Classifications

• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
  • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
  • H04N23/50—Constructional details
  • H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
  • G03B17/00—Details of cameras or camera bodies; Accessories therefor
  • G03B17/02—Bodies
  • G03B17/12—Bodies with means for supporting objectives, supplementary lenses, filters, masks, or turrets
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
  • G03B30/00—Camera modules comprising integrated lens units and imaging units, specially adapted for being embedded in other devices, e.g. mobile phones or vehicles
• • G—PHYSICS
  • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
  • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
  • G03B43/00—Testing correct operation of photographic apparatus or parts thereof
• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
  • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
  • H04N23/50—Constructional details
  • H04N23/51—Housings
• • G—PHYSICS
  • G02—OPTICS
  • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
  • G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
  • G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
  • G02B7/023—Mountings, adjusting means, or light-tight connections, for optical elements for lenses permitting adjustment

Definitions

• the disclosure relates to electronics, and more specifically, relates to a camera assembly that includes an image sensor assembly that includes a lens assembly housing configured to reduce axis alignment issues.
• tolerances related to roll, yaw, and pitch can deteriorate when mounting a lens assembly to a housing.
• mounting a camera in a housing is beneficial in that the housing may host an onboard processing unit that allows for processing images from the camera in a single unit, as opposed to having to connect the camera to a separate processing unit, such as to a vehicle onboard processing unit.
• one or more of the roll, yaw and/or pitch may deteriorate due to rotational forces exerted on the lens assembly when fasteners that attach the lens assembly to the housing experience torque. What is needed is an arrangement to ensure proper alignment of the lens assembly when attached to an image sensor assembly housing to allow for camera unit to carry an onboard processing unit.
• an image sensor system comprising a housing defining a lens receiving aperture; a lens assembly configured to interface with the lens receiving aperture of the housing; and a printed circuit board having an image sensor mounted thereon.
• the printed circuit board is configured to aligned with housing datums such that image sensor is positioned with six-axis alignment to cooperate with the lens assembly.
• a portion of the outer surface of the lens assembly includes threads.
• An inner surface of the lens receiving aperture includes corresponding threads such that the lens assembly can be threadably engaged to the housing.
• an adhesive is disposed on the printed circuit board around the image sensor.
• the adhesive is configured to secure the printed circuit board to the housing.
• the housing further comprises a mounting portion into which the lens receiving aperture is formed.
• the mounting portion further defines a mount surface inset from an outer edge of a circumferential wall disposed about the lens receiving aperture.
• a hood is provided.
• the hood has a generally C-shape defined by a pair of opposing arms connected by a beam, wherein each arm has a mounting flange.
• each mounting flange includes a mounting aperture. The mounting aperture is aligned with a corresponding mounting aperture formed on a fastener mount of the mounting portion.
• the mounting flange each includes a mounting element, wherein the mounting element may be press fit into a corresponding mounting aperture formed on a fastener mount of the mounting portion.
• the lens assembly includes a lens mount at one end of the lens assembly, wherein a portion of the lens mount may engage with adhesive to secure the lens mount to the printed circuit board assembly.
• the lens mount engages a surface of the housing.
• the lens mount there are two layers of adhesive, a first layer disposed between a first surface of the lens mount and an underside of the housing, and the second layer of adhesive is disposed between the lens mount and the printed circuit board assembly.
• the lens assembly includes a lens housing and a lens mount at one end of the lens housing.
• the lens mount extends laterally from the lens housing and includes mounting openings extending therethrough.
• the mounting openings correspond to fastener mounts formed in the housing. When aligned, the aligned mounting openings and fastener mounts receive fasteners.
• annular locating members are disposed about each fastener mount on the housing. The annular locating members receive portions of the lens mount where the mounting openings are disposed.
• a stop mount is formed on a bottom surface of the housing. The stop mount receives a portion of the lens mount therein to seat the lens assembly to the housing.
• a bond ring is secured to the housing, the bond ring also being secured to the printed circuit board by adhesive.
• the bond ring may be connected to the housing by a fastening assembly.
• an image sensor assembly comprises a housing defining a lens receiving aperture; a lens housing of a lens assembly configured to interface with the lens receiving aperture of the housing; and a bond ring attached to an inner surface of the housing; and a printed circuit board having an image sensor mounted thereon.
• the printed circuit board is configured to interface with the bond ring.
• FIG. 1A is a partially exploded isometric view of a rear side of certain components of an image sensor system according to an exemplary arrangement of the present disclosure
• FIG. 1 B is another isometric view of the rear side of certain components of the image sensor system of FIG. 1A, rotated 180° according to an exemplary arrangement of the present disclosure
• FIG. 1C is an enlarged view of area 1C taken from FIG. 1A of a portion of a housing of the image sensor system of FIG. 1A, according to an exemplary arrangement of the present disclosure
• FIG. 1 D is a top plan view the rear side of the image sensor system according to an exemplary arrangement of the present disclosure
• FIG. 1 E is a front elevational view of the image sensor system in a partially assembled configuration according to an exemplary arrangement of the present disclosure
• FIG. 1 F is a partially exploded view of the image sensor system according to an exemplary arrangement of the present disclosure
• FIG. 1 G is an assembled view of the image sensor system of FIG. 1 F;
• FIG. 2A is an isometric partially exploded view of components of another image sensor system according to an exemplary arrangement of the present disclosure
• FIG. 2B is a partially exploded isomeric view of a housing according to an exemplary arrangement of the present disclosure
• FIG. 2C is another partially isometric view of the image sensor system rotated 180° of the image sensor system of FIG. 2B according to an exemplary arrangement of the present disclosure
• FIG. 2D is another partially exploded isometric view of the image sensor system according to an exemplary arrangement of the present disclosure
• FIG. 2E is an assembled isometric view of the image sensor system of FIG. 2D according to an exemplary arrangement of the present disclosure
• FIG. 3 is a diagrammatic cross-sectional view of an image sensor system according to an exemplary arrangement of the present disclosure
• FIG. 4 is a diagrammatic cross-sectional view of an image sensor system according to an exemplary arrangement of the present disclosure
• FIG. 5 is a diagrammatic cross-sectional view of an image sensor system according to an exemplary arrangement of the present disclosure
• FIG. 6 is a diagrammatic cross-sectional view of an image sensor system according to an exemplary arrangement of the present disclosure
• FIG. 7 is a diagrammatic cross-sectional view of an image sensor system according to an exemplary arrangement of the present disclosure
• FIG. 8 is a diagrammatic cross-sectional view of an image sensor system according to an exemplary arrangement of the present disclosure
• FIG. 9 is a diagrammatic cross-sectional view of an image sensor system according to an exemplary arrangement of the present disclosure.
• FIGS. 1A through 9 illustrate various exemplary arrangements of an image sensor system.
• a first exemplary arrangement is shown in FIGS. 1A- 1 G.
• an image sensor system 10 is disclosed that comprises a housing 12 and a lens assembly 14.
• the housing 12 is configured to host an onboard processing unit that allows for processing of images from the lens assembly 14.
• the housing 12 defines a lens receiving aperture 16 that is positioned in a mounting flange 18 of the housing 12.
• the lens receiving aperture 16 is delineated by a circumferential wall 24 disposed within the rear side 20 of the mounting flange 18.
• the mounting flange 18 is further defined by an outer wall member 26 that extends from a main body portion 27 of the housing 12, around the circumferential wall 24 such that a groove 28 is formed between at least portions of the outer wall member 26 and the circumferential wall 24.
• the circumferential wall 24 abuts the outer wall member26, adjacent a top portion 30 of the mounting flange 18, such that the groove 28 is disposed on either side of the circumferential wall 24.
• the lens receiving aperture 16 further comprises threads disposed on an inner wall 32 thereof, as well as a mounting surface 34.
• the mount surface 34 is inset from an outer edge 36 of the circumferential wall 24.
• each fastener mount 38 Extending inwardly from the outer wall member 26 and into the groove 28, is at least one fastener mount 38.
• Each fastener mount 38 includes an aperture 40 formed therein.
• Each aperture 40 may be threaded on an inside surface 42 thereof.
• the lens assembly 14 includes a lens housing 44 which has a lens mount 46 at one end. A portion of an outer surface of the lens housing 44 is threaded and engages with the threads disposed on the inner wall 32 of the lens receiving aperture 16. Accordingly, the lens assembly 14 is assembled to the housing 12 by inserting the lens assembly 14 within the lens retaining aperture 16 and rotating the lens assembly 14 to secure the lens assembly 14 within the housing 12. In one exemplary arrangement, the lens assembly 14 is rotated until the lens mount 46 is seated against the mounting surface 34. To facilitate insertion of the lens assembly 14 within the lens receiving aperture 16, a top surface 48 of the lens assembly 14 may be provided with blind holes 50 for receiving a spanner tool. Other drive mechanisms may be employed, such as grooves or castellations. In addition, a thread locker may be employed to ensure that the lens assembly 14 is secured to the housing 12, once inserted within the lens receiving aperture 16.
• FIG. 1 C once the lens assembly 14 is fully seated within the lens receiving aperture 16, the top surface 48 of the lens assembly 14 is positioned below the outer edge 36 of the outer circumferential wall 24.
• FIG. 1 E once the lens assembly 14 is mounted within the housing 12, a forward end 52 of the lens assembly 14 is extends through the lens receiving aperture 16, through a front surface 22 of the mounting flange 18.
• the printed circuit board assembly 56 includes an image sensor 57 secured on a printed circuit board 58.
• An adhesive material 60 is disposed around the image sensor 57.
• the printed circuit board assembly 56 can include an electrical connector 62.
• the electrical connector 62 facilitates the transfer of electrical signal to and/or from the image sensor 57.
• the electrical connector 62 can comprise a surface-mounted board-to-board (BTB) connector.
• the electrical connector comprises a zero-insertion force (ZIF) interface.
• the electrical connector comprises anisotropic conductive film (ACF) or anisotropic conductive paste (AGP).
• the printed circuit board assembly 56 With the adhesive material 60 thereon, is positioned on the housing 12. More specifically, the image sensor 57 of the printed circuit board assembly 56 undergoes six-axis alignment with respect to bracket 64 datums to allow for proper positioning of the lens assembly and to ensure focus of a vehicle camera.
• the image sensor 57 is positioned within a space defined by the top surface 48 of the lens assembly 14 and the outer edge of the circumferential wall 24.
• the adhesive material 60 contacts the circumferential wall 24 to secure the printed circuit board assembly 56 to the housing 12.
• at least a portion of the adhesive material 60 is visible once the printed circuit board assembly 56 is assembled to the mounting flange 18, as shown in FIG. 1 E.
• the adhesive material 60 undergoes a curing operation, such as a UV tack cure or a thermal cure, to permanently fix the printed circuit board assembly 56 in place to the housing 12.
• a hood 63 may be secured to the housing 12.
• the hood 63 may be formed as a generally C-shaped bracket, with a pair of arms 66 arranged opposing one another, and each joined together with a central beam 68.
• the hood 63 is generally shaped to correspond with the outer wall member 26.
• the hood 63 may be constructed of a metal.
• each arm 66 Extending inwardly from each arm 66 is a mounting flange 70.
• the mounting flanges 70 each include a mounting aperture 72.
• the mounting apertures 72 align with the apertures 40 of the fastener mounts 38.
• fastening elements 74 engage the mounting apertures 72 and apertures 40, thereby securing the hood 63 to the housing 12, as shown in FIG. 1 G.
• FIGS. 2A-2E a second exemplary arrangement of an image sensor system 100 is illustrated.
• the arrangement of FIGS. 2A-2E are similar to the arrangement shown in FIGS. 1A-1 E. Accordingly, like numbers have been given the same numbers, but increased by 100.
• all of the components of image sensor system 100 are the same as the components of image sensor 10, except for the hood 163.
• the hood 163 is constructed of a plastic material.
• the hood 163 is constructed similar to that of hood 63 in that the hood 163 has a generally C-shape with arms 166 connected together with a central beam 168. Attached to each arm 166 is a mounting flange 170.
• mounting flange 170 instead of mounting apertures 72, on a bottom surface 172 of the mounting flange 170 includes a mounting element 174 extending from the bottom surface 172.
• the mounting element 174 includes a channel 175 that separates portions 176 of the mounting element 174 apart from one another.
• the mounting element 174 is received within the apertures 140 of the fastener mounts 138 formed in the mounting flange 1 18.
• the portions 176 are forced together as the mounting element 174 is press fit into the aperture 140.
• the channel 175 then biases the portions 176 apart again, once the mounting element 174 is positioned within the aperture 140, thereby locking the hood 163 to the housing 112.
• FIG. 3 a cross-sectional view of an alternative arrangement of an image sensor assembly 200 is shown in an assembled configuration.
• the arrangement of FIG. 3 is similar to the arrangement shown in FIGS. 1 A-1 E. Accordingly, like numbers have been given the same numbers, but increased by 200.
• the lens assembly 214 is attached to the housing 212 by a threaded nut 213.
• the threaded nut 213 includes threads 215 disposed on an internal surface 217 of a lens receiving aperture 216 formed in the threaded nut 213.
• Corresponding threads 219 are formed on an outer surface 221 of the lens housing 244 of the lens assembly 214.
• a thread locker may also be employed to lock the lens assembly 214 within the nut 213, once the threads 215 and 219 are engaged.
• the adhesive material 260 is dispensed on the printed circuit board 258 about the image sensor 257.
• the printed circuit board assembly 256 undergoes six-axis alignment to housing datums. Once so aligned, the adhesive material is subjected to an UV tack cure operation, and then a thermal cure operation, thereby securing the printed circuit board assembly 256 in place with respect to the housing 212.
• FIG. 4 a cross-sectional view of an alternative arrangement of an image sensor assembly 300 is shown in an assembled configuration.
• the arrangement of FIG. 4 is similar to the arrangement shown in FIGS. 1 A-1 E. Accordingly, like numbers have been given the same numbers, but increased by 300.
• the lens assembly 314 is attached to the housing 312 by an adhesive material 313.
• the adhesive material 313 is secured between the housing 312 and a bottom surface 345 of a lens mount 346.
• Adhesive material 360 is dispensed on the printed circuit board 358 about the image sensor 357.
• the image sensor assembly 300 has two phases. During the first phase, after the adhesive material 360 is disposed on the printed circuit board assembly 356, the printed circuit board assembly 356 undergoes five-axis alignment of the lens assembly 314 to the printed circuit board 356.
• the adhesive material 360 is subjected to a UV tack cure, and a thermal cure operation so as to fix the printed circuit board assembly 356 in place with respect to the lens assembly 314.
• the adhesive material 313 is disposed on the bottom surface 345 of the lens mount 346.
• the lens assembly 314 undergoes six axis alignment of the lens assembly 314 to the housing datums (not shown).
• the adhesive material 313 is subjected to a UV tack cure operation and then a thermal cure operation.
• a single cure operation may be performed, i.e., a UV tack cure operation.
• FIG. 5 a cross-sectional view of an alternative arrangement of an image sensor assembly 400 is shown in an assembled configuration.
• the arrangement of FIG. 5 is similar to the arrangement shown in FIGS. 1 A-1 E. Accordingly, like numbers have been given the same numbers, but increased by 400.
• the lens assembly 414 is attached to the housing 412 by a threaded mount 413 that extends outwardly from a first surface 415 of the housing 412.
• the threaded mount 413 is integrally formed with the housing 412.
• the threaded mount 413 includes threads 415 disposed on an internal surface 417 of a lens receiving aperture 416 formed in the threaded mount 413.
• Corresponding threads 419 are formed on an outer surface 421 of the lens housing 444 of the lens assembly 414.
• a thread locker may also be employed to lock the lens assembly 414 within the threaded mount 413, once the threads 415 and 419 are engaged.
• the adhesive material 460 is dispensed on the printed circuit board 458 about the image sensor 457.
• the printed circuit board assembly 456 undergoes six-axis alignment to housing datums (not shown). Once so aligned, the adhesive material is subjected to an UV tack cure operation, and then a thermal cure operation, thereby securing the printed circuit board assembly 456 in place with respect to the housing 412.
• the adhesive material 460 may be subject on a UV tack cure operation only.
• FIG. 6 a cross-sectional view of an alternative arrangement of an image sensor assembly 500 is shown in an assembled configuration.
• the arrangement of FIG. 6 is similar to the arrangement shown in FIGS. 1 A-1 E. Accordingly, like numbers have been given the same numbers, but increased by 500.
• the lens assembly 514 is attached to the housing 512 by a fastening arrangement 513 that is positioned on a lens mount 546 of the lens assembly 514.
• the lens mount 546 is constructed to extend laterally from the lens housing 544 and includes mounting openings 545 extends that through the lens mount 546.
• the housing 512 includes fastener mounts 538 that correspond to the number of mounting openings 545 in the lens mount 546.
• surrounding each fastener mount 538 is an annular locating member 539.
• the annular locating members 539 are machined so as to have datums that correspond to housing datums to ensure proper alignment of the lens assembly 514. The annular locating member 539 assist with proper positioning of the lens mount 546. Once positioned, a portion of the lens mount 546 is disposed within the annular locating member 539.
• the fastener mount 538 includes a threaded groove 541. Once the lens mount 546 is positioned, fastening elements 543 are inserted through the mounting openings 545 and engages with the threaded grooves 541 , thereby securing the lens mount 546 to the housing 512.
• adhesive material 560 is dispensed on the printed circuit board assembly 556.
• the printed circuit board assembly 556 then undergoes six axis alignment of the printed circuit board assembly 556 to housing datums. Once aligned, the adhesive material 560 is subjected to a UV tack cure and then to a thermal cure.
• FIG. 7 a cross-sectional view of an alternative arrangement of an image sensor assembly 600 is shown in an assembled configuration.
• the arrangement of FIG. 7 is similar to the arrangement shown in FIG. 5. Accordingly, like numbers have been given the same numbers, but increased by 200.
• the lens assembly 614 is attached to the housing 612 by a threaded mount 613 that extends outwardly from a first surface 631 of the housing 612.
• the threaded mount 613 is integrally formed with the housing 612.
• the threaded mount 613 includes threads 615 disposed on an internal surface 617 of a lens receiving aperture 616 formed in the threaded mount 613.
• Corresponding threads 619 are formed on an outer surface 621 of the lens housing 644 of the lens assembly 614.
• a thread locker may also be employed to lock the lens assembly 614 within the threaded mount 613, once the threads 615 and 619 are engaged.
• the housing 612 includes a stop mount 611 formed on a bottom surface 609 of the housing 612.
• the stop mount 61 1 is spot faced to the housing datums and provides a hard stop for the lens mount 646 to seat the lens assembly 614 properly. This arrangement allows for a coarser thread arrangement to be used, thereby reducing tolerances of drill and tap operations and thread form.
• the adhesive material 660 is dispensed on the printed circuit board 658 about the image sensor 657.
• the printed circuit board assembly 656 undergoes six-axis alignment to housing datums. Once so aligned, the adhesive material 660 is subjected to an LIV tack cure operation, and then a thermal cure operation, thereby securing the printed circuit board assembly 656 in place with respect to the housing 612.
• adhesive material 660 may be UV tack cured only.
• FIG. 8 a cross-sectional view of an alternative arrangement of an image sensor assembly 700 is shown in an assembled configuration.
• the arrangement of FIG. 8 is similar to the arrangement shown in FIG. 7. Accordingly, like numbers have been given the same numbers, but increased by 100.
• the lens assembly 714 is attached to the housing 712 by a threaded mount 713 that extends downwardly from a first surface 731 of the housing 712.
• the threaded mount 713 is integrally formed with the housing 712 and includes an inwardly formed stepped configuration.
• the threaded mount 713 includes threads 715 disposed on an internal surface 717 of a lens receiving aperture 716 formed in the threaded mount 713.
• Corresponding threads 719 are formed on an outer surface 721 of the lens housing 744 of the lens assembly 714.
• a thread locker may also be employed to lock the lens assembly 714 within the threaded mount 713, once the threads 715 and 719 are engaged.
• the housing 712 includes a stop mount 71 1 on the bottom surface 731 of the housing 712.
• the stop mount 711 is spot faced to the housing datums and provides a hard stop for the lens mount 746 to seat the lens assembly 714 properly.
• Extending outwardly from the lens mount 746 is an adhesive mount 747.
• the adhesive mount 747 is spot faced to the housing datums to ensure proper alignment of the lens assembly 714 to the housing 712.
• the adhesive material 760 is dispensed on the printed circuit board 758 about the image sensor 757.
• the printed circuit board assembly 756 undergoes six-axis alignment to housing datums and the adhesive material 760 is secured to the adhesive mount 747. Once so aligned, the adhesive material 760 is subjected to an UV tack cure operation, and then a thermal cure operation, thereby securing the printed circuit board assembly 756 in place with respect to the housing 712.
• the adhesive material 760 may be subjected to the UV tack cure operation only.
• FIG. 9 a cross-sectional view of an alternative arrangement of an image sensor assembly 800 is shown in an assembled configuration.
• the arrangement of FIG. 9 is similar to the arrangement shown in FIG. 6. Accordingly, like numbers have been given the same numbers, but increased by 300.
• the lens assembly 814 is attached to the housing 812 by a threaded mount 813 that extends outwardly from a first surface 815 of the housing 812.
• the threaded mount 813 is integrally formed with the housing 812.
• the threaded mount 813 includes threads 815 disposed on an internal surface 817 of a lens receiving aperture 816 formed in the threaded mount 813.
• Corresponding threads 819 are formed on an outer surface 821 of the lens housing 844 of the lens assembly 814.
• a thread locker may also be employed to lock the lens assembly 814 within the threaded mount 813, once the threads 815 and 819 are engaged.
• the lens assembly 814 is also attached to the housing 812 by a fastening arrangement 813. More specifically, the housing 812 also includes fastening mounts 838 that define threaded grooves 841 therein. The threaded grooves 841 are configured to receive corresponding threaded fasteners 843.
• a bottom surface 831 of the housing 812 includes a mounting surface 833 that is configured to receive a bond ring 835. The datum for the mounting surface 833 may be spot faced to the housing datums and so that the mounting surface 833 provides a hard stop for lens mount 846 and the bond ring 835.
• the bond ring 835 may be formed with an adhesive mount 847, positioned at datum B in FIG. 9.
• Datum B can be laser etched to improve the bond strength.
• all of the adhesive mounts shown in the exemplary arrangements above may be laser etched.
• the adhesive mount 847 extends outwardly from a bottom surface 851 of the bond ring 835.
• An opening 853 extends through the bond ring 835.
• the lens assembly 814 is threadingly attached to the housing 812, until the lens mount 846 engages the bottom surface 831 of the housing 831.
• the bond ring 835 is then positioned on the mounting surface 833 of the housing 812 formed in the bottom surface 831 of the housing 612 and secured to the housing 812 with fastening elements 843. More specifically, the fastening elements 843 are inserted through mounting openings 845 and engaged with the threaded grooves 841 , thereby securing the bond ring 835 to the housing 812.
• the bond ring 835 may be secured to the housing 812 before the lens assembly 814 is threadingly secured to the housing 814.
• adhesive material 860 is dispensed on the printed circuit board assembly 856.
• the printed circuit board assembly 856 then undergoes six axis alignment of the printed circuit board assembly 856 to housing datums. Once aligned, the adhesive material 860 is subjected to a UV tack cure and then to a thermal cure. This arrangement allows for a coarser thread arrangement to be used, thereby reducing tolerances of drill and tap operations and thread form. Alternatively, the adhesive material 860 may be subjected to only a UV tack cure operation.
• This arrangement also allows for the lens assembly 814 and housing to be reusable, by removing the bond ring and printed circuit board assembly 856.
• the bond ring 835 can function as a sacrificial spacer structure to allow recovery of the housing 812, lens assembly 814, and/or image sensor assembly 857.
• the bond ring 835 material coefficient of thermal expansion may be selected to optimize athermalization.
• the bond ring 835 material may also be selected to be compatible with the adhesive.
• the thickness of the bond ring 835 may be selected to accommodate different image sensors 857.
• 60, 160, 260, 360, 460, 560, 660, 760, and 860 may be an epoxy cationic material.

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• Physics & Mathematics (AREA)
• General Physics & Mathematics (AREA)
• Engineering & Computer Science (AREA)
• Multimedia (AREA)
• Signal Processing (AREA)
• Lens Barrels (AREA)

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• 2024
  • 2024-03-08 EP EP24767913.7A patent/EP4677407A1/de active Pending
  • 2024-03-08 WO PCT/US2024/019113 patent/WO2024187108A1/en not_active Ceased

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