EP4437453A1 - Support de stockage de données sous forme de carte et procédé de fabrication d'un support de stockage de données sous forme de carte - Google Patents

Support de stockage de données sous forme de carte et procédé de fabrication d'un support de stockage de données sous forme de carte

Info

Publication number
EP4437453A1
EP4437453A1 EP22821305.4A EP22821305A EP4437453A1 EP 4437453 A1 EP4437453 A1 EP 4437453A1 EP 22821305 A EP22821305 A EP 22821305A EP 4437453 A1 EP4437453 A1 EP 4437453A1
Authority
EP
European Patent Office
Prior art keywords
layer
card
inlay
data carrier
shaped data
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22821305.4A
Other languages
German (de)
English (en)
Inventor
Andreas Minks
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Giesecke and Devrient ePayments GmbH
Original Assignee
Giesecke and Devrient ePayments GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Giesecke and Devrient ePayments GmbH filed Critical Giesecke and Devrient ePayments GmbH
Publication of EP4437453A1 publication Critical patent/EP4437453A1/fr
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/02—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the selection of materials, e.g. to avoid wear during transport through the machine
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07722—Physical layout of the record carrier the record carrier being multilayered, e.g. laminated sheets
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07766—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement
    • G06K19/07769—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card comprising at least a second communication arrangement in addition to a first non-contact communication arrangement the further communication means being a galvanic interface, e.g. hybrid or mixed smart cards having a contact and a non-contact interface
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07771—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object

Definitions

  • the invention relates to a card-shaped data carrier, in particular a smart card, and a method for producing a card-shaped data carrier.
  • card-shaped data carriers for example smart cards, chip cards, integrated circuit cards, dual interface cards, access cards or identification cards
  • smart cards such as credit cards or payment cards
  • a card-shaped data carrier has a card body and an integrated circuit embedded in the card body, for example in the form of a chip module with a chip.
  • the chip module is usually arranged or inserted in a recess, such as a cavity or module opening, in the card body.
  • chip modules with an integrated or coupled antenna are considered, which enable both contact-based and contactless or contactless data transmission or communication.
  • card-shaped data carriers with an RFID (Radio Frequency Identification) functionality can be provided.
  • Card-shaped data carriers with a metallic surface or a metallic core layer are particularly insensitive and are considered to be of high quality. For this reason, card-shaped data carriers with an internal or external metal layer are becoming increasingly widespread.
  • a chip module which itself has a coupled antenna, in particular a coil (coil on module).
  • This coil couples to the card body with a metal layer.
  • the metal layer can disrupt or completely impede communication or data transmission. This coupling therefore only works if undesired ring closures of the magnetic flux can be prevented. In other words, interfering capacitive influences of the metal layer are to be prevented.
  • a ferrite layer between the antenna and the metal layer for shielding from interfering capacitive influences or alternatively to provide a slot for interrupting ring closures in the metal layer or for preventing short-circuit currents.
  • the invention can preferably be used for smart cards, in particular for credit cards and payment cards.
  • the use for metal cards is preferably provided here, in particular for full metal cards, hybrid metal cards with a metal layer and a plastic layer, and for metal cards that are coated or printed on one or both sides with plastic or paint.
  • it can also be used for other RFID devices, such as key cards, access cards, tokens, wearables or security ID cards.
  • a card-shaped data carrier in particular a smart card, which has the following components: a flexible inlay with a contact structure arranged on an upper side of the inlay, the inlay having an integrated circuit spaced apart from the contact structure and at least one antenna has an upper layer which is arranged above the inlay, the upper layer having a recess in which the contact structure is arranged, and a lower layer which is arranged below the inlay.
  • the top layer comprises a continuous metal layer and a ferrite layer, with the ferrite layer being sandwiched between the metal layer and the flexible inlay.
  • a continuous metal layer refers to a metal layer that does not have a slit or a similarly designed discontinuity to interrupt ring closures in the metal layer or to prevent short-circuit currents.
  • the continuous metal layer is not interrupted and possibly only has the module opening for accommodating the chip module.
  • a ferrite layer is provided for shielding from interfering capacitive influences.
  • the antenna of the flexible inlay can preferably be shielded from the metal layer by the ferrite layer.
  • the ferrite layer allows electromagnetic radiation to be transmitted from a reader to the smart card and back since the metal layer is shielded by the ferrite layer.
  • the integrated circuit is preferably in the form of a chip module which includes a chip.
  • the chip or the chip module is arranged on the flexible inlay, preferably on an underside of the flexible inlay.
  • the contact structure is preferably arranged on the opposite upper side of the flexible inlay.
  • the chip is connected to contacts of the contact structure via wires.
  • the chip module is coupled to the contact structure.
  • the number, size and position of the contacts of the contact structure can be defined by international standards so that the function of the smart card can be ensured in every reading device. Contact-based data transmission between the smart card and a reading device can advantageously be established by means of the chip module and the contact structure.
  • the flexible inlay also includes an antenna (as a coil) for inductive contactless data transmission.
  • the antenna is in particular coupled to the chip, or the chip is connected to the antenna.
  • the antenna is preferably arranged on the underside of the inlay.
  • a contactless smart card can communicate with a reader through electromagnetic waves, where the smart card can function similar to a transceiver.
  • electromagnetic waves emitted by the reading device generate an oscillating electromagnetic field which, for example, generates an oscillating electrical voltage in the coil or antenna of the flexible inlay, as a result of which the chip can be supplied with current.
  • the voltage fluctuations can be captured as a signal and converted into data in the chip.
  • This data can in turn be processed in the chip and converted into changes in the electromagnetic field, which in turn can be picked up by the reader and converted into data.
  • the flexible inlay with the chip module, the contact structure and the antenna can therefore enable contact-based and/or contactless data transmission.
  • a basic idea of the present invention is consequently that the integrated circuit and/or the antenna can be moved out of the area of the recess by means of an inlay and a metal layer is nevertheless present in the card-shaped data carrier.
  • This has the advantage, in particular, that an enlarged antenna can be used as a result of the displacement from the recess, since more space is available on the underside of the flexible inlay than in the area of the recess.
  • the invention thus has the advantage that the card-shaped data carrier proposed here can advantageously have an enlarged antenna, as a result of which both the transmission capacity and the energy input are increased. In particular, this can improve the RFID functionality of the card-shaped data carrier.
  • the card-shaped data carrier can be designed as a metal face card, for example. It can particularly preferably be provided that a first adhesive layer is arranged between the ferrite layer and the metal layer and a second adhesive layer is arranged between the ferrite layer and the inlay, the recess extending through the metal layer, the adhesive layers and the ferrite layer.
  • the adhesive layers have the advantage of improved adhesion between the individual layers, which is why the metal layer can be permanently connected to the ferrite layer and the ferrite layer can be permanently connected to the inlay.
  • the sequence of the existing layers of the upper layer is designed as follows: The second adhesive layer is arranged on the upper side of the inlay. The ferrite layer is arranged on the second adhesive layer.
  • the first adhesive layer is arranged on the ferrite layer and the metal layer, which can form an outer layer or surface of the card-shaped data carrier, is arranged on the first adhesive layer.
  • the recess in which the contact structure is arranged is formed in particular as a hole in the upper layer, which extends through the metal layer, the adhesive layers and the ferrite layer. In other words, the recess forms a type of cavity or breakthrough through the layers of the upper layer.
  • the lower layer comprises a plastic layer, a layer with optical features and an outer overlay layer.
  • the layer with optical features and the overlay layer can preferably be formed from a plastic and can be used, for example, for security features in the optical, IR and/or UV range as well as design features. Information can also be made available.
  • the sequence of the existing layers of the lower layer is designed as follows: The plastic layer is arranged on the underside of the inlay. Below the plastic layer is the layer with optical features arranged.
  • the overlay layer which can form an outer layer or lower surface of the card-shaped data carrier, is arranged below the layer with optical features.
  • the overlay layer can generally be transparent.
  • the layer with optical features can preferably be embodied as a printed layer.
  • an insert is arranged below the contact structure, which insert positions the contact structure in the recess of the upper layer.
  • This insert can be formed from a plastic, for example, and can have the identical dimensions as the contact structure.
  • the insert can press the contact structure into the correct position in the recess, so that the contacts of the contact structure are flush with the upper layer. Since the lower layer is present underneath the insert, a targeted and extensive pressure can be exerted on the insert in a simple manner. This facilitates the production of the card-shaped data carrier, in particular the positioning of the contact structure in the recess of the upper layer.
  • the insert can be formed as a single element or as part of a layer such as the inlay or the bottom layer. Particularly preferably, it can be provided that the insert is arranged in the lower layer below the contact structure, in particular with the insert being arranged between the plastic layer and the layer with optical features.
  • a height of the insert, the inlay, the plastic layer and the contact structure corresponds to a height of the recess in the upper layer. This makes it easy to ensure that the contacts of the contact structure are flush with the upper layer or with the surface of the card-shaped data carrier.
  • a card-shaped data carrier in particular a smart card
  • a card-shaped data carrier which has the following components has: a flexible inlay with a contact structure arranged on an upper side of the inlay, the inlay having an integrated circuit spaced apart from the contact structure and at least one antenna, an upper layer arranged above the inlay, the upper layer having a recess, in which the contact structure is arranged, and a lower layer, which is arranged below the inlay.
  • the bottom layer comprises a continuous metal layer and a ferrite layer, with the ferrite layer being sandwiched between the metal layer and the flexible inlay.
  • the card-shaped data carrier according to the second aspect has the same advantages as were described with regard to the card-shaped data carrier according to the first aspect. Since the lower layer includes the metal layer, the metal layer can be made thicker, for example, and the card-shaped data carrier can include more metal material to increase the value.
  • a first adhesive layer is arranged between the ferrite layer and the metal layer and a second adhesive layer is arranged between the ferrite layer and the inlay.
  • the adhesive layers have the advantage of improved adhesion between the individual layers, which is why the metal layer can be permanently connected to the ferrite layer and the ferrite layer can be permanently connected to the inlay.
  • the order of the existing layers of the lower layer is designed as follows, for example:
  • the second adhesive layer is arranged on the underside of the inlay.
  • the ferrite layer is arranged below the second adhesive layer.
  • the first adhesive layer is arranged below the ferrite layer and the metal layer, which can form an outer layer or lower surface of the card-shaped data carrier, is arranged below the first adhesive layer.
  • Adhesive layer a layer with optical features and an outer one An overlay layer, wherein the third adhesive layer is disposed between the optical feature layer and the inlay, the recess extending through the third adhesive layer, the optical feature layer, and the overlay layer.
  • the sequence of the existing layers of the upper layer is designed as follows:
  • the third adhesive layer is arranged on the upper side of the inlay.
  • the layer with optical features is arranged on the third adhesive layer.
  • the overlay layer which can form an outer layer or surface of the card-shaped data carrier, is arranged on the layer with optical features.
  • the recess in which the contact structure is arranged is formed in particular as a hole in the top layer, which extends through the third adhesive layer, the layer with optical features and the overlay layer. In other words, the recess forms a type of cavity or breakthrough through the layers of the upper layer.
  • the layers of the card-shaped data carrier preferably form the card body.
  • the card body can be formed from a large number of individual layers stacked on top of one another.
  • an insert is arranged below the contact structure, which insert positions the contact structure in the recess of the upper layer. Provision can particularly preferably be made for the insert to be arranged on the lower layer below the contact structure, in particular with the insert being arranged between the inlay and the second adhesive layer.
  • a height of the insert, the inlay and the contact structure corresponds to a height of the recess in the upper layer. This makes it easy to ensure that the contacts of the contact structure are flush with the upper layer.
  • the metal layer is covered with at least one outer layer. This additional layer or layers can be formed from a plastic and can be used, for example, for security features in the optical, IR and/or UV range as well as design features. Information can also be made available.
  • self-centering of the contact structure in the recess can be achieved when the layers are joined together.
  • excessive squeezing or even damage to the inlay during assembly, particularly with a metal layer can be prevented.
  • the antenna can be arranged in the area of a peripheral surface of the card-shaped data carrier.
  • the card-shaped data carrier can thus have an enlarged antenna, as a result of which both the transmission capacity and the energy input are increased. If the windings of the antenna are arranged in the area of the peripheral surface, ie as far outside as possible, the size or the diameter of the antenna can be maximized.
  • a method for producing a card-shaped data carrier according to one of the preceding embodiments is provided, the method having the following steps:
  • the inlay having an integrated circuit spaced apart from the contact structure and at least one antenna
  • the various steps of the method can also be carried out in other orders.
  • the contact structure can only be arranged in the recess when the layers are being laminated.
  • the contacts of the contact structure are then arranged on the recess beforehand, for example positioned below the recess.
  • FIG. 1 shows a plan view of a card-shaped data carrier according to a first embodiment
  • FIG. 2 shows a sectional illustration of a card-shaped data carrier according to a further exemplary embodiment
  • FIG. 3 shows a sectional illustration of a card-shaped data carrier according to a third exemplary embodiment
  • FIG. 4 a schematic representation of a method for producing a card-shaped data carrier.
  • 1 shows a top view of a card-shaped data carrier 10 with a card body 11.
  • the card-shaped data carrier 10 is designed as a smart card, for example.
  • the card-shaped data carrier 10 or the card body 11 has an essentially rectangular basic shape with a surface 11a and an opposite undersurface 11b, of which only the surface 11a is visible in FIG. The other, opposite sub-surface 11b is shown in FIG.
  • the upper surface 11a and the lower surface 11b run parallel to one another and are connected by an encircling peripheral surface 13 .
  • the card-shaped data carrier 10 has a rectangular shape in an x-y plane.
  • the thickness or height of the card-shaped data carrier 10 extends in the z-direction.
  • a recess 14 for a contact structure 15 with five contacts 15a shown as an example is visible in the surface 11a of the card-shaped data carrier 10 .
  • the recess 14 extends into the card-shaped data carrier 10 .
  • the recess 14 is created, for example, by means of a laser operation or a milling operation.
  • the card-shaped data carrier 10 or the card body 11 of the card-shaped data carrier 10 is formed from a plurality of superimposed layers.
  • the card-shaped data carrier 10 has a flexible inlay 19 (not shown) with the contact structure 15 arranged on an upper side of the inlay 19 (and visible through the recess 14), the inlay 19 having an integrated circuit 20 (not shown) at a distance from the contact structure 15 and at least has an antenna 21, not shown.
  • the inlay 19 has an upper layer 17 which is arranged above the inlay 19, the upper layer 17 having the recess 14 in which the contact structure 15 is arranged.
  • a surface of the upper layer 17 forms the surface 11a of the card body 11 or of the card-shaped data carrier 10 .
  • the inlay 19 has a lower layer 18 (not shown) which is arranged below the inlay 19.
  • an undersurface of the lower layer 18 forms the undersurface 11b of the card body 11 or of the card-shaped data carrier 10 .
  • the top layer 17 can include a continuous metal layer 34 (not shown) and a ferrite layer 35 (not shown), with the ferrite layer 35 being disposed between the metal layer 34 and the flexible inlay 19 .
  • the bottom layer 18 may comprise a continuous metal layer 34 and a ferrite layer 35, with the ferrite layer 35 being disposed between the metal layer 34 and the flexible inlay 19.
  • the integrated circuit and/or the antenna can be moved out of the area of the recess 14 by means of the inlay and a metal layer can still be present in the card-shaped data carrier.
  • a metal layer can still be present in the card-shaped data carrier.
  • Fig. 2 shows a sectional view of a card-shaped data carrier 10 according to a further embodiment.
  • the card-shaped data carrier 10 can, for example, be configured analogously to FIG.
  • the card-shaped data carrier 10 is formed, for example, as a stack of layers with a surface 11a and a bottom surface 11b, between which the individual layers are preferably arranged parallel to one another.
  • the stack of layers forms the card body 11 of the card-shaped data carrier 10 .
  • An upper layer 17, a flexible inlay 19 and a lower layer 18 are provided in the stack of layers of the card-shaped data carrier 10 shown in FIG.
  • the upper layer 17 is arranged above the inlay 19 and the lower layer 18 is arranged below the inlay 19.
  • the inlay 19 has, for example, a top side 19a and a bottom side 19b.
  • the upper layer 17 is arranged on the upper side 19a of the inlay 19 and the lower layer 18 is arranged on the lower side 19b of the inlay 19.
  • the flexible inlay 19 can be formed from a flexible plastic such as PET (polyethylene terephthalate), for example.
  • the flexible inlay 19 has a contact structure 15 arranged on the upper side 19a with three contacts 15a shown as an example.
  • the contacts 15a of the contact structure 15 can be formed from aluminum, for example.
  • the inlay 19 has an integrated circuit 20 spaced apart from the contact structure 15 and an antenna 21 .
  • the integrated circuit 20 and the antenna 21 are arranged on the underside 19b of the inlay 19 by way of example.
  • the integrated circuit 20 is embodied as a chip, for example. For example, a flip chip method can be used.
  • the antenna 21, in particular a coil is coupled to the integrated circuit 20 and runs, for example, in the area of a peripheral surface 13 of the card-shaped data carrier 10.
  • the antenna 21 supplies the integrated circuit 20 with energy and/or signals.
  • the integrated circuit 20 For contacting the card-shaped data carrier 10 via the contacts 15a, the integrated circuit 20 is connected to the contacts 15a via inner lines of the inlay 19 (not shown here).
  • the card-shaped data carrier 10 can thus provide a dual interface functionality.
  • the integrated circuit 20 and/or the antenna 21 can also be arranged on the upper side 19a of the flexible inlay 19. Since the individual windings of the antenna 21 are arranged in the area of the peripheral surface 13 of the card-shaped data carrier 10, the size or the diameter of the antenna 21 can be maximized. This improves both the energy input into the integrated circuit 20 and the data transmission to the integrated circuit 20.
  • a recess 14 is arranged in the upper layer 17 and is set up to accommodate the contact structure 15 of the card-shaped data carrier 10 .
  • the upper layer 17 has the recess 14 in which the contact structure 15 is arranged.
  • the recess 14 penetrates the entire thickness of the upper layer 17 and has dimensions which correspond to the dimensions of the contact structure 15, in particular in terms of width and length.
  • a chamfer 14a is provided on both sides, which facilitates the introduction of the contact structure 15 into the recess 14.
  • the layer stack of the card-shaped data carrier 10 during the production of the card-shaped data carrier 10 is shown in FIG.
  • the individual layers of the layer stack are already aligned or positioned relative to one another, but the card-shaped data carrier 10 is not yet laminated.
  • the top layer 17 comprises a continuous metal layer 34 and a ferrite layer 35, with the ferrite layer 35 being sandwiched between the metal layer 34 and the flexible inlay 19.
  • a first adhesive layer 31 is arranged between the ferrite layer 35 and the metal layer 34 and a second adhesive layer 32 is arranged between the ferrite layer 35 and the inlay 19, with the recess 14 extending through the metal layer 34, the adhesive layers 31, 32 and the ferrite layer 35 extends.
  • the sequence of the existing layers of the upper layer 17 is designed as follows, for example:
  • the second adhesive layer 32 is arranged on the upper side 19a of the inlay 19 .
  • the ferrite layer 35 is arranged on the second adhesive layer 32 .
  • the first adhesive layer 31 is arranged on the ferrite layer 35 and the metal layer 34 is arranged on the first adhesive layer 31 and forms an outer layer or the surface 11a of the card-shaped data carrier 10 .
  • the recess 14 in which the contact structure 15 is arranged is in particular formed as a hole in the top layer 17 which extends through the metal layer 34, the adhesive layers 31, 32 and the ferrite layer 35.
  • the lower layer 18 has, for example, a plastic layer 30, a layer 36 with optical features and an outer overlay layer 37.
  • the plastic layer 30 is arranged on the underside 19b of the inlay 19 .
  • the layer 36 with optical features which can also be made of plastic, for example.
  • the overlay layer 37 is arranged, which forms an outer layer or lower surface 11b of the card-shaped data carrier 10 .
  • the overlay layer 37 can generally be made transparent and made of plastic.
  • the plastic layer 30 can serve, for example, as electrical insulation for subsequent metal layers or can protect the flexible inlay 19 when the card-shaped data carrier 10 is mounted.
  • an insert 22 is arranged below the contact structure 15 which positions the contact structure 15 in the recess 14 of the upper layer 17 .
  • the insert 22 is positioned between the plastic layer 30 and the optical feature layer 36 .
  • the dimensions of the insert 22 correspond to the dimensions of the recess 14.
  • FIG. 3 shows a sectional view of a card-shaped data carrier 10 according to a third embodiment.
  • the structure or the layer sequence of the card-shaped data carrier 10 from FIG. 3 is similar to the structure of the card-shaped data carrier 10 shown in FIG. 2. Accordingly, reference is made in part to FIG.
  • the card-shaped data carrier 10 has the upper layer 17 , the flexible inlay 19 and the lower layer 18 .
  • the flexible inlay has the contact structure 15, the integrated circuit 20 and the antenna 21.
  • the recess 14 for the contact structure 15 is provided in the upper layer 17 analogously to FIG. A chamfer as in Figure 2 is also provided.
  • the lower layer 18 and the upper layer 17 in Figure 3 are designed as follows:
  • the lower layer 18 has a continuous metal layer 34 and a ferrite layer 35, with the ferrite layer 35 being arranged between the metal layer 34 and the flexible inlay 19 is.
  • a first adhesive layer 31 is arranged between the ferrite layer 35 and the metal layer 34 and a second adhesive layer 32 is arranged between the ferrite layer 35 and the inlay 19 .
  • the sequence of the existing layers of the lower layer 18 is designed as follows:
  • the second adhesive layer 32 is arranged on the underside 19b of the inlay 19 .
  • the ferrite layer 35 is arranged below the second adhesive layer 32 .
  • the first adhesive layer 31 is arranged below the ferrite layer 35 and the metal layer 34 is arranged below the first adhesive layer 31 and can form an outer layer or lower surface 11b of the card-shaped data carrier 10 .
  • the metal layer 34 can be made thicker so that the card-shaped data carrier 10 has more metal material to increase the value.
  • the upper layer 17 has a third adhesive layer 33, a layer 36 with optical features and an outer overlay layer 37, with the third adhesive layer 33 being arranged between the layer 36 with optical features and the inlay 19, with the recess 14 through the third adhesive layer 33, the optical feature layer 36 and the overlay layer 37.
  • the sequence of the existing layers of the upper layer 18 is designed as follows:
  • the third adhesive layer 33 is arranged on the upper side 19a of the inlay 19 .
  • the layer 36 with optical features is arranged on the third adhesive layer 33 .
  • the overlay layer 37 which forms an outer layer or surface 11a of the card-shaped data carrier 10, is arranged on the layer 36 with optical features.
  • the recess 14 in which the contact structure 15 is arranged is formed in particular as a hole in the top layer 17 which extends through the third adhesive layer 33 , the layer 36 with optical features and the overlay layer 37 .
  • an insert 22 is arranged below the contact structure 15 which positions the contact structure 15 in the recess 14 of the upper layer 17 .
  • the insert 22 in FIG. 3 is arranged between the inlay 19 and the second layer 32 of adhesive.
  • a height of the insert 22 , the inlay 19 and the contact structure 15 can correspond to a height of the recess 14 of the upper layer 17 . This ensures that the surface of the contact structure 15 is flush with the surface 11a of the card-shaped data carrier 10 .
  • the card-shaped data carrier 10 can have a thickness or height of about 920 ⁇ m, for example.
  • the thickness of the entire card body 11 should not exceed the maximum thickness of a card body 11 according to ISO 7810.
  • Fig. 4 shows a schematic representation of a method for producing a card-shaped data carrier 10. The method essentially describes the production of the card-shaped data carriers 10 shown in Figs. 1 to 3.
  • a flexible inlay 19 is provided with a contact structure 15 of the card-shaped data carrier 10 arranged on an upper side of the inlay 19, the inlay 19 having an integrated circuit 20 spaced apart from the contact structure 15 and at least one antenna 21.
  • an upper layer 17 with a recess 14 is arranged on the upper side of the inlay 19 in such a way that the contact structure 15 is arranged in or on the recess 14 .
  • This locating may include alignment or positioning and optionally a gluing operation.
  • the contact structure 15 can already be partially arranged in the recess 14 or on, ie underneath the recess 14 .
  • a lower layer 18 is arranged underneath the inlay 19.
  • an insert 22 can be arranged in or on the lower layer 18. The dimensions of the insert 22 correspond to the dimensions of the recess 14.
  • a fourth step 130 the individual layers are laminated to form a card-shaped data carrier 10.
  • the individual layers of the card-shaped data carrier 10 are brought together under the action of heat and pressure.
  • the insert 22 When laminating or assembling the card-shaped data carrier 10, the insert 22, if it is provided, is pressed into the recess 14, as a result of which the contact structure 15 is pushed up to the surface 11a.
  • the various steps of the method can also be carried out in other orders. It is also possible to join several layers together in a single gluing process.

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

L'invention concerne un support de stockage de données (10) sous la forme d'une carte, comprenant : - une incrustation souple (19) dotée d'une structure de contact (15) située sur une face supérieure de l'incrustation (19), l'incrustation (19) comportant un circuit intégré (20) espacé de la structure de contact (15) et présentant au moins une antenne (21) ; - une couche supérieure (17) qui est située au-dessus de l'incrustation (19), la couche supérieure (17) présentant une ouverture (14) dans laquelle la structure de contact (15) est située ; et - une couche inférieure (18) qui est située au-dessous de l'incrustation (19) ; la couche supérieure (17) comprenant une couche métallique continue (34) et une couche de ferrite (35), la couche de ferrite (35) étant située entre la couche métallique (34) et l'incrustation souple (19). L'invention concerne également un procédé de fabrication d'un support de stockage de données sous la forme d'une carte.
EP22821305.4A 2021-11-24 2022-11-23 Support de stockage de données sous forme de carte et procédé de fabrication d'un support de stockage de données sous forme de carte Pending EP4437453A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102021005830.5A DE102021005830A1 (de) 2021-11-24 2021-11-24 Kartenförmiger Datenträger und Verfahren zum Herstellen eines kartenförmigen Datenträgers
PCT/EP2022/025533 WO2023094027A1 (fr) 2021-11-24 2022-11-23 Support de stockage de données sous forme de carte et procédé de fabrication d'un support de stockage de données sous forme de carte

Publications (1)

Publication Number Publication Date
EP4437453A1 true EP4437453A1 (fr) 2024-10-02

Family

ID=84462801

Family Applications (1)

Application Number Title Priority Date Filing Date
EP22821305.4A Pending EP4437453A1 (fr) 2021-11-24 2022-11-23 Support de stockage de données sous forme de carte et procédé de fabrication d'un support de stockage de données sous forme de carte

Country Status (4)

Country Link
US (1) US12423549B2 (fr)
EP (1) EP4437453A1 (fr)
DE (1) DE102021005830A1 (fr)
WO (1) WO2023094027A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102024120102A1 (de) 2024-07-15 2026-01-15 Giesecke+Devrient ePayments GmbH Trägermodul für einen kartenförmigen Datenträger, kartenförmiger Datenträger und Verfahren zum Herstellen eines kartenförmigen Datenträgers
EP4693099A1 (fr) * 2024-08-09 2026-02-11 Thales Dis France Sas Bouchon de blindage

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11907791B2 (en) * 2013-01-18 2024-02-20 Amatech Group Lijited Smart cards with metal layer(s) and methods of manufacture
US20150206047A1 (en) 2014-01-20 2015-07-23 John Herslow Metal card with radio frequency (rf) transmission capability
US10289944B2 (en) 2015-07-08 2019-05-14 Composecure, Llc Metal smart card with dual interface capability
US11618191B2 (en) * 2016-07-27 2023-04-04 Composecure, Llc DI metal transaction devices and processes for the manufacture thereof
US11315003B2 (en) * 2019-08-14 2022-04-26 Federal Card Services, LLC RFID enabled metal transaction cards
TWI856170B (zh) * 2019-10-25 2024-09-21 美商坎柏斯庫爾有限責任公司 具生物特徵之金屬卡片

Also Published As

Publication number Publication date
WO2023094027A1 (fr) 2023-06-01
US20250021783A1 (en) 2025-01-16
US12423549B2 (en) 2025-09-23
DE102021005830A1 (de) 2023-05-25

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