EP4613072A1 - Structure de connexion électrique - Google Patents

Structure de connexion électrique

Info

Publication number
EP4613072A1
EP4613072A1 EP23761524.0A EP23761524A EP4613072A1 EP 4613072 A1 EP4613072 A1 EP 4613072A1 EP 23761524 A EP23761524 A EP 23761524A EP 4613072 A1 EP4613072 A1 EP 4613072A1
Authority
EP
European Patent Office
Prior art keywords
connection structure
electrical connection
conductor track
film
electrical conductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP23761524.0A
Other languages
German (de)
English (en)
Inventor
Bettina FLEMING
Julio Kuntz
Michael Neubauer
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ennovi Advanced Engineering Solutions Germany GmbH
Original Assignee
Ennovi Advanced Engineering Solutions Germany GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ennovi Advanced Engineering Solutions Germany GmbH filed Critical Ennovi Advanced Engineering Solutions Germany GmbH
Publication of EP4613072A1 publication Critical patent/EP4613072A1/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0286—Programmable, customizable or modifiable circuits
    • H05K1/0293—Individual printed conductors which are adapted for modification, e.g. fusable or breakable conductors, printed switches
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0158—Polyalkene or polyolefin, e.g. polyethylene [PE], polypropylene [PP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09063—Holes or slots in insulating substrate not used for electrical connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09236—Parallel layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10037—Printed or non-printed battery
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10181—Fuse
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by abutting or pinching; Mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Definitions

  • the invention relates to an electrical connection structure consisting of a flexible film and at least one electrical conductor track or contact surface.
  • the invention also relates to a manufacturing method for the electrical connection structure.
  • busbars and flexible printed circuit boards Flexible Printed Circuit
  • Flexible printed circuit boards Flexible Printed Circuit
  • the provision of the corresponding electrical conductor tracks and the lamination using two films is very complex and time-consuming. It is therefore an object of the present invention to provide an improved electrical connection structure and an optimized manufacturing method of the electrical connection structure.
  • an electrical connection structure consisting of a flexible film and at least one electrical conductor track.
  • the at least one electrical conductor track is applied to a film surface of the flexible film in a protruding manner, preferably printed directly onto the film surface using a direct printing process with a conductive metal.
  • the film is designed without a coating and/or covering.
  • the electrical conductor tracks are printed directly onto the flexible film and do not have to be arranged and aligned between two films.
  • the electrical conductor track is printed onto the flexible film according to a predetermined topology or a predetermined course. Accordingly, the electrical connection structure is optimally adapted or designed to suit a specific application. This also reduces the manufacturing effort and material usage, for example. Furthermore, the usual flexible printed circuit boards (flex printed circuit) are no longer required.
  • the film has a plurality of equidistantly spaced transport openings on at least one edge side for the engagement of a conveying tool and/or openings (12) for contacting a busbar.
  • the electrical connection structure can be manufactured automatically in a production line or can be automatically fed to a corresponding production device and after processing, it can be conveyed for further processing and/or storage using the conveying tool.
  • Current connectors such as current rails or current collectors, can be arranged in the openings for contacting a busbar and connected to the printed conductor structure.
  • the printed conductor tracks are used for monitoring and connecting to corresponding sensors in order to communicate with a battery management system (BMS).
  • BMS battery management system
  • the openings are designed for contacting a busbar with battery cells, in particular cylindrical, prismatic and/or pouch cells.
  • a further flexible film is provided and the electrical conductor track is fixed, in particular laminated, between the two flexible films.
  • the electrical connection structure according to the invention is designed in one embodiment such that at least one fuse is provided and the fuse is a fusible conductor track.
  • the corresponding fuse is integrated into the conductor track as a so-called "fusible trace”. In this way, a fuse can be integrated into the electrical conductor track without additional components, in particular when producing the electrical connection structure.
  • an embodiment is favorable in which at least one temperature sensor is provided.
  • the temperature sensor is in particular an NTC sensor and/or an NTC resistor and/or a thermistor.
  • the invention provides that connecting elements are connected to the electrical conductor track by means of a wire connection.
  • This enables the electrical conductor track or the connecting structure to be connected to, for example, a power connection or a further line or a consumer.
  • the electrical connection structure according to the invention is designed in one embodiment such that the film is made of a plastic, in particular a PE plastic.
  • the electrical conductor track is made of copper and/or silver and/or alloys of copper and/or alloys of silver. These materials are particularly suitable for the film or the conductor track.
  • a manufacturing method of an electrical connection structure in which a flexible film is first provided. Then at least one electrical conductor track is printed on the flexible film using a printing device. In this case, either the film is guided along a predetermined pattern relative to a fixedly positioned print head or the print head is guided relative to the fixedly positioned film, or the print head is moved synchronously during the transport of the film in a processing direction. Furthermore, the at least one electrical conductor track is printed on the flexible film, in particular according to a predetermined topology.
  • the electrical conductor track is printed directly onto the flexible film.
  • the electrical conductor track is printed onto the flexible film according to a predetermined topology or a predetermined course. Accordingly, the electrical connection structure is optimally adapted or designed for a specific application. This also reduces the manufacturing effort and material usage, for example.
  • the printing device prints the at least one electrical conductor track by means of screen printing, flexographic printing, gravure Printing or inkjet printing from the liquid phase of the metal to be printed.
  • a further flexible film is provided and then the further flexible film is laminated onto the first flexible film by means of a laminating device in such a way that the at least one conductor track is laminated between the two flexible films.
  • the electrical conductor track is printed onto one side of the flexible film on which the at least one electrical conductor is arranged.
  • Fig. 1 an electrical connection structure consisting of a flexible film and at least one electrical conductor track.
  • Figure 1 shows an electrical connection structure 10 consisting of a flexible film 1 and at least one electrical conductor track 2.
  • the film 1 is made of a plastic, in particular a PE plastic, and the electrical conductor track 2 is made of copper and/or silver.
  • the at least one electrical conductor track 2 is applied to a surface of the flexible film in a protruding manner.
  • the conductor track 2 is printed directly onto the corresponding surface using a direct printing process with a conductive metal.
  • the film is designed without a coating and/or covering.
  • a fuse 3 is provided, which is a fusible conductor track.
  • the electrical connection structure 10 comprises connecting elements 5, which are connected to the electrical conductor track 2 by means of a wire connection. Furthermore, the film 1 has a plurality of equidistantly spaced transport openings 11 for the engagement of a conveying tool on both edge sides along a longitudinal extension of the film 1.
  • the invention is not limited in its embodiment to the preferred embodiments given above. Rather, a number of variants are conceivable, which make use of the solution shown even in fundamentally different embodiments.

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

L'invention concerne une structure de connexion électrique (10) constituée d'un film flexible (1) et d'au moins un trajet conducteur électrique (2), le ou les trajets conducteurs électriques (2) étant appliqués en saillie sur une surface du film flexible (1), de préférence un métal conducteur étant imprimé directement sur la surface correspondante au moyen d'un procédé d'impression directe, le film flexible (1) étant formé sans revêtement et/ou recouvrement dans des régions de surface non imprimées. L'invention concerne également un procédé de fabrication de la structure de connexion électrique (10).
EP23761524.0A 2023-01-25 2023-08-24 Structure de connexion électrique Pending EP4613072A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102023101758.6A DE102023101758A1 (de) 2023-01-25 2023-01-25 Elektrische Verbindungsstruktur
PCT/EP2023/073284 WO2024156378A1 (fr) 2023-01-25 2023-08-24 Structure de connexion électrique

Publications (1)

Publication Number Publication Date
EP4613072A1 true EP4613072A1 (fr) 2025-09-10

Family

ID=87845541

Family Applications (1)

Application Number Title Priority Date Filing Date
EP23761524.0A Pending EP4613072A1 (fr) 2023-01-25 2023-08-24 Structure de connexion électrique

Country Status (4)

Country Link
EP (1) EP4613072A1 (fr)
CN (1) CN120359815A (fr)
DE (1) DE102023101758A1 (fr)
WO (1) WO2024156378A1 (fr)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5196819A (en) * 1991-02-28 1993-03-23 Rock Ltd. Partnership Printed circuits containing fuse elements and the method of making this circuit
US6027762A (en) 1996-05-23 2000-02-22 Mitsumi Electric Co., Ltd. Method for producing flexible board
WO2000048243A1 (fr) * 1999-02-09 2000-08-17 Seiko Epson Corporation Substrat de circuit imprime flexible, bande porte-puces, dispositif a semiconducteur sur bande, dispositif a semiconducteur, procede de fabrication de semiconducteur, substrat de circuit, et dispositif electronique
FI20115869A0 (fi) 2011-09-05 2011-09-05 Marimils Oy Taso-anturi ja sen valmistusmenetelmä
KR101223701B1 (ko) 2011-11-23 2013-01-21 스템코 주식회사 연성 회로 기판 및 이를 포함하는 표시 장치, 연성 회로 기판의 제조 방법
JP6535309B2 (ja) * 2016-09-26 2019-06-26 矢崎総業株式会社 電池監視ユニット
CN108289372B (zh) 2017-01-09 2021-11-19 莫仕连接器(成都)有限公司 电池连接模块
GB202002694D0 (en) * 2020-02-26 2020-04-08 Cognition Energy Ltd Battery architecture

Also Published As

Publication number Publication date
WO2024156378A1 (fr) 2024-08-02
DE102023101758A1 (de) 2024-07-25
CN120359815A (zh) 2025-07-22

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