EP4437382A4 - Outil de compactage interactif pour automatisation de conception électronique - Google Patents
Outil de compactage interactif pour automatisation de conception électroniqueInfo
- Publication number
- EP4437382A4 EP4437382A4 EP22899431.5A EP22899431A EP4437382A4 EP 4437382 A4 EP4437382 A4 EP 4437382A4 EP 22899431 A EP22899431 A EP 22899431A EP 4437382 A4 EP4437382 A4 EP 4437382A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- electronic design
- design automation
- interactive composition
- composition tool
- interactive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/705—Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/36—Masks having proximity correction features; Preparation thereof, e.g. optical proximity correction [OPC] design processes
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/70—Adapting basic layout or design of masks to lithographic process requirements, e.g., second iteration correction of mask patterns for imaging
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/76—Patterning of masks by imaging
- G03F1/78—Patterning of masks by imaging by charged particle beam [CPB], e.g. electron beam patterning of masks
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
- G03F7/70433—Layout for increasing efficiency or for compensating imaging errors, e.g. layout of exposure fields for reducing focus errors; Use of mask features for increasing efficiency or for compensating imaging errors
- G03F7/70441—Optical proximity correction [OPC]
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
- G06N3/045—Combinations of networks
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
- G06N3/0464—Convolutional networks [CNN, ConvNet]
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/04—Architecture, e.g. interconnection topology
- G06N3/048—Activation functions
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
- G06N3/00—Computing arrangements based on biological models
- G06N3/02—Neural networks
- G06N3/08—Learning methods
- G06N3/09—Supervised learning
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
- G06F2119/18—Manufacturability analysis or optimisation for manufacturability
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
- G06F30/27—Design optimisation, verification or simulation using machine learning, e.g. artificial intelligence, neural networks, support vector machines [SVM] or training a model
-
- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/30—Circuit design
- G06F30/39—Circuit design at the physical level
- G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Evolutionary Computation (AREA)
- General Engineering & Computer Science (AREA)
- Software Systems (AREA)
- Artificial Intelligence (AREA)
- Computing Systems (AREA)
- Mathematical Physics (AREA)
- General Health & Medical Sciences (AREA)
- Molecular Biology (AREA)
- Computational Linguistics (AREA)
- Biophysics (AREA)
- Biomedical Technology (AREA)
- Data Mining & Analysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Computer Hardware Design (AREA)
- Geometry (AREA)
- Plasma & Fusion (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Medical Informatics (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202163283520P | 2021-11-28 | 2021-11-28 | |
| US202263408832P | 2022-09-21 | 2022-09-21 | |
| US202217983372A | 2022-11-08 | 2022-11-08 | |
| US17/992,876 US20230169246A1 (en) | 2021-11-28 | 2022-11-22 | Interactive compaction tool for electronic design automation |
| PCT/US2022/051028 WO2023097068A1 (fr) | 2021-11-28 | 2022-11-27 | Outil de compactage interactif pour automatisation de conception électronique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| EP4437382A1 EP4437382A1 (fr) | 2024-10-02 |
| EP4437382A4 true EP4437382A4 (fr) | 2025-10-22 |
Family
ID=86540360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| EP22899431.5A Pending EP4437382A4 (fr) | 2021-11-28 | 2022-11-27 | Outil de compactage interactif pour automatisation de conception électronique |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP4437382A4 (fr) |
| JP (2) | JP7723376B2 (fr) |
| KR (1) | KR20240105405A (fr) |
| TW (2) | TWI845039B (fr) |
| WO (1) | WO2023097068A1 (fr) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20230169246A1 (en) | 2021-11-28 | 2023-06-01 | D2S, Inc. | Interactive compaction tool for electronic design automation |
| TWI862132B (zh) * | 2023-09-01 | 2024-11-11 | 國立臺北大學 | 基於形狀調整來提升粒子束微影生產量、製像真確度與對比度之鄰近效應校正方法及製像結構 |
| US20260036970A1 (en) * | 2024-08-02 | 2026-02-05 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method of manufacturing integrated circuit (ic) device having stand-alone feed-through via and system for same |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI252516B (en) * | 2002-03-12 | 2006-04-01 | Toshiba Corp | Determination method of process parameter and method for determining at least one of process parameter and design rule |
| US7171637B2 (en) * | 2005-01-14 | 2007-01-30 | Intel Corporation | Translation generation for a mask pattern |
| US7636904B2 (en) * | 2006-10-20 | 2009-12-22 | Synopsys, Inc. | Locating critical dimension(s) of a layout feature in an IC design by modeling simulated intensities |
| WO2009003139A1 (fr) * | 2007-06-27 | 2008-12-31 | Cadence Design Systems, Inc. | Conception robuste utilisant des modèles de fabricabilité |
| US8464194B1 (en) * | 2011-12-16 | 2013-06-11 | International Business Machines Corporation | Machine learning approach to correct lithographic hot-spots |
| WO2013158573A1 (fr) | 2012-04-18 | 2013-10-24 | D2S, Inc. | Procédé et système de formation de motifs par utilisation de lithographie par faisceau de particules chargées |
| US9858379B2 (en) * | 2015-02-18 | 2018-01-02 | Toshiba Memory Corporation | Mask data generation system, mask data generation method, and recording medium |
| EP3398123B1 (fr) | 2015-12-31 | 2025-03-12 | KLA - Tencor Corporation | Formation accélérée d'un modèle fondé sur l'apprentissage automatique destiné à des applications semi-conductrices |
| KR102582665B1 (ko) | 2016-10-07 | 2023-09-25 | 삼성전자주식회사 | 집적 회로의 패턴들을 평가하는 시스템 및 방법 |
| US10534257B2 (en) | 2017-05-01 | 2020-01-14 | Lam Research Corporation | Layout pattern proximity correction through edge placement error prediction |
| JP6508496B2 (ja) | 2017-06-16 | 2019-05-08 | 大日本印刷株式会社 | 図形パターンの形状推定装置 |
| US10394116B2 (en) | 2017-09-06 | 2019-08-27 | International Business Machines Corporation | Semiconductor fabrication design rule loophole checking for design for manufacturability optimization |
| US10445461B2 (en) | 2017-12-20 | 2019-10-15 | Lihong Zhang | Process variation-aware sizing-inclusive analog layout retargeting with optical proximity correction |
| KR102701616B1 (ko) | 2019-03-25 | 2024-09-04 | 에이에스엠엘 네델란즈 비.브이. | 패터닝 공정에서 패턴을 결정하는 방법 |
| WO2021034495A1 (fr) * | 2019-08-16 | 2021-02-25 | Synopsys, Inc. | Application de recettes de technique d'amélioration de réticule sur la base de modes de défaillance prédits par un réseau neuronal artificiel |
| KR20220034900A (ko) * | 2019-08-20 | 2022-03-18 | 에이에스엠엘 네델란즈 비.브이. | 이미지 내 구조물의 공정 기반 윤곽 정보 개선 방법 |
-
2022
- 2022-11-27 EP EP22899431.5A patent/EP4437382A4/fr active Pending
- 2022-11-27 WO PCT/US2022/051028 patent/WO2023097068A1/fr not_active Ceased
- 2022-11-27 JP JP2024531451A patent/JP7723376B2/ja active Active
- 2022-11-27 KR KR1020247017838A patent/KR20240105405A/ko active Pending
- 2022-11-28 TW TW111145522A patent/TWI845039B/zh active
- 2022-11-28 TW TW113103222A patent/TW202420138A/zh unknown
-
2025
- 2025-07-23 JP JP2025122978A patent/JP2025137718A/ja active Pending
Non-Patent Citations (6)
| Title |
|---|
| KAREEM PERVAIZ ET AL: "Fast prediction of process variation band through machine learning models", PROCEEDINGS OF THE SPIE, vol. 11613, 12 March 2021 (2021-03-12), pages 1161306 - 1161306, XP060140026, DOI: 10.1117/12.2583805 * |
| LUKASCHROSTOWSKI: "Silicon photonics lithography prediction simulation", 30 November 2013 (2013-11-30), XP093311023, Retrieved from the Internet <URL:https://www.youtube.com/watch?v=-Z1HYzCUKeo> * |
| MA YUZHE ET AL: "Methodologies for layout decomposition and mask optimization: A systematic review", PROCEEDINGS OF THE IFIP/IEEE INTERNATIONAL CONFERENCE ON VERY LARGE SCALE INTEGRATION, 23 October 2017 (2017-10-23), pages 1 - 6, XP033269681, DOI: 10.1109/VLSI-SOC.2017.8203477 * |
| PANORAMICTECH: "FullChip Lithography Engineering Software", 6 February 2019 (2019-02-06), XP093311026, Retrieved from the Internet <URL:https://www.youtube.com/watch?v=zvkjjOseU_Y> * |
| See also references of WO2023097068A1 * |
| YONG LIU ET AL: "Inverse Lithography Technology Principles in Practice:Unintuitive Patterns", PROC. SPIE 5992, 25TH ANNUAL BACUS SYMPOSIUM ON PHOTOMASK TECHNOLOGY, 8 November 2005 (2005-11-08), XP040211637, DOI: 10.1117/12.632366 * |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI845039B (zh) | 2024-06-11 |
| JP2024542595A (ja) | 2024-11-15 |
| TW202420138A (zh) | 2024-05-16 |
| JP2025137718A (ja) | 2025-09-19 |
| WO2023097068A1 (fr) | 2023-06-01 |
| EP4437382A1 (fr) | 2024-10-02 |
| KR20240105405A (ko) | 2024-07-05 |
| TW202336625A (zh) | 2023-09-16 |
| JP7723376B2 (ja) | 2025-08-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE INTERNATIONAL PUBLICATION HAS BEEN MADE |
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| PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
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| STAA | Information on the status of an ep patent application or granted ep patent |
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| 17P | Request for examination filed |
Effective date: 20240624 |
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| AK | Designated contracting states |
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| DAV | Request for validation of the european patent (deleted) | ||
| DAX | Request for extension of the european patent (deleted) | ||
| REG | Reference to a national code |
Ref country code: DE Ref legal event code: R079 Free format text: PREVIOUS MAIN CLASS: G03F0001700000 Ipc: G06F0030398000 |
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| A4 | Supplementary search report drawn up and despatched |
Effective date: 20250922 |
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| RIC1 | Information provided on ipc code assigned before grant |
Ipc: G06F 30/398 20200101AFI20250916BHEP Ipc: G06F 30/27 20200101ALI20250916BHEP Ipc: G03F 1/70 20120101ALI20250916BHEP Ipc: G03F 1/36 20120101ALI20250916BHEP Ipc: G05B 19/418 20060101ALI20250916BHEP Ipc: G06N 3/02 20060101ALI20250916BHEP Ipc: G03F 1/78 20120101ALI20250916BHEP Ipc: G06N 3/045 20230101ALI20250916BHEP Ipc: G06N 3/0464 20230101ALI20250916BHEP Ipc: G06N 3/048 20230101ALI20250916BHEP Ipc: G06N 3/09 20230101ALI20250916BHEP Ipc: G06F 119/18 20200101ALN20250916BHEP |