EP4587256A1 - Plateforme de fabrication additive, résine et améliorations apportées à la fabrication de microdispositifs - Google Patents

Plateforme de fabrication additive, résine et améliorations apportées à la fabrication de microdispositifs

Info

Publication number
EP4587256A1
EP4587256A1 EP23866120.1A EP23866120A EP4587256A1 EP 4587256 A1 EP4587256 A1 EP 4587256A1 EP 23866120 A EP23866120 A EP 23866120A EP 4587256 A1 EP4587256 A1 EP 4587256A1
Authority
EP
European Patent Office
Prior art keywords
printing
layer
resin
light source
projector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP23866120.1A
Other languages
German (de)
English (en)
Inventor
Walter MCALLISTER
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Skyphos Industries Inc
Original Assignee
Skyphos Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US17/943,177 external-priority patent/US12605896B2/en
Application filed by Skyphos Industries Inc filed Critical Skyphos Industries Inc
Publication of EP4587256A1 publication Critical patent/EP4587256A1/fr
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10—Processes of additive manufacturing
    • B29C64/106—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/124—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified
    • B29C64/129—Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using layers of liquid which are selectively solidified characterised by the energy source therefor, e.g. by global irradiation combined with a mask
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/227—Driving means
    • B29C64/232—Driving means for motion along the axis orthogonal to the plane of a layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/227—Driving means
    • B29C64/236—Driving means for motion in a direction within the plane of a layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/245—Platforms or substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B29C64/264—Arrangements for irradiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/386—Data acquisition or data processing for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00—Processes of additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00—Apparatus for additive manufacturing; Details thereof or accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y70/00—Materials specially adapted for additive manufacturing
    • B33Y70/10—Composites of different types of material, e.g. mixtures of ceramics and polymers or mixtures of metals and biomaterials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents

Definitions

  • 3D Printing 3D Printing
  • AM Additive Manufacturing
  • UF Microfluidics
  • POC Point of Care Diagnostics
  • LOC Lab on a Chip
  • 3D printing or “3DP”) is disruptive to standard manufacturing.
  • a well attenuated 3D printer, directed at a particular and focused manufacturing area, has displaced well-entrenched manufacturing processes previously, for example, from 2014 to 2016, Phonak was the first to employ 3D printing to produce hearing aids. In just over 500 days the entire industry replaced mold-based fabrication methods it had relied on for decades and adopted 3D printing.
  • 3D printing systems have been unable to combine both the feature sizes required (e.g., ⁇ 100um) with the larger print scales needed to pack all components on a device (e.g., 30-70 mm), and the integration of chip-to-world connectivity.
  • a device e.g., 30-70 mm
  • chip-to-world connectivity e.g., 30-70 mm
  • 3DP is viewed as a slower process than mass fabrication like molding. It is seen as a bridge to manufacturing and is mainly used for rapid prototyping or small batches for initial product development.
  • 3DP can challenge the current paradigm because in the correct application it is both a product development accelerator and a flexible/agile manufacturing platform.
  • a liquid resin comprised of one or more monomer(s) and/or oligomer(s), sometimes with plasticizers; a suitable photo-initiator that reacts with the light source of the printer.
  • the resin also includes (usually) a photo-blocker (“PB”) and/or dye which are used to limit the cure depth (penetration in Z) of the light source.
  • PB photo-blocker
  • the PB also acts to reduce bleeding over (beyond the illuminated area in XY) to reduce unwanted polymerization in previously printed layers, especially channels that are to remain open in the final part. After completion, the part is considered in a “green-cure” state, meaning it has structure but not final strength and has residual unreacted resin components.
  • Finishing is completed by washing the green-cure in a proper solution bath such as Isopropanol (IPA) to remove residual resin from the surfaces, flushing channels, and using a final cure step placing the model in a UV chamber, sometimes with heat, to bring the strength up and eliminate any toxic remnants of resin (PI/PB/monomers) which can kill target cells or be dangerous to handling.
  • IPA Isopropanol
  • Typical single channels LEDs are 10-20nm wide and centered at 365, 385, 395, or 405nm, but note that LCD machines cannot readily use lower than 405nm because the transmittance of the LCD screen drops to nearly 0% below 395nm.
  • SLA-Printers [00012] The disclosure herein focuses on Vat-based printers. For example, FORM Labs 2 and 3 have a laser cross-section approaching 70 um and many LCD printers have Pixel resolutions between 22-50 um. The resulting features have minimal cross sections of approximately 150 um for solids and voids of 250-750 um however they cannot print features or enclosed channels below this threshold which is the upper bound of microfluidics.
  • LCD [00023] Like a visual solenoid, a Liquid Crystal Display (LCD) uses voltage to “open” or “close” pixels on a transparent section of thin glass. The passage of light via pixels that alternate between black (eliminating light) and clear when switched between energized or not. An LED array below the LCD screen passes light to the resin in the specific areas to be polymerized only when the pixel affecting that area is open/clear. Beyond being cheap to manufacture, the advantage here is that a pure light source or diode laser source can be chosen to precisely fit the PI selected. However, there are two major drawbacks to LED/LCD setups.
  • this invention includes the creation of this 3D printer or additive manufacturing (AM) platform and resin formulation for the purpose of creating microfluidic and microdevices via layer by layer and voxel by voxel method(s).
  • the process/system can display pixels on the polymerization surface between 0.1 and 100 ums with a DLP projector which uses a wide spectrum bulb (such as NMHi, metal-halide bulb, Hg, or bank of several LED bulbs, or UV to visible light).
  • the current inventive printing system can offer advantages/improvements over the current state of manufacturing hot embossing and injection molding.
  • the typical limit for the number of assembled layers in mold-based uF is approximately 3-layers and has a 0% failure rate, with an 8-hour cycle time with a 4mm height.
  • 3D printing can create a 22-layered device, with over 100 inlets and outlets, a 1.5 mm height, and takes 14 minutes to produce with a 90% pass rate; it can be direct from drawing to part, and does not require months waiting for several molds.
  • this is between 1-200um in a cross-section of one plane (e.g., XY, XZ, YZ, etc.), but it could cover devices with features of less than 200 um in a cross-section of one plane (e.g., XY, XZ, YZ, etc.), of less than 300 um in a cross-section of one plane (e.g., XY, XZ, YZ, etc.), of less than 400 um in a cross-section of one plane (e.g., XY, XZ, YZ, etc.), and of less than 1000 um in a cross-section of one plane (e.g., XY, XZ, YZ, etc.) for chambers.
  • XY, XZ, YZ, etc. for chambers.
  • These small features on the device are for carrying, exchanging, extracting, moving, trapping, counting, analyzing, lysing (or breaking apart), mixing one or more fluids, cells, chemicals, biological entities, and other payloads for the purpose of gaining useful insight and/or data for decision making on patients, or a general process understanding of the interactions of those payloads and the other tests designed on the devices.
  • These interactions are by way of non-limiting examples for proteomics, genomics, phenotyping, DNA sequencing, and re-grafting, bioreactor growth studies, Ph, oxygen content/saturation, conductivity, salinity, cell confluence, reactivity to electronic fields, signals, etc.
  • microdevices or microfluidics may rely on an auxiliary portion (or portions) of features of a device with channel(s) and/or features (s), such as open channels and connections, by way of example, within the 200-1000um size range.
  • auxiliary portion or portions of features of a device with channel(s) and/or features (s), such as open channels and connections, by way of example, within the 200-1000um size range.
  • Other terms and nomenclature such as Lab-on-a-Chip (LOC), point-of-care (POC), microdevices, MEMS, Optical waveguides, sensors, implants, vaccine delivery systems and related terms, can be used to describe the technology that relates to the invention described herein, so they would be understood by one of ordinary skill in the art to relate to the current invention and therefore the current invention could be used in such technological fields and cover such fields.
  • the current invention can use multiple wavelengths and segments of the UV/Visible spectrum which originate from the light-source spectrum both between and within the layers to develop a multi-voxel polymerization method, controlling the depth (Z) and width (XY) of penetration independently and in real time or near real time between, through and within layers.
  • the current invention includes a method for using a wide-spectrum light source with a spectrum that extends significantly beyond the boundaries of the UV absorption spectrum of the photo blocker.
  • the current invention can adjust depth penetration via the selection of segments within the UV and visible spectrum of wavelengths, as well as their duration and intensity at the same time during a single layer or any temporal period. This means a layer or portions of a device in Z may be cured at any time during the print.
  • the invention can expand the ability to cure boundary segments (e.g., bulk: void) with different doses contained within a single exposure.
  • This method can increase and selectively tune the cross-linking and light penetration to adjacent pixel areas which may or may not be active on the digital micromirror device (DMD). This can be used to enhance printing resolution below a standard pixel size/pitch.
  • “Tune” can in aspects mean increasing or decreasing the polymerization rate, speed, and/or area, along with other parameters, via controlling the photon count and spread through wavelength and lumens. This can result in a new set of evaluation parameters for resin and its constituents as well as the controlling factors for polymerization.
  • Another aspect of the current invention pertains to the elevator platform, “Chip- Clip TM ” and the attachment method for glass slides to allow quick loading and unloading of a device to the machine.
  • the current invention pertains to how to use a small camera to capture information on the print on a per-layer basis - this enables the ability to integrate quality control and capture data from each print.
  • the inventive machine/apparatus can use a pivot on the chip clip to allow faster lift and reset time for the resin to refresh between layers. This lift-reset time can be important to the speed of a print and typically is a constraint within the 3D printing community.
  • the current invention can automate the pixel pitch between and during layers for enhanced resolution and speed of printing devices, this is discussed in further detail later.
  • the current invention is a 3D-printing system comprising an off- the-shelf home-based projector, specifically designed focusing apparatus, custom resin formulation, and low-cost parts for the creation of microdevices.
  • the use of an off-the-shelf projector can allow the futureproofing by the intrinsic and automated evolution of new and improved DLP projector systems each year.
  • this system could currently be a 4K micro printing system, but future 8K projectors could also be used for the light-source.
  • FIG.5 D Originating light source from projector bulb, according to embodiments of the current invention.
  • FIG.6 A-D Pixelated surface roughness schematics and table, according to embodiments of the current invention.
  • FIG.7A Chip Clip or Build Plate Attachment according to embodiments of the current invention.
  • FIG.7B Chip Clip or Build Plate Attachment with camera, according to embodiments of the current invention.
  • FIG.8 Chip Clip or Build Plate Gantry according to embodiments of the current invention.
  • FIG.20 Resulting interactions between photoinitiator, photoblocker and filter, according to embodiments of the current invention.
  • FIG.21 Cure depth vs. speed for multiple resins and filters, according to embodiments of the current invention.
  • FIG.22 Microscope imaging of micro channels voids and circular cross channels, according to embodiments of the current invention.
  • FIG.23 shows depictions of flux pass rates, according to embodiments of the current invention.
  • FIG.24 is a photograph showing differences in height of TPO/BBOT resin with a 385nm filter at times of 16, 14, 12, 10, 8, 6, and 4 seconds, confirming limited cure depth.
  • FIG.25 is a photograph showing use of a 405nm filter with TPO/BBOT resin at times of 16, 14, 12, 10, 8, 6, and 4 seconds, which shows a thicker cure depth which is not bound as in FIG 24.
  • FIG.26 is a photograph showing different angle of a 405nm filter with TPO/BBOT resin at times of 16, 14, 12, 10, 8, 6, and 4 seconds, which shows a thicker cure depth, from a different angle than FIG.25, comparatively these three FIGS 24-26 show cure depth is dependent and can be controlled by on light spectrum.
  • DETAILED DESCRIPTION OF THE INVENTION [000102] Reference will now be made in detail to various exemplary embodiments of the invention.
  • the Chip-Clip TM can hold the substrate which the object/device can be printed on, such as a glass slide (110). It can be inserted at the beginning of the print and brought to a preferred location at the “working layer.” An area located between the top of the vat window and the bottom of the slide or last layer printed can be, in aspects, within 1um to 2 mm. This is a larger range than standard 3D printers which have working ranges of 20um-100um. The working layer can be the current layer being printed.
  • the working layer can also be known as the slicing height or layer height, and it can vary between 1 um and 2000 um depending on the filter selected, by way of example.
  • the working layer thickness on a per-layer selection can be a different thickness. Additionally, each layer may have more than one exposure using a different filter and altering the addressable cure depth or working layer distance.
  • the platform can be raised to a sufficient height to allow the new resin to backfill in the area where the previous layer was solidified.
  • the elevator can be brought back to the preferred position, depending on the working layer height. The cycle continues until the end of the part.
  • the current invention allows for the ability to move and reposition the projector in Z to allow for automated positioning with a gantry and associated parts.
  • the invention can include a set of linear rails (114), stepper motor (116) or servo (201), and linear screw (115).
  • the focus of the projector can be adjusted via two independent motors which control the fine focus via a gear set (200)(1) and the zoom (220) of the lens package, or via a linear guide.
  • the current invention allows for movement of the projector lens distance and focusing in real time on the working layer. This overall range of projector travel or distance is generally from direct physical contact to the bottom of the vat window, to a distance of 500 mm below.
  • the projector positioning for each pixel aspect can be stored in a library lookup table of the 3D printer or equation for positioning the motors. If a pixel position is called for which is not available (e.g., in between two hard-coded pixels) a linear calculation can be performed for positioning via a JavaScript algo, by way of example.
  • the computer code, in this example JavaScript may not directly be read by g-code and may only output the final numbers called for by the program.
  • the algorithm can look for the preceding pixel and the next largest pixel in the library. Using these as the range it can then determine what percentage of this range is required and add this number to the preceding pixel location – thus providing the new coordinate to each motor.
  • the master program can use the actual library number or the calculated step and a call movement in g-code can be sent to the three motors controlling projector positioning on the linear rails, focus, and zoom.
  • General functions which describe the position for each motor given a set of parameters can be developed which then also eliminate the need for a direct library. This general function may be of a curve, logarithmic, quadratic, decaying exponential or linear, or determined by linear regression on a set of points for each motor along the total range of the pixel sizes or a combination of any above.
  • Shutter and Filter set [000112] DLP printers and LCD-style printers can utilize a shutter, which when activated, eliminates some or all light from the bulb or LED array by interrupting the beam path.
  • FIG.4 is a picture (4a) of the inventive shutter (106) described herein with two separate filter locations, a 365nm filter (401) and a 385 nm filter (402), between the light source (102) and DMD (103) and after the final lens adjustment (105).
  • LEDs have a number of ranges from 250 - 500nm and the bandwidths are very controlled.
  • resins with varying photo initiators and photo blockers will require different filter ranges.
  • the effect can allow for a custom surface roughness as different pixels are cured to different depths, even if these areas are interspersed with one another.
  • a second spring (702) is in place directly above the slide and puts pressure to hold it down in the Z direction onto the bent portion of the clips.
  • Other methods to hold the glass slide present are vacuum, suction cup, servo motor with a lever arm, magnetic, etc.
  • the spring method was employed after investigating the aforementioned ideas because it, in aspects, had the lowest possibility of failure during age.
  • the chip clip A mounting block (733) shown in the picture of Figure 4b is attached to the elevator of the 3d printer (229) via, in aspects, hand tightened screw via a knob (118) or other fastening methods, such as a spring with a ball and receptacle, magnetics, cam lock positioning, or others.
  • the quick release block (733) holds four vertical rods on springs (732).
  • the rods are free moving within the mounting plate guide holes until a second fastening screw or set screw (734) is tightened against them. [000119] In this way, the clip can be lowered to the “zero” position and aligned parallel to the build window with the setscrews (734) loose.
  • the spring activated rods (732) keep the plate level and flat against the build window, the set screws are then tightened, and the chip clip is level and remains so during printing use.
  • This functionality in a preferred embodiment, is all toolless by design, and can allow for switching out a Chip-Clip TM and leveling a new one in less than 1 minute (by way of example only) from an operator using one hand which is important for fast and agile manufacturing.
  • the “zero” position is the initial layer position for the first bonding layer. This initial layer is one “layer height” above the top of the vat window. A layer height can be determined by the user in the initial slicing of an STL object. In embodiments, the actual standoff distance when using a clip or mount will be, at minimum, the thickness of the clips (701)which hold the glass slide in place. It is also possible to use suction, adhesive, magnets etc.
  • FIG.7b shows the Chip-Clip TM with a cutaway window (740) on the top.
  • a schematic shows where a camera (741)) is mounted above the mounted glass slide (110)enabling images to be taken of the slide and build process at each layer.
  • the current invention allows for the ability to record XY clips of a vat-based printer sequence of all layers.
  • the camera can be remotely triggered to take an image at any point in the build.
  • the camera can be mounted to a linear slide rail (114) to allow focus adjustment as the device height increases.
  • the camera can be of the typical low-cost camera modules for Raspberry Pi, such as the Camera Board V2, as this camera module is 8 Megapixels and could then be matched 1:1 with the number of pixels on the 4K.
  • this is important for data collection, especially in the case of regulations that may require in-process qc control checks.
  • a different bandwidth of light must be used than for the polymerization, otherwise it would either cause polymerization (and eliminate what would be a previously printed channel), be absorbed by the photo blocker and not transmitted to the camera, or a combination of both.
  • the invention can use a 500 nm cut-on filter with the light source, which allows only 500nm light and above from the light source to be transmitted beyond the filter (green, yellow, orange, or red and into the IR spectrum).
  • a chosen layer may be used to log the information and it is also possible to use an extended exposure, moving the filter into position after the proper curing portion of exposure is complete. The image of the current layer is then recorded as part of QA/QC. It can be logged as part of a run, taken at intervals during the print or print run.
  • the camera setup according to the current invention offers nearly in-real-time collection. Further, in vat polymerization styles of printing without the current invention this data is nearly impossible to accrue due to each layer not being visible or able to be tracked.
  • the addition of a camera with imaging per layer according to the current invention allows for closed- loop Quality Control (QC) with real time monitoring and analytics.
  • QC Quality Control
  • the current invention utilizes an adjustable camera mounted to an elevator, which can view directly over the printing area and can be focused on the working print area regardless of thickness of the object or position of the layer internal to the final print, as it can capture the XY plane at each layer.
  • FIG.8 shows a moveable gantry via micro stepping stage (229) and linear rail (114). This stage allows the motion and precise movement of the Chip-Clip TM over and within the elevator in the Y direction. The movement can allow for one exposure to be printed, and a second one after repositioning the stage can allow the doubling, or more of the printing area. This can be important in the case of a 4K projector using a 10-um pixel pitch where the final build area can be 38.4 x 21.6 mm. This size can be limiting as many uF devices require 75mm in at least one axis.
  • the Chip-Clip TM could be moved and double the axis length, for example. Further, it does not restrict the chip clip from one motion and distance. If the pixels were altered to 5 um pitch as described herein, the chip clip can move a preferred distance and still allow for the same overall build platform. In fact, the Chip-Clip TM with properly outfitted gantry motors and linear screw or nano XY stage could move any single distance, even a distance less than one-pixel width.
  • FIG.9 a-d shows illustrations of several sequence variations of the gantry and pixel aspect customization.
  • the FIG.9a sequence shows first exposure for the layer is completed, then the chip-clip raises and moves in the Y direction during, followed by the stage dropping to position for the second exposure in the same layer.
  • the motion in the Y direction can be equal to any amount of projector build area; from less than 1 pixel distance (by way of non-limiting examples ⁇ 1 um, ⁇ 5um, or ⁇ 10um), to an equal amount of build area (in this example 38.4mm), to more than the projector area.
  • the multiple exposures per layer may take several forms; exposing a portion of a layer image and then moving to display the remaining parts, thus enabling a larger device than possible with one.
  • FIG.10 shows the focus of the optic adjustment has been improved and now uses a series of threaded sleeves to adjust the focus.
  • FIG.10 shows the focus apparatus and the projector mounted to the frame.
  • the projector can be mounted with linear slides (040), allowing motion in the Z direction and a variety of different focal distances of the optical set (005). This in turn can allow for adjustment of pixel sizes in real-time by numerical control ranging from the Debye limit of light used..
  • FIG.3b shows the focusing apparatus (020), and a set of motors allowing for control of the focus via a zoom motor apparatus (which, in aspects, comprises a stepper motor, linear rail and bearing, and a threaded rod) (015, 016, 018, respectively), and a fine focus motor (022).
  • a zoom motor apparatus which, in aspects, comprises a stepper motor, linear rail and bearing, and a threaded rod
  • a fine focus motor (022).
  • the system can be capable of adjusting pixel pitch at any time during a print, before, during, or after any layer. This can allow for fidelity and control over the pixel size and thus the resolution down to the Debye number (1 ⁇ 2 wavelength of a particular wavelength) and up.
  • FIG.10 shows a circle in four different quadrants with four different pixel pitches, illustrating there is a need for a high pixel count for precise resolution of objects and proper rendering.
  • FIG.10 is the result of large pixel pitches (047) combined with small pixel patches (048) to enhance the resolution.
  • FIG.11 a-d is a schematic of various pixel pitches. In FIG.11a the size comparison of pixels between 5 um and 50 um is shown.
  • FIG.11b a table lists the total sizes of the build plate resulting from these differences, illustrating the overall build area and the minimum feature size.
  • FIG.11c a schematic is representative of the differences in scale for total build area for the various pixel pitches shown, (e.g., 5 um,10 um, 25 um, and 50 um).
  • FIG.11d a table lists the total build area for one DMD exposure of various resolutions (e.g., 2k, 4k, 8k) vs. different pixel pitches.
  • Multi-Pixel Pitch [000139] The resolution of a printer is generally limited to a single pixel aspect (XY) spacing to create or render any object. While there are certain techniques like dimming or grayscale to reduce or expand the cure of objects that are not a direct multiple of pixel spacing, these do not function very well in practice and can only be applied as a global setting per print - they cannot be tuned to individual cases per layer or even segments of a layer. The result is an object not a direct multiple of the given pixel aspect or smaller than a single pixel is at risk for proper tolerance, and for any features that border on this aspect. These factors should be considered as part of the design for additive manufacturing at the earliest stages of concepts and revisited at the time of any revision.
  • pixel size can be changed before, during, or after printing, including during a layer.
  • the current invention allows for effectively decoupling the printer from any pixel grid and introduces several novel concepts.
  • This inventive technique can be applied for creating smooth curves in the structure in the Z direction, in place of 3D anti-aliasing typically used or in addition to shrinking the pixels to smaller levels.
  • the shapes could be independent from one another, or connected to each other.
  • Features created can be independent from the pixel map of the DLP/LCD, but also not the same as the SLA - it can be a hybrid design. This would enable smooth lines at the micron level, curves and circles with hollow sections, and the ability to make blocks of these features (for example multiple cylinders created with wall thicknesses at), which is exceedingly difficult to do via LCD/DLP, even with the best dimming resolutions technologies.
  • FIG.12 The gantry example in FIG.12 is non-limiting, and several examples of gantries exist, including, by way of example: core-XY, Cartesian, polar, and delta. It is envisioned that a polar gantry would find particularly beneficial use in the creation of devices similar to CD style microfluidics.
  • FIGs.14 a-f illustrate a common microdevice scenario of a circuitous route and branched or bifurcated channels which reduces the span of a channel with each split.
  • FIG.14E illustrates that all aspects of this layer may be resolved; all aspects of the bifurcated channels and route may be printed.
  • the cost in FIG.14E is a very high number of exposures per layer which increases total time to print.
  • FIG 14F shows that more than one pixel size can be integrated for a given layer.
  • the total area covered is multiplication of the total size of the pixels (e.g., 10 um) by the total array size, e.g., 4K is 3840 x 2160 pixels in X and Y. In this example, the total area for an exposure would be would be 38.4 mm x 21.6 mm. If the size of a print dictates a larger build area, the pixels must be scaled up (say by around 50um). However, if the features in the layers are too small (e.g., around 60um width channels in this particular example), they will not be properly resolved, because as taught above, smaller pixels are required to produce detailed features.
  • the picture or image slice can be converted into a mosaic of sub-slices.
  • This can be accomplished by software capable of creating sub images or cropped images via scale size (e.g., vector analysis) or pixel count (e.g., raster/bitmap).
  • scale size e.g., vector analysis
  • pixel count e.g., raster/bitmap
  • all mosaic tiles are the same size, and all pixels remain the same size for the layer and the print - e.g., 10 ums with 4 exposures.
  • this is both not necessary and can take longer to print.
  • Expanding on this aspect of the pixels can also be expanded to print in larger sections more quickly; especially in some layers for uF devices the actual layer has lower tolerance requirements – for example the base layers in many devices are a slab which have no channels. In this case, completing the layer in one exposure - especially if several layers are the same - can have a significant shortening of the total print time. In total this could reduce the number of actual displayed areas per print per layer.
  • FIG 17A shows 30 layers are 10 um in height, this would take 30 repeats of exposure plus peel motion.
  • 10x e.g.2500um
  • standard light sources and high accuracy resins e.g. 10-25um
  • Fig 17B shows a scenario of using 3 filters to allow three different tuned heights of 10 um ,150 um and 300um. This represents a significant reduction in print time as only 6 layers needed to be printed in 17B vs.30 in 17A. This can also be combined with the “trace” described herein and use an edge of pixels to trace the channel or other feature.
  • FIG.19 shows a representative schematic of the projector with focus apparatus, mounted to a standard rotational stage (1901) and then mounted to an XY gantry (1902) with a mounted projector stage.
  • the stage also can have a Z motor (FIG.3) as well as a focusing apparatus.
  • the process reduces the time for the device to be printed. It shows that this technique can reduce the print time by, for example, 30% over standard printing techniques, or 10%, 20%, 40%, 50% over stand techniques, and so on. Together with the chip clip motion time savings, this reduces the time significantly; for example, the new method can be 4-10x faster, or 2x faster, 3x faster, 11x faster, 12x faster, and so on.
  • Exposures can happen in a single layer with the results and crosslinking being tuned within that one exposure vs. multiple exposures in previous art, which required double exposures for the same result (Nordin).
  • a method of three-dimensionally (“3D”) printing comprising: a. providing one or more resin comprising at least one of one or more photoinitiator, one or more photo blocker, one or more monomer, one or more oligomer, one or more plasticizer, or one or more dye; b. providing projector having a light source; c. constructing a 3D printed structure by 3D printing one layer at a time; d. curing each layer of the 3D printed structure using the light source; and e. providing a bandpass filter between the light source and the resin that allows a chosen segment of a spectrum of the light source to polymerize the resin, which allows for control over the cure depth and thickness of a layer of the 3D structure.
  • Aspect 2 The method of three-dimensionally (“3D”) printing of Aspect 1, further comprising: [000199] providing at least two bandpass filters, a first bandpass filter and a second bandpass filter; and [000200] using the first bandpass filter for curing a first layer of the 3D printed structure and the second bandpass filter for curing a second layer of the 3D printed structure, wherein using the two different bandpass filters causes the first layer to have a first cure depth, cure rate, dose rate, or combinations thereof, and the second layer to have a second cure depth, cure rate, dose rate, or combinations thereof, such that the first layer has a first thickness and the second layer has a second thickness.
  • Aspect 3 Aspect 3.
  • a three-dimensional (“3D”) printing apparatus comprising: a. a build deck allowing for loading and unloading of a printing surface for 3D printing of an object or device; b. one or more clip having a thickness ranging from 0.15 mm to 0.5 mm; c. one or more spring for at least one of spring-activated locating of the printing surface, allowing for a repeatable location of the printing surface, spring-activated leveling of the build deck, spring-activated locking of the printing surface and the build deck, or spring-activated removal of the object or the device being 3D printed without having to remove the build deck; and d. one or more gantry located between an elevator and the build deck, wherein the one or more gantry has at least one axis of motion.
  • a 3D printer comprising: a projector with light-source including at least one of LED of suitable wavelength, standard bulb, or laser(s); a DMD; at least one filter to reduce or alter the originating light-source spectrum that hits a polymerization zone/working area; tunable optics enabling pixel resolutions between 0.2um and 50 um; a resin container with transparent window; resin or resin source with at least one photoinitiator, one photoblocker, and one or more monomer and/or oligomer; a build deck attached to an elevator which raises up and down to refresh resin between each layer of polymerization.
  • Aspect 31 The 3D printer of Aspect 30 with a projector or light engine comprised of: a.
  • Aspect 36 A method further to any of the above Aspects, including an ability to move the projector closer or farther from the polymerization plane and to adjust focus to the same plane.
  • Aspect 37 A method further to any of the above Aspects, including wherein different pixel pitches are within the same layer and are adjacent to other areas with different or a same pixel pitch.
  • Aspect 47 A method further to any of the above Aspects, wherein a filter is selected and used in combination with the light source to increase cross-linking or smooth walls of channels of previous layers formed, while still leaving voids which allow uncured resin to be removed.
  • Aspect 48 A method further to any of the above Aspects, wherein the shutter has an open position to allow the full spectrum of original light source to hit the polymerization area.
  • Aspect 49 A method further to any of the above Aspects, wherein filters can be selected to allow the full light spectrum to penetrate the entire device, allowing final curing on a build plate.
  • Aspect 50 Aspect 50.
  • Aspect 51 A method further to any of the above Aspects, wherein the number of layers printed at once is greater than 1, and may be a fraction or multiple of total of the standard layer heights, i.e. if 10 um was the slicing height; 1.1 layers (11 vs 10 um), 2 layers 20 vs 10 um), 30 layers (300 vs 10 um), 100 layers (1000 um vs 10 um).
  • Aspect 52 Aspect 52.
  • a method further to any of the above Aspects wherein the filter selected allows printing thinner than the default layer height, i.e. default layer height is 10 um, but a filter selection allows 1 um to be printed.
  • Aspect 53 A method further to any of the above Aspects, wherein a slicing engine accounts for the changes in layer heights or cure distances and makes adjustments to the next layer, elevator motions, and cure distances via the filter selection.
  • Aspect 54 A method further to any of the above Aspects, wherein the filter is used to reduce the spectrum of LED bulb transmission such that it is fully enveloped by the photoabsorber and the photoblocker. [000257] Aspect 55.
  • Aspect 64 The method of three-dimensionally (“3D”) printing according any previous Aspect, wherein adjacent images (tiled sections from within the same layer), overlapping images (tiled images with a segment or portion overlapping another tiled image), or superimposed images (completely overlapping images), are created using at least one different filter(s).
  • Aspect 65 The method of three-dimensionally (“3D”) printing according any previous Aspect, further comprising a computer processing unit providing a decision matrix program to control a dimming algorithm to render a treatment to images from the slicing engine allowing greyscale treatment for individual layers and portions of those layers to control a range of cross-linking densities in a single exposure.
  • Aspect 66 The method of three-dimensionally (“3D”) printing according any previous Aspect, wherein adjacent images (tiled sections from within the same layer), overlapping images (tiled images with a segment or portion overlapping another tiled image), or superimposed images (completely overlapping images), are created using at least one different filter(s).
  • Aspect 65 The
  • Aspect 71 The method of three-dimensionally (“3D”) printing according any previous Aspect, wherein areas of a layer which are directly above an area of a previous layer which is to have a void created and non-significant cross-linking may be dimmed, thus leaving the previous section uncured and able to be flushed with the end result and intent to create a void, channel or otherwise uncured section of resin within a different layer than the one being polymerized.
  • Aspect 72 Aspect 72.
  • a projector comprising a projector lens, wherein the projector is attached to one or more Z axis gantry; b. automatically focusing of the projector lens for pixels between 0.1um and 100um; c. providing at least one of a stepper motor or a servo motor that interfaces with the one or more Z axis gantry; d. providing at least one of a bevel, a spur gears, set of screws, a hollow screw- set or a belt, or a linear activator, to activate the automatically focusing of the projector lens; e. using a linear rail to adjust the projector position relative to the vat; f.
  • Aspect 81 A shutter for a three-dimensional (“3D”) printing apparatus according to any of the previous Aspects, wherein changing between the at least two or more positions causes a change in a surface roughness of an internal cavity of an object being 3D printed, and wherein the changing between positions changes the cure depth of an internal layer.
  • Additional embodiments of this disclosure comprise a computer system for carrying out the computer-implemented method of this disclosure.
  • the computer system may comprise a processor for executing the computer-executable instructions, one or more electronic databases containing the data or information described herein, an input/output interface or user interface, and a set of instructions (e.g., software) for carrying out the method.
  • the computer system can include a stand-alone computer, such as a desktop computer, a portable computer, such as a tablet, laptop, PDA, or smartphone, or a set of computers connected through a network including a client-server configuration and one or more database servers.
  • the network may use any suitable network protocol, including IP, UDP, or ICMP, and may be any suitable wired or wireless network including any local area network, wide area network, Internet network, telecommunications network, Wi-Fi enabled network, or Bluetooth enabled network.
  • the computer system comprises a central computer connected to the internet that has the computer-executable instructions stored in memory that is operably connected to an internal electronic database.
  • the central computer may perform the computer-implemented method based on input and commands received from remote computers through the internet.
  • the user interface may then be operated through a remote computer (client computer) accessing the web page and transmitting queries or receiving output from a server through a network connection.
  • client computer accessing the web page and transmitting queries or receiving output from a server through a network connection.
  • the term “substantial” and “substantially” refers to what is easily recognizable to one of ordinary skill in the art.
  • the phraseology and terminology employed herein is not to be construed as limiting and are for descriptive purpose only.
  • [000311] It is to be understood that while certain of the illustrations and figure may be close to the right scale, most of the illustrations and figures are not intended to be of the correct scale.
  • [000312] It is to be understood that the details set forth herein do not construe a limitation to an application of the invention.
  • the invention can be carried out or practiced in various ways and that the invention can be implemented in embodiments other than the ones outlined in the description above.

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Abstract

La présente invention concerne une plateforme d'impression 3D, telle qu'une plateforme complète, permettant l'impression 3D de microdispositifs pour des applications dans la microfluidique, un LOAC, le diagnostic au point d'intervention, la découverte de médicaments, la manipulation personnalisée de liquides, ainsi que pour des applications présentant des exigences de dimension ou des micro-caractéristiques comparables, telles qu'une technologie croisée à des MEMS et des guides d'ondes optiques. Ladite plateforme peut comprendre de la résine, un processeur informatique pour les calculs et la programmation sur la base, par exemple, de paramètres prédéterminés, un générateur de lumière ou un projecteur ou un projecteur de divertissement à domicile et/ou des moteurs présentant une mécatronique automatisée.
EP23866120.1A 2022-09-12 2023-09-12 Plateforme de fabrication additive, résine et améliorations apportées à la fabrication de microdispositifs Pending EP4587256A1 (fr)

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US17/943,177 US12605896B2 (en) 2018-09-18 2022-09-12 Additive manufacturing platform, resin, and improvements for microdevice fabrication
PCT/US2023/032542 WO2024059071A1 (fr) 2022-09-12 2023-09-12 Plateforme de fabrication additive, résine et améliorations apportées à la fabrication de microdispositifs

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US7568904B2 (en) * 2005-03-03 2009-08-04 Laser Solutions Co., Ltd. Stereolithography apparatus
BR112016029755A2 (pt) * 2014-06-23 2017-08-22 Carbon Inc métodos de produção de objetos tridimensionais a partir de materiais tendo múltiplos mecanismos de endurecimento
US11141919B2 (en) * 2015-12-09 2021-10-12 Holo, Inc. Multi-material stereolithographic three dimensional printing
US11278885B2 (en) * 2017-08-30 2022-03-22 The Charles Stark Draper Laboratory, Inc. Systems and methods for fabricating microfluidic devices
WO2019173674A1 (fr) * 2018-03-09 2019-09-12 Northwestern University Impression 3d à haut débit de lentilles d'imagerie asphérique personnalisées
ES3041159T3 (en) * 2018-03-22 2025-11-07 Tissium Sa 3d printing composition for biomaterials
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