 104 may not define a pocket 120 to receive the cover 106 (e.g., the cover 106 may be welded to the base 104 along a periphery thereof).
  • the upper surface 116 of the base 104 is not surrounded by the rim portion 117.
  • a path of the fluid conduit 115 is defined by the base 104 which is manufactured to have a plurality of passages 130 that are designed such as to promote turbulent flow as the cooling fluid flows within the passages 130.
  • the manner in which the base 104 is designed and manufactured will be described in greater detail further below.
  • the cover 106 is a plate member that is generally planar and shaped to be received within the pocket 120.
  • the lower surface 114 of the cover 106 is a flat surface that closes off the fluid conduit 115 from its upper side. It is contemplated that, in other embodiments, the cover 106 could define the path of the fluid conduit 115 in part or in its entirety (e.g., the passages 130 could instead be defined by the cover 106).
  • an inlet connection 125 and an outlet connection 127 are provided on the cover 106 and are in fluid communication with the inlet 110 and the outlet 112 of the fluid conduit 115 respectively.
  • the inlet and outlet connections 125, 127 are connected to additional piping (not shown) to route cooling fluid to the cooling block 100 and discharge cooling fluid from the cooling block 100 respectively.
  • the fluid conduit 115 has an inlet manifold portion 132 that extends from the inlet 110 and an outlet manifold portion 134 that extends from the outlet 112.
  • the passages 130 extend between the inlet and outlet manifold portions 132, 134 thereby fluidly connecting the inlet manifold portion 132 to the outlet manifold portion 134.
  • the passages 130 are parallel to each other and extend in a longitudinal direction (i.e., along the Y-axis) of the cooling block 100.
  • the passages 130 are in a parallel flow configuration whereby cooling fluid flows through the multiple passages 130 in parallel rather than in series. In other words, as cooling fluid flows from the inlet 110 to the outlet 112 of the fluid conduit 115, the cooling fluid flow is split between the passages 130.
  • inlet and outlet manifolds 132, 134 may be omitted.
  • multiple passages 130 may be fluidly connected to each other in series rather than in parallel.
  • each passage 130 extends between an inlet point 131 and an outlet point 133 along the longitudinal direction of the cooling block 100.
  • the outlet point 133 is downstream from the inlet point 131.
  • the inlet and outlet points 131, 133 are located at the inlet and outlet manifold portions 132, 134 respectively.
  • the passage 130 is defined between opposite internal sidewalls 140, 142 extending between the inlet and outlet points 131, 133 and facing each other such that, as cooling fluid flows within the passage 130, the cooling fluid is bound between the internal sidewalls 140, 142.
  • each of the internal sidewalls 140, 142 has a scalloped shape and thus comprises a plurality of rounded sections 144 distributed along the longitudinal direction of the cooling block 100.
  • the rounded sections 144 are uniformly dimensioned, shaped and distributed.
  • Each rounded section 144 has a concave side thereof facing inwardly toward a central linear axis CA that extends along the longitudinal direction of the cooling block 100.
  • the central linear axis CA bisects a width of the passage 130 measured along a lateral direction (i.e., along the X-axis) of the cooling block 100, which is normal to the longitudinal direction.
  • the lateral direction may thus also be referred to as a "passage width direction".
  • the rounded sections 144 of the internal sidewall 140 are aligned with the rounded sections 144 of the internal sidewall 142 along the longitudinal direction such that respective middle points of the rounded sections 144 (i.e., points marking the middle of the lengths of the rounded sections 144 measured in the longitudinal direction) of the internal sidewalls 140, 142 are aligned with each other.
  • the passage 130 is also defined in part by a pin row 150 including a multitude of pins 152 of the base 104.
  • the pins 152 deflect the cooling fluid flowing within the fluid conduit 115 toward either side of the central linear axis CA.
  • the pin row 150 is disposed between the opposite internal sidewalls 140, 142.
  • the pins 152 of the pin row 150 are spaced apart along the longitudinal direction and aligned with each other in the lateral direction such that the central linear axis CA traverses each pin 152.
  • this arrangement of the pin row 150 imparts the passage 130 with a catenulate (i.e., chain-like) shape.
  • the passage 130 has a plurality of constricted portions 154 and a plurality of expanded portions 156 disposed alternatingly along the longitudinal direction and which impart, together with the pins 152, the catenulate shape to the passage 130.
  • the expanded portions 156 of the passage 130 are formed by the rounded sections 144 of the internal sidewalls 140, 142.
  • the constricted and expanded portions 154, 156 are referenced as such due to their relative dimensions.
  • the expanded portions 156 of the passage 130 have a width that is greater than a width of the constricted portions 154.
  • the widths of the constricted and expanded portions 154, 156 are measured along the lateral direction.
  • the pins 152 are disposed along the expanded portions 156 (i.e., the pins 152 of the pin row 150 are contained within respective ones of the expanded portions 156).
  • each pin 152 of the pin row 150 defining the passage 130 has a lanceolate profile along a plane parallel to the thermal transfer surface 108 and traversing the pins 152. More specifically, each pin 152 is shaped like an ellipse albeit with first and second pointed ends 158, 160 opposite each other. As can be seen, in this embodiment, the first and second pointed ends 158, 160 are aligned in the lateral direction and the central linear axis CA of the passage 130 extends through both the first and second pointed ends 158, 160. In fact, in this example, the pins 152 are symmetric about the central linear axis CA. As will be described in other examples below, the pins 152 may be shaped differently in other embodiments.
  • the fluid conduit 115 has seven passages 130 extending parallel to each other, each passage 130 being defined in part by a corresponding pin row 150. It is contemplated that more or fewer passages 130 could be provided in other embodiments.
  • the constricted and expanded portions 154, 156 of consecutive ones of the passages 130 are offset from each other in the longitudinal direction. That is, the constricted portions 154 of a first passage 130 are offset, in the longitudinal direction, from the constricted portions 154 of a second passage 130 that is consecutive to the first passage 130. Rather, the constricted portions 154 of the first passage 130 are aligned, in the longitudinal direction, with the expanded portions 156 of the second passage 130.
  • the pins 152 of consecutive ones of the pin rows 150 are offset from each other along the longitudinal direction.
  • a centerpoint of each pin 152 of a first pin row 150 is offset from the centerpoint of each pin 152 of a second pin row 150 that is consecutive to the first pin row 150. This may be helpful to more closely pack together the passages 130 which can increase the amount of pins 152 defining the fluid conduit 115 and also optimize a thickness of the material between consecutive passages 130, thereby optimizing the cooling provided by the cooling block 100.
  • This configuration of the passages 130 promotes turbulent flow and limits flow separation and recirculation of the cooling fluid as it flows through the fluid conduit 115, contrary to many conventional fluid conduit designs. In turn, this increases the heat absorbing capability of the cooling fluid which can therefore dissipate heat more efficiently from the heat-generating electronic component 50,
  • the fluid conduit 115 is machined, namely milled, onto a piece of material to form the finished base 104.
  • the inlet and outlet manifold portions 132, 134 are already formed prior to machining the passages 130. It is contemplated that the inlet and outlet manifold portions 132, 134 may not yet be formed prior to machining the passages 130. In other embodiments, the inlet and outlet manifold portions 132, 134 may even be entirely omitted. As shown in Fig.
  • a first channel 170 is milled on the upper surface 116 of the base 104 following a path defined by a sinusoidal spline 201.
  • the sinusoidal spline 201 extends in a longitudinal direction of the cooling block 100 from a first end 202 to a second end 204.
  • the first end 202 is located at an edge of the inlet manifold portion 132 and the second end 204 is located at an edge of the outlet manifold portion 134 such that the resulting first channel 170 interconnects the inlet and outlet manifold portions 132, 134.
  • the sinusoidal spline 201 has the shape of a sinusoidal function, therefore oscillating periodically at a given amplitude and defining a plurality of peaks 206 at each half period thereof.
  • a second channel 180 is milled on the upper surface 116 of the base 104 following a path defined by another sinusoidal spline 301.
  • the milling of the channels 170, 180 forms a corresponding pin row 150 as described above.
  • the sinusoidal spline 301 extends in the longitudinal direction of the cooling block 100 from a first end 302 to a second end 304.
  • the first end 302 is located at an edge of the inlet manifold portion 132 and the second end 304 is located at an edge of the outlet manifold portion 134 such that the resulting second channel 180 interconnects the inlet and outlet manifold portions 132, 134.
  • the sinusoidal spline 301 has the shape of a sinusoidal function, therefore oscillating periodically at a given amplitude (namely the same amplitude as the sinusoidal spline 201) and defining a plurality of peaks 306 at each half period thereof.
  • the sinusoidal spline 301 is completely out of phase with the sinusoidal spline 201 (i.e., 180° out of phase along the longitudinal direction).
  • the peaks 306 of the sinusoidal spline 301 are aligned, in the longitudinal direction, with the peaks 206 of the sinusoidal spline 201 while being on opposite sides of the linear axis about which the sinusoidal splines 201, 301 are centered and oscillate.
  • the first end 302 of the sinusoidal spline 301 is coincident with the first end 202 of the sinusoidal spline 201.
  • the first ends 202, 302 of the channels 170, 180 may not be coincident in other embodiments.
  • the sinusoidal splines 201, 301 are arranged such that the resulting first and second channels 170, 180 are interconnected to each other such that, in use, cooling fluid flowing within the passage 130 flows in both the first and second channels 170, 180.
  • the channels 170, 180 form the opposite internal sidewalls 140, 142 of the passage 130 and the catenulate shape thereof.
  • the sinusoidal splines 201, 301 crisscross each other and therefore the resulting channels 170, 180 are interconnected.
  • the sinusoidal splines 201, 301 may not necessarily crisscross each other in other embodiments as will be described further below. As shown in Fig.
  • the sinusoidal splines 201, 301 are symmetric about a linear axis extending in the longitudinal direction which, once the channels 170, 180 are formed, corresponds to the central linear axis CA.
  • the sinusoidal splines 201, 301 oscillate about a common linear axis. As will be seen further below, this may not be the case in other embodiments.
  • the channels 170, 180 are milled using a milling cutter and have a relatively small width.
  • the channels 170, 180 have a width of approximately 2 mm.
  • each channel 170, 180 is formed by cutting into the surface 116 of the base 104 along the corresponding sinusoidal spline 201, 301.
  • the milling cutter does not need to divert from either of the sinusoidal splines 201, 301 as it mills the respective channels 170, 180.
  • each of the channels 170, 180 could be formed by milling along the corresponding sinusoidal spline 201, 301 a single time (i.e., in a single pass along each sinusoidal spline 201, 301).
  • each channel 170, 180 corresponds to the diameter of the milling cutter. Milling the channels 170, 180 is relatively simple as it does not require extensive tooling as might be the case for example for forming "micro" passages that have a microscopic width (e.g., 0.5 mm).
  • milling micro passages that are less than 1 mm wide can require more specialized tooling (e.g., a micro mill and associated micro milling cutters) and, moreover, typically requires significantly more passes to mill to a desired depth since the milling cutters cannot safely and/or cleanly cut a thickness of material that is deeper than the diameter of the milling cutter.
  • micro milling cutters can have a greater tendency to break during use.
  • a second passage 130 adjacent to the first passage 130 is formed.
  • the second passage 130 is formed in the same manner as the first passage 130 as described above.
  • the sinusoidal splines 201, 301 along which the channels 170, 180 forming the second passage 130 are milled are positioned such that the pins 152 of the pin row 150 defining the second passage 130 are offset in the longitudinal direction from the pins 152 defining the first passage 130. That is, a centerpoint of each pin 152 in the second pin row 150 is offset from a centerpoint of each pin 152 in the first pin row 150.
  • the fluid conduit 115 could be configured differently and still have the passages 130 as described above.
  • the base 104 is shaped differently and the fluid conduit 115 includes nine passages 130 extending parallel to each other.
  • the passages 130 are fluidly connected to each other in series by interconnecting portions 175 of the fluid conduit 115.
  • each interconnecting portion 175 is disposed between two consecutive passages 130 such that the cooling fluid flows into a given interconnecting portion 175 before flowing into another passage 130.
  • each interconnecting portion 175 includes two parallel channels 176 through which the cooling fluid flows in parallel.
  • the interconnecting portions 175 may be configured differently in other embodiments.
  • the base 104 shown in Fig. 9 is manufactured in a manner similar to that described above.
  • each passage 130 is defined by the opposite internal sidewalls 140, 142 and includes the constricted portions 154 and the expanded portions 156 disposed alternatingly.
  • the base 104 is manufactured in a manner similar to that described above, however with the additional step of milling the base 104 to remove the pins 152 once the pins 152 are formed. For example, this could involve milling the base 104 along the central linear axis CA of each respective passage 130 such as to eliminate the pins 152.
  • the pins 152 of a given pin row 150 may be configured differently.
  • the pins 152 of a given pin row 150 have different widths, namely two different widths.
  • consecutive ones of the pins 152 of each pin row 150 have different widths measured along the lateral direction of the cooling block 100.
  • a first pin 152 has a width W1 measured between the lateral ends of the pin 152
  • a second pin 152 consecutive to the first pin 152 has a width W2 that is greater than the first width W1.
  • the pins 152 of the pin row 150 are symmetric about the central linear axis CA that bisects the passage 130. This can be achieved during manufacturing by slightly offsetting the sinusoidal splines 201, 301 corresponding to the channels 170, 180 so that the sinusoidal splines 201, 301 are centered about respective linear axes LI, L2 laterally spaced from each other and extending longitudinally (i.e., parallel to the central linear axis CA bisecting the width of the passage 130). This results in the corresponding pins 152 having the two different widths W1, W2. This configuration can cause a variation of the perturbations of the flow of cooling fluid caused by the pins 152 and may also enhance flow disturbances in the cooling fluid.
  • the pins 152 of a given pin row 150 may be asymmetric about the central linear axis CA that bisects the width of the corresponding passage 130.
  • the central linear axis CA traverses only one of the first and second pointed ends 158, 160 of each pin 152. More specifically, for each two consecutive pins 152 of a pin row 150, the central linear axis CA traverses a different one of the first and second pointed ends 158, 160 thereof.
  • the sinusoidal splines 201, 301 are less than a quarter of a wavelength from being completely out of phase with each other.
  • two sinusoidal splines are said to be completely out of phase with each other when they are 180° out of phase such that the peaks of one are aligned with the troughs of the other.
  • This configuration can cause a variation of the perturbations of the flow of cooling fluid caused by the pins 152 and may also enhance flow disturbances in the cooling fluid.
  • each passage 130 may be defined by more than one pin row 150.
  • each passage 130 is defined in part by first and second pin rows 150 disposed between the internal sidewalls 140, 142 of the passage 130.
  • the pins 152 thereof are laterally aligned with each other such that a corresponding linear axis C1, C2 extending in the longitudinal direction traverses each pin 152.
  • the linear axes C1, C2 are laterally spaced from each other.
  • each linear axis C1, C2 extends through both ends 158, 160 of each pin 152 of the corresponding pin row 150 as the pins 152 are symmetric about the respective linear axes C1, C2.
  • the pins 152 of the first pin row 150 are offset from the pins 152 of the second pin row 150 in the longitudinal direction.
  • the pins 152 may be asymmetric as described above with regard to Fig. 11 .
  • the pins 152 could have different widths as described above with regard to Fig. 10 .
  • each internal sidewall 140, 142 has an undulating shape (i.e., a wave-like shape) and therefore has a plurality of rounded sections. More specifically, the rounded sections of each internal sidewall 140, 142 are a plurality of convex undulations 162 and a plurality of concave undulations 164 disposed alternatingly. Notably, each internal sidewall 140, 142 has a sinusoidal shape describing a sinusoidal function.
  • the convex undulations 162 of the internal sidewall 140 are aligned, in the longitudinal direction, with the concave undulations 164 of the opposite internal sidewall 142 such that their respective peaks are longitudinally aligned.
  • the internal sidewalls 140, 142 defining each passage 130 are asymmetric about a central linear axis bisecting the width of the passage 130.
  • the internal sidewall 140 defining a first passage 130 is adjacent to the internal sidewall 142 defining a second passage 130 consecutive to the first passage 130, and the concave undulations 164 of the internal sidewall 140 defining the first passage 130 are aligned, in the longitudinal direction, with the convex undulations 162 of the internal sidewall 142 defining the second passage 130.
  • This may allow the passages 130 to be disposed closer to one another.
  • the concave undulations 164 of the internal sidewall 140 defining the first passage 130 are partly aligned, in the lateral direction, with the concave undulations 164 of the internal sidewall 142 defining the second passage 130.
  • the cooling efficiency of the cooling block 100 may be optimized by positioning the passages 130 closer to each other.
  • the fluid conduit 115 is machined, namely milled, onto a piece of material to form the finished base 104.
  • the inlet and outlet manifold portions 132, 134 are already formed prior to machining the passages 130. It is contemplated that the inlet and outlet manifold portions 132, 134 may not yet be formed prior to machining the passages 130. In other embodiments, the inlet and outlet manifold portions 132, 134 may even be entirely omitted. As shown in Fig.
  • a first channel 270 is milled on the upper surface 116 of the base 104 following a path defined by a sinusoidal spline 401.
  • the sinusoidal spline 401 extends in a longitudinal direction of the cooling block 100 from a first end 402 to a second end 404.
  • the first end 402 is located at an edge of the inlet manifold portion 132 and the second end 404 is located at an edge of the outlet manifold portion 134 such that the resulting first channel 270 interconnects the inlet and outlet manifold portions 132, 134.
  • the sinusoidal spline 401 has the shape of a sinusoidal function, therefore oscillating periodically at a given amplitude and defining a plurality of peaks 406 at each half period thereof.
  • a second channel 280 is milled on the upper surface 116 of the base 104 following a path defined by another sinusoidal spline 501.
  • the milling of the channels 270, 280 forms a first pin row 150 as described above.
  • the sinusoidal spline 501 extends in the longitudinal direction of the cooling block 100 from a first end 502 to a second end 504.
  • the first end 502 is located at an edge of the inlet manifold portion 132 and the second end 504 is located at an edge of the outlet manifold portion 134 such that the resulting second channel 280 interconnects the inlet and outlet manifold portions 132, 134.
  • the sinusoidal spline 501 has the shape of a sinusoidal function, therefore oscillating periodically at a given amplitude (namely the same amplitude as the sinusoidal spline 401) and defining a plurality of peaks 506 at each half period thereof.
  • the sinusoidal splines 401, 501 are centered (and oscillate) about different axes, namely two distinct linear axes extending in the longitudinal direction and spaced apart from each other in the lateral direction.
  • the sinusoidal spline 501 is completely out of phase with the sinusoidal spline 401 (i.e., 180° out of phase along the longitudinal direction).
  • the peaks 506 of the sinusoidal spline 501 are aligned, in the longitudinal direction, with the peaks 406 of the sinusoidal spline 401 and are symmetric to each other about a common linear axis (which, in this example, corresponds to the linear axis C1).
  • a third channel 290 is milled on the upper surface 116 of the base 104 following a path defined by another sinusoidal spline 601.
  • the channels 270, 280, 290 may be milled in a different order (e.g., the second channel 280 could be milled after the third channel 290).
  • the sinusoidal spline 601 extends in the longitudinal direction of the cooling block 100 from a first end 602 to a second end 604.
  • the first end 602 is located at an edge of the inlet manifold portion 132 and the second end 604 is located at an edge of the outlet manifold portion 134 such that the resulting third channel 290 interconnects the inlet and outlet manifold portions 132, 134.
  • the sinusoidal spline 601 has the shape of a sinusoidal function, therefore oscillating periodically at a given amplitude (namely the same amplitude as the sinusoidal splines 401, 501) and defining a plurality of peaks 606 at each half period thereof.
  • the sinusoidal splines 401, 501, 601 are centered (and oscillate) about different axes, namely three distinct linear axes extending in the longitudinal direction and spaced apart from each other in the lateral direction.
  • the sinusoidal spline 601 is completely out of phase with the sinusoidal spline 501 (i.e., 180° out of phase along the longitudinal direction) but in phase with the sinusoidal spline 401.
  • the sinusoidal splines 501, 601 are symmetric to each other about a common linear axis (which, in this example, corresponds to the linear axis C2), however the sinusoidal splines 401, 601 are not symmetric to each other about a linear axis as the sinusoidal spline 601 is identical to the sinusoidal spline 401 but shifted relative thereto in the lateral direction.
  • the sinusoidal spline 501 disposed between the sinusoidal splines 401, 601, partly overlaps the sinusoidal splines 401, 601.
  • the peaks 506 of the sinusoidal spline 501 on one side of the linear axis about which the sinusoidal spline 501 is centered overlap the peaks 406 of the sinusoidal spline 401 that are longitudinally aligned therewith
  • the peaks 506 of the sinusoidal spline 501 on an opposite side of the linear axis about which the sinusoidal spline 501 is centered overlap the peaks 606 of the sinusoidal spline 601 that are longitudinally aligned therewith.
  • the amplitude of the sinusoidal splines 401, 501, 601 is equal to the distance between the linear axes C1, C2. Moreover, the amplitude of the sinusoidal splines 401, 501, 601 is equal to a sum of a radius of a milling cutter used for milling the channels 270, 280, 290 and half of the width of the pins 152.
  • the first passage 130 of the fluid conduit 115 is formed.
  • the other passages 130 are then formed in the same manner.
  • the channels 270, 280, 290 are milled using a milling cutter and have a relatively small width.
  • the channels 270, 280, 290 have a width of approximately 2 mm.
  • each channel 270, 280, 290 is formed by cutting into the surface 116 of the base 104 along the corresponding sinusoidal spline 401, 501, 601.
  • the milling cutter does not need to divert from any of the sinusoidal splines 401, 501, 601 as it mills the respective channels 270, 280, 290.
  • each of the channels 270, 280, 290 could be formed by milling along the corresponding sinusoidal spline 401, 501, 601 a single time (i.e., in a single pass along each sinusoidal spline 401, 501, 601). In some embodiments, more than a single pass along each sinusoidal spline 401, 501, 601 may be effected depending on the desired depth of the channels 270, 280, 290 . In this embodiment, the width of each channel 270, 280, 290 corresponds to the diameter of the milling cutter.
  • the shape of the pins 152 is more elongated and the distance, in the longitudinal direction, between the pins 152 of a given pin row 150 can be made smaller.
  • a ratio of a distance between two consecutive pins 152 of a pin row 150 over a length of a pin 152 is between 0.9 and 1.1.
  • the ratio of a distance between two consecutive pins 152 of a pin row 150 over a length of a pin 152 is approximately 1. This ratio may be different in other examples.
  • the pins 152 are spaced unequally from the internal sidewalls 140, 142.
  • a distance between the pin 152 and the internal sidewall 140 is different from a distance between the pin 152 and the opposite internal sidewall 142.
  • consecutive ones of the pins 152 defining the passage 130 are spaced further apart from one of the internal sidewalls 140, 142 alternatingly. That is, a first pin 152 of a first pin row 150 is spaced from the right internal sidewall 142 by a distance D1 and from the left internal sidewall 140 by a distance D2 (D1 being greater than D2), and a second pin 152 of the second pin row 150 that is consecutive in the longitudinal direction to the first pin 152 is spaced from the right internal sidewall 142 by the distance D2 and from the left internal sidewall 140 by the distance D1.
  • the distance D2 corresponds to the diameter of the milling cutter used to mill the channels 270, 280, 290.
  • This configuration of the passages 130 and pins 152 are obtained when the sinusoidal splines 401, 501, 601 defining the paths that the milling cutter follows during machining of the channels 270, 280, 290 do not overlap each other.
  • the amplitude of each of the sinusoidal splines 401, 501, 601 is smaller than a distance between consecutive ones of the linear axes about which the sinusoidal splines 401, 501, 601 are centered.
  • This configuration can cause a variation of the perturbations of the flow of cooling fluid caused by the pins 152 and may also enhance flow disturbances in the cooling fluid.
  • each passage 130 could be defined in part by three pin rows 150.
  • the pins 152 thereof are aligned in the lateral direction such that a respective linear axis traverses the pins 152 of the pin row 150.
  • the pins 152 of a first pin row 150 are offset in the longitudinal direction from the pins 152 of a second pin row 150 consecutive to the first pin row 150.
  • each passage 130 includes the constricted portions 154 and the expanded portions 156 disposed alternatingly, whereby the expanded portions 156 have a width (measured in the lateral direction) greater than that of the constricted portions 154.
  • the pins 152 of the two "outer” pin rows 150 that are closest to the internal sidewalls 140, 142 are disposed in the expanded portions 156, while the pins 152 of the "inner” pin row 150 disposed between the two outer pin rows 150 are disposed in the constricted portions 154.
  • this configuration of the passages 130 can be obtained by forming a fourth channel 300 interconnected with the other channels 270, 280, 290.
  • the fourth channel 300 is milled on the upper surface 116 of the base 104 following a path defined by another sinusoidal spline 701.
  • the sinusoidal spline 701 has the same configuration as the sinusoidal spline 501 and therefore will not be described in detail herein.
  • the sinusoidal spline 701 has the shape of a sinusoidal function, therefore oscillating periodically at a given amplitude (namely the same amplitude as the sinusoidal splines 401, 501, 601) and defining a plurality of peaks 706 at each half period thereof.
  • the passages 130 could be defined by any number of pin rows 150 in other embodiments.
  • a passage 130 of the fluid conduit 115 is defined by twenty-one pin rows 150, the pins 152 of each pin row 150 being centered about a respective linear axis that traverses each pin 152 of the respective pin row 150.
  • the fluid conduit 115 has a single passage 130 such that an entire proportion of the cooling fluid flows from the inlet manifold portion 132 to the outlet manifold portion 134 via the single passage 130.
  • each pin 152 has a lacrimiform shape (which could also be referred to as an airfoil shape). That is, each pin 152 has a lacrimiform profile observed along a plane parallel to the thermal transfer surface 108 and traversing the pin 152.
  • lacrimiform as defined herein encompasses all shapes generally resembling a tear-drop, including symmetric and asymmetric variations thereof.
  • each pin 152 is symmetric about a linear axis which traverses the rounded end 158 and the pointed end 160 of the pins 152 of the pin row 150.
  • the central linear axis CA that bisects the passage 130 traverses the rounded ends 158 and pointed ends 160 of each pin 152 of the pin row 150.
  • the pins 152 may have a lacrimiform shape and be asymmetric in other embodiments.
  • each expanded portion 156 of each passage 130 is similar to that of the pins 152 which are disposed along the expanded portions 156.
  • each expanded portion 156 is formed by two rounded sections 144 of the internal sidewalls 140, 142.
  • each rounded section 144 of the internal sidewalls 140, 142 is aligned, along the longitudinal direction, with a corresponding pin 152 of the pin row 150.
  • each rounded section 144 has a similar shape as a portion of the corresponding pin 152 such that a spacing between the rounded section 144 and the portion of the corresponding pin 152 is constant.
  • the internal sidewalls 140, 142 of a given passage 130 are symmetric to each other about the corresponding central linear axis CA.
  • the constricted portions 154 of the passage 130 are formed by rectilinear sections of the internal walls 140, 142.
  • the lacrimiform pins 152 could be disposed closer to one another than shown in Fig. 20 .
  • the constricted portions 154 of the passages 130 correspond to the ends of the rounded sections 144 of the internal sidewalls 140, 142.
  • the distance between the trailing end 160 of each pin 152 and the leading edge 158 of each consecutive one of the pin row 150 can be identical to the spacing between the rounded sections 144 and the corresponding pins 152.
  • the internal sidewalls 140, 142 are scalloped.
  • each passage 130 could have more than one pin row 150 of the lacrimiform pins 152 such as in the embodiments of Figs. 12 , 18 and 19 .
  • each passage 130 is defined in part by two pin rows 150 including multiple ones of the lacrimiform pins 152.
  • the pins 152 of consecutive ones of the pin rows 150 are offset from each other along the longitudinal direction.
  • a centerpoint of each pin 152 of a first pin row 150 (located at midlength between the opposite ends 158, 160 of the pin 152) is offset from the centerpoint of each pin 152 of a second pin row 150 that is consecutive to the first pin row 150.
  • a linear axis LX extending longitudinally can be traced to traverse each pin 152 of a respective pin row 150.
  • each linear axis LX traverses the pointed trailing end 160 of each pin 152 of the corresponding pin row 150.
  • the linear axes LX of the two pin rows 150 are spaced apart from each other in the lateral direction.
  • each pin 152 is asymmetric about the linear axis LX of its corresponding pin row 150.
  • the linear axes LX do not extend through the rounded leading ends 158 of the pins 152.
  • the pins 152 are shaped and oriented such that the rounded ends 158 of the pins 152 of two consecutive pin rows 150 are closer to each other than the pointed ends 160 of the pins 152 of the two consecutive pin rows 150.
  • a distance between the rounded end 158 of a pin 152 of a first pin row 150 and the rounded end 158 of a pin 152 of a second pin row 150 is less than a distance between the pointed ends 160 of these same pins 152.
  • the shape of the pins 152 of the first pin row 150 is a mirror image of the shape of the pins 152 of the second pin row 150.
  • the central linear axis CA that bisects the width of the passage 130 extends between the two pin rows 150 and is spaced from the pins 152 of each pin row 150 by equal distances.
  • the lacrimiform shape of the pins 152 can promote flow disturbances in the flow of cooling fluid, notably increasing turbulent flow and limiting flow separation. This is particularly evident in comparison to conventional pin shapes such as circular or elliptical pins. As will be appreciated, many of the configurations discussed above are also applicable to the lacrimiform pins 152.
  • the passages 130 that are defined by the lacrimiform pins 152 can be machined on the base 104 via a milling operation using a milling cutter.
  • a method for manufacturing a cooling block configured to cool a heat-generating electronic component comprising: providing a base for forming part of the cooling block; forming each passage of at least one passage of a fluid conduit of the cooling block by: milling a first channel on a surface of the base following a path defined by a first sinusoidal spline; and milling a second channel on the surface of the base following a path defined by a second sinusoidal spline, the first and second sinusoidal splines extending in a longitudinal direction of the cooling block and being arranged such that the first channel and the second channel are interconnected to each other such that, in use, cooling fluid flowing within the passage flows within the first channel and the second channel; said milling of the first and second channels forming a pin row comprising a plurality of pins aligned such that a linear pin axis extending in the longitudinal direction traverses each pin of the pin row, the pins of the pin row being spaced from each other along the longitudinal direction.
  • CLAUSE 4 The method of clause 1 or 2, wherein said forming the at least one passage further comprises milling the base to remove the pins.
  • each of the first and second sinusoidal splines is centered about a respective linear axis extending in the longitudinal direction, the linear axes about which the first and second sinusoidal splines are centered being spaced from each other in a lateral direction normal to the longitudinal direction.
  • CLAUSE 7 The method of any one of clauses 1 to 6, wherein: the at least one passage is a plurality of passages including a first passage and a second passage parallel to the first passage; and each passage of the first and second passages is bounded by first and second internal sidewalls of the passage such that, in use, cooling fluid flowing in the passage is bounded to the passage by the first and second internal sidewalls.
  • the first and second sinusoidal splines are symmetric to each other; the pin row is a first pin row and the plurality of pins is a first plurality of pins; the linear pin axis is a first linear pin axis; forming the at least one passage further comprises milling a third channel on the surface of the base following a third path described by a third sinusoidal spline; the third sinusoidal spline extends in the longitudinal direction of the cooling block and being arranged such that the second channel and the third channel are interconnected to each other such that, in use, cooling fluid flowing within the passage flows within the first, second and third channels; and said milling of the second and third channels forms a pin row comprising a second plurality of pins aligned such that a second linear axis extending in the longitudinal direction traverses each pin of the second pin row, the pins of the second pin row being spaced from each other along the longitudinal direction.
  • a cooling block for cooling a heat-generating electronic component comprising: a body (102) having a thermal transfer surface (108) configured to be placed in thermal contact with the heat-generating electronic component, the body defining a fluid conduit (115) for circulating a cooling fluid therein, the fluid conduit having an inlet (110) for receiving the cooling fluid and an outlet (112) for discharging the cooling fluid; the fluid conduit comprising at least one passage (130) extending from a first point (131) to a second point (133) along a longitudinal direction of the cooling block, the second point being downstream from the first point, wherein, for each passage of the at least one passage: the passage is defined in part by first and second internal sidewalls (140, 142) extending from the first point to the second point, each internal sidewall of the first and second internal sidewalls having a scalloped or undulating shape such that the internal sidewall comprises a plurality of rounded sections (144, 162, 164), a width of the passage being measured between the first and second internal sidewalls in

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EP22306277.9A 2022-08-29 2022-08-29 Bloc de refroidissement pour refroidir un composant électronique générant de la chaleur et son procédé de fabrication Active EP4333048B1 (fr)

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EP22306277.9A EP4333048B1 (fr) 2022-08-29 2022-08-29 Bloc de refroidissement pour refroidir un composant électronique générant de la chaleur et son procédé de fabrication
US18/236,559 US20240074107A1 (en) 2022-08-29 2023-08-22 Cooling block for cooling a heat-generating electronic component and method for manufacturing thereof
CA3209876A CA3209876A1 (fr) 2022-08-29 2023-08-23 Bloc de refroidissement pour refroidir un composant electronique generant de la chaleur et methode de fabrication
CN202311093358.9A CN117631788A (zh) 2022-08-29 2023-08-28 用于对发热的电子部件进行冷却的冷却块及其制造方法
KR1020230113242A KR20240031112A (ko) 2022-08-29 2023-08-29 발열 전자 구성요소를 냉각하기 위한 냉각 블록 및 그 제조 방법

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EP22306277.9A Active EP4333048B1 (fr) 2022-08-29 2022-08-29 Bloc de refroidissement pour refroidir un composant électronique générant de la chaleur et son procédé de fabrication

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US (1) US20240074107A1 (fr)
EP (1) EP4333048B1 (fr)
KR (1) KR20240031112A (fr)
CN (1) CN117631788A (fr)
CA (1) CA3209876A1 (fr)

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DE112020005982B4 (de) * 2019-12-06 2025-07-31 Mitsubishi Electric Corporation Wärmesenke und Wärmesenke-Herstellungsverfahren
CN117460210A (zh) * 2023-03-28 2024-01-26 武汉华星光电半导体显示技术有限公司 散热板与显示装置

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US5544703A (en) * 1993-05-18 1996-08-13 Vicarb Plate heat exchanger
US20030071525A1 (en) * 2000-12-20 2003-04-17 General Electric Company Heat transfer enhancement at generator stator core space blocks
US20140138063A1 (en) * 2011-04-20 2014-05-22 Nippon Soken, Inc Cooling fin structure
DE102011118483A1 (de) * 2011-11-12 2013-05-16 Volkswagen Aktiengesellschaft Wärmeübertrager
CN104465562B (zh) * 2014-12-24 2017-11-24 西安电子科技大学 一种链式交错型微通道结构

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US20240074107A1 (en) 2024-02-29
CN117631788A (zh) 2024-03-01
CA3209876A1 (fr) 2024-02-29
EP4333048B1 (fr) 2025-09-24
KR20240031112A (ko) 2024-03-07

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