EP4608921A2 - Électronique imprimée flexible utilisant du cuivre à ultra-haute température - Google Patents

Électronique imprimée flexible utilisant du cuivre à ultra-haute température

Info

Publication number
EP4608921A2
EP4608921A2 EP23959056.5A EP23959056A EP4608921A2 EP 4608921 A2 EP4608921 A2 EP 4608921A2 EP 23959056 A EP23959056 A EP 23959056A EP 4608921 A2 EP4608921 A2 EP 4608921A2
Authority
EP
European Patent Office
Prior art keywords
copper
silver
slurry composition
conductive slurry
conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP23959056.5A
Other languages
German (de)
English (en)
Inventor
Shenqiang REN
Aaron Sheng
Saurabh KHUJE
Devin ANGEVINE
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Research Foundation of the State University of New York
Original Assignee
Research Foundation of the State University of New York
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Research Foundation of the State University of New York filed Critical Research Foundation of the State University of New York
Publication of EP4608921A2 publication Critical patent/EP4608921A2/fr
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/52—Electrically conductive inks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
    • C09D11/037—Printing inks characterised by features other than the chemical nature of the binder characterised by the pigment
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D11/00—Inks
    • C09D11/02—Printing inks
    • C09D11/14—Printing inks based on carbohydrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/097—Inks comprising nanoparticles and specially adapted for being sintered at low temperature
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/017—Glass ceramic coating, e.g. formed on inorganic substrate

Definitions

  • Flexible hybrid electronics are advancing at a rapid pace, which are critical for creating functional and long-lasting devices. Usability under extreme conditions like high temperatures and reactive environments, however, provides a different set of challenges as most flexible electronics operate up to moderate temperatures and use substrates such as polymers. Various considerations must be addressed for flexible electronics to be applicable under extreme conditions. There are three distinct but important aspects of high-temperature FHE device that must be improved upon for more efficient use: The conductor (the metal of choice), advanced substrate material (flexible thin ceramics), and system passivation with thermal management (further thermal and reactive protection from environment). The metal used as the conductor should ideally have high conductivity, high resistance to environmental conditions, and be reliable over a long period of time.
  • Precious metals such as gold, platinum, and silver
  • gold, platinum, and silver show great promise due to their inherent physicochemical properties; however, the low abundance and high cost of these metals proves to be a limiting factor, necessitating the need for other materials.
  • Copper on the contrary, is highly abundant, has high conductivity, and relatively high melting point.
  • compositions are made by a method of the present disclosure.
  • Non-limiting examples of compositions are provided herein.
  • a composition may be referred to as a conductive slurry or a conductive slurry composition.
  • the conductive slurry may be a conductive ink, printable conductive ink, or a conductive ink composition.
  • the conductive slurry composition comprises copper nanoplates or nanoparticles. In various examples, the conductive slurry composition does not comprise copper nanowires.
  • the nanoplates may be copper or copper/silver core/shell nanoplates.
  • the copper nanoplates may further comprise one or more layers of graphene or a graphene-material or a formate layer.
  • the conductive slurry composition comprises copper nanoparticles (e.g., copper silver alloy nanoparticles or silver coated copper nanoparticles).
  • the term “conductive filler” may be used to refer to nanoplates or nanoparticles.
  • the conductive filler may be copper or a copper silver alloy.
  • the present disclosure provides a method of making a conductive slurry composition of the present disclosure.
  • the present disclosure provides a method for printing a conductive ink.
  • an object e.g., conductor
  • a conductive slurry composition of the present disclosure may be printed (e.g., 3D printed) from a conductive slurry composition of the present disclosure.
  • the printed object may be passivated with, for example, formate groups, which may be desirable for the printed (e.g., solid) object.
  • Figure 1 shows (a) printable ink with two major components: (i) the Cu-based building blocks or conductive fillers and (ii) the additives used in hybridizing with the building blocks for high temperature stability, (b) The final device with an AI2O3 layer coating (top) and the (ceramic or aerogel) substrate, (c) Depiction of how the conductors made for testing and in-situ measurements.
  • Figure 2 shows (a) a brief schematic depicting a Cu seed and the resulting variety of nanostructures possible. The listed precursors are used in the following samples.
  • (b) A representative SEM images of the Cu nanoplates that were printed and sintered. The inset shows the sizing curves for the control (typical), CuBr, and ascorbic acid variations,
  • (c) The corresponding conductivity (left y-axis, black) and sheet resistance (right y-axis, red) for each sample synthesized. The pre-sintered conductors and post-sintered conductors are shown, light and darker colors, respectively.
  • Figure 3 shows (a) oxidation resistance of several copper-based conductors (Cu NPLs, black; Cu/Ag core/ shell NPLs, red; Cu/Ag 9: 1, brown) at 160 °C for 98 hours. The ratios determine the Cu: Ag molar ratios, (b) Powder XRD patterns of the conductors (Cu NPL, Cu/Ag NPL, and CuAg 9:1 NPs) before (darker line) and after (lighter line) the accelerated oxidation test. Guidelines for copper (red dashed line) and silver (red dashed line) peaks are shown. A zoomed in graph of 2 theta values at 35 to 40 are provided for clarity for the copper oxide peak at approximately 2 theta of 36.5 (blue dashed line).
  • Figure 4 shows (a) a schematic of Cu interfaced with graphene (both red and blue representing carbons) or BN (blue representing boron and red representing nitrogen), (b) The RT curve comparison between Cu-BN (dashed lines) and Cu-G (solid line), (c) The stability-over-time curves at 400 °C comparison between Cu-G (black) and CuAg-G (blue), (d) The SEM images of Cu-G conductor before (top) and after (bottom) the stability-overtime heating measurement. The scale bars represent 10 pm.
  • Figure 5 shows (a) an image of the setup for the hydrogen torch testing.
  • Figure 6 shows SEM images of (a) control, (b) CuCl, (c) CuBr, (d) increased HDA (1.5x), (e) increased CuCh (L5x), (f) decreased Nal (0.5x), (g) ascorbic acid, and (f) addition of HC1.
  • FIG. 7 shows overlaid sizing curves of NPLs for the different variation of precursors used: CuCl (red), increased HDA concentration (orange), concentration (pink), decreased Nal concentration (green), and HC1 addition (cyan).
  • Figure 8 shows a picture of the printed conductors of each variation in the synthetic procedure (starting from top left to bottom right). All the conductors have already been sintered. There is a clear difference between the good (shiny and copper colored) and bad (dull and black) conductors.
  • Figure 9 shows images of synthetic solution containing increased CuCh concentrations: 2x CuCh (5.1), 2.5x CuCh (5.2), and 3x CuCh (5.3).
  • Figure 10 shows SEM images of nanostructures synthesized at various concentrations (rows) and times (columns).
  • the various ascorbic acid concentrations tested are lx (top row), 3x (middle row), and 6x (bottom row).
  • the various synthesis times tested are 6 (left column), 9 (middle column), and 12 (right column) hrs.
  • the scale bars represent 10 pm.
  • Figure 11 shows conductivity measurements of sintered prints at various synthesis time (x-axis) and concentrations (lx, left in each series; 3x, middle in each series; 6x, right in each series).
  • Figure 12 shows SEM images of nanostructures with less Nal concentrations are shown: (a) 0.135 mM Nal, (b) 0.081 mM Nal, and (c) 0.027 mM Nal.
  • the inset (with black border) is a zoomed in image.
  • the inset (with border in (c)) is a imaged that has been zoomed in significantly to better identify the nanostructures.
  • the white scale bar represents 10 pm), while the scale bar represents 1 pm.
  • the inset represents the size curve and average size of the Cu NPLs.
  • Figure 13 shows SEM image of Cu/Ag (a) NPLs and (b) 9: 1 alloyed NPs.
  • EDS linescans were measured along the yellow line. The intensities correspond to copper (red) and silver (cyan).
  • Figure 14 shows SEM image and EDS of Cu/Ag (a and b) 1 : 1 alloyed NPs, (c and d) 3 : 1 alloyed NPs, and (e and f) 6: 1 alloyed NPs. EDS linescans were measured along the yellow line. The intensities correspond to copper (red) and silver (cyan).
  • Figure 15 shows oxidation resistance of the other CuAg alloy (CuAg NP 1 : 1; CuAg NP 3: 1; CuAg 6: 1) at 160 °C for 98 hours.
  • Figure 16 shows powder XRD patterns of the conductors (CuAg 1 : 1, CuAg 3: 1, and CuAg 6: 1) before (darker line) and after (lighter line) the accelerated oxidation test in.
  • a zoomed in graph at 35 to 40 2 theta values are provided for clarity for the copper oxide peak at approximately 36.5 2 theta.
  • Figure 17 shows an RT curve of Cu/Ag-BN (red, dashed line), Cu/Ag-G (solid line), CuAg-BN (dashed line), and CuAg-G (solid line).
  • Figure 18 shows stability-over-time curves at 400 °C of Cu/Ag-BN (dashed line), Cu/Ag-G (solid line), CuAg-BN (dashed line), and CuAg-G (solid line) over 8 hours.
  • Figure 19 shows Cu NPL conductors coated with (a) 25 nm, (b) 50 nm, (c) 75 nm, and (d) 100 nm AI2O3 thin coating. For each conductor, an image before (top) and after (bottom) the front torch test was performed.
  • Figure 20 shows measured resistances of the conductors (a, 25 nm; b, 50 nm; c, 75 nm; d, 100 nm) post-torch test. The measurement was from end to end (through the point of impact).
  • Figure 21 shows measured resistances of the conductors (a, 25 nm; b, 50 nm; c, 75 nm; d, 100 nm) post-torch test. The measurement was on undamaged part of the conductor.
  • compositions, composite structures, and uses thereof are provided.
  • the present disclosure provides compositions.
  • the composition is made by a method of the present disclosure.
  • Non-limiting examples of compositions are provided herein.
  • a composition may be referred to as a conductive slurry or a conductive slurry composition.
  • the conductive slurry may be a conductive ink, printable conductive ink, or a conductive ink composition.
  • the conductive slurry composition comprises copper nanoplates or nanoparticles. In various examples, the conductive slurry composition does not comprise copper nanowires.
  • the nanoplates may be copper or copper/silver core/shell nanoplates.
  • the copper nanoplates may further comprise one or more layers of graphene or a graphene-material or a formate layer.
  • the conductive slurry composition comprises copper nanoparticles (e.g., copper silver alloy nanoparticles or silver coated copper nanoparticles).
  • the term “conductive filler” may be used to refer to nanoplates or nanoparticles.
  • the conductive filler may be copper or a copper silver alloy.
  • Various amounts of conductive filler are used.
  • the conductive filler are present at 10 to 30 wt.% in the conductive slurry composition (based on the total weight of the conductive slurry composition including water), including all 0.1 wt.% values and ranges therebetween. This weight percent further includes any functionalization on the conductive filler, such as functionalize with graphene or formate.
  • the concentration of the conductive filler is 25 wt.%.
  • when the conductive filler is a silver coated copper nanoparticles (copper/ silver core/shell) may be 30 to 70 wt.%, including all 0.1 wt.% values and ranges therebetween.
  • the majority of the copper in the conductive slurry composition has a nanoplates morphology.
  • less 10 wt.% of the copper has a nanowire morphology (e.g., less than 10 wt.%, less than 9 wt.%, less than 8 wt.%, less than 7 wt.%, less than 6 wt.%, less than 5 wt.%, less than 4 wt.%, less than 3 wt.%, less than 2 wt.%, less than 1 wt.%, or no detectable amount of nanowires).
  • the majority of the copper in the conductive slurry composition has a nanoparticle morphology.
  • less 10 wt.% of the copper has a nanowire morphology (e.g., less than 10 wt.%, less than 9 wt.%, less than 8 wt.%, less than 7 wt.%, less than 6 wt.%, less than 5 wt.%, less than 4 wt.%, less than 3 wt.%, less than 2 wt.%, less than 1 wt.%, or no detectable amount of nanowires).
  • At least a portion of the copper has a nanoparticle morphology and at least a portion of the nanoparticles are at least partially or completely coated with silver.
  • the silver coating may be uniformly or non-uniformly coated on the nanoparticles.
  • the copper nanoplates of the conductive slurry composition may have a variety of lengths and thicknesses.
  • the copper nanoplates may have a longest linear dimension (e.g., a length) of 100 nm to 10 pm, including all 0.1 nm values and ranges therebetween.
  • the copper nanoplates have a thickness of 1 to 100 nm, including all 0.1 values and ranges therebetween (e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68,69, 70, 71, 72, 73, 74, 75, 76, 77, 78, 79, 80, 81, 82, 83, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, 95, 96, 97, 98, 99, or 100 nm).
  • the dimensions are roughly uniform or uniform across the dimensions
  • the copper nanoparticles of the conductive slurry composition may have a variety of lengths.
  • the copper nanoparticles may have a longest linear dimension (e.g., a length) of 1 to 100 nm, including all 0.1 values and ranges therebetween (e.g., 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51,
  • nanoparticles when they are silver coated nanoparticles, they may have a longest linear dimension of 5 to 15 microns, including all integer nm values and ranges therebetween.
  • the conductive filler further comprises iodide.
  • the iodide may adsorb onto the ⁇ 111 ⁇ facets. Without intending to be bound by any particular theory, it is considered the adsorption of the iodide forces growth parallel to the basal plane, which in turn results in plate formation rather than wire formation.
  • liquids which may be referred to as dispersants or solvents, can be used to form a slurry of copper nanoplates.
  • the liquid is water, an organic liquid, such as, for example, a Ci to Ce alcohol (e.g., ethanol), diethylene glycol butyl ether, 2-ethoxyethyl acetate, ethylene glycol, 2-butoxyethyl acetate, diethylene glycol monobutyl ether acetate, dibasic ester mixture, terpineol, or a combination thereof.
  • a Ci to Ce alcohol e.g., ethanol
  • diethylene glycol butyl ether 2-ethoxyethyl acetate
  • ethylene glycol 2-butoxyethyl acetate
  • diethylene glycol monobutyl ether acetate dibasic ester mixture
  • terpineol or a combination thereof.
  • a conductive slurry composition can comprise various amounts of liquids.
  • a dispersion comprises 10 to 70 wt. % of a liquid based on the total weight of the composition, including all wt. % values and ranges therebetween (e.g., 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 228, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62, 63, 64, 65, 66, 67, 68,69, or 70 wt. %). It is desirable to use an amount of liquid that forms a dispersion or slurry. In various embodiments, the liquid is water.
  • the conductive slurry composition may further comprise one or more additive.
  • the additive improves the flowability and/or viscosity of the slurry, which may be used as an ink, for example, an ink for printing.
  • Non-limiting examples of additives include water-soluble primary amines (e.g., alkylamines, such as, for example, C10-C20 alkyl amines (hexadecylamines)).
  • An additive or additives may be present in a dispersion at 1 to 10 wt.% based on the total weight of the conductive slurry composition.
  • the conductive slurry may further comprise (hydroxypropyl)methyl cellulose (HPMC).
  • HPMC hydroxypropyl)methyl cellulose
  • the concentration of the HPMC may be 0.1 to 30 weight percent, relative to the total weight of the conductive ink, including all 0.01 weight percent values and ranges therebetween. In various embodiments, the concentration of the HPMC is 25 wt.%. In various other embodiments, the concentration of HPMC is 0.1 to to 10 weight percent, including all 0.01 weight percent values and ranges therebetween.
  • the conductive filler is functionalized with graphene or a graphene material or boron nitride. In various other examples, the conductive filler is surface functionalized with one or more formate groups.
  • Various ratios of conductive filler weight to the graphene material and/or graphene-precursor material can be used.
  • the ratio of the conductive filler weight to the graphene material and/or graphene-precursor material and/or boron nitride weight is 90: 10 to 99.9:0.1, including all 0.1 ratio values and ranges therebetween.
  • the weight percent of the graphene-precursor e.g., dopamine
  • the weight percent of the graphene-precursor is 0.1 to 1.0 wt.%, including all 0.01 wt.% values and ranges therebetween (e.g., 0.3 wt.%), which is a ratio of 99.7:0.3.
  • the weight percent of boron nitride is 1 to 10 wt.%, including all 0.1 values and ranges therebetween (e.g., 8 wt.%), which is a ratio of 92:8.
  • graphene materials may be used. Combinations of graphene materials may be used. Non-limiting examples of graphene materials include graphene, reduced graphene oxide, and combinations thereof.
  • the graphene materials may be exfoliated sheets. Non-limiting examples of exfoliated sheet graphene materials include exfoliated graphene sheets, exfoliated reduced graphene sheets, exfoliated graphene oxide sheets, and combinations thereof. Suitable graphene materials are known in the art and are commercially available or can be made by processes known in the art.
  • Graphene-material precursors react or decompose (e.g., thermally react or thermally decompose) to form a graphene material.
  • Various graphene material precursors may be used.
  • Combinations of graphene material precursors may be used.
  • a graphenematerial precursor may be an organic small molecule.
  • Non-limiting examples of graphenematerial precursors include dopamine, aniline, and the like, and combinations thereof.
  • the conductive slurry is a conductive ink.
  • the conductive filler may either be functionalized with graphene/graphene materials or formate groups. In various embodiments, the conductive filler is functionalized with both graphene/graphene materials and formate groups.
  • copper or copper silver nanoplates are functionalized with graphene or a graphene material. In various examples, copper or copper silver nanoplates are functionalized with formate groups. In various examples, copper or copper silver nanoplates are functionalized with graphene/graphene material and formate groups.
  • the conductive filler is functionalized/hybridized with boron nitride. In various examples, the copper or copper silver nanoplates are functionalized with boron nitride. In various examples, the copper or copper silver nanoparticles are functionalized with boron nitride.
  • the conductive filler may have one or more desirable properties.
  • desirable properties include an electrical conductivity, thermal conductivity, heat dissipation, breakdown current, mechanical properties (e.g., Young’s modulus), and the like, and combinations thereof.
  • the nanoplates exhibit an electrical conductivity of 1 MS/m to 35 MS/m.
  • the composition comprises silver coated copper nanoparticles.
  • the silver coated copper nanoparticles may have a particle size (e.g., longest linear dimension) of 5 to 15 microns, including all integer nm values and ranges therebetween.
  • a composition of the present disclosure may comprise silver coated copper nanoparticles in a concentration of 10 to 30 weight percent (wt%) silver, including all 0.1 wt% ranges and values therebetween. In various embodiments, the weight percent is rrelative to the total weight of the nanoparticle.
  • the sintering/curing process used to prepared the formulations can be carried out in a heat press or oven/fumace or by means of photonic, microwave or reactive sintering.
  • the silver coated copper nanoparticle loading is 30- 40 wt%, including all 0.1 wt% values and ranges therebetween.
  • the composition may further comprise water, where the concentration is 35-45 wt%, including all 0.1 wt% values and ranges therebetween.
  • the composition may further comprise hydroxypropyl methylcellulose (HPMC), where the concentration is 0.1-10 wt%, including all 0.01 wt% values and ranges therebetween.
  • HPMC hydroxypropyl methylcellulose
  • the composition may further comprise an alcohol, such as, for example, ethanol. For example, when the alcohol is ethanol, the concentration is 12.5-17.5 wt%, including all 0.01 ranges and values therebetween.
  • the composition may further comprise a polyol (i.e., glycol), such as, for example, ethylene glycol.
  • a polyol i.e., glycol
  • the concentration of the polyol e.g., ethylene glycol
  • the composition may further comprise graphene and/or boron nitride at a concentration of 0 to 1 wt%, including all 0.01 wt% values and ranges therebetween.
  • a composition is 32.5 weight percent silver coated copper nanoparticles, 42.5 weight percent water, 0.9 weight percent hydroxypropyl methylcellulose (HPMC), 14.5 weight percent alcohol (e.g., ethanol), 9.6 weight percent polyol (e.g., ethylene glycol).
  • HPMC hydroxypropyl methylcellulose
  • alcohol e.g., ethanol
  • polyol e.g., ethylene glycol
  • a composition comprising silver coated copper nanoparticle at a loading of a 30-40 wt% may have desirable features.
  • such a composition may have a lowest achievable sheet resistance of 30 milliohms/square/1 mil obtained using the four-point probe method.
  • such a composition may have a lowest achievable sheet resistance of 20 milliohms/square/2 mil obtained using the four-point probe method.
  • such a composition may have a maximum conductivity of 2.8 MS/m.
  • the silver coated copper nanoparticle loading is 40- 50 wt%, including all 0.1 wt% values and ranges therebetween.
  • the composition may further comprise water, where the concentration is 30-40 wt%, including all 0.1 wt% values and ranges therebetween.
  • the composition may further comprise hydroxypropyl methylcellulose (HPMC), where the concentration is 0.1-10 wt%, including all 0.01 wt% values and ranges therebetween.
  • HPMC hydroxypropyl methylcellulose
  • the composition may further comprise an alcohol, such as, for example, ethanol. For example, when the alcohol is ethanol, the concentration is 8-13 wt%, including all 0.01 ranges and values therebetween.
  • the composition may further comprise a polyol (i.e., glycol), such as, for example, ethylene glycol.
  • the concentration of the polyol may be 5-10 wt% ethylene glycol, including all 0.01 wt% values and ranges therebetween.
  • the composition may further comprise graphene and/or boron nitride at a concentration of 0 to 1 wt%, including all 0.01 wt% values and ranges therebetween.
  • a composition comprising silver coated copper nanoparticle at a loading of a 40-50 wt% may have desirable features.
  • such a composition may have a lowest achievable sheet resistance of 15 milliohms/square/1 mil obtained using the four-point probe method.
  • such a composition may have a lowest achievable sheet resistance of 10 milliohms/square/2 mil obtained using the four-point probe method.
  • such a composition may have a maximum conductivity of 4.1 MS/m.
  • the silver coated copper nanoparticle loading is 50- 60 wt%, including all 0.1 wt% values and ranges therebetween.
  • the composition may further comprise water, where the concentration is 25-35 wt%, including all 0.1 wt% values and ranges therebetween.
  • the composition may further comprise hydroxypropyl methylcellulose (HPMC), where the concentration is 0.1-10 wt%, including all 0.01 wt% values and ranges therebetween.
  • HPMC hydroxypropyl methylcellulose
  • the composition may further comprise an alcohol, such as, for example, ethanol. For example, when the alcohol is ethanol, the concentration is 7-12 wt%, including all 0.01 ranges and values therebetween.
  • the composition may further comprise a polyol (i.e., glycol), such as, for example, ethylene glycol.
  • the concentration of the polyol may be 4-9 wt% ethylene glycol, including all 0.01 wt% values and ranges therebetween.
  • the composition may further comprise graphene and/or boron nitride at a concentration of 0 to 1 wt%, including all 0.01 wt% values and ranges therebetween.
  • 54.8 weight percent silver coated copper nanoparticles 28.4 weight percent water, 0.6 weight percent hydroxypropyl methylcellulose (HPMC), 9.7 weight percent alcohol (e.g., ethanol), 6.5 weight percent polyol (e.g., ethylene glycol).
  • a composition comprising silver coated copper nanoparticle at a loading of a 50-60 wt% may have desirable features. For example, such a composition may have a lowest achievable sheet resistance of 9 milliohms/square/1 mil be obtained using the four-point probe method. In various other examples, such a composition may have a lowest achievable sheet resistance of 1 milliohms/square/2 mil obtained using the four-point probe method. In various other examples, such a composition may have a maximum conductivity of 30 MS/m. [0062] In various embodiments, the silver coated copper nanoparticle loading is 60- 70 wt%, including all 0.1 wt% values and ranges therebetween.
  • the composition may further comprise water, where the concentration is 20-30 wt%, including all 0.1 wt% values and ranges therebetween.
  • the composition may further comprise hydroxypropyl methylcellulose (HPMC), where the concentration is 0.1-10 wt%, including all 0.01 wt% values and ranges therebetween.
  • HPMC hydroxypropyl methylcellulose
  • the composition may further comprise an alcohol, such as, for example, ethanol. For example, when the alcohol is ethanol, the concentration is 7-12 wt%, including all 0.01 ranges and values therebetween.
  • the composition may further comprise a polyol (i.e., a glycol), such as, for example, ethylene glycol.
  • the concentration of the polyol may be 4-9 wt% ethylene glycol, including all 0.01 wt% values and ranges therebetween.
  • the composition may further comprise graphene and/or boron nitride at a concentration of 0 to 1 wt%, including all 0.01 wt% values and ranges therebetween.
  • 62.2 weight percent silver coated copper nanoparticles 23.8 weight percent water, 0.5 weight percent hydroxypropyl methylcellulose (HPMC), 8.1 weight percent alcohol (e.g., ethanol), 5.4 weight percent polyol (e.g., ethylene glycol).
  • a composition comprising silver coated copper nanoparticle at a loading of a 60-70 wt% may have desirable features.
  • such a composition may have a lowest achievable sheet resistance of 5 milliohms/square/1 mil be obtained using the four-point probe method.
  • such a composition may have a lowest achievable sheet resistance of 0.66 milliohms/square/2 mil obtained using the four-point probe method.
  • such a composition may have a maximum conductivity of 46 MS/m.
  • the present disclosure provides a method of making a conductive slurry composition of the present disclosure.
  • the method comprises contacting a copper salt, an aliphatic amine, D-glucose or ascorbic acid, an iodide salt, and water to form a reaction mixture; and heating the reaction mixture to form a conductive slurry composition of the present disclosure.
  • the method for preparing a copper nanoplates comprises contacting a copper precursor (e.g., CuCh, CuCl, or CuBr), a reducing agent (e.g., glucose or ascorbic acid), a surfactant (e.g., HD A), sodium iodide, and water.
  • a copper precursor e.g., CuCh, CuCl, or CuBr
  • a reducing agent e.g., glucose or ascorbic acid
  • a surfactant e.g., HD A
  • sodium iodide e.g., sodium iodide
  • an acid e.g., HC1
  • the method for preparing copper silver nanoplates comprises contacting copper nanoplates with a formic acid solution and washing with an alcohol (e.g., ethanol) followed by centrifugation. The plates are then washed with a polyvinylpyrrolidone (PVP)/diethylhydroxylamine (DEHA) solution in water.
  • PVP polyvinylpyrrolidone
  • DEHA diethylhydroxylamine
  • the ratio of nanoplates may be dispersed in water at a ratio of nanoplates to PVP to ascorbic acid at a molar ratio of 1 : 2 : 5.5.
  • a silver salt e.g., silver nitrate
  • the method for preparing copper silver nanoparticles comprises mixing CuCh, AgNCh, ascorbic acid, HD A, sodium iodide, and water and mixed via blender.
  • the resulting mixture is heated (e.g., heated to 100 °C) for 12 hours.
  • the nanoparticles may be collected via centrifugation and then washed with an alcohol (e.g., ethanol).
  • the copper salt may be a copper (I) or a copper (II) salt.
  • a copper (I) salt may be cuprous (I) chloride.
  • a copper (II) salt may be copper(II) chloride or copper(II) bromide.
  • the copper salt may be a combination of various copper salts described herein.
  • the aliphatic amine may have 10 to 20 carbon atoms and may be linear or branched and/or have various degrees of unsaturation.
  • the aliphatic amine is hexadecylamine (HDA).
  • one or more additives may be added during the method.
  • the method may further comprise mixing HPMC with water into the reaction mixture.
  • the reaction mixture may be heated for various lengths of time and at various temperatures.
  • the reaction mixture is heated for a period of time ranging from 5-48 hours, including all second values and ranges therebetween (e.g., (e.g., 6, 9, 9.5, 10, 11, 12, 13, 18, 19, 20, 25, 30, 35, 40, 45, or 48 hours).
  • the reaction mixture is maintained at a constant temperature for the full period of time.
  • the reaction mixture is at a temperature of 60 °C to 140 °C, including all 0.1 values and ranges therebetween (e.g., the temperature is at least 100 °C or is heated to a temperature of 100 °C or less).
  • the method further comprises functionalizing the copper nanoplates with formate groups.
  • Functionalization may be achieved by adding a mixture comprising one or more formate salts to the conductive slurry composition and heating the mixture of the conductive slurry composition and the formate salt mixture to a temperature of 100 to 150 °C, including all 0.1 °C values and ranges therebetween.
  • the formate salts may be sodium formate, copper formate, or a combination thereof.
  • the mixture comprising one or more formate salts may ethylene glycol (e.g., 50 mL of ethylene glycol) and a solution comprising sodium formate (e.g., 30 g of sodium formate) and copper formate (e.g., 15 mg copper formate) in water (e.g., 150 mL of water).
  • ethylene glycol e.g., 50 mL of ethylene glycol
  • a solution comprising sodium formate e.g., 30 g of sodium formate
  • copper formate e.g., 15 mg copper formate
  • the method further comprises functionalizing the copper nanoplates with graphene or a graphene material.
  • the functionalization may be achieved by blending the copper nanoplates with graphene or graphene derivatives or the graphene is prepared in situ via conversion from dopamine.
  • functionalization may be achieved by dispersing graphene or a graphene material into the slurry and sonicating the mixture of the slurry and graphene or a graphene material.
  • the method comprises using the following: the copper salt is provided as 2.4 g of copper(II) chloride; 3.9 g D-glucose; the aliphatic amine is 14.55 g of HD A; the iodide salt is provided as 90 mg of Nal; and 900 mL water.
  • the present disclosure provides a method for printing a conductive ink.
  • the method may comprise extruding a conductive ink composition and washing the extruded ink with an acid to remove residual aliphatic amine.
  • the acid may be an organic acid or an organic acid solvent.
  • An aqueous organic acid solution comprises water and one or more organic acid.
  • organic acids include alkylcarboxylic acids (e.g., C1-C5 alkylcarboxlic acid, such as, for example, acetic acid, and the like).
  • An organic solvent acid solution comprises one or more alcohol and one or more organic acid.
  • alcohols include C1-C5 alcohols (e.g., ethanol, and the like, and combinations thereof).
  • Non-limiting examples of organic acids include alkylcarboxylic acids (e.g., a Ce-Cis alkylcarboxlic acid, such as, for example, dodecanoic acid, and the like).
  • an object e.g., conductor
  • the printed object may be passivated with, for example, formate groups, which may be desirable for the printed (e.g., solid) object.
  • an article of manufacture is printed from the conductive slurry of the present disclosure.
  • the article of manufacture may comprise one or more component, which may be a passive component or components (e.g., conductor(s), wire(s), and the like, and combinations thereof) and/or an active component or components (e.g., antennas, relays, switch leads, RF shields, and the like, and combinations thereof), comprising the nanoplates of the present disclosure.
  • the nanoplates may be useful for producing electrodes.
  • the article of manufacture may be an electrical device.
  • electrical devices include electrical motors, electrical generators, transformers, switching regulators, converters, inverters, charging circuits, discharge circuits, PCL control devices, transmission and distribution units (which may be high-voltage transmission or distribution units), circuit breakers, and the like.
  • Additional non-limiting examples include consumer electronic devices (e.g., computer, cellular phone, and the like), home appliance devices (e.g., television, washers, dryers, and the like), solar cells, sensor devices (e.g., wireless sensor devices), control devices, amplifiers, attenuators, Internet of Things (IOT) devices, audio devices, RFID devices, illuminating devices, and the like.
  • IOT Internet of Things
  • An electrical device or electronic devices may comprise one or more component that comprises one or more nanocomposite.
  • components include antennas, contacts, conductors, relays, switch leads, RF shields, and the like.
  • the electronic device may be flexible.
  • the conductive slurry composition may be used to print a conductor onto a substrate.
  • the substrate may have various thicknesses.
  • the substrate may have a thickness of 10 nm to 1000 nm, including all 0.1 nm values and ranges therebetween.
  • the substrate may be a metal oxide or an aerogel composite.
  • the substrate may comprise AI2O3.
  • the substrate is AI2O3.
  • the aerogel composite comprises AI2O3.
  • the flexible electronic has a metal oxide layer disposed thereon.
  • the metal oxide layer may be disposed via atomic layer deposition.
  • the metal oxide may be AI2O3.
  • the metal oxide layer may be 25-100 nm thick, including all 0.1 nm values and ranges therebetween.
  • the flexible electronic may have one or more desirable features.
  • the flexible electronic may have a desirable thermal stability.
  • the flexible electronic may be thermally stable at 400 °C, 500 °C, 600 °C, 700 °C, 800 °C, 900 °C, 1000 °C, or over 1000 °C.
  • a conductive slurry composition comprising a slurry of copper silver nanoplates in water or copper silver nanoparticles in water, and the conductive slurry composition comprises less than 10 wt.% copper nanowires.
  • a conductive slurry composition according to Statement 2 wherein the silver- coated copper nanoparticles are 10 to 30 weight percenter silver, relative to the total weight of an individual silver-coated copper nanoparticle.
  • Statement 4. A conductive slurry composition according to Statements 2 or 3, wherein the concentration of the silver-coated copper nanoparticles is 30 to 70 weight percent, relative to the total weight of the conductive slurry.
  • HPMC hydroxypropylmethyl cellulose
  • a flexible electronic comprising a conductor formed from a conductive slurry composition according to any one of the preceding Statements disposed on a substrate.
  • Statement 11 A flexible electronic according to Statement 10, wherein the substrate is AI2O3.
  • Statement 12 A flexible electronic according to Statement 9 or Statement 10, wherein the substrate is a AI2O3 aerogel composite.
  • Statement 13 A flexible electronic according to any one of Statements 9-12, wherein the substrate has a thickness of 25 to 1,000 nm, including every 0.1 nm value and range therebetween.
  • Statement 14 A flexible electronic according to any one of Statements 9-13, wherein the conductor has a metal oxide layer disposed thereon.
  • This example provides a description of printed electronics of the present disclosure.
  • the first strategy was to optimize conductor composition, which revolves around reconstructing the copper on the atomic scale through alloying or the structural surface coating on an atomic level.
  • Copper-silver (CuAg) alloys typically provide the corrosion resistance or higher thermal stability.
  • the Cu/Ag (core/shell) structure requires Ag to be coated on the surface, providing a passivating layer to protect the copper from oxidation and corrosion.
  • hybridization choice is also important to dictate electronic conductivity, while hybridizing the copper with two-dimensional additives (like graphene and boron nitride) provides the properties of both components (Copper’s electrical conductivity and graphene’s thermal conductivity). It is also known that hybridized structures show superior oxidation and temperature stability, with little-to-no adverse effect on the copper. A unique benefit of reconstructing the surface, as opposed to alloying, is the ability to preserve the nanostructure. Improving the conductor composition is important; however, it is only one aspect of the device. Precise selection of the substrate based on application is equally important. The second strategy utilize advanced substrates that are flexible and temperature stable.
  • Ultrathin flexible alumina ribbon ceramics provide remarkable thermal management due to its low thermal mass and high thermal conductivity.
  • Flexible ceramic aerogels provide superinsulation at higher temperatures. They have an added benefit of an ultralow thermal conductivity which hampers heat penetration, protecting the conductor from extreme temperatures.
  • the conductor can be passivated with the third strategy, which focuses on utilizing robust oxide layers to overcoat the conductor. This layer should be resistant to extreme temperatures while preventing the conductor from oxidizing.
  • Depositing aluminum oxide (AI2O3) using atomic layer deposition at a low temperature allows for scalability while also allowing for long durability of the conductor under extreme conditions.
  • the advanced flexible ceramic substrate prevented high temperatures from penetrating through to the conductor while the ALD coating protected the conductor from oxygen in the atmosphere and high temperatures.
  • FIG. 1 The average size and standard deviation for each sizing curve is shown in Table 1, in which nanostructured Cu synthesized with CuBr or ascorbic acid had an average size of 8.78 pm or 0.85 pm, respectively (The control sample had an average size of 3.39 pm).
  • Figure 2b shows a representative SEM image of a printed Cu conductor. The nanostructured geometry is distinguishable but melted together after sintering. The corresponding electrical conductivity measurements of as-synthesized Cu NPLs from different reaction conditions are shown in Figure 2c, with the optimum electric conductivity of 5.6 MS/m (Images of the conductors are shown in Figure 8).
  • Figure 12 insets show the sizing curves and the average size of Cu NPLs for each concentration. This observation in size correlated to the changes in its electrical conductivity, suggesting that the Cu NPLs are essential in forming a percolating network and that the larger size NPLs can result in higher conductivities.
  • Table 1 Average size and standard deviation values based on the sizing curves from Figure 6.
  • Copper’s low oxidation resistance is exacerbated on the nanoscale due to higher surface-to-volume ratio.
  • One method to improve the resistance is to alloy or coat the
  • FIG 13 show the SEM images and energy-dispersive X-ray spectroscopy (EDS) scan line of Cu/Ag NPLs and CuAg NPs (molar ratio of 9: 1), respectively (SEM images of the other alloys are provided in Figure 14).
  • the line scan of the NPLs show that Cu (red) is the main element in the middle with more Ag (cyan) present at the edges, supporting its core/shell nanostructure.
  • the line scan of the NPs shows both Cu and Ag present consistently throughout, supporting its alloy composition. This observation is consistent for the rest of the alloy NPs made ( Figure 14b, 14d and 14f).
  • the oxidation stability of printed conductors of Cu/Ag NPLs and CuAg NPs were evaluated against Cu NPLs (control) at an elevated temperature (160 °C) for 98 hrs ( Figure 3a) (the rest shown in Figure 15).
  • the Cu NPLs displayed the greatest decrease in electrical conductivity, dropping more than half the value at the end of the 98 hrs (2.8 MS/m to 1.2MS/m).
  • the Cu/Ag NPLs degraded at a slower rate ending with a conductivity around 75% (2.2 MS/m to 1.5 MS/m) by the end.
  • the CuAg alloy NPs showed high oxidation stability over the 98 hours of heating, losing less than 10% of its original conductivity (17 MS/m to 16 MS/m).
  • the Cu/Ag NPLs have the Cu (111) peak as in addition to the Ag (111) peak at 29 of 38.1. These match up well with what is expected, as the (111) plane is most dominant facet for the NPLs.
  • the CuAg NPs were observed to have more 29 peaks: Cu (111) at 43.3, Cu (299) at 59.4, Cu (229) at 74.1, Ag (111) at 38.1, and Ag (299) at 44.3, which was expected from the formation of NPs.
  • diffractograms before (darker color) and after (lighter color) the oxidation stability test only one new 29 peak at 36.4 arises, corresponding to Cu(I) oxide.
  • the Cu-G hybrid conductor showed thermal stability around 460 °C where the resistance started to increase above 10 . Comparing both hybridized conductors, it suggests that the in- situ converted graphene provided a greater protection, seen by the operation temperature window increase of 60 °C.
  • the hybridized interface between Cu and graphene is responsible for its improved protection ( Figure 17).
  • the graphene was converted, in-situ, from dopamine, whereas boron nitride nanosheets were exfoliated and incorporated in the ink.
  • the nature of the in-situ conversion resulted in a more favorable interaction between the Cu NPLs and graphene whilst covering the NPLs.
  • the boron nitride on the other hand, was physically incorporated and possibly resulted in some aggregation of the nanosheets.
  • the RT curve only estimates the maximum temperature before its failure.
  • hybridized Cu-G and CuAg-G conductors were evaluated at 400 °C over a duration of eight hours, shown in Figure 4c (Other conductors shown in Figure 18).
  • the CuAg-G conductor proved stable for approximately 1 hr, before the resistance started increasing, until the failure of the conductor at the 4-hour mark.
  • the Cu-G conductor proved to be stable throughout the eight-hour heating period, with an increase of resistance from 0.7 to 2.2 Q by the end.
  • the printed conductor is an essential component in flexible electronics
  • a suitable substrate is just as critical in proper design.
  • Cu-G conductors were printed onto an ultrathin flexible alumina sheets with high thermal conductivity of 30 W/m*K, and flexible alumina aerogel nanocomposite sheet which is stable at high temperatures, thermal insulation with thermal conductivity of 0.03 W/m*K, and lightweight (Figure 5a).
  • a thin layer of AI2O3 with various thicknesses was coated onto the printed Cu-G conductor (at the same thickness of 10 pm) to protect it from oxidation.
  • Figure 5a shows the setup for the hydrogen torch test.
  • the AI2O3 coating (front) and the aerogel nanocomposite substrate (back) were evaluated for determining their respective stability against higher temperatures.
  • the front side tests the effectiveness of AI2O3 thin layer at protecting the conductor from extreme temperatures and preventing oxidation (Figure 5b).
  • the final reading represents either the last point before the conductor started to fail or once the temperature reached over 1,000 °C, whichever happens first.
  • Starting from an ultrathin AI2O3 coating its 25 nm thickness (black trace) showed thermal stability until 563 °C where the resistance changed from 6.3 to 7.1 .
  • the 50 nm thickness (red trace) coated Cu-G conductor was stable up to 729 °C with a resistance change from 4.2 to 4.8 .
  • the 75 nm thickness coated Cu-G conductor was stable to around 714 °C, with a change in resistance from 4.6 to 5.6 .
  • the 100 nm thickness coated Cu-G conductor was shown to be stable up to 913 °C and a resistance from 3.9 to 5.0 , while the 1,000 nm thickness coated Cu-G has shown to be stable up to 1031 °C with an increase in resistance from 3.2 to 4.6 .
  • Figure 5c shows the resistance (of 1.9 ) after the torch test for 1000 nm thickness coated Cu-G conductors. This shows that the printed Cu-G conductor could survive above 1,000 °C. The trend supports that thicker AI2O3 coating promoted better thermal stability of printed Cu-G conductor at higher temperatures.
  • Described herein is the controlled growth of printable copper nanostructured materials for high-temperature flexible hybrid electronics.
  • advanced copperceramic platform three hybridization and passivation strategies to improve thermal stability of printed copper conductor for high temperatures were demonstrated.
  • an ultrathin flexible thermal conductive ceramic substrate it is indispensable to employ a thin ALD layer coating to protect the printed Cu conductor from oxidation at high temperatures (over 1,000 °C), while a flexible ceramic aerogel substrate could prevent the heat penetration into the printed Cu conductor due to its superinsulation characteristics.
  • the findings shown here provide a pathway towards the applications of copper materials for high-temperature electronics.
  • the synthetic precursor was made up of a copper precursor (CuCh, CuCl, or CuBr), a reducing agent (glucose or ascorbic acid (AA)), a surfactant/ligand (HD A), sodium iodide, and DI H2O.
  • a copper precursor CuCh, CuCl, or CuBr
  • a reducing agent glucose or ascorbic acid (AA)
  • a surfactant/ligand HD A
  • sodium iodide sodium iodide
  • DI H2O DI H2O
  • a typical synthesis consists of copper chloride dihydrate (CuCh «2H 2 O, 2.4 g; 14.1 mmol; 15.7 mM), D-glucose (CeHnOe, 3.9 g; 21.6 mmol; 24 mM), hexadecylamine (HD A, 14.55 g; 60.2 mmol; 66.9 mM), and sodium iodide (Nal, 90 mg; 0.6 mmol; 0.54 mM) and were added to 900 mL of DI water. This solution was mixed (Via blender or mechanically stirred for 12 hrs) to obtain a uniform emulsion. 600 mL of the above solution was heated in an autoclavable glass bottle for 12 hrs at 100 °C, unless specified.
  • the Cu NPL solids are collected via centrifugation at 5000 rpm for 5 minutes.
  • the solids obtained from centrifugation were redispersed in DI H2O, and filtered with a 180 pm membrane to remove any material left bigger than said membrane.
  • the Cu NPLs will be centrifuged to collect the solids and further cleaned with the addition of DI H2O and ethanol at a 1 : 1 ratio and then the ink feedstock was collected via centrifugation.
  • ALD Atomic Layer Deposition
  • AI2O3 coatings were deposited on copper ink printed on Alumina Ribbon Ceramic using 236, 472, 708 and 944 cycles, respectively.
  • the deposition was performed at 200°C.
  • the growth rate for AI2O3 during this procedure was 1.06 A/cycle.
  • This example provides a description of an ink of the present disclosure.
  • Table 2 Silver coated copper nanoparticle ink formulations and their associated properties.

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Abstract

L'invention concerne des compositions de suspensions conductrices qui peuvent être utilisées en tant qu'encre imprimable. La composition de suspension conductrice présente une charge conductrice, qui peut être une nanoparticule de cuivre, une nanoparticule d'alliage cuivre-argent et/ou une nanoparticule de cuivre revêtue d'argent. Les suspensions conductrices peuvent être utilisées pour fabriquer des composants électroniques flexibles. L'invention concerne également des procédés de fabrication des compositions et des composants électroniques flexibles formés à partir desdites compositions.
EP23959056.5A 2022-10-28 2023-10-20 Électronique imprimée flexible utilisant du cuivre à ultra-haute température Pending EP4608921A2 (fr)

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