EP4707924A3 - Halbleiteranordnung - Google Patents

Halbleiteranordnung

Info

Publication number
EP4707924A3
EP4707924A3 EP26153621.3A EP26153621A EP4707924A3 EP 4707924 A3 EP4707924 A3 EP 4707924A3 EP 26153621 A EP26153621 A EP 26153621A EP 4707924 A3 EP4707924 A3 EP 4707924A3
Authority
EP
European Patent Office
Prior art keywords
thickness direction
holder
resin
semiconductor device
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
EP26153621.3A
Other languages
English (en)
French (fr)
Other versions
EP4707924A2 (de
Inventor
Kohei Tanikawa
Daiki IKEDA
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Publication of EP4707924A2 publication Critical patent/EP4707924A2/de
Publication of EP4707924A3 publication Critical patent/EP4707924A3/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H10W74/114—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed by a substrate and the encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D80/00—Assemblies of multiple devices comprising at least one device covered by this subclass
    • H10D80/20—Assemblies of multiple devices comprising at least one device covered by this subclass the at least one device being covered by groups H10D1/00 - H10D48/00, e.g. assemblies comprising capacitors, power FETs or Schottky diodes
    • H10D80/251—FETs covered by H10D30/00, e.g. power FETs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D80/00—Assemblies of multiple devices comprising at least one device covered by this subclass
    • H10D80/20—Assemblies of multiple devices comprising at least one device covered by this subclass the at least one device being covered by groups H10D1/00 - H10D48/00, e.g. assemblies comprising capacitors, power FETs or Schottky diodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/413—Insulating or insulated substrates serving as die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/468—Circuit boards
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/481—Leadframes for devices being provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H10W70/658—Shapes or dispositions of interconnections for devices provided for in groups H10D8/00 - H10D48/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/111—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being completely enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/10—Configurations of laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/763—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/421—Shapes or dispositions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/467—Multilayered additional interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/871—Bond wires and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/886—Die-attach connectors and strap connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/761—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors
    • H10W90/764—Package configurations characterised by the relative positions of pads or connectors relative to package parts of strap connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/811—Multiple chips on leadframes

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
EP26153621.3A 2022-05-02 2023-04-13 Halbleiteranordnung Pending EP4707924A3 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2022075921 2022-05-02
JP2022127149 2022-08-09
PCT/JP2023/015070 WO2023214500A1 (ja) 2022-05-02 2023-04-13 半導体装置
EP23799432.2A EP4517823A4 (de) 2022-05-02 2023-04-13 Halbleiteranordnung

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
EP23799432.2A Division EP4517823A4 (de) 2022-05-02 2023-04-13 Halbleiteranordnung

Publications (2)

Publication Number Publication Date
EP4707924A2 EP4707924A2 (de) 2026-03-11
EP4707924A3 true EP4707924A3 (de) 2026-04-22

Family

ID=88646429

Family Applications (4)

Application Number Title Priority Date Filing Date
EP25196791.5A Pending EP4629292A3 (de) 2022-05-02 2023-04-13 Halbleiteranordnung
EP26165088.1A Pending EP4739065A2 (de) 2022-05-02 2023-04-13 Halbleiteranordnung
EP26153621.3A Pending EP4707924A3 (de) 2022-05-02 2023-04-13 Halbleiteranordnung
EP23799432.2A Pending EP4517823A4 (de) 2022-05-02 2023-04-13 Halbleiteranordnung

Family Applications Before (2)

Application Number Title Priority Date Filing Date
EP25196791.5A Pending EP4629292A3 (de) 2022-05-02 2023-04-13 Halbleiteranordnung
EP26165088.1A Pending EP4739065A2 (de) 2022-05-02 2023-04-13 Halbleiteranordnung

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP23799432.2A Pending EP4517823A4 (de) 2022-05-02 2023-04-13 Halbleiteranordnung

Country Status (6)

Country Link
US (2) US20250046664A1 (de)
EP (4) EP4629292A3 (de)
JP (4) JP7820505B2 (de)
CN (3) CN121712087A (de)
DE (1) DE112023001614T5 (de)
WO (1) WO2023214500A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115428143A (zh) * 2020-04-27 2022-12-02 罗姆股份有限公司 半导体装置
EP4379966A4 (de) * 2021-07-28 2024-09-04 Mitsubishi Electric Corporation Schaltungsverbindungsvorrichtung, dynamoelektrische maschinenvorrichtung und verfahren zur herstellung einer schaltungsverbindungsvorrichtung
WO2025154475A1 (ja) * 2024-01-18 2025-07-24 ローム株式会社 半導体装置および半導体装置の製造方法
TW202531523A (zh) * 2024-01-30 2025-08-01 朋程科技股份有限公司 半導體模組及其製作方法
DE102025101191B3 (de) 2025-01-14 2026-03-26 Volkswagen Aktiengesellschaft Vorrichtung für einen Stromwandler, Stromwandler und Fahrzeug

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070090473A1 (en) * 2003-05-26 2007-04-26 Thomas Engling Microelectromechanical component and method for the production thereof
JP2011077280A (ja) * 2009-09-30 2011-04-14 Mitsubishi Electric Corp 電力用半導体装置およびその製造方法
JP2011222684A (ja) * 2010-04-08 2011-11-04 Mitsubishi Electric Corp 半導体装置の製造方法
EP2597675A1 (de) * 2011-04-05 2013-05-29 Panasonic Corporation Eingekapselte halbleitervorrichtung und herstellungsverfahren dafür
US20150103498A1 (en) * 2013-10-15 2015-04-16 Fairchild Korea Semiconductor Ltd. Power module package and method of manufacturing the same
US20150145123A1 (en) * 2013-11-25 2015-05-28 Samsung Electro-Mechanics Co., Ltd. Power semiconductor module and method of manufacturing the same
JP2021040065A (ja) * 2019-09-04 2021-03-11 ローム株式会社 半導体装置の実装構造
WO2021151949A1 (en) * 2020-01-30 2021-08-05 Abb Power Grids Switzerland Ag Power semiconductor module with accessible metal clips
WO2022063283A1 (zh) * 2020-09-28 2022-03-31 华为技术有限公司 半导体封装结构及其制造方法和半导体器件
WO2022080063A1 (ja) * 2020-10-14 2022-04-21 ローム株式会社 半導体モジュール

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JPH04127996U (ja) * 1991-05-16 1992-11-20 ナイルス部品株式会社 モジユールにおける端子の接続構造
JP4569473B2 (ja) * 2006-01-04 2010-10-27 株式会社日立製作所 樹脂封止型パワー半導体モジュール
JP5272768B2 (ja) 2009-02-05 2013-08-28 三菱電機株式会社 電力用半導体装置とその製造方法
JP5218442B2 (ja) * 2010-02-09 2013-06-26 三菱電機株式会社 電力用半導体装置
JP5383621B2 (ja) 2010-10-20 2014-01-08 三菱電機株式会社 パワー半導体装置
JP6016611B2 (ja) * 2012-12-20 2016-10-26 三菱電機株式会社 半導体モジュール、その製造方法およびその接続方法
US10153424B2 (en) * 2016-08-22 2018-12-11 Rohm Co., Ltd. Semiconductor device and mounting structure of semiconductor device
JP2018113326A (ja) * 2017-01-11 2018-07-19 三菱電機株式会社 電力用半導体装置およびその製造方法
US10319659B2 (en) * 2017-10-13 2019-06-11 Semiconductor Components Industries, Llc Semiconductor package and related methods
CN118213346A (zh) * 2018-10-24 2024-06-18 罗姆股份有限公司 半导体装置
JP2021190505A (ja) 2020-05-27 2021-12-13 ローム株式会社 半導体装置
US20230245956A1 (en) * 2020-10-14 2023-08-03 Rohm Co., Ltd. Semiconductor module

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070090473A1 (en) * 2003-05-26 2007-04-26 Thomas Engling Microelectromechanical component and method for the production thereof
JP2011077280A (ja) * 2009-09-30 2011-04-14 Mitsubishi Electric Corp 電力用半導体装置およびその製造方法
JP2011222684A (ja) * 2010-04-08 2011-11-04 Mitsubishi Electric Corp 半導体装置の製造方法
EP2597675A1 (de) * 2011-04-05 2013-05-29 Panasonic Corporation Eingekapselte halbleitervorrichtung und herstellungsverfahren dafür
US20150103498A1 (en) * 2013-10-15 2015-04-16 Fairchild Korea Semiconductor Ltd. Power module package and method of manufacturing the same
US20150145123A1 (en) * 2013-11-25 2015-05-28 Samsung Electro-Mechanics Co., Ltd. Power semiconductor module and method of manufacturing the same
JP2021040065A (ja) * 2019-09-04 2021-03-11 ローム株式会社 半導体装置の実装構造
WO2021151949A1 (en) * 2020-01-30 2021-08-05 Abb Power Grids Switzerland Ag Power semiconductor module with accessible metal clips
WO2022063283A1 (zh) * 2020-09-28 2022-03-31 华为技术有限公司 半导体封装结构及其制造方法和半导体器件
WO2022080063A1 (ja) * 2020-10-14 2022-04-21 ローム株式会社 半導体モジュール

Also Published As

Publication number Publication date
WO2023214500A1 (ja) 2023-11-09
EP4707924A2 (de) 2026-03-11
JP2025163208A (ja) 2025-10-28
CN121712087A (zh) 2026-03-20
JP7799880B2 (ja) 2026-01-15
US20250046664A1 (en) 2025-02-06
EP4517823A4 (de) 2026-04-15
CN119110995A (zh) 2024-12-10
EP4629292A2 (de) 2025-10-08
CN120751756B (zh) 2026-04-28
JP7725758B1 (ja) 2025-08-19
JP2025131877A (ja) 2025-09-09
EP4739065A2 (de) 2026-05-06
DE112023001614T5 (de) 2025-01-16
JP2025094258A (ja) 2025-06-24
CN120751756A (zh) 2025-10-03
JP7820505B2 (ja) 2026-02-25
EP4517823A1 (de) 2025-03-05
EP4629292A3 (de) 2026-04-15
JPWO2023214500A1 (de) 2023-11-09
US20250379111A1 (en) 2025-12-11

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