EP4466760A1 - Ensemble électromécanique ayant un conducteur intégré - Google Patents

Ensemble électromécanique ayant un conducteur intégré

Info

Publication number
EP4466760A1
EP4466760A1 EP22835982.4A EP22835982A EP4466760A1 EP 4466760 A1 EP4466760 A1 EP 4466760A1 EP 22835982 A EP22835982 A EP 22835982A EP 4466760 A1 EP4466760 A1 EP 4466760A1
Authority
EP
European Patent Office
Prior art keywords
housing
conductor
assembly according
assembly
dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP22835982.4A
Other languages
German (de)
English (en)
Inventor
Channing Paige FAVREAU
Alexander Gilbert
Thomas V. Sikina
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US17/658,344 external-priority patent/US11949216B2/en
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of EP4466760A1 publication Critical patent/EP4466760A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/27—Adaptation for use in or on movable bodies
    • H01Q1/28—Adaptation for use in or on aircraft, missiles, satellites, or balloons
    • H01Q1/286—Adaptation for use in or on aircraft, missiles, satellites, or balloons substantially flush mounted with the skin of the craft
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P3/00—Waveguides; Transmission lines of the waveguide type
    • H01P3/02—Waveguides; Transmission lines of the waveguide type with two longitudinal conductors
    • H01P3/06—Coaxial lines
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/27—Adaptation for use in or on movable bodies
    • H01Q1/28—Adaptation for use in or on aircraft, missiles, satellites, or balloons
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome

Definitions

  • interconnections As is known in the art, electromechanical assemblies require electrical interconnections. As assemblies shrink in size and increase in the level of integration, interconnections may become a limiting factor. A wide variety of interconnections and connectors can be used to provide desired signal paths. For example, in conventional systems, cables and connectors may be routed either free standing or tied down with cables ties.
  • Example embodiments of the disclosure provide methods and apparatus for an electromechanical housing assembly having integrated cable channels, such as DC and RF cable channels.
  • the housing is 3D printed.
  • a conductive channel is used as an outer ground conductor for coaxial RF cables and shielding for DC/Logic Cables. Direct contact between the cable structure and the housing serves as a thermal connection to the housing for improved power handling.
  • a wide variety of desired complex geometries can be realized to control cable length, phase, loss, etc., as well as to simplify assembly and reduce the likelihood of miswiring.
  • embodiments of the disclosure can provide enabling technology for high frequency arrays that have a high interconnect density.
  • channels can serve as high performing coaxial transmission lines.
  • a housing assembly comprises: a housing comprising a conductive material; a conductor extending through the housing; a dielectric material at least partially surrounding the conductor, wherein portions of the housing surround the conductor such that the conductor, the dielectric, and the portions of the housing form a channel through the housing.
  • a housing assembly can further include one or more of the following features: the first channel comprises a coaxial transmission line, the housing is printed, the housing forms part of a conformal antenna array, a circuit board conformally mounted on the housing, the housing has a hemispherical shape, the housing has a cylindrical shape, the housing is grounded, the housing provides a thermal dissipation path, a path of the conductor through the housing is non-linear and selected to achieve a selected length for the conductor, a path of the conductor through the housing is non-linear and selected for phase performance, a path of the conductor through the housing is non-linear and selected for loss performance, the housing comprises a surface with a series of facets, respective circuit cards mounted on the facets, and respective channels are connected to the circuit cards, the housing further includes a structural member to increase thermal performance of the assembly, the housing further includes a structural member to increase structural strength of the housing, and/or an end of the conductor provides a through hole soldered interface to a circuit board.
  • a method comprises: employing a housing comprising a conductive material; employing a conductor extending through the housing; employing a dielectric material at least partially surrounding the conductor, wherein portions of the housing surround the conductor such that the conductor, the dielectric, and the portions of the housing form a channel through the housing.
  • a method can further include one or more of the following features: the first channel comprises a coaxial transmission line, the housing is printed, the housing forms part of a conformal antenna array, a circuit board conformally mounted on the housing, the housing has a hemispherical shape, the housing has a cylindrical shape, the housing is grounded, the housing provides a thermal dissipation path, a path of the conductor through the housing is non-linear and selected to achieve a selected length for the conductor, a path of the conductor through the housing is non-linear and selected for phase performance, a path of the conductor through the housing is non-linear and selected for loss performance, the housing comprises a surface with a series of facets, respective circuit cards mounted on the facets, and respective channels are connected to the circuit cards, the housing further includes a structural member to increase thermal performance of the assembly, the housing further includes a structural member to increase structural strength of the housing, and/or an end of the conductor provides a through hole soldered interface to a circuit board.
  • BRIE B
  • FIG. 1 A is a partially cutaway side view
  • FIG. IB is a first isometric view
  • FIG. 1C is a second isometric view, of a housing assembly having an integrated cable
  • FIG. 2A is a graphical representation of S mode parameters for the housing assembly of FIG. 1A;
  • FIG. 2B is a graphical representation of the E-field for the housing assembly of FIG. 1A;
  • FIG. 3 is an isometric view of a conductive cylindrical housing having a groove for a cable
  • FIG. 4A is an isometric view
  • FIG. 4B is a cross-sectional view
  • FIG. 4C is a cross-sectional view with certain features removed, of a housing assembly having integrated channels
  • FIG. 5 is a cutaway isometric view of a housing assembly having integrated cables and structural members.
  • FIG. 6A is an isometric view of a housing assembly having integrated cables interconnected to a circuit board and FIG. 6B shows further details of the connection of the cables to the circuit board.
  • Coaxial cables refer to a type of electrical cable having an inner conductor surrounded by a concentric conductive material that forms a shield separated from the inner conductor by a dielectric material.
  • a protective sheath or jacket can form an outer layer for the coaxial cable.
  • a coaxial cable can be considered a type of transmission line for propagating high-frequency electrical signals with relatively low loss.
  • the electromagnetic field corresponding to the propagated signal is only present in the space between the inner and outer conductors so that coaxial cables can be located near conductive objects and materials without power loss.
  • the outer conductor prevents external signals from interfering with signals carried by the center conductor. Normally, the outside of the shield is kept at ground potential and a signal carrying voltage is applied to the center conductor.
  • the characteristic impedance of the coaxial cable corresponds to the dielectric constant of the insulating material and the size of the center and outer conductors.
  • a uniform cable characteristic impedance minimizes signal loss.
  • Source and load impedances may be selected to match cable impedance for preferred power transfer and standing wave characteristics.
  • Example dielectrics include solid and foam dielectric materials that may contain air or other gas to achieve desired operating characteristics. In some embodiments, the dielectric is air.
  • Coaxial cables have connectors at terminal ends to maintain the coaxial connection and provide the same impedance as the cable.
  • Connectors are usually coated with high-conductivity metals.
  • FIG. 1 shows an example assembly 100 including a conductive metal housing 102 and a conductor 104 at least partially contained within a dielectric material 106 to provide a low loss, high isolation interconnect.
  • Example interconnects are configured for RF signals, DC signals, digital logic signals, and the like.
  • the conductor 104 is completely contained in the dielectric material 106. In other embodiments, the conductor 104 is not completely contained in the dielectric material.
  • a coaxial cable includes the conductor 104, the dielectric material 106, and a shield or outer conductor 108 provided by the conductive housing 102. In some embodiments, the conductor 104 is completely contained in the housing material 108. In other embodiments, the conductor 104 is not completely contained in the housing material 108.
  • the conductor 104, the dielectric 106, and the shield 108 provide a signal channel in a 3D printed housing.
  • the use of 3D printing provides more degrees of freedom to form the housing than conventional assemblies for better performance.
  • channels can be added to existing housings and cables can be fixed in place without the need for additional tie down points. Because the housing 102 is conductive, the housing can serve as the outer conductor for coaxial cables so as to reduce the overall size of the cables. In embodiments, a channel can serve as a high performing coaxial transmission line.
  • a conductor 104 is integrally formed in the housing 102 which provides a thermal path to dissipate heat generated in and around the conductor.
  • a channel can serve to carry large numbers of signals as an enabler for high frequency and conformal arrays.
  • example channel embodiments may reduce the likelihood of assembly miswirings.
  • channels can include respective conductors 104 interconnected to a conformal antenna array 120, as shown in FIG. 1C.
  • conformal array refers to an array that conforms to the shape of a non-planar substrate.
  • a conformal array may conform to the outer surface of an airplane.
  • channels can match phase and loss better than with standard connectors and cables. Channels can be optimized to specific lengths and shapes for desired performance.
  • FIG. 2A shows an example S parameter plot over frequency for modes S(l, 1) 200 and S(2,l) for the housing assembly of FIG. 1A.
  • FIG. 2B shows an example graphical E-field display for an example channel, such as the conductor 104, dielectric 106, hemispherical housing 108 configuration of FIG. 1A.
  • FIG. 3 shows an example conductive housing 300 that is cylindrical in shape.
  • the housing 300 includes a groove 302 along a length of the housing that is configured to contain a conductor and dielectric material.
  • the groove 302 allows a cable to be routed on an interior surface of the conductive housing 300. It is understood that the groove 302 can have any suitable geometry, location, size, etc., to contain a particular conductor and dielectric configuration to form a channel having selected characteristics.
  • FIG. 4A is an isometric view of a housing assembly 400 having integrated cables
  • FIG. 4B is an isometric cross-sectional view of the housing assembly 400 of FIG. 4A
  • FIG. 4C is an isometric cross-sectional view of the housing assembly of FIG. 4B without an outer conductor for the cables provided by the conductive housing.
  • a housing 402 includes a top with eight facets 404 and a bottom surface 408. Respective circuit card assemblies (CCAs) 410 are mounted on each of the facets 404. A further CCA (not shown) can be mounted to the bottom surface 408 of the housing.
  • CCAs circuit card assemblies
  • respective channels include a cable (not shown) surrounded by dielectric material 412 and a shield 414 provided by the same material as the conductive housing 402.
  • the housing 402 can be 3D printed using a conductive material to form the facets 404, sides 416, and outer conductor/cable shields 414 for the channels.
  • the channels can carry large numbers of high frequency signals for an antenna array, for example.
  • the array can comprise a conformal array.
  • the cables can be inserted and/or embedded in the housing to reduce or eliminate mis-wired connections and facilitate assembly.
  • FIG. 5 shows a housing assembly 500 having integrated channels 502 shaped and configured to match phase and loss so as to provide improved performance compared to conventional cable configurations.
  • the channels 502 can have lengths and shapes for optimization of a desired performance characteristics.
  • the channel walls which can comprise the same conductive material as the housing, provide a thermal interface to the rest of the system.
  • structural members 504 can increase structural support and thermal performance.
  • channels 502 can be flared 506 at one or both ends.
  • FIG. 6A is an isometric view of a housing assembly 600 having integrated cables that can provide an interface to a circuit board 602, such as a printed wiring board.
  • FIG. 6B shows further detail of the interface to the circuit board.
  • a printed wiring board (PWB) 602 is conformally mounted to a hemispherical housing 604. As described above, a conductor 606 surrounded by dielectric material 608 can go through the housing 604. The conductor 606 can extend up from the surface of the housing. In embodiments, the conductor 606 is used as a through hole solder interface to the PWB 602.
  • a portion of the conductor 606 extends through the PWB 602.
  • a solder fillet 610 and solder via pad 612 provide a connection to the PWB 602.
  • embodiments of an assembly having integrated cables is applicable to wide variety of applications in which highly integrated electromechanical assemblies are desirable, such as radar antenna feed lines, computer network connections, digital audio, streaming configurations, cellular network connections, vehicle and the like.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Astronomy & Astrophysics (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Remote Sensing (AREA)
  • Waveguides (AREA)
  • Details Of Aerials (AREA)
  • Variable-Direction Aerials And Aerial Arrays (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

L'invention concerne des procédés et un appareil pour un ensemble boîtier comprenant un boîtier comprenant un matériau conducteur, un conducteur s'étendant à travers le boîtier, et un matériau diélectrique entourant au moins partiellement le conducteur. Des parties du boîtier peuvent entourer le conducteur de telle sorte que le conducteur, le diélectrique et les parties du boîtier forment un canal à travers le boîtier.
EP22835982.4A 2022-01-18 2022-11-29 Ensemble électromécanique ayant un conducteur intégré Pending EP4466760A1 (fr)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US202263300389P 2022-01-18 2022-01-18
US17/658,344 US11949216B2 (en) 2022-01-18 2022-04-07 Electromechanical assembly having integrated conductor
PCT/US2022/051132 WO2023140930A1 (fr) 2022-01-18 2022-11-29 Ensemble électromécanique ayant un conducteur intégré

Publications (1)

Publication Number Publication Date
EP4466760A1 true EP4466760A1 (fr) 2024-11-27

Family

ID=84799797

Family Applications (1)

Application Number Title Priority Date Filing Date
EP22835982.4A Pending EP4466760A1 (fr) 2022-01-18 2022-11-29 Ensemble électromécanique ayant un conducteur intégré

Country Status (5)

Country Link
EP (1) EP4466760A1 (fr)
JP (2) JP7772955B2 (fr)
KR (1) KR20240115891A (fr)
TW (1) TWI836776B (fr)
WO (1) WO2023140930A1 (fr)

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09321525A (ja) * 1996-05-29 1997-12-12 Dainippon Printing Co Ltd 空中線および空中線制御装置
DE19707490C2 (de) * 1997-02-25 2000-05-11 Siemens Ag HF-Koaxial-Steckverbinder
US5870064A (en) * 1997-10-01 1999-02-09 Tx Rx Systems Inc. Signal transmission antenna mast
US6483464B2 (en) 2000-10-31 2002-11-19 Harris Corporation Patch dipole array antenna including a feed line organizer body and related methods
US7038625B1 (en) 2005-01-14 2006-05-02 Harris Corporation Array antenna including a monolithic antenna feed assembly and related methods
JP5299335B2 (ja) 2010-03-26 2013-09-25 三菱電機株式会社 スパイラルアンテナ装置
US20160141766A1 (en) * 2013-03-13 2016-05-19 SeeScan, Inc. Gradient antenna coils and arrays for use in locating systems
JP5998296B1 (ja) * 2013-06-07 2016-09-28 アップル インコーポレイテッド コンピュータシステムのためのエンクロージャ及び計算構成要素を有するコンパクトコンピューティングシステムのためのエンクロージャ
EP3125804B1 (fr) * 2014-03-31 2019-05-01 Covidien LP Système d'antenne sphérique tenu à la main pour détecter des objets marqués par transpondeur, par exemple pendant une chirurgie
WO2017200616A2 (fr) * 2016-02-23 2017-11-23 Massachusetts Institute Of Technology Alimentation de fente rayonnante coaxiale intégrée
SE1650818A1 (en) * 2016-06-10 2017-12-11 Cellmax Tech Ab Antenna feeding network
WO2018005532A1 (fr) 2016-06-27 2018-01-04 The Regents Of The University Of California Réseaux d'antennes redresseuses unipolaires réparties sur une surface courbe pour collecte d'énergie rf ambiante multidirectionnelle, multipolarisation et multibande
US11395923B2 (en) * 2018-11-16 2022-07-26 Verily Life Sciences Llc Branched proximal connectors for high density neural interfaces

Also Published As

Publication number Publication date
TW202333438A (zh) 2023-08-16
TWI836776B (zh) 2024-03-21
WO2023140930A1 (fr) 2023-07-27
JP2025502255A (ja) 2025-01-24
JP7772955B2 (ja) 2025-11-18
KR20240115891A (ko) 2024-07-26
JP2026034819A (ja) 2026-03-02

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