EP4437382A4 - Outil de compactage interactif pour automatisation de conception électronique - Google Patents

Outil de compactage interactif pour automatisation de conception électronique

Info

Publication number
EP4437382A4
EP4437382A4 EP22899431.5A EP22899431A EP4437382A4 EP 4437382 A4 EP4437382 A4 EP 4437382A4 EP 22899431 A EP22899431 A EP 22899431A EP 4437382 A4 EP4437382 A4 EP 4437382A4
Authority
EP
European Patent Office
Prior art keywords
electronic design
design automation
interactive composition
composition tool
interactive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22899431.5A
Other languages
German (de)
English (en)
Other versions
EP4437382A1 (fr
Inventor
Donald Oriordan
Akira Fujimura
George Janac
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
D2S Inc
Original Assignee
D2S Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US17/992,876 external-priority patent/US20230169246A1/en
Application filed by D2S Inc filed Critical D2S Inc
Publication of EP4437382A1 publication Critical patent/EP4437382A1/fr
Publication of EP4437382A4 publication Critical patent/EP4437382A4/fr
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70491Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
    • G03F7/705Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/36Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/70Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/76Patterning of masks by imaging
    • G03F1/78Patterning of masks by imaging by charged particle beam [CPB], e.g. electron beam patterning of masks
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G03F7/70433Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
    • G03F7/70441Optical proximity correction [OPC]
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00Computing arrangements based on biological models
    • G06N3/02Neural networks
    • G06N3/04Architecture, e.g. interconnection topology
    • G06N3/045Combinations of networks
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00Computing arrangements based on biological models
    • G06N3/02Neural networks
    • G06N3/04Architecture, e.g. interconnection topology
    • G06N3/0464Convolutional networks [CNN, ConvNet]
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00Computing arrangements based on biological models
    • G06N3/02Neural networks
    • G06N3/04Architecture, e.g. interconnection topology
    • G06N3/048Activation functions
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06NCOMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N3/00Computing arrangements based on biological models
    • G06N3/02Neural networks
    • G06N3/08Learning methods
    • G06N3/09Supervised learning
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/18Manufacturability analysis or optimisation for manufacturability
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/20Design optimisation, verification or simulation
    • G06F30/27Design optimisation, verification or simulation using machine learning, e.g. artificial intelligence, neural networks, support vector machines [SVM] or training a model
    • GPHYSICS
    • G06COMPUTING OR CALCULATING; COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00Computer-aided design [CAD]
    • G06F30/30Circuit design
    • G06F30/39Circuit design at the physical level
    • G06F30/398Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Evolutionary Computation (AREA)
  • General Engineering & Computer Science (AREA)
  • Software Systems (AREA)
  • Artificial Intelligence (AREA)
  • Computing Systems (AREA)
  • Mathematical Physics (AREA)
  • General Health & Medical Sciences (AREA)
  • Molecular Biology (AREA)
  • Computational Linguistics (AREA)
  • Biophysics (AREA)
  • Biomedical Technology (AREA)
  • Data Mining & Analysis (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Geometry (AREA)
  • Plasma & Fusion (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Medical Informatics (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
EP22899431.5A 2021-11-28 2022-11-27 Outil de compactage interactif pour automatisation de conception électronique Pending EP4437382A4 (fr)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US202163283520P 2021-11-28 2021-11-28
US202263408832P 2022-09-21 2022-09-21
US202217983372A 2022-11-08 2022-11-08
US17/992,876 US20230169246A1 (en) 2021-11-28 2022-11-22 Interactive compaction tool for electronic design automation
PCT/US2022/051028 WO2023097068A1 (fr) 2021-11-28 2022-11-27 Outil de compactage interactif pour automatisation de conception électronique

Publications (2)

Publication Number Publication Date
EP4437382A1 EP4437382A1 (fr) 2024-10-02
EP4437382A4 true EP4437382A4 (fr) 2025-10-22

Family

ID=86540360

Family Applications (1)

Application Number Title Priority Date Filing Date
EP22899431.5A Pending EP4437382A4 (fr) 2021-11-28 2022-11-27 Outil de compactage interactif pour automatisation de conception électronique

Country Status (5)

Country Link
EP (1) EP4437382A4 (fr)
JP (2) JP7723376B2 (fr)
KR (1) KR20240105405A (fr)
TW (2) TWI845039B (fr)
WO (1) WO2023097068A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230169246A1 (en) 2021-11-28 2023-06-01 D2S, Inc. Interactive compaction tool for electronic design automation
TWI862132B (zh) * 2023-09-01 2024-11-11 國立臺北大學 基於形狀調整來提升粒子束微影生產量、製像真確度與對比度之鄰近效應校正方法及製像結構
US20260036970A1 (en) * 2024-08-02 2026-02-05 Taiwan Semiconductor Manufacturing Company, Ltd. Method of manufacturing integrated circuit (ic) device having stand-alone feed-through via and system for same

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TWI252516B (en) * 2002-03-12 2006-04-01 Toshiba Corp Determination method of process parameter and method for determining at least one of process parameter and design rule
US7171637B2 (en) * 2005-01-14 2007-01-30 Intel Corporation Translation generation for a mask pattern
US7636904B2 (en) * 2006-10-20 2009-12-22 Synopsys, Inc. Locating critical dimension(s) of a layout feature in an IC design by modeling simulated intensities
WO2009003139A1 (fr) * 2007-06-27 2008-12-31 Cadence Design Systems, Inc. Conception robuste utilisant des modèles de fabricabilité
US8464194B1 (en) * 2011-12-16 2013-06-11 International Business Machines Corporation Machine learning approach to correct lithographic hot-spots
WO2013158573A1 (fr) 2012-04-18 2013-10-24 D2S, Inc. Procédé et système de formation de motifs par utilisation de lithographie par faisceau de particules chargées
US9858379B2 (en) * 2015-02-18 2018-01-02 Toshiba Memory Corporation Mask data generation system, mask data generation method, and recording medium
EP3398123B1 (fr) 2015-12-31 2025-03-12 KLA - Tencor Corporation Formation accélérée d'un modèle fondé sur l'apprentissage automatique destiné à des applications semi-conductrices
KR102582665B1 (ko) 2016-10-07 2023-09-25 삼성전자주식회사 집적 회로의 패턴들을 평가하는 시스템 및 방법
US10534257B2 (en) 2017-05-01 2020-01-14 Lam Research Corporation Layout pattern proximity correction through edge placement error prediction
JP6508496B2 (ja) 2017-06-16 2019-05-08 大日本印刷株式会社 図形パターンの形状推定装置
US10394116B2 (en) 2017-09-06 2019-08-27 International Business Machines Corporation Semiconductor fabrication design rule loophole checking for design for manufacturability optimization
US10445461B2 (en) 2017-12-20 2019-10-15 Lihong Zhang Process variation-aware sizing-inclusive analog layout retargeting with optical proximity correction
KR102701616B1 (ko) 2019-03-25 2024-09-04 에이에스엠엘 네델란즈 비.브이. 패터닝 공정에서 패턴을 결정하는 방법
WO2021034495A1 (fr) * 2019-08-16 2021-02-25 Synopsys, Inc. Application de recettes de technique d'amélioration de réticule sur la base de modes de défaillance prédits par un réseau neuronal artificiel
KR20220034900A (ko) * 2019-08-20 2022-03-18 에이에스엠엘 네델란즈 비.브이. 이미지 내 구조물의 공정 기반 윤곽 정보 개선 방법

Non-Patent Citations (6)

* Cited by examiner, † Cited by third party
Title
KAREEM PERVAIZ ET AL: "Fast prediction of process variation band through machine learning models", PROCEEDINGS OF THE SPIE, vol. 11613, 12 March 2021 (2021-03-12), pages 1161306 - 1161306, XP060140026, DOI: 10.1117/12.2583805 *
LUKASCHROSTOWSKI: "Silicon photonics lithography prediction simulation", 30 November 2013 (2013-11-30), XP093311023, Retrieved from the Internet <URL:https://www.youtube.com/watch?v=-Z1HYzCUKeo> *
MA YUZHE ET AL: "Methodologies for layout decomposition and mask optimization: A systematic review", PROCEEDINGS OF THE IFIP/IEEE INTERNATIONAL CONFERENCE ON VERY LARGE SCALE INTEGRATION, 23 October 2017 (2017-10-23), pages 1 - 6, XP033269681, DOI: 10.1109/VLSI-SOC.2017.8203477 *
PANORAMICTECH: "FullChip Lithography Engineering Software", 6 February 2019 (2019-02-06), XP093311026, Retrieved from the Internet <URL:https://www.youtube.com/watch?v=zvkjjOseU_Y> *
See also references of WO2023097068A1 *
YONG LIU ET AL: "Inverse Lithography Technology Principles in Practice:Unintuitive Patterns", PROC. SPIE 5992, 25TH ANNUAL BACUS SYMPOSIUM ON PHOTOMASK TECHNOLOGY, 8 November 2005 (2005-11-08), XP040211637, DOI: 10.1117/12.632366 *

Also Published As

Publication number Publication date
TWI845039B (zh) 2024-06-11
JP2024542595A (ja) 2024-11-15
TW202420138A (zh) 2024-05-16
JP2025137718A (ja) 2025-09-19
WO2023097068A1 (fr) 2023-06-01
EP4437382A1 (fr) 2024-10-02
KR20240105405A (ko) 2024-07-05
TW202336625A (zh) 2023-09-16
JP7723376B2 (ja) 2025-08-14

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