EP4699196A2 - Appareil d'alignement et de support laser - Google Patents

Appareil d'alignement et de support laser

Info

Publication number
EP4699196A2
EP4699196A2 EP24792256.0A EP24792256A EP4699196A2 EP 4699196 A2 EP4699196 A2 EP 4699196A2 EP 24792256 A EP24792256 A EP 24792256A EP 4699196 A2 EP4699196 A2 EP 4699196A2
Authority
EP
European Patent Office
Prior art keywords
dfl
pic
adaptor
contact
trench
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP24792256.0A
Other languages
German (de)
English (en)
Inventor
Jonathan ANKRI
Arie FAITELSON
Shmuel BORENSTAIN
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dustphotonics
Original Assignee
Dustphotonics
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dustphotonics filed Critical Dustphotonics
Publication of EP4699196A2 publication Critical patent/EP4699196A2/fr
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4239—Adhesive bonding; Encapsulation with polymer material
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4296—Coupling light guides with opto-electronic elements coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02315—Support members, e.g. bases or carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0236—Fixing laser chips on mounts using an adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
    • H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Light Receiving Elements (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Wire Bonding (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

Dispositif, qui comprend (a) un laser à rétroaction répartie (DFL), (b) un circuit intégré photonique (PIC) qui comprend une tranchée de PIC, le DFL étant positionné dans la tranchée de PIC, (c) un contact de tranchée de PIC formé dans la tranchée de PIC, (d) un adaptateur, l'adaptateur étant fixé à une région du PIC et au DFL à l'aide d'un ou de plusieurs éléments de liaison, et (e) un ou plusieurs pièges destinés à recevoir un excès de matériau de liaison formé lors d'une fixation de l'adaptateur au DFL et/ou à la région du PIC, et à éviter que l'excès de matériau de liaison couple électriquement le contact distal de DFL au contact proximal de DFL.
EP24792256.0A 2023-04-19 2024-04-19 Appareil d'alignement et de support laser Pending EP4699196A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US202363497123P 2023-04-19 2023-04-19
PCT/IB2024/053813 WO2024218721A2 (fr) 2023-04-19 2024-04-19 Appareil d'alignement et de support laser

Publications (1)

Publication Number Publication Date
EP4699196A2 true EP4699196A2 (fr) 2026-02-25

Family

ID=93153402

Family Applications (1)

Application Number Title Priority Date Filing Date
EP24792256.0A Pending EP4699196A2 (fr) 2023-04-19 2024-04-19 Appareil d'alignement et de support laser

Country Status (3)

Country Link
EP (1) EP4699196A2 (fr)
CN (1) CN121586975A (fr)
WO (1) WO2024218721A2 (fr)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6771682B2 (en) * 2002-08-12 2004-08-03 Infinera Corporation Electrical isolation of optical components in photonic integrated circuits (PICs)
FR3047811B1 (fr) * 2016-02-12 2018-03-16 Commissariat A L'energie Atomique Et Aux Energies Alternatives Modulateur des pertes de propagation et de l'indice de propagation d'un signal optique guide
EP3447556B1 (fr) * 2016-02-19 2020-04-29 MACOM Technology Solutions Holdings, Inc. Techniques d'alignement laser dans des circuits intégrés photoniques

Also Published As

Publication number Publication date
WO2024218721A2 (fr) 2024-10-24
CN121586975A (zh) 2026-02-27
WO2024218721A3 (fr) 2025-07-24

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