EP4465761A1 - Système de régulation de température de surface - Google Patents

Système de régulation de température de surface Download PDF

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Publication number
EP4465761A1
EP4465761A1 EP23220367.9A EP23220367A EP4465761A1 EP 4465761 A1 EP4465761 A1 EP 4465761A1 EP 23220367 A EP23220367 A EP 23220367A EP 4465761 A1 EP4465761 A1 EP 4465761A1
Authority
EP
European Patent Office
Prior art keywords
carrier plate
heat
manufacturing process
foil
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP23220367.9A
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German (de)
English (en)
Inventor
Jeannot Weber
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of EP4465761A1 publication Critical patent/EP4465761A1/fr
Withdrawn legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
    • F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
    • F24F5/0089—Systems using radiation from walls or panels
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F24—HEATING; RANGES; VENTILATING
    • F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
    • F24D3/00—Hot-water central heating systems
    • F24D3/12—Tube and panel arrangements for ceiling, wall, or underfloor heating
    • F24D3/14—Tube and panel arrangements for ceiling, wall, or underfloor heating incorporated in a ceiling, wall or floor
    • F24D3/141—Tube mountings specially adapted therefor
    • F24D3/142—Tube mountings specially adapted therefor integrated in prefab construction elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B3/00—Ohmic-resistance heating
    • H05B3/20—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater
    • H05B3/22—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible
    • H05B3/26—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base
    • H05B3/265—Heating elements having extended surface area substantially in a two-dimensional [2D] plane, e.g. plate-heater non-flexible heating conductor mounted on insulating base the insulating base being an inorganic material, e.g. ceramic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/014—Heaters using resistive wires or cables not provided for in H05B3/54
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
    • H05B2203/026—Heaters specially adapted for floor heating

Definitions

  • the invention relates to a surface temperature control system according to the preamble of claim 1 and a manufacturing method for producing a room surface to be temperature controlled according to claim 9.
  • Heat conducting plates made of expanded graphite are known. Material thicknesses of 10 to 15 mm are considered to be low. A groove arranged in the heat conducting plate serves to accommodate a pipe for the flow of a fluid heat transport medium.
  • a wall heating system is known in which a graphite-containing heat-conducting layer is applied to a carrier plate.
  • a groove is made in the heat-conducting layer and/or in the carrier plate, which serves to accommodate a heat exchanger tube.
  • the graphite-containing heat-conducting layer can be designed as a graphite-containing heat-conducting plate or as a fine-grained or low-viscosity to liquid, graphite-containing material.
  • WO 2016/037606 A2 a wall heating system known, which represents the generic state of the art and in which the graphite-containing heat-conducting layer can also be designed as a graphite-containing heat-conducting foil, in particular as a heat-conducting foil made of graphite.
  • the linear heating element can be designed as a heating pipe through which a fluid flows, or it can be designed as an electrical heating cable through which an electrical current flows and which gives off heat in the manner of a resistance heater.
  • the graphite-containing heat-conducting layer can either be arranged in a groove in the carrier plate, i.e.
  • the linear heating element behind the linear heating element, namely on the back of the linear heating element facing away from the room to be heated, or it can, after the heating element has been placed in the groove in the carrier plate, be laid over the entire front of the carrier plate so that it contacts the front of the heating element.
  • the heating element is designed as a pipe, it can be used not only for heating but also for cooling by using a correspondingly tempered fluid.
  • the surface facing the room to be heated is covered with a cladding.
  • the cladding can consist of a layer of plaster, tiles or natural stone slabs, depending on the desired visual and functional design of the wall surface of the room to be heated, so that the materials mentioned are merely examples and not exhaustive.
  • the invention is based on the object of improving a generic surface temperature control system in such a way that it enables a design of the cladding in a particularly simple manner that is as varied as possible and in a simple manner as well as the conditions for a favorable room climate.
  • the invention proposes using a perforated heat-conducting foil, which has openings that make up a total of at least 1.5% of the surface of the heat-conducting foil.
  • the invention is based on the consideration that a heat-conducting foil typically has poor adhesion properties, which applies, for example, to metallic heat-conducting foils made of aluminum or copper as well as to graphite-containing heat-conducting foils, for example heat-conducting foils made of graphite, e.g. expanded graphite.
  • a degreased copper foil can advantageously be used, since this has improved adhesion properties and can, for example, be easily attached to the carrier plate using an adhesive.
  • the openings provided according to the invention make the thermally conductive foil permeable and have two different effects: Firstly, they enable a favourable indoor climate by making the heat-conducting foil permeable to water vapour, which in practice is referred to as "permeable to diffusion". If the heat-conducting foil is attached to the carrier plate using an adhesive in one embodiment of the surface temperature control system, the choice of the appropriate adhesive and the appropriate carrier plate, if these are themselves permeable to diffusion, can ensure the permeable design of the building surface, which is which is provided with the surface temperature control system, for example a floor, a wall or a ceiling surface of the room.
  • the openings allow the adhesive to pass through. Since an adhesive is used that, in coordination with the material from which the thermally conductive foil is made, ensures good adhesion to the thermally conductive foil, this adhesive provides an excellent primer on the front of the thermally conductive foil, so that the further cladding can be built on this primer, e.g. in the form of a clay plaster.
  • the heat-conducting foil can be attached to the carrier plate on site.
  • it can be attached at the factory, independently of the construction site, for example at the carrier plate manufacturer's factory, so that a carrier plate that is ready for immediate use and ready for processing can be provided at the construction site.
  • the carrier plate typically has a single groove, namely when a single linear heating element is to be laid on the carrier plate.
  • the heating element can run in a spiral.
  • it is usually laid in a serpentine or meandering shape so that it runs in the same plane everywhere.
  • the several grooves referred to in this way actually represent several sections of the same, continuous groove. Therefore, the following also refers to several grooves, even if the carrier plate is not designed to accommodate several heating elements, but only has a single, continuous groove to accommodate a single linear heating element.
  • the carrier plate has several grooves running next to one another - for example parallel to one another.
  • This part of the heat-conducting foil can be so long that it is in contact with the heating element, which typically has a round cross-section, over 180° of its cross-section. This results in excellent, intensive heat transfer from the heating element to the heat-conducting foil and thus has a positive effect on the efficiency of the surface temperature control system.
  • the strips can be dimensioned and arranged on the carrier plate in such a way that each strip projects with its two side edges over both adjacent grooves, to such an extent that two adjacent strips of the heat-conducting film overlap above the grooves.
  • the projections by which the strips project over a groove can be dimensioned so short that the strips only have to project over the respective groove, but not beyond it, and the groove can still be completely lined with the heat-conducting film, in order to ensure as large a contact area as possible with the heating element. Since the strips do not project over the adjacent groove, they do not hinder the processing of the adhesive in order to distribute it on the front of the heat-conducting film in the procedure described above.
  • a water glass-based adhesive has proven to be a good adhesive when using a thermally conductive film made of expanded graphite.
  • this type of adhesive is also commercially available under the name of water glass adhesive.
  • Water glass adhesive is highly temperature stable, so that its function is guaranteed even under changing temperature stresses and in the face of temperature fluctuations over a long period of time.
  • the carrier plate can be made of different materials.
  • a carrier plate made of natural, organic materials, such as a wood fiber board can be advantageous.
  • the carrier plate can be made of foam glass, for example if the temperature control system is to serve as underfloor heating and the floor will be subject to heavy furniture or, for example, vehicles in industrial applications.
  • the carrier plate can be made of a calcium silicate material so that it can absorb its own weight in water without structural failure and without mold.
  • Fig. 1 shows a cross-section through a carrier plate 1, which has a front side 2 and a back side 3.
  • the back side 3 can be placed on a supporting surface of a building, for example laid on a screed or attached to a building wall, while the front side 2 is arranged facing the room to be heated.
  • the front side 2 is provided with a groove 4, which serves to accommodate a linear heating element. Depending on the cross-sectional geometry of the groove 4, this is intended to accommodate an electrical resistance heating cable, or to Recording of a heating pipe through which, for example, water flows as a heat transfer medium.
  • a heat-conducting foil 5 is arranged on the front side 2 of the carrier plate 1.
  • the foil is designed as a foil made of expanded graphite and has a material thickness in the range of 0.1 to 1 mm.
  • the heat-conducting foil 5 does not consist of a single cut that extends over the entire front side 2 of the carrier plate 1. Rather, Fig. 1 Two strips 6 of the heat-conducting foil 5 are visible, which extend in the area of their side edges over the Fig. 1 illustrated groove 4 and overlap above the groove 4, and which protrude with their respective second side edge above a groove 4 which is adjacent to the illustrated groove 4 and runs, for example, parallel to the illustrated groove 4.
  • the heat-conducting foil 5 is provided with a plurality of openings 7.
  • Fig. 2 the carrier plate 1 is shown in a state which, compared to Fig. 1 represents a further assembly progress.
  • a linear heating element 8 in the form of a heating pipe has been inserted into the groove 4.
  • the two projections with which the tracks 6 protruded over the groove 4 were bent into the groove 4 and aligned with the round contour of the groove cross-section.
  • an adhesive 9 can be seen which, on the one hand, fixes the webs 6 to a carrier plate 1 and, on the other hand, has passed through the openings 7 and has been spread on the front side of the webs 6 facing the room in order to create a primer there.
  • the tracks 6 with their respective projection do not extend completely over the groove 4, as can be seen from Fig. 1
  • the two projections can be dimensioned in such a way that an overlap within the groove, as shown in Fig. 2 is shown, is avoided.
  • the cutting of the strips 6 can be dimensioned such that either the aforementioned overlap within the groove 4 is avoided or, by accepting such an overlap, the largest possible contact with the heating element 8 is ensured.
  • the front side 2 of the carrier plate 1 can be covered with a single cut of material of a heat-conducting film 5.
  • this heat-conducting film 5 can span the grooves 4. Cuts are then made in the heat-conducting film 5, namely following the course of the grooves 4, so that two projections of the heat-conducting film 5 are created above each groove 4, which touch each other.
  • the cutting line can run exactly over the middle of the groove 4.
  • the cutting line can also run deliberately offset from the middle, so that a projection of the heat-conducting film 5 is created that can be folded particularly deeply into the groove 4 when the heating element 8 is inserted into the groove 4.

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Combustion & Propulsion (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Surface Heating Bodies (AREA)
  • Central Heating Systems (AREA)
  • Resistance Heating (AREA)
EP23220367.9A 2023-05-16 2023-12-27 Système de régulation de température de surface Withdrawn EP4465761A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE202023102668.0U DE202023102668U1 (de) 2023-05-16 2023-05-16 Flächentemperiersystem

Publications (1)

Publication Number Publication Date
EP4465761A1 true EP4465761A1 (fr) 2024-11-20

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Family Applications (1)

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EP23220367.9A Withdrawn EP4465761A1 (fr) 2023-05-16 2023-12-27 Système de régulation de température de surface

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EP (1) EP4465761A1 (fr)
DE (1) DE202023102668U1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE202025002638U1 (de) 2025-09-08 2026-02-26 Leon Seibicke Modulare Grundplatte mit werkseitiger Fräsung und flächig aufgebrachter Wärmeleitfolie zum Heizen und Kühlen zur optionalen Integration von Heizrohren

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10341255A1 (de) 2003-09-04 2005-04-07 Sgl Carbon Ag Wärmeleitplatten aus expandiertem Graphit sowie Verfahren zu ihrer Herstellung
DE202012003810U1 (de) * 2012-03-15 2013-02-08 Sgl Carbon Se Wärmeleitendes Verbundelement auf Basis von expandiertem Graphit
DE202014104262U1 (de) 2014-09-09 2014-11-25 Jeannot Weber Wandheizsystem
DE202014101786U1 (de) * 2014-04-15 2015-07-17 herotec GmbH Flächenheizung Flächenelement zur Aufnahme von Fußbodenheizungsrohren
DE102014002205A1 (de) * 2014-02-21 2015-08-27 Sgl Lindner Gmbh & Co. Kg Verbundelement zur Temperierung von Räumen sowie Verfahren zur Herstellung eines solchen Elements
DE202015106131U1 (de) * 2015-11-12 2017-02-16 Uponor Innovation Ab Flächentemperiersystem sowie Wärmetauscheranordnung
DE202017101128U1 (de) * 2017-02-28 2018-05-29 Uponor Innovation Ab Flächentemperiersystem
DE202020101499U1 (de) * 2020-03-05 2020-05-05 Eps Industries Gmbh Trägerplatten für Fußbodenheizungen
GB2589105A (en) * 2019-11-19 2021-05-26 Marmox Ltd A thermal insulation and diffusion floor panel for an underfloor heating or cooling system
EP3497373B1 (fr) * 2016-08-10 2021-07-14 Omnie Limited Panneau de transfert de chaleur
GB2597258A (en) * 2020-07-16 2022-01-26 Ridgespear Ltd Heat transfer panel and method

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10341255A1 (de) 2003-09-04 2005-04-07 Sgl Carbon Ag Wärmeleitplatten aus expandiertem Graphit sowie Verfahren zu ihrer Herstellung
DE202012003810U1 (de) * 2012-03-15 2013-02-08 Sgl Carbon Se Wärmeleitendes Verbundelement auf Basis von expandiertem Graphit
DE102014002205A1 (de) * 2014-02-21 2015-08-27 Sgl Lindner Gmbh & Co. Kg Verbundelement zur Temperierung von Räumen sowie Verfahren zur Herstellung eines solchen Elements
DE202014101786U1 (de) * 2014-04-15 2015-07-17 herotec GmbH Flächenheizung Flächenelement zur Aufnahme von Fußbodenheizungsrohren
DE202014104262U1 (de) 2014-09-09 2014-11-25 Jeannot Weber Wandheizsystem
WO2016037606A2 (fr) 2014-09-09 2016-03-17 Jeannot Weber Système de chauffage de paroi
DE202015106131U1 (de) * 2015-11-12 2017-02-16 Uponor Innovation Ab Flächentemperiersystem sowie Wärmetauscheranordnung
EP3497373B1 (fr) * 2016-08-10 2021-07-14 Omnie Limited Panneau de transfert de chaleur
DE202017101128U1 (de) * 2017-02-28 2018-05-29 Uponor Innovation Ab Flächentemperiersystem
GB2589105A (en) * 2019-11-19 2021-05-26 Marmox Ltd A thermal insulation and diffusion floor panel for an underfloor heating or cooling system
DE202020101499U1 (de) * 2020-03-05 2020-05-05 Eps Industries Gmbh Trägerplatten für Fußbodenheizungen
GB2597258A (en) * 2020-07-16 2022-01-26 Ridgespear Ltd Heat transfer panel and method

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Publication number Publication date
DE202023102668U1 (de) 2023-07-25

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